SN54CBT16212AWD [TI]

24-BIT FET BUS-EXCHANGE SWITCHES; 24位FET总线交换开关系列
SN54CBT16212AWD
型号: SN54CBT16212AWD
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

24-BIT FET BUS-EXCHANGE SWITCHES
24位FET总线交换开关系列

总线驱动器 总线收发器 开关 逻辑集成电路 信息通信管理
文件: 总13页 (文件大小:350K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢈ ꢉ ꢇ ꢉ ꢊꢋ ꢀꢁ ꢌꢃ ꢄꢅ ꢆꢇ ꢈꢉ ꢇꢉꢊ  
ꢉ ꢃ ꢍꢅꢎ ꢆ ꢏ ꢐꢆ ꢅꢑꢀ ꢍꢐꢒꢄ ꢓꢊꢁꢔ ꢐ ꢀ ꢕꢎ ꢆꢄ ꢓꢐ ꢀ  
SCDS007U − NOVEMBER 1992 − REVISED JUNE 2005  
SN54CBT16212A . . . WD PACKAGE  
SN74CBT16212A . . . DGG, DGV, OR DL PACKAGE  
(TOP VIEW)  
D
Members of the Texas Instruments  
WidebusFamily  
D
D
D
D
5-Switch Connection Between Two Ports  
TTL-Compatible Input Levels  
1
S0  
1A1  
1A2  
2A1  
2A2  
3A1  
3A2  
GND  
4A1  
4A2  
5A1  
5A2  
6A1  
6A2  
7A1  
7A2  
56  
S1  
2
55 S2  
Latch-Up Performance Exceeds 250 mA Per  
JESD 17  
3
54 1B1  
53 1B2  
52 2B1  
51 2B2  
50 3B1  
49 GND  
48 3B2  
47 4B1  
46 4B2  
45 5B1  
44 5B2  
43 6B1  
42 6B2  
41 7B1  
40 7B2  
39 8B1  
38 GND  
37 8B2  
36 9B1  
35 9B2  
4
ESD Protection Exceeds JESD 22  
− 200-V Machine Model (A115-A)  
5
6
7
description/ordering information  
8
The ’CBT16212A devices provide 24 bits of  
high-speed TTL-compatible bus switching or  
exchanging. The low on-state resistance of the  
switch allows connections to be made with  
minimal propagation delay.  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
Each device operates as a 24-bit bus switch or a  
12-bit bus exchanger that provides data  
exchanging between the four signal ports via the  
data-select (S0, S1, S2) terminals.  
V
CC  
8A1  
GND  
8A2  
9A1  
9A2  
10A1  
10A2  
11A1  
11A2  
12A1  
12A2  
34  
33  
32  
31  
30  
29  
10B1  
10B2  
11B1  
11B2  
12B1  
12B2  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
Tube  
SN74CBT16212ADL  
SSOP − DL  
CBT16212A  
Tape and reel  
Tape and reel  
Tape and reel  
SN74CBT16212ADLR  
SN74CBT16212ADGGR  
SN74CBT16212ADGVR  
SN74CBT16212AGQLR  
SN74CBT16212AZQLR  
SNJ54CBT16212AWD  
TSSOP − DGG  
TVSOP − DGV  
VFBGA − GQL  
CBT16212A  
CY212A  
−40°C to 85°C  
−55°C to 125°C  
Tape and reel  
Tube  
CY212A  
VFBGA − ZQL (Pb-free)  
CFP − WD  
SNJ54CBT16212AWD  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Widebus is a trademark of Texas Instruments.  
Copyright 2005, Texas Instruments Incorporated  
ꢘ ꢛ ꢦ ꢞ ꢝꢩ ꢤꢣ ꢡꢢ ꢣꢝ ꢟꢦ ꢨꢚ ꢠꢛ ꢡ ꢡꢝ ꢰꢎ ꢱꢍ ꢖꢗ ꢏ ꢍꢲꢳꢂ ꢲꢂꢋ ꢠꢨꢨ ꢦꢠ ꢞ ꢠ ꢟꢥ ꢡꢥꢞ ꢢ ꢠ ꢞ ꢥ ꢡꢥ ꢢꢡꢥ ꢩ  
ꢡ ꢥ ꢢ ꢡꢚ ꢛꢯ ꢝꢜ ꢠ ꢨꢨ ꢦꢠ ꢞ ꢠ ꢟ ꢥ ꢡ ꢥ ꢞ ꢢ ꢪ  
ꢢꢚ  
ꢤ ꢛꢨ ꢥꢢꢢ ꢝ ꢡꢫꢥ ꢞ ꢭꢚ ꢢꢥ ꢛ ꢝꢡꢥ ꢩꢪ ꢘ ꢛ ꢠꢨ ꢨ ꢝ ꢡꢫꢥ ꢞ ꢦꢞ ꢝ ꢩꢤꢣ ꢡꢢ ꢋ ꢦꢞ ꢝ ꢩꢤꢣ ꢡꢚꢝ ꢛ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢈ ꢉꢇ ꢉꢊ ꢋ ꢀ ꢁꢌ ꢃ ꢄꢅꢆ ꢇ ꢈꢉ ꢇ ꢉꢊ  
ꢉꢃ ꢍꢅꢎ ꢆ ꢏ ꢐꢆ ꢅ ꢑꢀ ꢍꢐ ꢒꢄ ꢓꢊꢁ ꢔꢐ ꢀ ꢕꢎ ꢆ ꢄꢓ ꢐ ꢀ  
SCDS007U − NOVEMBER 1992 − REVISED JUNE 2005  
GQL OR ZQL PACKAGE  
(TOP VIEW)  
terminal assignments  
1
2
3
4
5
6
1
2
3
4
5
6
A
B
C
D
E
F
A
B
C
D
E
F
1A2  
3A1  
4A1  
5A2  
6A2  
7A1  
1A1  
2A2  
GND  
4A2  
6A1  
7A2  
GND  
9A1  
10A2  
12A1  
S0  
S1  
S2  
1B1  
2B2  
3B2  
5B1  
6B1  
6B2  
7B2  
8B2  
10B1  
11B2  
2A1  
3A2  
5A1  
1B2  
3B1  
4B2  
2B1  
GND  
4B1  
5B2  
7B1  
GND  
9B1  
10B2  
12B1  
G
H
J
V
CC  
8A1  
9A2  
8B1  
9B2  
G
H
J
8A2  
10A1  
11A2  
11A1  
12A2  
11B1  
12B2  
K
K
FUNCTION TABLE  
INPUTS/OUTPUTS  
INPUTS  
FUNCTION  
S2  
L
S1  
L
S0  
L
A1  
A2  
Z
Z
Disconnect  
L
L
H
L
B1 port  
Z
Z
A1 port = B1 port  
A1 port = B2 port  
A2 port = B1 port  
A2 port = B2 port  
Disconnect  
L
H
H
L
B2 port  
L
H
L
Z
Z
Z
B1 port  
B2 port  
Z
H
H
L
H
A1 port = B1 port  
A2 port = B2 port  
H
H
H
H
L
B1 port  
B2 port  
B2 port  
B1 port  
A1 port = B2 port  
A2 port = B1 port  
H
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢈ ꢉ ꢇ ꢉ ꢊꢋ ꢀꢁꢌ ꢃ ꢄ ꢅꢆ ꢇꢈ ꢉꢇꢉ ꢊ  
ꢉ ꢃ ꢍꢅꢎ ꢆ ꢏ ꢐꢆ ꢅꢑꢀ ꢍꢐꢒꢄ ꢓꢊꢁꢔ ꢐ ꢀ ꢕꢎ ꢆꢄ ꢓꢐ ꢀ  
SCDS007U − NOVEMBER 1992 − REVISED JUNE 2005  
logic diagram (positive logic)  
2
54  
1A1  
1B1  
3
53  
1A2  
1B2  
30  
27  
12A1  
12B1  
28  
29  
12B2  
12A2  
1
S0  
56  
S1  
55  
S2  
Pin numbers shown are for the DGG, DGV, DL, and WD packages.  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢈ ꢉꢇ ꢉꢊ ꢋ ꢀ ꢁꢌ ꢃ ꢄꢅꢆ ꢇ ꢈꢉ ꢇ ꢉꢊ  
ꢉꢃ ꢍꢅꢎ ꢆ ꢏ ꢐꢆ ꢅ ꢑꢀ ꢍꢐ ꢒꢄ ꢓꢊꢁ ꢔꢐ ꢀ ꢕꢎ ꢆ ꢄꢓ ꢐ ꢀ  
SCDS007U − NOVEMBER 1992 − REVISED JUNE 2005  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
I
Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA  
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
IK  
I
Package thermal impedance, θ (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W  
JA  
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48°C/W  
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56°C/W  
GQL/ZQL package . . . . . . . . . . . . . . . . . . . . . . . . . . . 42°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
2. The package thermal impedance is calculated in accordance with JESD 51-7.  
recommended operating conditions (see Note 3)  
SN54CBT16212A SN74CBT16212A  
UNIT  
MIN  
4
MAX  
MIN  
4
MAX  
V
V
V
Supply voltage  
5.5  
5.5  
V
V
CC  
IH  
IL  
High-level control input voltage  
Low-level control input voltage  
Operating free-air temperature  
2
2
0.8  
0.8  
85  
V
T
A
−55  
125  
−40  
°C  
NOTE 3: All unused control inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
SN54CBT16212A  
SN74CBT16212A  
PARAMETER  
TEST CONDITIONS  
I = −18 mA  
UNIT  
MIN TYP  
MAX  
−1.2  
10  
MIN TYP  
MAX  
−1.2  
10  
V
V
V
V
V
V
= 4.5 V,  
= 0,  
V
IK  
CC  
CC  
CC  
CC  
CC  
I
V = 5.5 V  
I
I
I
µA  
µA  
I
= 5.5 V,  
= 5.5 V,  
V = 5.5 V or GND  
I
1
1
I
O
= 0, V = V  
CC  
or GND  
3.2  
3
CC  
I
= 5.5 V, One input at 3.4 V,  
or GND  
§
I  
CC  
Control inputs  
2.5  
2.5  
20  
mA  
Other inputs at V  
CC  
C
C
Control inputs V = 3 V or 0  
2.5  
7.5  
2.5  
7.5  
pF  
pF  
i
I
V
O
= 3 V or 0,  
S0, S1, and S2 = GND  
io(off)  
V
= 4 V,  
CC  
V = 2.4 V, I = 15 mA  
I
14  
20  
14  
I
TYP at V  
= 4 V  
CC  
I = 64 mA  
I
4
4
6
10  
10  
14  
4
4
6
7
7
r
on  
V = 0  
I
V
CC  
= 4.5 V  
I = 30 mA  
I
V = 2.4 V, I = 15 mA  
12  
I
I
§
All typical values are at V  
= 5 V (unless otherwise noted), T = 25°C.  
A
CC  
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V  
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by  
the lower of the voltages of the two (A or B) terminals.  
or GND.  
CC  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢈ ꢉ ꢇ ꢉ ꢊꢋ ꢀꢁꢌ ꢃ ꢄ ꢅꢆ ꢇꢈ ꢉꢇꢉ ꢊ  
ꢉ ꢃ ꢍꢅꢎ ꢆ ꢏ ꢐꢆ ꢅꢑꢀ ꢍꢐꢒꢄ ꢓꢊꢁꢔ ꢐ ꢀ ꢕꢎ ꢆꢄ ꢓꢐ ꢀ  
SCDS007U − NOVEMBER 1992 − REVISED JUNE 2005  
switching characteristics over recommended operating free-air temperature range, C = 50 pF  
L
(unless otherwise noted) (see Figure 1)  
SN54CBT16212A  
= 5 V  
SN74CBT16212A  
= 5 V  
V
V
FROM  
(INPUT)  
TO  
(OUTPUT)  
CC  
0.5 V  
CC  
0.5 V  
V
CC  
= 4 V  
V
CC  
= 4 V  
PARAMETER  
UNIT  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
t
pd  
A or B  
B or A  
0.8*  
0.35  
0.25  
ns  
S
S
S
A or B  
A or B  
A or B  
14  
15  
1.5  
1.5  
1.5  
13  
13.7  
13.5  
10  
10.4  
9.2  
1.5  
1.5  
1.5  
9.1  
9.7  
8.8  
ns  
ns  
ns  
t
t
t
pd  
en  
dis  
14.2  
* On products compliant to MIL-PRF-38535, this parameter is not production tested.  
The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when  
driven by an ideal voltage source (zero output impedance).  
PARAMETER MEASUREMENT INFORMATION  
7 V  
TEST  
S1  
S1  
Open  
GND  
500 Ω  
t
Open  
7 V  
From Output  
Under Test  
pd  
/t  
t
PLZ PZL  
t
/t  
Open  
PHZ PZH  
C
= 50 pF  
L
500 Ω  
(see Note A)  
3 V  
0 V  
Output  
Control  
1.5 V  
1.5 V  
LOAD CIRCUIT  
t
t
PLZ  
PZL  
Output  
Waveform 1  
S1 at 7 V  
3.5 V  
3 V  
0 V  
1.5 V  
Input  
1.5 V  
1.5 V  
V
V
+ 0.3 V  
OL  
V
(see Note B)  
OL  
OH  
t
t
PHZ  
PZH  
t
t
PHL  
PLH  
Output  
Waveform 2  
S1 at Open  
(see Note B)  
V
V
OH  
− 0.3 V  
OH  
1.5 V  
Output  
1.5 V  
1.5 V  
0 V  
V
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
NOTES: A.  
C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 , t 2.5 ns, t 2.5 ns.  
O
r
f
D. The outputs are measured one at a time, with one transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
PHL  
are the same as t  
.
dis  
PLZ  
PZL  
PLH  
PHZ  
PZH  
are the same as t  
.
en  
are the same as t .  
pd  
H. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Oct-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
5962-9852101QXA  
ACTIVE  
ACTIVE  
CFP  
WD  
56  
56  
1
TBD  
Call TI  
Level-NC-NC-NC  
74CBT16212ADGGRE4  
TSSOP  
DGG  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
74CBT16212ADGVRE4  
SN74CBT16212ADGGR  
SN74CBT16212ADGVR  
SN74CBT16212ADL  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
TVSOP  
TSSOP  
TVSOP  
SSOP  
SSOP  
SSOP  
SSOP  
DGV  
DGG  
DGV  
DL  
56  
56  
56  
56  
56  
56  
56  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74CBT16212ADLG4  
SN74CBT16212ADLR  
SN74CBT16212ADLRG4  
DL  
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DL  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DL  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74CBT16212AGQLR  
SN74CBT16212AZQLR  
ACTIVE  
ACTIVE  
VFBGA  
VFBGA  
GQL  
ZQL  
56  
56  
1000  
TBD  
SNPB  
Level-1-240C-UNLIM  
Level-1-260C-UNLIM  
1000 Green (RoHS &  
no Sb/Br)  
SNAGCU  
SNJ54CBT16212AWD  
ACTIVE  
CFP  
WD  
56  
1
TBD  
Call TI  
Level-NC-NC-NC  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MCFP010B – JANUARY 1995 – REVISED NOVEMBER 1997  
WD (R-GDFP-F**)  
CERAMIC DUAL FLATPACK  
48 LEADS SHOWN  
0.120 (3,05)  
0.075 (1,91)  
0.009 (0,23)  
0.004 (0,10)  
1.130 (28,70)  
0.870 (22,10)  
0.370 (9,40)  
0.250 (6,35)  
0.390 (9,91)  
0.370 (9,40)  
0.370 (9,40)  
0.250 (6,35)  
1
48  
0.025 (0,635)  
A
0.014 (0,36)  
0.008 (0,20)  
24  
25  
NO. OF  
LEADS**  
48  
56  
0.740  
0.640  
(16,26) (18,80)  
A MAX  
A MIN  
0.610 0.710  
(15,49) (18,03)  
4040176/D 10/97  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. This package can be hermetically sealed with a ceramic lid using glass frit.  
D. Index point is provided on cap for terminal identification only  
E. Falls within MIL STD 1835: GDFP1-F48 and JEDEC MO-146AA  
GDFP1-F56 and JEDEC MO-146AB  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000  
DGV (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
24 PINS SHOWN  
0,23  
0,13  
M
0,07  
0,40  
24  
13  
0,16 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
0°ā8°  
0,75  
1
12  
0,50  
A
Seating Plane  
0,08  
0,15  
0,05  
1,20 MAX  
PINS **  
14  
16  
20  
24  
38  
48  
56  
DIM  
A MAX  
A MIN  
3,70  
3,50  
3,70  
3,50  
5,10  
4,90  
5,10  
4,90  
7,90  
7,70  
9,80  
9,60  
11,40  
11,20  
4073251/E 08/00  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.  
D. Falls within JEDEC: 24/48 Pins – MO-153  
14/16/20/56 Pins – MO-194  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001  
DL (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
48 PINS SHOWN  
0.025 (0,635)  
48  
0.0135 (0,343)  
0.008 (0,203)  
0.005 (0,13)  
M
25  
0.010 (0,25)  
0.005 (0,13)  
0.299 (7,59)  
0.291 (7,39)  
0.420 (10,67)  
0.395 (10,03)  
Gage Plane  
0.010 (0,25)  
0°ā8°  
1
24  
0.040 (1,02)  
0.020 (0,51)  
A
Seating Plane  
0.004 (0,10)  
0.008 (0,20) MIN  
PINS **  
0.110 (2,79) MAX  
28  
48  
0.630  
56  
DIM  
0.380  
(9,65)  
0.730  
A MAX  
A MIN  
(16,00) (18,54)  
0.370  
(9,40)  
0.620  
0.720  
(15,75) (18,29)  
4040048/E 12/01  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).  
D. Falls within JEDEC MO-118  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998  
DGG (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
48 PINS SHOWN  
0,27  
0,17  
M
0,08  
0,50  
48  
25  
6,20  
6,00  
8,30  
7,90  
0,15 NOM  
Gage Plane  
0,25  
1
24  
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
48  
56  
64  
DIM  
A MAX  
12,60  
12,40  
14,10  
13,90  
17,10  
16,90  
A MIN  
4040078/F 12/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process  
in which TI products or services are used. Information published by TI regarding third-party products or services  
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.  
Use of such information may require a license from a third party under the patents or other intellectual property  
of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without  
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction  
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for  
such altered documentation.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that  
product or service voids all express and any implied warranties for the associated TI product or service and  
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.  
Following are URLs where you can obtain information on other Texas Instruments products and application  
solutions:  
Products  
Applications  
Audio  
Amplifiers  
amplifier.ti.com  
www.ti.com/audio  
Data Converters  
dataconverter.ti.com  
Automotive  
www.ti.com/automotive  
DSP  
dsp.ti.com  
Broadband  
Digital Control  
Military  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
Logic  
interface.ti.com  
logic.ti.com  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
Telephony  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address:  
Texas Instruments  
Post Office Box 655303 Dallas, Texas 75265  
Copyright 2005, Texas Instruments Incorporated  

相关型号:

SN54CBT16212A_07

24-BIT FET BUS-EXCHANGE SWITCHES
TI

SN54CBT16212A_15

24-BIT FET BUS-EXCHANGE SWITCHES
TI

SN54CBT16244

16-BIT FET BUS SWITCHES
TI

SN54CBT16244WD

16-BIT FET BUS SWITCHES
TI

SN54CBT16244_07

16-BIT FET BUS SWITCHES
TI

SN54CBT3383

10-BIT FET BUS-EXCHANGE SWITCHES
TI

SN54CBT3383JT

10-BIT FET BUS-EXCHANGE SWITCHES
TI

SN54CBT3383W

10-BIT FET BUS-EXCHANGE SWITCHES
TI

SN54CBT3383_06

10-BIT FET BUS-EXCHANGE SWITCHES
TI

SN54CBTD3384

10-BIT FET BUS SWITCHES WITH LEVEL SHIFTING
TI

SN54CBTD3384FK

10-BIT FET BUS SWITCHES WITH LEVEL SHIFTING
TI

SN54CBTD3384FKR

暂无描述
TI