MAX3232EIDWG4 [TI]
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION; 3V至5.5V多通道RS - 232线路驱动器/接收器【 15千伏IEC ESD保护
| 型号： | MAX3232EIDWG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION |
| 文件： | 总17页 (文件大小：461K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MAX3232E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS664A–AUGUST 2005–REVISED APRIL 2007
FEATURES
APPLICATIONS
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
•
ESD Protection for RS-232 Bus Pins
–
–
–
±15 kV (HBM)
±8 kV (IEC61000-4-2, Contact Discharge)
±15 kV (IEC61000-4-2, Air-Gap Discharge)
•
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
•
•
•
•
•
•
•
Operates With 3-V to 5.5-V VCC Supply
Operates up to 250 kbit/s
D, DB, DW, OR PW PACKAGE
(TOP VIEW)
Two Drivers and Two Receivers
Low Supply Current . . . 300 µA Typ
External Capacitors . . . 4 × 0.1 µF
Accepts 5-V Logic Input With 3.3-V Supply
C1+
V+
V
CC
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND
C1−
DOUT1
RIN1
C2+
C2−
ROUT1
DIN1
Pin Compatible to Alternative High-Speed
Device (1 Mbit/s)
V−
DOUT2
RIN2
DIN2
–
SNx5C3232
ROUT2
DESCRIPTION/ORDERING INFORMATION
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
MAX3232ECD
TOP-SIDE MARKING
Tube of 40
SOIC – D
MAX3232EC
MAX3232EC
MP232EC
MP232EC
MAX3232EI
MAX3232EI
MP232EI
Reel of 2500
Tube of 40
Reel of 2000
Tube of 80
Reel of 2000
Tube of 90
Reel of 2000
Tube of 40
Reel of 2500
Tube of 40
Reel of 2000
Tube of 80
Reel of 2000
Tube of 90
Reel of 2000
MAX3232ECDR
MAX3232ECDW
MAX3232ECDWR
MAX3232ECDB
MAX3232ECDBR
MAX3232ECPW
MAX3232ECPWR
MAX3232EID
SOIC – DW
SSOP – DB
TSSOP – PW
SOIC – D
–0°C to 70°C
MAX3232EIDR
MAX3232EIDW
SOIC – DW
SSOP – DB
TSSOP – PW
MAX3232EIDWR
MAX3232EIDB
–40°C to 85°C
MAX3232EIDBR
MAX3232EIPW
MP232EI
MAX3232EIPWR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
MAX3232E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS664A–AUGUST 2005–REVISED APRIL 2007
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
The MAX3232E device consists of two line drivers, two line receivers, and a dual charge-pump circuit with
±15-kV IEC ESD protection pin to pin (serial-port connection pins, including GND). The device meets the
requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication
controller and the serial-port connector. The charge pump and four small external capacitors allow operation
from a single 3-V to 5.5-V supply. The devices operate at data signaling rates up to 250 kbit/s and a maximum
of 30-V/µs driver output slew rate.
FUNCTION TABLES
ABC
EACH DRIVER(1)
INPUT
DIN
OUTPUT
DOUT
L
H
L
H
(1) H = high level, L = low level
EACH RECEIVER(1)
INPUT
RIN
OUTPUT
ROUT
L
H
H
L
Open
H
(1) H = high level, L = low level,
Open = input disconnected or
connected driver off
LOGIC DIAGRAM (POSITIVE LOGIC)
11
10
12
9
14
DIN1
DIN2
DOUT1
DOUT2
RIN1
7
13
8
ROUT1
ROUT2
RIN2
2
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MAX3232E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS664A–AUGUST 2005–REVISED APRIL 2007
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
–0.3
0.3
MAX
6
UNIT
VCC
V+
Supply voltage range(2)
V
V
V
V
Positive output supply voltage range(2)
Negative output supply voltage range(2)
Supply voltage difference(2)
7
V–
–7
13
V+
–
V–
Drivers
–0.3
–25
6
25
V
V
V
V
VI
Input voltage range
Output voltage range
Receivers
Drivers
–13.2
13.2
VO
Receivers
D package
DB package
DW package
PW package
–0.3 VCC + 0.3
73
82
θJA
Package thermal impedance(3)(4)
°C/W
57
108
150
TJ
Operating virtual junction temperature
Storage temperature range
°C
°C
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
See Figure 4
MIN
NO
M
MAX
UNIT
VCC = 3.3 V
VCC = 5 V
VCC = 3.3 V
VCC = 5 V
DIN
3
4.5
2
3.3
5
3.6
5.5
5.5
5.5
0.8
25
Supply voltage
V
V
VIH Driver high-level input voltage
VIL Driver low-level input voltage
DIN
2.4
0
V
V
VI
Receiver input voltage
–25
0
MAX3232EC
MAX3232EI
70
TA Operating free-air temperature
°C
–40
85
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
Supply current
TEST CONDITIONS
No load, VCC = 3.3 V or 5 V
MIN TYP(2) MAX
0.3
UNIT
ICC
1
mA
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
3
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MAX3232E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS664A–AUGUST 2005–REVISED APRIL 2007
DRIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MIN
5
TYP(2)
5.4
MAX
UNIT
V
VOH
VOL
IIH
High-level output voltage
Low-level output voltage
High-level input current
Low-level input current
DOUT at RL = 3 kΩ to GND,
DIN = GND
DIN = VCC
DOUT at RL = 3 kΩ to GND,
VI = VCC
–5
–5.4
V
±0.01
±0.01
±1
±1
µA
µA
IIL
VI at GND
VCC = 3.6 V,
VO = 0 V
VO = 0 V
VO = ±2 V
(3)
IOS
rO
Short-circuit output current
Output resistance
±35
±60
mA
VCC = 5.5 V,
VCC, V+, and V– = 0 V,
300
10M
Ω
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MIN TYP(2)
MAX
UNIT
CL = 1000 pF,
One DOUT switching,
RL = 3 kΩ,
See Figure 1
Maximum data rate
150
250
300
kbit/s
CL = 150 pF to 2500 pF,
See Figure 2
RL = 3 kΩ to 7 kΩ,
tsk(p)
Pulse skew(3)
ns
CL = 150 pF to 1000 pF
CL = 150 pF to 2500 pF
6
4
30
30
Slew rate, transition region
(see Figure 1)
RL = 3 kΩ to 7 kΩ,
VCC = 3.3 V
SR(tr)
V/µs
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
4
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MAX3232E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS664A–AUGUST 2005–REVISED APRIL 2007
RECEIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
High-level output voltage
Low-level output voltage
TEST CONDITIONS
IOH = –1 mA
MIN
TYP(2)
MAX
UNIT
V
VOH
VOL
VCC – 0.6
VCC – 0.1
IOL = 1.6 mA
VCC = 3.3 V
VCC = 5 V
0.4
2.4
2.4
V
1.5
1.8
1.2
1.5
0.3
5
VIT+
Positive-going input threshold voltage
Negative-going input threshold voltage
V
V
VCC = 3.3 V
VCC = 5 V
0.6
0.8
VIT–
Vhys
ri
Input hysteresis (VIT+ – VIT–
)
V
Input resistance
VI = ±3 V to ±25 V
3
7
kΩ
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 3)
PARAMETER
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Pulse skew(3)
TEST CONDITIONS
TYP(2)
300
UNIT
ns
tPLH
tPHL
tsk(p)
CL = 150 pF
300
ns
300
ns
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
5
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MAX3232E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS664A–AUGUST 2005–REVISED APRIL 2007
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
t
t
C
L
THL
TLH
R
L
(see Note A)
V
V
OH
3 V
−3 V
3 V
−3 V
Output
TLH
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
6 V
or t
SR(tr) +
t
THL
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 1. Driver Slew Rate
3 V
0 V
RS-232
Output
1.5 V
1.5 V
Input
Generator
(see Note B)
50 Ω
C
L
t
t
PHL
PLH
R
L
(see Note A)
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 2. Driver Pulse Skew
3 V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
t
t
PHL
PLH
C
L
(see Note A)
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 3. Receiver Propagation Delay Times
6
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MAX3232E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS664A–AUGUST 2005–REVISED APRIL 2007
APPLICATION INFORMATION
1
2
3
4
16
V
CC
C1+
V+
+
−
C
BYPASS
= 0.1µF
+
−
15
14
GND
C1
+
−
†
C3
DOUT1
C1−
C2+
C2−
13
RIN1
+
−
5 kΩ
C2
5
6
12
11
ROUT1
DIN1
V−
−
+
C4
7
8
10
9
DOUT2
RIN2
DIN2
ROUT2
5 kΩ
†
C3 can be connected to V or GND.
CC
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
V
CC
vs CAPACITOR VALUES
V
CC
C1
C2, C3, C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
Figure 4. Typical Operating Circuit and Capacitor Values
7
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
MAX3232ECD
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232ECDB
SSOP
SSOP
SSOP
SSOP
SSOP
SSOP
SOIC
DB
DB
DB
DB
DB
DB
D
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232ECDBE4
MAX3232ECDBG4
MAX3232ECDBR
MAX3232ECDBRE4
MAX3232ECDBRG4
MAX3232ECDE4
MAX3232ECDG4
MAX3232ECDR
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232ECDRE4
MAX3232ECDRG4
MAX3232ECDW
MAX3232ECDWG4
MAX3232ECDWR
MAX3232ECDWRG4
MAX3232ECPW
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
DW
DW
DW
DW
PW
PW
PW
PW
PW
PW
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232ECPWE4
MAX3232ECPWG4
MAX3232ECPWR
MAX3232ECPWRE4
MAX3232ECPWRG4
MAX3232EID
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232EIDB
SSOP
SSOP
DB
DB
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232EIDBE4
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
Orderable Device
MAX3232EIDBG4
MAX3232EIDBR
MAX3232EIDBRE4
MAX3232EIDBRG4
MAX3232EIDE4
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DB
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
SSOP
SSOP
SOIC
DB
DB
DB
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232EIDG4
MAX3232EIDR
SOIC
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232EIDRE4
MAX3232EIDRG4
MAX3232EIDW
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
DW
DW
DW
DW
PW
PW
PW
PW
PW
PW
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232EIDWG4
MAX3232EIDWR
MAX3232EIDWRG4
MAX3232EIPW
SOIC
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232EIPWE4
MAX3232EIPWG4
MAX3232EIPWR
MAX3232EIPWRE4
MAX3232EIPWRG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF MAX3232E :
Automotive: MAX3232E-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
MAX3232ECDBR
MAX3232ECDR
MAX3232ECDWR
MAX3232ECPWR
MAX3232EIDBR
MAX3232EIDR
SSOP
SOIC
DB
D
16
16
16
16
16
16
16
16
2000
2500
2000
2000
2000
2500
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
16.4
12.4
16.4
16.4
16.4
12.4
8.2
6.5
6.6
10.3
10.7
5.6
2.5
2.1
2.7
1.6
2.5
2.1
2.7
1.6
12.0
8.0
16.0
16.0
16.0
12.0
16.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
SOIC
DW
PW
DB
D
10.75
7.0
12.0
8.0
TSSOP
SSOP
SOIC
8.2
6.6
12.0
8.0
6.5
10.3
10.7
5.6
MAX3232EIDWR
MAX3232EIPWR
SOIC
DW
PW
10.75
7.0
12.0
8.0
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
MAX3232ECDBR
MAX3232ECDR
MAX3232ECDWR
MAX3232ECPWR
MAX3232EIDBR
MAX3232EIDR
SSOP
SOIC
DB
D
16
16
16
16
16
16
16
16
2000
2500
2000
2000
2000
2500
2000
2000
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
33.0
33.0
33.0
29.0
33.0
33.0
33.0
29.0
SOIC
DW
PW
DB
D
TSSOP
SSOP
SOIC
MAX3232EIDWR
MAX3232EIPWR
SOIC
DW
PW
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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