TPS2371 [TI]

LEGACY IEEE802.3AF COMPATIBLE POWER INTERFACE SWITCH FOR POWER OVER ETHERNET POWERED DEVICES; LEGACY IEEE802.3AF兼容的电源接口开关,用于以太网供电的设备供电
TPS2371
型号: TPS2371
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

LEGACY IEEE802.3AF COMPATIBLE POWER INTERFACE SWITCH FOR POWER OVER ETHERNET POWERED DEVICES
LEGACY IEEE802.3AF兼容的电源接口开关,用于以太网供电的设备供电

开关 以太网 以太网:16GBASE-T
文件: 总14页 (文件大小:281K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SLUS566A − JULY 2003 − REVISED NOVEMBER 2003  
FEATURES  
DESCRIPTION  
D
Integrated Power Interface Switch for IEEE  
802.3af Powered Devices (PDs)  
Acting as an interface between the Power Source  
Equipment (PSE) and the Powered Device (PD),  
the TPS2371 performs all detection, class−  
ification, inrush current limiting, and switch FET  
control that is necessary for compatibility with  
Legacy/IEEE 802.3af Standard. The TPS2371  
incorporates precision UVLO thresholds and  
hysteresis as well as a UVLO off-time delay to  
enable Legacy IEEE802.3af PoE compatibilty. An  
internal 0.3-FET provides maximum power  
delivery. As an additional feature, the TPS2371  
interfaces with the enable/soft-start signal of a  
dc-to-dc converter, eliminating the need to have  
an accurate UVLO in the dc-to-dc converter.  
D
D
D
D
D
D
D
D
D
Precision UVLO Thresholds  
20-ms UVLO Off-Time Delay  
Provides PD Detection Signature  
Provides PD Classification Signature  
(Class 0−4)  
Programmable Inrush Current Limit  
Internal 0.3-Low-Side FET  
Interfaces to DC/DC Soft-Start for DC/DC  
Enable  
Internal Thermal Protection – Disconnects  
PD Load  
At low input voltages (1.8 V to 10 V), the TPS2371  
draws less than 12 µA, allowing accurate sensing  
of the external 24.9-kdiscovery resistor. At input  
voltages between 15 V and 20 V, an external  
resistor sets the level of current to be drawn during  
classification mode. TPS2371 is compatible with  
current as well as voltage measurement schemes  
for classification. Above 20-V input, the  
classification current is shut off, reducing internal  
power dissipation.  
8-Pin SOIC, 8-Pin TSSOP Packages  
APPLICATIONS  
D
D
D
D
VoIP Phones  
Internet Appliances  
Wireless LAN Access Points  
BluetoothAccess Points  
SIMPLIFIED APPLICATION DIAGRAM  
V+  
R
DET  
8
C
C
DCDCIN  
BYPASS  
3
1
7
TPS2371  
44 V  
TO  
57 V  
R
LIM  
C
DEL  
DC/DC  
Converter/  
Controller  
VREG  
Ethernet  
Appliance  
C
LIM  
6
5
R
CLASS  
SMAJ54A  
C
SS  
2
4
5 V  
V−  
UDG−03092  
Bluetooth is a trademark of the Bluetooth SIG, Inc.  
ꢀꢪ  
Copyright 1999 − 2003, Texas Instruments Incorporated  
ꢦ ꢪ ꢧ ꢦꢢ ꢣꢳ ꢞꢓ ꢒ ꢭꢭ ꢫꢒ ꢤ ꢒ ꢥ ꢪ ꢦ ꢪ ꢤ ꢧ ꢑ  
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SLUS566A − JULY 2003 − REVISED NOVEMBER 2003  
DESCRIPTION (continued)  
The TPS2371 drives an internal low-side FET for control of the return side of the power path. The internal FET  
is turned on when the input voltage reaches 36 V and above. When the input voltage decreases, the FET  
remains on until the input voltage drops to below 30 V.  
During initial turn-on of the switch (inrush mode), an external resistor is used to program the inrush current,  
allowing a wide range of capacitor values to be used at the load. According to IEEE 802.3af specification, inrush  
current of 400 mA is allowed only for 50 ms, limiting the load capacitor to approximately 180 µF. A programmable  
inrush current limit removes this limitation, allowing a larger capacitor to be used with a lower inrush current limit.  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
ABSOLUTE MAXIMUM RATINGS  
Over operating free-air temperature range unless otherwise noted  
(2)  
TPS2371  
UNIT  
ILIM, DELAY  
4
12  
CLASS  
Input voltage range, wrt V  
EE  
V
DET, RTN, EN_DC, VDD  
68  
Operating junction temperature range, T  
−55 to 150  
−65 to 150  
300  
°C  
°C  
°C  
J
Storage temperature, T  
stg  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds  
(2)  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions”  
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
RECOMMENDED OPERATING CONDITIONS  
MIN NOM MAX UNIT  
Input voltage, V  
48  
57  
70  
V
I
Operating junction temperature, T  
0
°C  
J
(3)(4)  
DISSIPATION RATINGS  
T
< 25°C  
T
= 25°C  
T = 70°C  
A
POWER RATING  
A
A
THERMAL IMPEDANCE  
JUNCTION-TO-AMBIENT  
PACKAGE  
POWER RATING  
DERATING  
FACTOR  
8-Pin Plastic TSSOP (PW)  
8-Pin Plastic SOIC (D)  
258.5°C/W  
176.0°C/W  
464 mW  
682 mW  
3.9 mW/°C  
5.7 mW/°C  
290 mW  
426 mW  
(3)  
(4)  
Test board conditions:  
1. 3” x 3”, 4 layers, thickness: 0.062”  
2. 1.5 oz. copper traces located on the top of the PCB  
3. 1.5 oz. copper ground plane on the bottom of the PCB  
4. 0.5 oz. copper ground planes on the 2 internal layers  
5. 12 thermal vias (see “Recommended Land Pattern” in applications section of this data sheet)  
Maximum power dissipation may be limited by over current protection.  
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SLUS566A − JULY 2003 − REVISED NOVEMBER 2003  
ELECTRICAL CHARACTERISTICS  
V
= 48 V; T = 0°C to 70°C; all voltages and currents are with respect to VEE; (unless otherwise noted)  
A
DD  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
SUPPLY  
Offset current  
VDD = 1.8 V, DET = OPEN  
1.8 V VDD < 10 V, DET = OPEN  
3
12  
I
I
Sleep current  
5
73  
DD  
µA  
R
R
= 24.9 k, VDD = 1.8 V  
= 24.9 k, VDD = 9.5 V  
70  
380  
76  
DET  
DET  
Detection load current  
DET  
390  
12.5  
22.5  
400  
14.0  
23.5  
Turn on  
10.0  
21.5  
Classification current threshold  
VDD current class 0  
V
Turn off  
0.44 W P  
15 V VDD 20 V,  
12.95 W,  
PoE  
2.2  
10.4  
18.1  
27.7  
38.5  
2.5  
10.8  
18.6  
28.4  
39.6  
2.8  
11.5  
19.5  
29.9  
42.0  
R
= 4.42 kΩ  
= 953 Ω  
= 549 Ω  
= 357 Ω  
CLASS  
0.44 W P 3.84 W,  
PoE  
15 V VDD 20 V,  
VDD current class 1  
R
CLASS  
3.84 W P  
PoE  
15 V VDD 20 V,  
6.49 W,  
VDD current class 2  
mA  
R
CLASS  
6.49 W P  
12.95 W,  
PoE  
15 V VDD 20 V,  
VDD current class 3  
R
CLASS  
Reserved for future use,  
VDD current class 4  
15 V VDD 20 V,  
30 V VDD 57 V,  
Turn on  
R
= 255 Ω  
= 255 Ω  
CLASS  
CLASS  
VDD quiescent current  
R
500  
35.0  
30.5  
4.5  
800  
36.1  
31.5  
µA  
33.9  
29.5  
4.3  
Input UVLO threshold  
Turn off  
V
UVLO hysteresis  
UVLO off-time delay  
EN_DC sink current  
RTN threshold for EN_DC  
C
= 180 nF  
18  
ms  
µA  
V
DELAY  
40  
1.2  
80  
200  
1.8  
1.5  
DMOS R  
DS(on)  
I
= 200 mA  
0.15  
405  
180  
0.30  
455  
250  
144  
20  
0.60  
505  
300  
RTN  
Full load current limit  
V
< 1.5 V  
RTN  
mA  
ILIM current limit programming  
Thermal shutdown temperature  
Thermal shutdown hysteresis  
R
= 125 kΩ, V  
> 1.5 V during startup  
LIM  
RTN  
°C  
D OR PW PACKAGE  
(TOP VIEW)  
ILIM  
VDD  
1
2
3
4
8
7
6
5
CLASS  
DET  
DELAY  
EN_DC  
RTN  
VEE  
ORDERING INFORMATION  
(1)  
T
PACKAGE  
PART NUMBER  
TPS2371PW  
TPS2371D  
A
Plastic TSSOP (PW)  
Plastic SOIC (D)  
0°C to 70°C  
(1)  
The PW and D packages are also available taped and reeled. Add an R suffix to the device type (i.e., TPS2371PWR).  
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SLUS566A − JULY 2003 − REVISED NOVEMBER 2003  
TERMINAL FUNCTIONS  
TERMINAL  
I/O  
DESCRIPTION  
NAME  
NO.  
Sets classification level with a single resistor to VEE. A precision voltage of 10.0 V is applied to this pin during  
CLASS  
2
O
I
classification. R  
CLASS  
values listed in Table 1.  
UVLO turn-off delay programming. Connect a capacitor between VCC and this pin to program the UVLO  
turn-off delay.  
(2)  
DELAY  
7
DET  
3
6
O
O
Connect the 24.9kdetection resistor (R ) between this pin and VDD.  
DET  
EN_DC  
(1)  
Ties to dc-to-dc converter’s shutdown or soft-start pin. Sinks 80µA until the load capacitor is fully charged.  
Sets startup current limit level with a resistor to VEE. If using C > 180 µF, I must be less than  
DC2DCIN RUSH  
ILIM  
1
O
400 mA. Extra capacitance on ILIM pin can cause oscillations in the current waveform.  
Return pin. Connect this pin to input return side of the dc-to-dc converter.  
Connection to PD input port positive voltage.  
RTN  
VDD  
VEE  
5
8
4
O
I
I
Input side power return for the controller.  
25 kW  
RLIM  
( )  
  1 A  
+ 450 mA * ǒ Ǔ  
NOTE 1: IINRUSH  
NOTE 2: TDELAY  
100 ms  
+ ǒ Ǔ  
  CDELAY  
mF  
DETAILED PIN DESCRIPTIONS  
ILIM (Pin 1)  
Inrush current limiting pin. This pin is used to program the inrush current of the device. Due to the low UVLO  
hysteresis of this device, a 1.0-µF capacitor from this pin to VEE is necessary to allow startup with 20 in series  
with V  
as required by the IEEE standards. By placing a resistor to VEE from this pin, the inrush current into  
DD  
the load will be limited via the following equation:  
25 kW  
( )  
  1 A  
+ 450 mA * ǒ Ǔ  
I
INRUSH  
R
LIM  
(1)  
CLASS (Pin 2)  
Classification pin. The PD can be optionally classified by adding a resistor from this pin to ground. The resistor  
specific to each class is given in Table 1: PoE Classification Resistance Values.  
DET (Pin3)  
Detection pin. This pin is used to set up the detection resistance during PD detection. By tying a resistor, R  
from this pin to VDD, the user sets the detection resistance. It should be noted that the device itself looks like  
,
DET  
approximately 1 Mof resistance in parallel with R  
.
DET  
VEE (Pin 4)  
Negative supply to the device.  
RET (Pin 5)  
Negative supply to the load. This pin is the drain side of a FET between the RET pin and the VEE pin, providing  
hot swap capabilities to the load. When the FET is switched on, there is approximately 300mbetween this  
pin and VEE.  
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SLUS566A − JULY 2003 − REVISED NOVEMBER 2003  
DETAILED PIN DESCRIPTIONS (continued)  
EN_DC (Pin 6)  
Enable pin for the load. This pin is intended to be used with a dc-to-dc coverter with a soft start capacitor. When  
power is not available to the dc-to-dc converter, this pin sinks 80-µA and hold off the softstart cap on the dc-to-dc  
converter. Once the voltage across the load is within 1.5 V of its final value, the EN_DC pin stops drawing current  
and become high impedance, allowing the dc-to-dc to soft start normally.  
DELAY (Pin 7)  
This pin controls the amount of time that the device ignores an undervoltage condition on VDD. That time is set  
by the following equation:  
100 ms  
+ ǒ Ǔ  
T
  C  
DELAY  
DELAY  
mF  
(2)  
VDD (Pin 8)  
Positive supply to the device.  
Table 1. PoE Classification Resistance Values  
RESISTANCE  
) VALUE ()  
POWERED DEVICES  
(PDs) Power (W)  
CLASSIFICATION  
CURRENT (mA)  
CLASS  
(R  
CLASS  
4420  
0
1
2
3
4
0.44 − 12.95  
0.44 − 3.84  
2.5  
953  
549  
357  
255  
10.8  
18.6  
28.4  
39.6  
3.84 − 6.49  
6.49 − 12.95  
reserved for future use  
5
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SLUS566A − JULY 2003 − REVISED NOVEMBER 2003  
INTERNAL BLOCK DIAGRAM  
+VE SUPPLY  
TO DC/DC’s  
EN/SS  
VDD  
R
DET  
8
24.9 kΩ  
DELAY  
UVLO, Detection,  
Classification Control  
CLASS  
7
C
SS  
LDO  
10 V  
2
Precision Bandgap Reference  
Precision Current Source  
Internal Supplies  
DET  
3
C
BYBASS  
VEE  
EN_DC  
5 V  
15 V  
80 µA  
60 V  
6
5
1.5 V  
R
CLASS  
5 V  
RTN  
ILIM  
20 µA  
2 kΩ  
1
+
TO DC/DC’s  
INPUT RETURN  
0.1 Ω  
4
R
LIM  
VEE  
C
LIM  
−VE SUPPLY  
UDG−03093  
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SLUS566A − JULY 2003 − REVISED NOVEMBER 2003  
STATE DIAGRAM  
DETECTION  
V
< 10 V  
DD  
I
= VDD/(R  
Switch Resistance > 100 MΩ  
) || 1 MΩ  
DET  
DD  
CLASSIFICATION  
10 V < V  
DD  
< 22 V  
CLASS  
I
10 V/(R  
)
DD  
Switch Resistance > 100 MΩ  
INRUSH MODE  
V
> 36 V (rising edge)  
= 450 mA − (25 k/R  
Switch Resistance 100 Ω  
V
> 1.5 V  
RTN  
DD  
= I  
I
) x (1 A)  
RET INRUSH  
LIM  
LATCH OFF  
V
DD  
> 30 V  
I
< 1 mA  
DD  
Switch Resistance 100  
MΩ  
NORMAL OPERATION  
V
> 30 V  
) < 450 mA  
DD  
(I  
= I  
RET LOAD  
NO  
Switch Resistance 0.3 Ω  
YES  
TSD  
OVERLOAD/FAULT  
Count < 7?  
V
RET  
> 30 V  
= 450 mA  
DD  
I
Switch Resistance 100 Ω  
THERMAL SHUTDOWN  
YES  
NO  
V > 30 V  
DD  
< 1 mA  
T
J
< 145 _C?  
I
DD  
Switch Resistance > 100 MΩ  
MACHINE STATE  
Detection  
Normal Operation  
(I = 450 mA)  
UVLO ON  
(Rising Edge)  
UVLO OFF  
(Falling Edge)  
(R  
= 25 k)  
LOAD  
Classification  
DD  
50  
57  
0
2
4
6
8
10  
15  
20  
25  
30.5  
35  
44  
7
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SLUS566A − JULY 2003 − REVISED NOVEMBER 2003  
APPLICATION INFORMATION  
OVERVIEW  
With the addition of power via media dependent interface (MDI) to the IEEE 802.3af Standard, all data terminal  
equipment (DTE) now has the option to receive power over existing cabling that is used for data transmission.  
The IEEE 802.3af Standard defines the requirements associated with providing and receiving power over the  
existing cabling. The power sourcing equipment (PSE) provides the power on the cable and the powered device  
(PD) receives the power. As part of the IEEE 802.3af Standard, the interface between the PSE and PD is defined  
as it relates to the detection and classification protocol.  
POWER SOURCING EQUIPMENT DETECTION OF A POWERED DEVICE  
A powered device (PD) draws power or requests power by participating in a PD detection algorithm. This  
algorithm requires the power sourcing equipment (PSE) to probe the link looking for a valid PD. The PSE probes  
the link by sending out a voltage between 2.8 V and 10 V across the power lines. A valid PD detects this voltage  
and places a resistance of between 23.75 kand 26.25kacross the power lines. Naturally, the current varies  
depending on the input voltage. Upon detecting this current, the PSE concludes that a valid PD is connected  
at the end of the ethernet cable and is requesting power.  
If the powered device (PD) is in a state in which it does not accept power, the PD is required to place a resistance  
above or below the values listed for a valid PD. On the lower end, a range between 12 kand 23.75 ksignifies  
that the PD does not require power. On the higher end, the range is defined to be between 26.25 kand 45  
k. Any resistance value less than 12 kand greater than 45 k, is interpreted by the PSE as a non-valid PD  
detection signature.  
The TPS2371 participates in the detection algorithm by activating an internal FET, which connects the DET pin  
of the device to VEE. As a result, any resistance connected between VDD and the DET pin of the TPS2371 is,  
in effect, across the power lines. This internal FET is active only when input power to the PD is between 2.8 V  
and 10 V.  
POWER SOURCING EQUIPMENT CLASSIFICATION OF A POWERED DEVICE  
After the detection phase, the PSE can optionally initiate a classification of the PD. The classification of a PD  
is used by the PSE to determine the maximum power required by the PD during normal operation. Five different  
levels of classification are defined by the IEEE 802.3af Standard. These levels are shown in Table 2.  
Table 2. Powered Device Classification Levels  
POWER DEVICE  
POWER  
CLASSIFICATION  
CURRENT  
(mA)  
CLASS  
USAGE  
(W)  
MIN  
0.44  
0.44  
3.84  
6.49  
MAX  
12.95  
3.84  
MIN  
0
MAX  
4
0
1
2
3
4
Default  
Optional  
9
12  
20  
30  
44  
Optional  
6.49  
17  
26  
36  
Optional  
12.95  
Not allowed  
reserved for future use  
8
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APPLICATION INFORMATION  
Classification of the PD is optionally performed by the PSE only after a valid PD has been detected. To determine  
PD classification, the PSE increases the voltage across the power lines to between 15.5 V and 20.5 V. The  
amount of current drawn by the PD determines the classification (see Table 2).  
When the input voltage to the TPS2371 is between 14.0 V and 20.5 V, the TPS2371 uses an internal regulator  
to generate a fixed voltage on the CLASS pin. A resistor connected between the CLASS pin and VEE draws  
a fixed amount of current and thereby defines the classification level of the PD.  
POWER SOURCING EQUIPMENT POWER TO THE POWERED DEVICE  
Upon completion of the detection and optional classification phases, the PSE ramps its output voltage above  
36 V . Once the UVLO threshold has been reached, the internal FET is turned on. At this point, the PD begins  
to operate normally and it continues to operate normally as long as the input voltage remains above 30 V. For  
most PDs, this input voltage is down-converted using an on board dc-to-dc converter to generate the required  
voltages.  
The TPS2371 is designed to apply the PSE output voltage of 36 V to 57 V across the input of the on board  
dc-to-dc converter. This is accomplished on the TPS2371 by turning on an internal pass FET located across  
the power return.  
Programming the Inrush Current  
During the initial turn-on of the pass FET, an inrush current is created from the charging of the capacitance at  
the input of the dc-to-dc converter. According to the IEEE 802.3af specification, if the input capacitance is less  
than 180-µF, the PSE limits the inrush current. If the input capacitance is greater than 180-µF, the IEEE 802.3af  
specification requires the PD to limit the inrush current to less than 400 mA.  
In order to satisfy the IEEE 802.3af requirements, the TPS2371 has been designed for a typical current limit  
of 450 mA. This current limit setting satisfies the normal operation requirements as well as the inrush  
requirements for a capacitive load of 180-µF or less. If a larger load capacitor is desired, the TPS2371 has been  
designed with a programmable inrush current limit feature. This feature allows the designer the option of using  
a capacitor larger than 180-µF. Note that the inrush current feature may also be used to lower voltage drops  
in the cabling between the PSE and the PD during startup.  
The programmable inrush current limit has a range of 50 mA to 449 mA. The limit is set by connecting an external  
resistor from ILIM (pin 1) to VEE (pin 4) of the TPS2371. Equation (3) shows the calculation for the  
programmable inrush current limit.  
25 kW  
( )  
  1 A  
+ 450 mA * ǒ Ǔ  
I
INRUSH  
R
LIM  
(3)  
where R  
is a value between 63.5 kand 25 M.  
LIM  
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SLUS566A − JULY 2003 − REVISED NOVEMBER 2003  
APPLICATION INFORMATION  
Using EN_DC as a SoftStart or a PowerGood Function  
The EN_DC pin is an output intended for use as a soft-start for a dc-to-dc converter. During the initial turn-on  
of the pass FET, an internal 80-µA current sink is enabled on the EN_DC pin. This internal current sink is  
removed only after the load capacitance has been charged to within 1.5-V of the supply voltage. By connecting  
the EN_DC output to the soft start capacitor of a dc-to-dc converter, the internal current sink keeps the dc-to-dc  
converter off during startup. Once the voltage across the converter has reached within 1.5 V of full voltage, the  
dc-to-dc converter is allowed to soft start. A 5-V zener diode connected between EN_DC and RTN is required  
for operation in this architecture.  
For operation as a powergood output, the EN_DC requires an external pull-up. A 1-Mresistor is  
recommended. The EN_DC output also requires a clamp to limit the output voltage to within recommended  
operating levels. A 5-V zener diode connected between EN_DC and RTN (pin 5 of the TPS2371) is  
recommended. This configuration allows the EN_DC pin to act as an open drain output with which many  
designers are more familiar.  
SURGE SUPPRESSION  
As specified in the Absolute Maximum Ratings table, the absolute maximum input voltage of the TPS2371 is  
68 V. The IEEE 802.3af Power-Over-Ethernet Standard specifies the voltage range of PSE output is between  
44 V asd 57 V. This PSE output voltage range would be reduced by cable, connector and other IR drops  
between the PSE and the TPS2371 in the PD. However, the use of extended cable lengths and transformers  
in some applications may induce transients in excess of 68 V during a hot plug event. To manage these transient  
events and keep them from significantly exceeding the application’s maximum voltage, a transorb such as the  
SMAJ54A should be placed between the positive input supply, VDD (pin 8), and the negative input supply, VEE  
(pin 4). This, combined with a 0.1-µF bypass capacitor in parallel with the transorb helps to protect the TPS2371  
from damage caused by transients during hot plug events. The transorb or zener diode should be selected such  
that it does not zener below the maximum required application voltage of 57 V, but before reaching the 68-V  
absolute maximum rating. For layout purposes, the 0.1-µF capacitor should be placed as close as possible to  
the device; the transorb or zener diode should be placed as close to the supply connector as possible. Based  
on the nature of the PD application, these measures should be considered an implementation requirement.  
USE OF BARREL RECTIFIERS  
Many applications use barrel rectifiers after the RJ-45 connector in order to be polarity insensitive. Barrel  
rectifiers in front of the TPS2371 cause the voltages at the device to be lower than the voltages at the RJ-45.  
The TPS2371 allows for this and is IEEE802.3af compliant during the detection and classification phases. For  
the detection phase, the device begins detection for voltages as low as 1.3 V across the supply pins. For the  
optional classification phase, the device is guaranteed to start classification below 14 V across the supply pins.  
Once classification has been engaged, it becomes latched-in and further voltage drops due to cable resistance  
and class current does not cause it to switch out of classification. However, in cases where the PSE is operating  
at minimum class voltage (15.5 V) and there is a 20-, 100-m cable between the PSE and the PD, Class 3  
devices may not classify correctly when using barrel rectifiers. Class 3 device designs should include schottky  
diodes to handle all corner cases or switch to Class 0 devices when using barrel rectifiers.  
Thermal Shutdown  
In the event of a short circuit or overload condition, the TPS2371 begins to heat up until thermal shutdown is  
reached. Once thermal shutdown is reached, the internal FET is switched off, removing the load from the supply.  
After the device has cooled sufficiently, it retries by restarting the internal FET. If the overload or short is not  
removed, the device cycles thermal shutdown seven times before latching the internal FET off. Once the internal  
FET is latched off, power needs to be cycled to reset the latch.  
10  
www.ti.com  
ꢀꢁ ꢂ ꢃꢄ ꢅꢆ  
SLUS566A − JULY 2003 − REVISED NOVEMBER 2003  
APPLICATION INFORMATION  
Figure 1 shows an application where 40 V < V < 57 V. In this case, the brick supply is greater then 40 V and  
IN  
goes through TPS2371.  
PoE Powered Device Front End  
3
V+  
RX  
TX  
R
DET  
8
C
6
1
C
LIM  
SS  
3
7
C
DCDCIN  
TPS2371  
R
LIM  
44 V  
TO  
57 V  
1
2
V−  
VREG  
DC/DC  
Converter  
Ethernet  
Device  
2
4
5
6
5
R
CLASS  
S
P
A
R
E
V−  
4
7
8
DC BRICK  
SUPPLY  
RJ−45  
UDG−03094  
Figure 1. For Applications 40 V < V < 57 V.  
IN  
Figure 2 shows an application where V < 36 V. In this application, the brick supply is bypassing the hot swap  
IN  
switch. Consequently, the dc-to-dc converter can operate from any voltage. However, for V  
< 23 V, a Class  
BRICK  
0 resistor (R  
= 4.42 k) is recommended. This minimizes the power dissipation in TPS2371 if V  
in the classification voltage range (15 V to 20 V). The 80-µA current sink on EN_DC pin is enabled only if  
falls  
CLASS  
BRICK  
VDD > 36 V.  
PoE POWERED DEVICE FRONT END  
3
V+  
RX  
TX  
R
DET  
6
1
8
C
C
LIM  
DCDCIN  
3
7
C
SS  
R
LIM  
44 V  
TO  
1
2
VREG  
Ethernet  
Device  
TPS2371  
DC/DC  
Converter  
V−  
57 V  
2
4
5
6
5
R
CLASS  
S
P
A
R
E
V−  
4
7
8
DC BRICK  
SUPPLY  
RJ−45  
UDG−03095  
Figure 2. For Applications V < 40 V.  
IN  
11  
www.ti.com  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
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