TPS22913CYZVR [TI]
Ultra-Small, Low on Resistance Load Switch with Controlled Turn-on; 超小尺寸，低导通电阻负载开关与受控的接通
| 型号： | TPS22913CYZVR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Ultra-Small, Low on Resistance Load Switch with Controlled Turn-on |
| 文件： | 总22页 (文件大小：864K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS22913
www.ti.com
SLVSB20 –SEPTEMBER 2011
Ultra-Small, Low on Resistance Load Switch with Controlled Turn-on
Check for Samples: TPS22913
1
FEATURES
DESCRIPTION
The TPS22913 is a small, low rON load switch with
controlled turn on. The device contains a P-channel
MOSFET that can operate over an input voltage
range of 1.4 V to 5.5 V. The switch is controlled by an
on/off input (ON), which is capable of interfacing
directly with low-voltage control signals. The
TPS22913 is active high enable.
•
•
Integrated Single Load Switch
Ultra Small CSP-4 Package 0.9mm × 0.9mm,
0.5mm Pitch
•
•
Input Voltage Range: 1.4-V to 5.5-V
Low ON-Resistance
–
–
–
–
rON = 60-mΩ at VIN = 5-V
rON = 61-mΩ at VIN = 3.3-V
rON = 74-mΩ at VIN = 1.8-V
rON = 84-mΩ at VIN = 1.5-V
The TPS22913 contains
a 150-Ω on-chip load
resistor for quick output discharge when the switch is
turned off. The rise time of the device is internally
controlled in order to avoid inrush current. The
TPS22913 family has various slew rate options (see
Table 1).
•
•
•
•
•
•
2-A Maximum Continuous Switch Current
Low Threshold Control Input
Controlled Slew-rate Options
Under-Voltage Lock Out
The TPS22913 device provides circuit breaker
functionality by latching off the power-switch during
reverse voltage situations. An internal reverse voltage
comparator disables the power-switch when the
output voltage is driven higher than the input (VIN) to
quickly (10µs typ) stop the flow of current towards the
input side of the switch. The reverse current
protection is active when the power switch is enabled
(ON). Additionally, during under-voltage lockout
(UVLO), or when the switch is disabled, no reverse
current can flow as the switch body diode is not
engaged.
Quick Output Discharge Transistor
Reverse Current Protection
APPLICATIONS
•
•
•
•
•
•
•
•
Portable Industrial Equipment
Portable Medical Equipment
Portable Media Players
Point Of Sales Terminal
GPS Devices
The TPS22913 is available in an ultra-small,
space-saving
4-pin
CSP
package
and
is
Digital Cameras
characterized for operation over the free-air
temperature range of –40°C to 85°C.
Portable Instrumentation
Smartphones
TYPICAL APPLICATION
V
V
OUT
IN
Power
Supply
ON
ON
C
L
C
IN
R
L
OFF
GND
TPS22913
GND
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
TPS22913
SLVSB20 –SEPTEMBER 2011
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Table 1. Feature List
SLEW RATE
(typ)
QUICK OUTPUT
DISCHARGE(1)
MAXIMUM OUTPUT
CURRENT
DEVICE
rON (typ) at 3.3 V
ENABLE
TPS22913A(2)
TPS22913B
TPS22913C
TPS22913D(2)
63 mΩ
63 mΩ
63 mΩ
63 mΩ
0.1 µs/V
20 µs/V
Yes
Yes
Yes
Yes
2-A
2-A
2-A
2-A
Active High
Active High
Active High
Active High
200 µs/V
900 µs/V
(1) This feature discharges the output of the switch to ground through an 150-Ω resistor, preventing the output from floating.
(2) Contact local sales/distributor or factory for availability.
ORDERING INFORMATION
TOP-SIDE MARKING/
STATUS(2)
TA
PACKAGE(1)
YZV (0.5mm pitch)
ORDERABLE PART NUMBER
–40°C to 85°C
–40°C to 85°C
–40°C to 85°C
–40°C to 85°C
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
TPS22913AYZVR
TPS22913BYZVR
TPS22913CYZVR
TPS22913DYZVR
Contact factory for availability
_ _ _ _ 64
YZV (0.5mm pitch)
YZV (0.5mm pitch)
YZV (0.5mm pitch)
_ _ _ _ 76
Contact factory for availability
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) Contact factory for details and availability for PREVIEW devices, minimum order quantities may apply.
DEVICE INFORMATION
YZV PACKAGE
TERMINALS ASSIGNMENTS
B
A
ON
VIN
2
GND
VOUT
1
PIN FUNCTIONS
DESCRIPTION
Ground
TPS22913
PIN NAME
YZV
B1
GND
ON
B2
Switch control input, active high. Do not leave floating
Switch output
A1
VOUT
Switch input, bypass this input with a ceramic capacitor to
ground
A2
VIN
2
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SLVSB20 –SEPTEMBER 2011
BLOCK DIAGRAM
V
IN
Reverse
Current
Protection
UVLO
Control
Logic
ON
V
OUT
GND
Table 2. FUNCTION TABLE
ON
L
VIN to VOUT
OFF
VOUT to GND(1)
ON
H
ON
OFF
(1) See Application section ‘Output Pull-Down’
ABSOLUTE MAXIMUM RATINGS
VALUE
–0.3 to 6
VIN + 0.3
–0.3 to 6
2
UNIT
V
VIN
Input voltage range
VOUT Output voltage range
V
VON
IMAX
IPLS
TA
Input voltage range
V
Maximum continuous switch current
Maximum pulsed switch current, pulse <300 µS, 2% duty cycle
Operating free-air temperature range
Maximum junction temperature
A
2.5
A
–40 to 85
125
°C
°C
°C
°C
TJ
TSTG
Storage temperature range
–65 to 150
300
TLEAD Maximum lead temperature (10-s soldering time)
Human-Body Model (HBM) (VIN, VOUT, GND pins)
Charged-Device Model (CDM) (VIN, VOUT, ON, GND pins)
2000
ESD
Electrostatic discharge protection
V
1000
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UNITS
THERMAL INFORMATION
TPS22913
CSP
THERMAL METRIC(1)
(4) PINS
189.1
1.9
θJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
θJCtop
θJB
Junction-to-board thermal resistance
36.8
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
11.3
ψJB
36.8
θJCbot
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
MIN
1.4
0
MAX
5.5
5.5
VIN
5.5
5.5
0.6
0.4
UNIT
V
VIN
Input voltage range
ON voltage range
Output voltage range
VON
VOUT
V
VIN = 3.61 V to 5.5 V
VIN = 1.4 V to 3.6 V
VIN = 3.61 V to 5.5 V
VIN = 1.4 V to 3. 6V
1.1
1.1
V
V
VIH
High-level input voltage, ON
V
VIL
Low-level input voltage, ON
Input Capacitor
V
(1)
CIN
1
µF
(1) Refer to the application section.
4
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ELECTRICAL CHARACTERISTICS
VIN = 1.4 V to 5.5 V, TA = –40ºC to 85ºC (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOUT = 0, VIN = VON = 5.25 V
TA
MIN
TYP
2
MAX UNIT
10
IOUT = 0, VIN = VON = 4.2 V
2
7.0
IIN
Quiescent current
IOUT = 0, VIN = VON = 3.6 V
Full
2
7.0
5
µA
µA
µA
IOUT = 0, VIN = VON = 2.5 V
0.9
0.7
1.2
0.2
0.1
0.1
0.1
1.2
0.2
0.1
0.1
0.1
60
IOUT = 0, VIN = VON = 1.5 V
5
VON = GND, VOUT = Open, VIN = 5.25 V
VON = GND, VOUT = Open, VIN = 4.2 V
VON = GND, VOUT = Open, VIN = 3.6 V
VON = GND, VOUT = Open, VIN = 2.5 V
VON = GND, VOUT = Open, VIN = 1.5 V
VON = GND, VOUT = 0, VIN = 5.25 V
VON = GND, VOUT = 0, VIN = 4.2 V
VON = GND, VOUT = 0, VIN = 3.6 V
VON = GND, VOUT = 0, VIN = 2.5 V
VON = GND, VOUT = 0, VIN = 1.5 V
10
7.0
7.0
5
IIN(off)
Off supply current
Full
Full
5
10
7.0
7.0
5
IIN(Leakage) Leakage current
5
25°C
Full
80
VIN = 5.25 V, IOUT = –200 mA
VIN = 5.0 V, IOUT = –200 mA
VIN = 4.2 V, IOUT = –200 mA
VIN = 3.3 V, IOUT = –200 mA
VIN = 2.5 V, IOUT = –200 mA
VIN = 1.8 V, IOUT = –200 mA
110
80
25°C
Full
60
60
110
80
25°C
Full
110
80
25°C
Full
60.7
63.4
74.2
83.9
153
rON
On-resistance
mΩ
110
90
25°C
Full
120
100
130
120
150
200
25°C
Full
25°C
Full
VIN = 1.5 V, IOUT = –200 mA
RPD
Output pull down resistance
Under voltage lockout
VIN = 3.3 V, VON = 0, IOUT = 30 mA
25°C
Ω
VIN increasing, VON = 3.6 V,
IOUT = –100 mA
1.2
UVLO
Full
Full
V
VIN decreasing, VON 3.6 V, RL = 10 Ω
0.50
ION
ON input leakage current
VON = 1.4 V to 5.25 V or GND
1
µA
Reverse Current Voltage
Threshold
VRVP
44
10
mV
Reverse Current Response
Delay
tDELAY
VIN = 5V
µs
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SLVSB20 –SEPTEMBER 2011
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UNIT
SWITCHING CHARACTERISTICS
PARAMETER
TPS22913 TPS22913
B
C
TEST CONDITION
TYP
TYP
VIN = 5 V, TA = 25ºC (unless otherwise noted)
tON
tOFF
tR
Turn-ON time
Turn-OFF time
VOUT rise time
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
76
6.6
82
3
770
6.6
838
3
RL = 10 Ω, CL = 0.1 µF
RL = 10 Ω, CL = 0.1 µF
RL = 10 Ω, CL = 0.1 µF
µs
µs
µs
tF
VIN = 3.3 V, TA = 25ºC (unless otherwise noted)
tON
tOFF
tR
Turn-ON time
Turn-OFF time
VOUT rise time
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
RL = 10 Ω, CL = 0.1 µF
RL = 10 Ω, CL = 0.1 µF
RL = 10 Ω, CL = 0.1 µF
102
8.5
97
3
1048
8.6
980
3
tF
VIN = 1.5 V, TA = 25ºC (unless otherwise noted)
tON
tOFF
tR
Turn-ON time
Turn-OFF time
VOUT rise time
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
RL = 10 Ω, CL = 0.1 µF
RL = 10 Ω, CL = 0.1 µF
RL = 10 Ω, CL = 0.1 µF
234
17
2344
18
244
6.5
1823
6.5
tF
PARAMETRIC MEASUREMENT INFORMATION
V
V
OUT
IN
C
= 1 mF
IN
ON
C
+
-
ON
L
(A)
R
L
OFF
GND
TPS22913
GND
GND
TEST CIRCUIT
V
ON
50%
t
50%
t
t
f
r
t
OFF
ON
90% 90%
V
50%
50%
OUT
V
OUT
10%
10%
t
H/t
ON
WAVEFORMS
OFF
(A) Rise and fall times of the control signal is 100 ns.
A. Rise and fall times of the control signal is 100 ns.
Figure 1. Test Circuit and tON/tOFF Waveforms
6
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TYPICAL CHARACTERISTICS
ON-STATE RESISTANCE
vs
INPUT VOLTAGE
ON INPUT THRESHOLD
120
110
100
90
80
70
60
50
40
30
20
10
0
6
5.5
5
−40C
25C
85C
VIN = 5.0V
VIN = 4.2V
VIN = 3.3V
VIN = 2.5V
VIN = 1.8V
VIN = 1.5V
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
0
0.2
0.4
0.6
0.8
1
1.2
Voltage (V)
VON (V)
G000
G000
Figure 2.
Figure 3.
INPUT CURRENT, QUIESCENT
INPUT CURRENT, LEAK
vs
vs
INPUT VOLTAGE
INPUT VOLTAGE
4
4
3
2
2
2
1
0
0
3500
3000
2500
2000
1500
1000
500
−40C
25C
85C
−40C
25C
85C
0
0
1
2
3
4
5
6
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
Voltage (V)
Voltage (V)
G000
G000
Figure 4.
Figure 5.
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TYPICAL CHARACTERISTICS (continued)
ON-STATE RESISTANCE
INPUT CURRENT, OFF
vs
vs
TEMPERATURE
INPUT VOLTAGE
120
3500
3000
2500
2000
1500
1000
500
VIN = 1.4V
VIN = 1.5V
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 4.2V
VIN= 5.0V
VIN = 5.5V
−40C
25C
85C
80
40
−40
0
−15
10
35
60
85
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
Temperature (°C)
Voltage (V)
G000
G000
Figure 6.
Figure 7.
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80
Ambient Temperature (°C)
G001
Figure 8. Allowable Power Dissipation
Figure 9. ULVO Response IOUT = -100mA
Figure 10. Reverse Current Protection VOUT = 3.3V, VIN = 3.3V Decreasing to 0V
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SLVSB20 –SEPTEMBER 2011
TYPICAL CHARACTERISTICS (continued)
TYPICAL AC CHARACTERISTICS FOR TPS22913B
RISE TIME
vs
FALL TIME
vs
TEMPERATURE
TEMPERATURE
180
160
140
120
100
80
10
9
8
7
6
5
4
3
2
1
0
VIN =5.0V, CL = 0.1 µF, RL = 10 Ohms
60
40
20
VIN =5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
60
85
−40
−15
10
35
60
85
Temperature (°C)
Temperature (°C)
G000
G000
Figure 11.
Figure 12.
RISE TIME
vs
FALL TIME
vs
TEMPERATURE
TEMPERATURE
500
400
300
200
100
0
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
−15 10 35
−40
60
85
Temperature (°C)
G000
Figure 13.
Figure 14.
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TYPICAL CHARACTERISTICS (continued)
TURN-ON TIME
TURN-OFF TIME
vs
vs
TEMPERATURE
TEMPERATURE
150
120
90
20
16
12
8
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
60
30
4
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
−15 10 35
0
−40
0
−40
60
85
−15
10
35
60
85
Temperature (°C)
Temperature (°C)
G000
G000
Figure 15.
Figure 16.
TURN-ON TIME
vs
TURN-OFF TIME
vs
TEMPERATURE
TEMPERATURE
500
400
300
200
100
0
40
30
20
10
0
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
−15 10 35
−40
60
85
−40
−15
10
35
60
85
Temperature (°C)
Temperature (°C)
G000
G000
Figure 17.
Figure 18.
10
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TYPICAL CHARACTERISTICS (continued)
RISE TIME
vs
INPUT VOLTAGE
300
250
200
150
100
50
−40C
25C
CL = 0.1 µF, RL = 10 Ohms, VON = 1.8V
0.5 1.5 2.5 3.5
85C
0
0
1
2
3
4
4.5
5
5.5
6
VIN (V)
G000
Figure 19.
TURN-ON RESPONSE
TURN-OFF RESPONSE
VIN = 5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
VIN = 5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
Figure 20.
Figure 21.
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TYPICAL CHARACTERISTICS (continued)
TURN-ON RESPONSE TIME
TURN-OFF RESPONSE TIME
VIN = 5V, TA = 25°C, CIN =1µF, CL = 0.1µF, RL = 10Ω
VIN = 5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
Figure 22.
Figure 23.
TURN-Of RESPONSE TIME
TURN-Of RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
VIN = 1.5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
Figure 24.
Figure 25.
TURN-Of RESPONSE TIME
TURN-Of RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
VIN = 1.5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
Figure 26.
Figure 27.
12
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TYPICAL CHARACTERISTICS (continued)
TYPICAL AC CHARACTERISTICS FOR TPS22913C
RISE TIME
vs
FALL TIME
vs
TEMPERATURE
TEMPERATURE
1200
1000
800
4
3
2
1
0
VIN =5.0V, CL = 0.1 µF, RL = 10 Ohms
600
400
200
VIN =5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
60
85
−40
−15
10
35
60
85
Temperature (°C)
Temperature (°C)
G000
G000
Figure 28.
Figure 29.
RISE TIME
vs
FALL TIME
vs
TEMPERATURE
TEMPERATURE
3000
10
9
8
7
6
5
4
3
2
1
0
VIN =1.5V, CL = 0.1 µF, RL = 10 Ohms
2500
2000
1500
1000
500
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
−15 10 35
0
−40
60
85
−40
−15
10
35
60
85
Temperature (°C)
Temperature (°C)
G000
G000
Figure 30.
Figure 31.
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TYPICAL CHARACTERISTICS (continued)
TURN-ON TIME
TURN-OFF TIME
vs
vs
TEMPERATURE
TEMPERATURE
1200
1000
800
10
8
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
6
600
4
400
2
200
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
−15 10 35
0
−40
0
−40
60
85
−15
10
35
60
85
Temperature (°C)
Temperature (°C)
G000
G000
Figure 32.
Figure 33.
TURN-ON TIME
vs
TURN-OFF TIME
vs
TEMPERATURE
TEMPERATURE
3500
3000
2500
2000
1500
1000
500
25
20
15
10
5
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
−15 10 35
0
−40
0
−40
60
85
−15
10
35
60
85
Temperature (°C)
Temperature (°C)
G000
G000
Figure 34.
Figure 35.
14
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TYPICAL CHARACTERISTICS (continued)
RISE TIME
vs
INPUT VOLTAGE
3000
2500
2000
1500
1000
500
−40C
25C
CL = 1 µF, RL = 10 Ohms, VON = 1.8V
0.5 1.5 2.5 3.5
85C
0
0
1
2
3
4
4.5
5
5.5
6
VIN (V)
G000
Figure 36.
TURN-ON RESPONSE
TURN-OFF RESPONSE
VIN = 5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
VIN = 5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
Figure 37.
Figure 38.
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TPS22913
SLVSB20 –SEPTEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
TURN-ON RESPONSE TIME
TURN-OFF RESPONSE TIME
VIN = 5V, TA = 25°C, CIN =1µF, CL = 0.1µF, RL = 10Ω
VIN = 5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
Figure 39.
Figure 40.
TURN-Of RESPONSE TIME
TURN-Of RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
VIN = 1.5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
Figure 41.
Figure 42.
TURN-Of RESPONSE TIME
TURN-Of RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
VIN = 1.5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
Figure 43.
Figure 44.
16
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Product Folder Link(s) :TPS22913
TPS22913
www.ti.com
SLVSB20 –SEPTEMBER 2011
APPLICATION INFORMATION
On/Off Control
The ON pin controls the state of the switch. Asserting ON high enables the switch. ON is active high and has a
low threshold, making it capable of interfacing with low-voltage signals. The ON pin is compatible with standard
GPIO logic threshold. It can be used with any microcontroller with 1.8-V, 2.5-V or 3.3-V GPIOs.
Input Capacitor
To limit the voltage drop on the input supply caused by transient inrush currents when the switch turns on into a
discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1-μF ceramic
capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce
the voltage drop.
Output Capacitor
A CIN to CL ratio of 10 to 1 is recommended for minimizing VIN dip caused by inrush currents during startup.
Output Pull-Down
The output pulldown is active when the user is turning off the main pass FET. The pulldown discharges the
output rail to approximately 10% of the rail, and then the output pulldown is automatically disconnected to
optimize the shutdown current.
Under-Voltage Lockout
The under-voltage lockout turns-off the switch if the input voltage drops below the under-voltage lockout
threshold. With the ON pin active the input voltage rising above the under-voltage lockout threshold will cause a
controlled turn-on of the switch which limits current over-shoots. During under-voltage lockout (UVLO), no
reverse current can flow as the body diode is not engaged.
Reverse Current Protection
In a scenario where VOUT is greater than VIN, there could be reverse current through the body diode of the PMOS
FET. The TPS22913 monitors the current through the FET and shuts off the FET when a reverse current is
detected. The FET, and the output, resumes normal operation when the reverse current scenario is no longer
present. When the reverse current protection (RCP) is active, no reverse current can flow as the body diode is
not engaged. During under-voltage lockout (UVLO), or when the switch is disabled, no reverse current can flow
as the body diode is not engaged.
Use the following formula to calculate the amount of reverse current for a particular application:
0.044V
=
IRC
RON(VIN)
Where,
IRC is the amount of reverse current,
RON(VIN) is the on-resistance at the VIN of the reverse current condition.
Board Layout
For best performance, all traces should be as short as possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects
along with minimizing the case to ambient thermal impedance.
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PACKAGE OPTION ADDENDUM
www.ti.com
3-Oct-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TPS22913BYZVR
TPS22913BYZVT
TPS22913CYZVR
TPS22913CYZVT
ACTIVE
ACTIVE
DSBGA
DSBGA
DSBGA
DSBGA
YZV
YZV
YZV
YZV
4
4
4
4
3000
250
Green (RoHS
& no Sb/Br)
SNAGCU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
ACTIVE
3000
250
Green (RoHS
& no Sb/Br)
PREVIEW
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Sep-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS22913BYZVR
TPS22913BYZVT
TPS22913CYZVR
TPS22913CYZVT
DSBGA
DSBGA
DSBGA
DSBGA
YZV
YZV
YZV
YZV
4
4
4
4
3000
250
178.0
178.0
178.0
178.0
9.2
9.2
9.2
9.2
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
0.63
0.63
0.63
0.63
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
Q1
Q1
Q1
Q1
3000
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Sep-2011
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS22913BYZVR
TPS22913BYZVT
TPS22913CYZVR
TPS22913CYZVT
DSBGA
DSBGA
DSBGA
DSBGA
YZV
YZV
YZV
YZV
4
4
4
4
3000
250
220.0
220.0
220.0
220.0
220.0
220.0
220.0
220.0
35.0
35.0
35.0
35.0
3000
250
Pack Materials-Page 2
D: Max = 0.918 mm, Min =0.858 mm
E: Max = 0.918 mm, Min =0.858 mm
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