MAX3232EIPWRQ1 [TI]
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION; 3V至5.5V多通道RS - 232线路驱动器/接收器，具有± 15 kV的IEC ESD保护
| 型号： | MAX3232EIPWRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION |
| 文件： | 总10页 (文件大小：200K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MAX3232E-Q1
www.ti.com
SLLS676A–DECEMBER 2005–REVISED FEBRUARY 2008
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
1
FEATURES
PW PACKAGE
(TOP VIEW)
•
Qualified for Automotive Applications
•
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
C1+
V+
VCC
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND
•
•
•
•
•
•
•
Operates With 3-V to 5.5-V VCC Supply
Operates up to 250 kbit/s
C1−
DOUT1
RIN1
C2+
Two Drivers and Two Receivers
C2−
ROUT1
DIN1
Low Standby Current . . .300 µA Typical
External Capacitors . . . 4 × 0.1 µF
Accepts 5-V Logic Input With 3.3-V Supply
V−
DOUT2
RIN2
DIN2
ROUT2
Pin Compatible to Alternative High-Speed
Pin-Compatible Device (1 Mbit/s): SNx5C3232
DESCRIPTION
The MAX3232E device consists of two line drivers, two line receivers, and a dual charge-pump circuit with
±15-kV IEC ESD protection pin to pin (serial-port connection pins, including GND). The device meets the
requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication
controller and the serial-port connector. The charge pump and four small external capacitors allow operation from
a single 3-V to 5.5-V supply. The device operates at data signaling rates up to 250 kbit/s and a maximum of
30-V/µs driver output slew rate.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–40°C to 85°C
TSSOP – PW
Reel of 2000
MAX3232EIPWRQ1
MB3232I
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
FUNCTION TABLE
EACH DRIVER(1)
EACH RECEIVER(1)
OUTPUT
INPUT
DIN
OUTPUT
DOUT
INPUT
RIN
ROUT
L
H
L
L
H
H
L
H
Open
H
(1) H = high level, L = low level, Open = input disconnected or connected driver off
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2008, Texas Instruments Incorporated
MAX3232E-Q1
www.ti.com
SLLS676A–DECEMBER 2005–REVISED FEBRUARY 2008
LOGIC DIAGRAM (POSITIVE LOGIC)
11
10
12
9
14
DIN1
DIN2
DOUT1
DOUT2
RIN1
7
13
8
ROUT1
ROUT2
RIN2
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
–0.3 to 6
–0.3 to 7
0.3 to –7
13
UNIT
V
VCC
Supply voltage range(2)
V+
Positive output supply voltage range(2)
Negative output supply voltage range(2)
Supply voltage difference(2)
V
V–
V
V+ – V–
V
Drivers
–0.3 to 6
–25 to 25
–13.2 to 13.2
–0.3 to VCC + 0.3
108
V
VI
Input voltage range
Receivers
Drivers
V
V
VO
Output voltage range
Receivers
V
θJA
TJ
Package thermal impedance(3) (4)
°C/W
°C
°C
Operating virtual junction temperature
Storage temperature range
150
Tstg
–65 to 150
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS(1)
see Figure 4
MIN
3
NOM
3.3
5
MAX
3.6
5.5
5.5
5.5
0.8
25
UNIT
VCC = 3.3 V
VCC = 5 V
Supply voltage
V
4.5
2
VCC = 3.3 V
VCC = 5 V
VIH
Driver high-level input voltage
DIN
DIN
V
2.4
0
VIL
VI
Driver low-level input voltage
Receiver input voltage
V
V
–25
–40
TA
Operating free-air temperature
MAX3232I
85
°C
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ±0.5 V.
2
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Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): MAX3232E-Q1
MAX3232E-Q1
www.ti.com
SLLS676A–DECEMBER 2005–REVISED FEBRUARY 2008
ELECTRICAL CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS(1)
MIN
TYP(2)
MAX UNIT
mA
ICC
Supply current
No load, VCC = 3.3 V or 5 V
0.3
1
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V and TA = 25°C.
DRIVER SECTION – ELECTRICAL CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS(1)
DOUT at RL = 3 kΩ to GND, DIN = GND
DOUT at RL = 3 kΩ to GND, DIN = VCC
VI = VCC
MIN
5
TYP(2)
5.4
MAX UNIT
VOH High-level output voltage
V
V
VOL
IIH
Low-level output voltage
High-level input current
Low-level input current
–5
–5.4
±0.01
±0.01
±1
±1
µA
µA
IIL
VI at GND
VCC = 3.6 V, VO = 0 V
IOS
ro
Short-circuit output current(3)
Output resistance
±35
±60
mA
VCC = 5.5 V, VO = 0 V
VCC, V+, and V– = 0 V, VO = 2 V
300
10M
Ω
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V and TA = 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one
output should be shorted at a time.
DRIVER SECTION – SWITCHING CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS(1)
MIN
TYP(2)
MAX
UNIT
CL = 1000 pF, One DOUT switching,
RL = 3 kΩ, See Figure 1
Maximum data rate
150
250
kbit/s
CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ,
See Figure 2
tsk(p)
Pulse skew(3)
300
ns
CL = 150 pF to 1000 pF
CL = 150 pF to 2500 pF
6
4
30
30
Slew rate, transition region
(see Figure 1)
RL = 3 kΩ to 7 kΩ,
VCC = 3.3 V
SR(tr)
v/µs
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
RECEIVER SECTION – ELECTRICAL CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4 )
PARAMETER
High-level output voltage
Low-level output voltage
TEST CONDITIONS(1)
IOH = –1 mA
MIN
TYP(2)
MAX UNIT
VOH
VOL
VCC – 0.6 V
VCC – 0.1 V
V
IOL = 1.6 mA
VCC = 3.3 V
VCC = 5 V
0.4
2.4
2.4
V
1.5
1.8
1.2
1.5
0.3
5
VIT+
Positive-going input threshold voltage
Negative-going input threshold voltage
V
VCC = 3.3 V
VCC = 5 V
0.6
0.8
VIT–
V
Vhys
rI
Input hysteresis (VIT+ – VIT–
)
V
Input resistance
VI = ±3 V to ±25 V
3
7
kΩ
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V and TA = 25°C.
Copyright © 2005–2008, Texas Instruments Incorporated
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3
Product Folder Link(s): MAX3232E-Q1
MAX3232E-Q1
www.ti.com
SLLS676A–DECEMBER 2005–REVISED FEBRUARY 2008
RECEIVER SECTION – SWITCHING CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 3)
PARAMETER
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Pulse skew(3)
TEST CONDITIONS(1)
TYP(2) UNIT
tPLH
tPHL
tsk(p)
CL = 150 pF
CL = 150 pF
300
300
300
ns
ns
ns
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
4
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Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): MAX3232E-Q1
MAX3232E-Q1
www.ti.com
SLLS676A–DECEMBER 2005–REVISED FEBRUARY 2008
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
t
t
C
L
THL
TLH
R
L
(see Note A)
V
V
OH
3 V
−3 V
3 V
−3 V
Output
TLH
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
6 V
or t
SR(tr) +
t
THL
A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3 V
0 V
RS-232
Output
1.5 V
1.5 V
Input
Generator
(see Note B)
50 Ω
C
L
t
t
PLH
PHL
R
L
(see Note A)
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
A. CL includes probe and jig capacitance.
VOLTAGE WAVEFORMS
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
3 V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
t
t
PLH
PHL
C
L
(see Note A)
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
Copyright © 2005–2008, Texas Instruments Incorporated
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Product Folder Link(s): MAX3232E-Q1
MAX3232E-Q1
www.ti.com
SLLS676A–DECEMBER 2005–REVISED FEBRUARY 2008
APPLICATION INFORMATION
1
2
3
4
16
V
CC
C1+
V+
+
−
C
BYPASS
= 0.1µF
+
−
15
14
GND
C1
+
−
†
C3
DOUT1
C1−
C2+
C2−
13
RIN1
+
−
5 kΩ
C2
5
6
12
11
ROUT1
DIN1
V−
−
+
C4
7
8
10
9
DOUT2
RIN2
DIN2
ROUT2
5 kΩ
†
C3 can be connected to V or GND.
CC
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
V
CC
vs CAPACITOR VALUES
V
CC
C1
C2, C3, C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
Figure 4. Typical Operating Circuit and Capacitor Values
6
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Product Folder Link(s): MAX3232E-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
13-May-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
MAX3232EIPWRQ1
ACTIVE
TSSOP
PW
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
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OTHER QUALIFIED VERSIONS OF MAX3232E-Q1 :
Catalog: MAX3232E
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 1
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