SNJ54CBTD3384W [TI]
10-BIT FET BUS SWITCHES WITH LEVEL SHIFTING; 10位FET总线开关，电平转换
| 型号： | SNJ54CBTD3384W |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 10-BIT FET BUS SWITCHES WITH LEVEL SHIFTING |
| 文件： | 总21页 (文件大小：1053K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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SCDS025R − MAY 1995 − REVISED JANUARY 2004
D
D
5-Ω Switch Connection Between Two Ports
TTL-Compatible Input Levels
D
Designed to Be Used in Level-Shifting
Applications
SN54CBTD3384 . . . JT OR W PACKAGE
SN54CBTD3384 . . . FK PACKAGE
(TOP VIEW)
SN74CBTD3384 . . . DB, DBQ, DGV, DW, OR PW PACKAGE
(TOP VIEW)
1OE
1B1
1A1
1A2
1B2
1B3
1A3
1A4
1B4
V
CC
1
2
3
4
5
6
7
8
9
24
23
22
21
20
19
18
17
16
2B5
2A5
2A4
2B4
2B3
2A3
2A2
2B2
4
3
2 1 28 27 26
5
6
7
8
9
25
24
23
22
21
20
19
1A2
1B2
1B3
NC
2A4
2B4
2B3
NC
1A3
1A4
1B4
2A3
2A2
2B2
10
11
12 13 14 15 16 17 18
1B5 10
15 2B1
1A5
GND
2A1
2OE
11
12
14
13
NC − No internal connection
description/ordering information
The ’CBTD3384 devices provide ten bits of high-speed TTL-compatible bus switching. The low on-state
resistance of the switches allows connections to be made without adding propagation delay. A diode to V is
CC
integrated on the die to allow for level shifting from 5-V signals at the device inputs to 3.3-V signals at the device
outputs.
These devices are organized as two 5-bit switches with separate output-enable (OE) inputs. When OE is low,
the switch is on, and port A is connected to port B. When OE is high, the switch is open, and the high-impedance
state exists between the two ports.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
Tube
SN74CBTD3384DW
SN74CBTD3384DWR
SN74CBTD3384DBR
SN74CBTD3384DBQR
SN74CBTD3384PW
SN74CBTD3384PWR
SN74CBTD3384DGVR
SNJ54CBTD3384JT
SNJ54CBTD3384W
SNJ54CBTD3384FK
SOIC − DW
SSOP − DB
CBTD3384
Tape and reel
Tape and reel
CC384
SSOP (QSOP) − DBQ Tape and reel
Tube
CBTD3384
−40°C to 85°C
TSSOP − PW
CC384
Tape and reel
TVSOP − DGV
CDIP − JT
Tape and reel
Tube
CC384
SNJ54CBTD3384JT
SNJ54CBTD3384W
SNJ54CBTD3384FK
CFP − W
Tube
−55°C to 125°C
LCCC − FK
Tube
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2004, Texas Instruments Incorporated
ꢚ ꢝ ꢨ ꢠ ꢟꢫ ꢦꢥ ꢣꢤ ꢥꢟ ꢡꢨ ꢪꢜ ꢢꢝ ꢣ ꢣꢟ ꢲꢏ ꢕꢎ ꢘꢙ ꢐ ꢎꢈꢉꢂ ꢈꢂꢊ ꢢꢪꢪ ꢨꢢ ꢠ ꢢ ꢡꢧ ꢣꢧꢠ ꢤ ꢢ ꢠ ꢧ ꢣꢧ ꢤꢣꢧ ꢫ
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢌꢍ ꢎꢅꢏ ꢆ ꢐ ꢑꢆ ꢅ ꢒꢀ ꢀ ꢓꢏ ꢆ ꢄꢔ ꢑꢀ
ꢓꢏ ꢆ ꢔ ꢕ ꢑꢖ ꢑꢕ ꢀꢔꢏ ꢐ ꢆꢏ ꢁ ꢗ
SCDS025R − MAY 1995 − REVISED JANUARY 2004
FUNCTION TABLE
(each 5-bit bus switch)
INPUTS
INPUTS/OUTPUTS
1OE
2OE
L
1B1−1B5
1A1−1A5
1A1−1A5
Z
2B1−2B5
2A1−2A5
Z
L
L
H
H
H
L
2A1−2A5
Z
H
Z
logic diagram (positive logic)
3
2
1B1
1B5
1A1
1A5
11
10
1
1OE
2A1
14
15
23
2B1
2B5
22
13
2A5
2OE
Pin numbers shown are for the DB, DBQ, DGV, DW, JT, PW, and W packages.
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
I
Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
IK I/O
Package thermal impedance, θ (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W
JA
DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SCDS025R − MAY 1995 − REVISED JANUARY 2004
recommended operating conditions (see Note 3)
SN54CBTD3384 SN74CBTD3384
UNIT
MIN
4.5
2
MAX
MIN
4.5
2
MAX
V
V
V
Supply voltage
5.5
5.5
V
V
CC
IH
IL
High-level control input voltage
Low-level control input voltage
Operating free-air temperature
0.8
0.8
85
V
T
A
−55
125
−40
°C
In applications with fast edge rates, multiple outputs switching, and operating at high frequencies, the output may have little or no level-shifting
effect.
NOTE 3: All unused control inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54CBTD3384
SN74CBTD3384
PARAMETER
TEST CONDITIONS
I = −18 mA
UNIT
†
†
MIN TYP
MAX
MIN TYP
MAX
V
V
V
= 4.5 V,
−1.2
−1.2
V
IK
CC
See Figure 2
I
OH
I
V
V
V
= 5.5 V,
= 5.5 V,
V = 5.5 V or GND
1
1
µA
I
CC
CC
CC
I
I
I
O
= 0,
V = V
I CC
or GND
1.5
1.5
mA
CC
= 5.5 V, One input at 3.4 V,
or GND
‡
Control inputs
2.5
2.5
mA
∆I
CC
Other inputs at V
CC
C
C
Control inputs V = 3 V or 0
3
3
pF
pF
i
I
V
O
= 3 V or 0, OE = V
CC
3.5
5
3.5
5
io(OFF)
I = 64 mA
I
7
7
V = 0
I
§
V
CC
= 4.5 V
I = 30 mA
I
5
5
Ω
r
on
V = 2.4 V,
I
I = 15 mA
I
35
35
50
†
‡
§
Typical values are at V
CC
= 5 V, T = 25°C.
A
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V
or GND.
CC
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by
the lowest voltage of the two (A or B) terminals.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature range, C = 50 pF (unless otherwise noted) (see Figure 1)
L
SN54CBTD3384 SN74CBTD3384
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
MAX
0.25
9.7
MIN
MAX
0.25
7
¶
t
pd
t
en
t
A or B
OE
B or A
A or B
A or B
ns
ns
ns
2.2
1.5
2.3
1.7
8.6
5.3
OE
dis
¶
The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇ ꢈꢈ ꢉꢃꢊ ꢀ ꢁꢋ ꢃ ꢄꢅꢆ ꢇꢈ ꢈ ꢉꢃ
ꢌꢍ ꢎꢅꢏ ꢆ ꢐ ꢑꢆ ꢅ ꢒꢀ ꢀ ꢓꢏ ꢆ ꢄꢔ ꢑꢀ
ꢓꢏ ꢆ ꢔ ꢕ ꢑꢖ ꢑꢕ ꢀꢔꢏ ꢐ ꢆꢏ ꢁ ꢗ
SCDS025R − MAY 1995 − REVISED JANUARY 2004
PARAMETER MEASUREMENT INFORMATION
7 V
TEST
S1
S1
Open
GND
500 Ω
t
Open
7 V
From Output
Under Test
pd
/t
t
PLZ PZL
t
/t
Open
PHZ PZH
C
= 50 pF
L
500 Ω
(see Note A)
3 V
0 V
Output
Control
1.5 V
1.5 V
LOAD CIRCUIT
t
t
PLZ
PZL
Output
Waveform 1
S1 at 7 V
3.5 V
3 V
0 V
1.5 V
Input
V
V
+ 0.3 V
1.5 V
1.5 V
OL
V
(see Note B)
OL
OH
t
t
PHZ
PZH
t
t
PHL
PLH
Output
Waveform 2
S1 at Open
(see Note B)
V
V
OH
− 0.3 V
OH
1.5 V
Output
1.5 V
1.5 V
0 V
V
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A.
C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
D. The outputs are measured one at a time with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
PLZ
PZL
PLH
PHZ
PZH
PHL
are the same as t
.
en
are the same as t .
pd
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SCDS025R − MAY 1995 − REVISED JANUARY 2004
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE HIGH
OUTPUT VOLTAGE HIGH
vs
vs
SUPPLY VOLTAGE
SUPPLY VOLTAGE
4
3.75
3.5
4
3.75
3.5
T
A
= 85°C
T
A
= 25°C
100 µA
100 µA
6 mA
12 mA
6 mA
3.25
3.25
24 mA
12 mA
24 mA
3
3
2.75
2.75
2.5
2.25
2
2.5
2.25
2
1.75
1.5
1.75
1.5
4.5
4.75
V
5
5.25
5.5
5.75
4.5
4.75
5
5.25
− Supply Voltage − V
CC
5.5
5.75
− Supply Voltage − V
V
CC
OUTPUT VOLTAGE HIGH
vs
SUPPLY VOLTAGE
4
T
A
= 0°C
3.75
3.5
100 µA
3.25
6 mA
12 mA
3
24 mA
2.75
2.5
2.25
2
1.75
1.5
4.5
4.75
5
5.25
5.5
5.75
V
CC
− Supply Voltage − V
Figure 2. V
Values
OH
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
5962-9752701Q3A
ACTIVE
LCCC
FK
28
1
TBD
Call TI
Call TI
-55 to 125
5962-
9752701Q3A
SNJ54CBTD
3384FK
5962-9752701QKA
5962-9752701QLA
ACTIVE
ACTIVE
CFP
W
24
24
1
1
TBD
TBD
Call TI
Call TI
Call TI
Call TI
-55 to 125
-55 to 125
5962-9752701QK
A
SNJ54CBTD3384W
CDIP
JT
5962-9752701QL
A
SNJ54CBTD3384J
T
74CBTD3384DBQRE4
74CBTD3384DBQRG4
74CBTD3384DGVRE4
74CBTD3384DGVRG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
DBQ
DBQ
DGV
DGV
24
24
24
24
2500
2500
2000
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
CBTD3384
CBTD3384
CC384
Green (RoHS
& no Sb/Br)
TVSOP
TVSOP
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
CC384
SN74CBTD3384DBLE
SN74CBTD3384DBQR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
24
24
TBD
Call TI
Call TI
-40 to 85
-40 to 85
DBQ
2500
2000
2000
2000
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CBTD3384
CC384
SN74CBTD3384DBR
SN74CBTD3384DBRG4
SN74CBTD3384DGVR
SN74CBTD3384DW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
TVSOP
SOIC
DB
DB
24
24
24
24
24
24
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Green (RoHS
& no Sb/Br)
CC384
DGV
DW
DW
DW
Green (RoHS
& no Sb/Br)
CC384
Green (RoHS
& no Sb/Br)
CBTD3384
CBTD3384
CBTD3384
SN74CBTD3384DWE4
SN74CBTD3384DWG4
SOIC
25
Green (RoHS
& no Sb/Br)
SOIC
25
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
SN74CBTD3384DWR
SN74CBTD3384DWRE4
SN74CBTD3384DWRG4
SN74CBTD3384PW
ACTIVE
SOIC
SOIC
DW
24
24
24
24
24
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
CBTD3384
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DW
DW
PW
PW
PW
2000
2000
60
Green (RoHS
& no Sb/Br)
CBTD3384
CBTD3384
CC384
SOIC
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
Green (RoHS
& no Sb/Br)
SN74CBTD3384PWE4
SN74CBTD3384PWG4
60
Green (RoHS
& no Sb/Br)
CC384
60
Green (RoHS
& no Sb/Br)
CC384
SN74CBTD3384PWLE
SN74CBTD3384PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
24
24
TBD
Call TI
Call TI
-40 to 85
-40 to 85
2000
2000
2000
1
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CC384
CC384
CC384
SN74CBTD3384PWRE4
SN74CBTD3384PWRG4
SNJ54CBTD3384FK
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
LCCC
PW
PW
FK
24
24
28
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
POST-PLATE
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 85
-40 to 85
-55 to 125
Green (RoHS
& no Sb/Br)
TBD
TBD
TBD
5962-
9752701Q3A
SNJ54CBTD
3384FK
SNJ54CBTD3384JT
SNJ54CBTD3384W
ACTIVE
ACTIVE
CDIP
CFP
JT
W
24
24
1
1
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
5962-9752701QL
A
SNJ54CBTD3384J
T
5962-9752701QK
A
SNJ54CBTD3384W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54CBTD3384, SN74CBTD3384 :
Catalog: SN74CBTD3384
•
Military: SN54CBTD3384
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74CBTD3384DBQR
SN74CBTD3384DBR
SSOP
SSOP
DBQ
DB
24
24
24
24
24
2500
2000
2000
2000
2000
330.0
330.0
330.0
330.0
330.0
16.4
16.4
12.4
24.4
16.4
6.5
8.2
6.9
9.0
8.8
5.6
2.1
2.5
1.6
2.7
1.6
8.0
12.0
8.0
16.0
16.0
12.0
24.0
16.0
Q1
Q1
Q1
Q1
Q1
SN74CBTD3384DGVR TVSOP
DGV
DW
PW
SN74CBTD3384DWR
SN74CBTD3384PWR
SOIC
10.75 15.7
6.95 8.3
12.0
8.0
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74CBTD3384DBQR
SN74CBTD3384DBR
SN74CBTD3384DGVR
SN74CBTD3384DWR
SN74CBTD3384PWR
SSOP
SSOP
TVSOP
SOIC
DBQ
DB
24
24
24
24
24
2500
2000
2000
2000
2000
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
38.0
35.0
45.0
38.0
DGV
DW
PW
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MCER004A – JANUARY 1995 – REVISED JANUARY 1997
JT (R-GDIP-T**)
CERAMIC DUAL-IN-LINE
24 LEADS SHOWN
PINS **
A
24
28
DIM
13
24
1.280
(32,51) (37,08)
1.460
A MAX
1.240
(31,50) (36,58)
1.440
B
A MIN
B MAX
B MIN
0.300
(7,62)
0.291
(7,39)
1
12
0.070 (1,78)
0.030 (0,76)
0.245
(6,22)
0.285
(7,24)
0.320 (8,13)
0.290 (7,37)
0.015 (0,38) MIN
0.100 (2,54) MAX
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.014 (0,36)
0.008 (0,20)
0.100 (2,54)
4040110/C 08/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP3-T24, GDIP4-T28, and JEDEC MO-058 AA, MO-058 AB
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MCFP007 – OCTOBER 1994
W (R-GDFP-F24)
CERAMIC DUAL FLATPACK
0.375 (9,53)
0.340 (8,64)
Base and Seating Plane
0.006 (0,15)
0.004 (0,10)
0.045 (1,14)
0.026 (0,66)
0.090 (2,29)
0.045 (1,14)
0.395 (10,03)
0.360 (9,14)
0.360 (9,14)
0.240 (6,10)
0.360 (9,14)
0.240 (6,10)
0.019 (0,48)
0.015 (0,38)
1
24
0.050 (1,27)
0.640 (16,26)
0.490 (12,45)
0.030 (0,76)
0.015 (0,38)
12
13
30° TYP
1.115 (28,32)
0.840 (21,34)
4040180-5/B 03/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD
E. Index point is provided on cap for terminal identification only.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,23
0,13
M
0,07
0,40
24
13
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–ā8°
0,75
1
12
0,50
A
Seating Plane
0,08
0,15
0,05
1,20 MAX
PINS **
14
16
20
24
38
48
56
DIM
A MAX
A MIN
3,70
3,50
3,70
3,50
5,10
4,90
5,10
4,90
7,90
7,70
9,80
9,60
11,40
11,20
4073251/E 08/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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