LP3984IMFX-2.5 [TI]
2.5V FIXED POSITIVE LDO REGULATOR, 0.1V DROPOUT, PDSO5, SOT-23, SOP-5;
| 型号： | LP3984IMFX-2.5 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 2.5V FIXED POSITIVE LDO REGULATOR, 0.1V DROPOUT, PDSO5, SOT-23, SOP-5 光电二极管 输出元件 调节器 |
| 文件： | 总12页 (文件大小：311K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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PRELIMINARY
October 2001
LP3984
Micropower, 150mA Ultra Low-Dropout CMOS Voltage
Regulator in Subminiature 4-I/O micro SMD Package
@
n 55dB PSRR at 1kHz, 40dB at 10kHz 3.1VIN
General Description
The LP3984 is designed for portable and wireless applica-
tions with demanding performance and space requirements.
n ≤1.5µA quiescent current when shut down
n Fast Turn-On time: 20 µs (typ.)
n 60mV typ dropout with 150mA load
n −40 to +125˚C junction temperature range for operation
n 1.5V, 1.8V, 2.0V, and 3.1V
The LP3984’s performance is optimized for battery powered
systems to deliver extremely low dropout voltage and low
quiescent current. Regulator ground current increases only
slightly in dropout, further prolonging the battery life.
Features
Power supply rejection is better than 60 dB at low frequen-
cies and starts to roll off at 10 kHz. High power supply
rejection is maintained down to lower input voltage levels
common to battery operated circuits.
n Miniature 4-I/O micro SMD and SOT-23-5 package
n Logic controlled enable
n Stable with tantalum capacitors
n 1 µF Tantalum output capacitor
n Fast turn-on
The device is ideal for mobile phone and similar battery
powered wireless applications. It provides up to 150 mA,
from a 2.5V to 6V input, consuming less than 1.5µA in
disable mode and has fast turn-on time less than 20µs.
n Thermal shutdown and short-circuit current limit
The LP3984 is available in micro SMD and 5 pin SOT-23
package. Performance is specified for −40˚C to +85˚C tem-
perature range and is available in 1.5V, 1.8V, 2.0V, and 3.1V
output voltages. For other output voltage options from 1.5V
to 3.5V, please contact National Semiconductor sales office.
Applications
n CDMA cellular handsets
n Wideband CDMA cellular handsets
n GSM cellular handsets
n Portable information appliances
±
n Tiny 3.3V 5% to 3.1V, 150mA converter
Key Specifications
n 2.5 to 6.0V input range
n 150mA guaranteed output
Typical Application Circuit
20020402
Note: Pin Numbers in parenthesis indicate micro SMD package.
© 2001 National Semiconductor Corporation
DS200204
www.national.com
Block Diagram
20020401
Pin Descriptions
Name
VEN
µSMD
SOT
Function
4
1
2
3
3
2
5
1
4
Enable Input Logic, Enable High
Common Ground
GND
VOUT
VIN
Output Voltage of the LDO
Input Voltage of the LDO
No Connection
N.C.
Connection Diagrams
micro SMD, 4 Bump Package (BPA04A)
SOT-23-5 Package (MF)
20020407
Top View
See NS Package Number MF05A
20020470
Top View
See NS Package Number BPA04
Note: The actual physical placement of the package marking will vary from
part to part. The package marking ’X’ will designate the date code and will
vary considerably. Package marking does not correlate to device type in
any way.
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2
Ordering Information
For micro SMD Package
Output
LP3984 Supplied as 250
Units, Tape and Reel
LP3984IBP-1.5
LP3984 Supplied as 3000
Units, Tape and Reel
LP3984IBPX-1.5
Grade
Voltage (V)
1.5
1.8
2.0
3.1
STD
STD
STD
STD
LP3984IBP-1.8
LP3984IBPX-1.8
LP3984IBP-2.0
LP3984IBPX-2.0
LP3984IBP-3.1
LP3984IBPX-3.1
For SOT Package
Output
LP3984 Supplied as 1000
LP3984 Supplied as 3000
Grade
Package Marking
Voltage (V)
Units, Tape and Reel
LP3984IMF-1.5
LP3984IMF-1.8
LP3984IMF-2.0
LP3984IMF-2.5
LP3984IMF-2.8
LP3984IMF-3.0
LP3984IMF-3.1
Units, Tape and Reel
LP3984IMFX-1.5
LP3984IMFX-1.8
LP3984IMFX-2.0
LP3984IMFX-2.5
LP3984IMFX-2.8
LP3984IMFX-3.0
LP3984IMFX-3.1
1.5
1.8
2.0
2.5
2.8
3.0
3.1
STD
STD
STD
STD
STD
STD
STD
LEAB
LEBB
LECB
LEDB
LEEB
*
Please contact factory for availability.
3
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Absolute Maximum Ratings (Notes 1,
2)
ESD Rating(Note 5)
Human Body Model
Machine Model
2kV
150V
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Operating Ratings (Notes 1, 2)
V
IN,VOUT, VEN
−0.3 to 6.5V
150˚C
VIN
2.5 to 6V
Junction Temperature
Storage Temperature
Lead Temp. (Note 3)
Pad Temp. (Note 3)
Power Dissipation (Note 4)
θJA (SOT23-5)
VEN
0 to (VIN + 0.3V)
−40˚C to +125˚C
−65˚C to +150˚C
235˚C
Junction Temperature
Maximum Power Dissipation (Note 6)
SOT23-5
235˚C
250mW
160mW
micro SMD
220˚C/W
340˚C/W
θJA (micro SMD)
Electrical Characteristics
Unless otherwise specified: VIN = 2.5V for 1.5, 1.8, & 2.0V options, VIN = VOUT + 0.5 for output options higher than 2.5V, CIN
=
1 µF, IOUT = 1mA, COUT = 1 µF, tantalum. Typical values and imits appearing in standard typeface are for TJ = 25˚C. Limits
appearing in boldface type apply over the entire junction temperature range for operation, −40˚C to +125˚C. (Note 7) (Note 8)
Limit
Symbol
Parameter
Output Voltage
Conditions
Typ
Units
Min
−2
Max
2
% of
Tolerance
−3
3
VOUT(nom)
Line Regulation Error
VIN = 2.5V to 6V for 1.5, 1.8, 2.0V
options
0.05
−0.15
0.15
%/V
VIN = (VOUT + 0.5V) to 6.0V for
Voltage options higher than 2.5V
IOUT = 1 mA to 150 mA
LP3984IM5 (SOT23-5)
LP3984IBP (micro SMD)
VIN = VOUT(nom) + 0.2V,
f = 1 kHz,
∆VOUT
Load Regulation Error
(Note 9)
0.0025
0.005
%/mA
0.0004
60
0.002
IOUT = 50 mA (Figure 2)
VIN = VOUT(nom) + 0.2V,
f = 10 kHz,
PSRR
Power Supply Rejection Ratio
dB
50
IOUT = 50 mA (Figure 2)
VEN = 1.4V, IOUT = 0 mA
VEN = 1.4V, IOUT = 0 to 150 mA
VEN = 0.4V
IQ
Quiescent Current
80
110
0.003
0.6
125
150
1.5
2
µA
Dropout Voltage (Note 10)
IOUT = 1 mA
IOUT = 50 mA
25
40
mV
IOUT = 100 mA
45
70
IOUT = 150 mA
60
100
ISC
Short Circuit Current Limit
Output Grounded
600
mA
mA
(Steady State)
IOUT(PK)
TON
Peak Output Current
Turn-On Time
VOUT ≥ VOUT(nom) - 5%
550
200
300
µs
(Note 11)
en
Output Noise Voltage
BW = 10 Hz to 100 kHz,
COUT = 1µF tant.
90
µVrms
±
IEN
VIL
Maximum Input Current at EN
Maximum Low Level Input
Voltage at EN
VEN = 0.4 and VIN = 6.0
VIN = 2.5 to 6.0V
1
nA
V
0.4
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4
Electrical Characteristics (Continued)
Unless otherwise specified: VIN = 2.5V for 1.5, 1.8, & 2.0V options, VIN = VOUT + 0.5 for output options higher than 2.5V, CIN
1 µF, IOUT = 1mA, COUT = 1 µF, tantalum. Typical values and imits appearing in standard typeface are for TJ = 25˚C. Limits
=
appearing in boldface type apply over the entire junction temperature range for operation, −40˚C to +125˚C. (Note 7) (Note 8)
Limit
Symbol
VIH
Parameter
Conditions
VIN = 2.5 to 6.0V
Typ
Units
Min
1.4
Max
Minimum High Level Input
Voltage at EN
V
COUT
TSD
Output Capacitor
Capacitance
ESR
1
2
22
10
µF
Ω
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
160
20
˚C
˚C
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device
is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical
Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: Additional information on lead temperature and pad temperature can be found in National Semiconductor Application Note (AN-1112).
Note 4: The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using the formula:
P
= (T - T )/θ ,
J A JA
D
where T is the junction temperature, T is the ambient temperature, and θ is the junction-to-ambient thermal resistance. The 364mW rating appearing under
JA
J
A
Absolute Maximum Ratings results from substituting the Absolute Maximum junction temperature, 150˚C, for T , 70˚C for T , and 220˚C/W for θ . More power can
J
A
JA
be dissipated safely at ambient temperatures below 70˚C . Less power can be dissipated safely at ambient temperatures above 70˚C. The Absolute Maximum power
dissipation can be increased by 4.5mW for each degree below 70˚C, and it must be derated by 4.5mW for each degree above 70˚C.
Note 5: The human body model is 100pF discharged through 1.5kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each
pin.
Note 6: Like the Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature. The 250mW rating
appearing under Operating Ratings results from substituting the maximum junction temperature for operation, 125˚C, for T , 70˚C for T , and 220˚C/W for θ into
J
A
JA
(Note 4) above. More power can be dissipated at ambient temperatures below 70˚C . Less power can be dissipated at ambient temperatures above 70˚C. The
maximum power dissipation for operation can be increased by 4.5mW for each degree below 70˚C, and it must be derated by 4.5mW for each degree above 70˚C.
Note 7: All limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production with T = 25˚C or correlated using
J
Statistical Quality Control (SQC) methods. All hot and cold limits are guaranteed by correlating the electrical characteristics to process and temperature variations
and applying statistical process control.
Note 8: The target output voltage, which is labeled V
, is the desired voltage option.
OUT(nom)
Note 9: An increase in the load current results in a slight decrease in the output voltage and vice versa.
Note 10: Dropout voltage is the input-to-output voltage difference at which the output voltage is 100mV below its nominal value. This specification does not apply
for input voltages below 2.5V.
Note 11: Turn-on time is time measured between the enable input just exceeding V and the output voltage just reaching 95% of its nominal value.
IH
20020408
FIGURE 1. Output AC Line Regulation Input Perturbation
5
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20020409
FIGURE 2. PSRR Input Perturbation
Typical Performance Characteristics Unless otherwise specified, CIN = COUT = 1 µF Tantalum, VIN
= 2.5 for 1.5, 1.8, and 2.0V options, VIN = VOUT + 0.2V for output options higher than 2.5V, TA = 25˚C, Enable pin is tied to
VIN
.
Power Supply Rejection Ratio (VIN = 3.5V
Power Supply Rejection Ratio (VIN = 3.5V
20020403
20020404
Power Supply Rejection Ratio (VIN = 3.5V
Power Supply Rejection Ratio (LP3984-1.5, VIN = 2.5V)
20020420
20020419
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6
Typical Performance Characteristics Unless otherwise specified, CIN = COUT = 1 µF Tantalum, VIN
= 2.5 for 1.5, 1.8, and 2.0V options, VIN = VOUT + 0.2V for output options higher than 2.5V, TA = 25˚C, Enable pin is tied to
VIN. (Continued)
Line Transient Response (LP3984-3.1)
Line Transient Response (LP3984-3.1)
20020418
20020417
Line Transient Response (LP3984-3.1)
Line Transient Response (LP3984-3.1)
20020416
20020415
Line Transient Response (LP3984-3.1)
Line Transient Response (LP3984-3.1)
20020414
20020413
7
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Typical Performance Characteristics Unless otherwise specified, CIN = COUT = 1 µF Tantalum, VIN
= 2.5 for 1.5, 1.8, and 2.0V options, VIN = VOUT + 0.2V for output options higher than 2.5V, TA = 25˚C, Enable pin is tied to
VIN. (Continued)
Start Up Response
Start Up Response
20020412
20020411
Enable Response
Load Transient Response (LP3984-3.1
20020410
20020408
Load Transient Response (LP3984-3.1)
Load Transient Response (VIN = 4.2V)
20020406
20020405
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8
On/Off Input Operation
Application Hints
The LP3984 is turned off by pulling the VEN pin low, and
turned on by pulling it high. If this feature is not used, the VEN
pin should be tied to VIN to keep the regulator output on at all
time. To assure proper operation, the signal source used to
drive the VEN input must be able to swing above and below
the specified turn-on/off voltage thresholds listed in the Elec-
External Capacitors
Like any low-dropout regulator, the LP3984 requires external
capacitors for regulator stability. The LP3984 is specifically
designed for portable applications requiring minimum board
space and smallest components. These capacitors must be
correctly selected for good performance.
trical Characteristics section under VIL and VIH
.
Fast On-Time
Input Capacitor
The LP3984 utilizes a speed up circuitry to ramp up the
internal VREF voltage to its final value to achieve a fast
output turn on time.
An input capacitance of ) 1µF is required between the
LP3984 input pin and ground (the amount of the capacitance
may be increased without limit).
This capacitor must be located a distance of not more than
1cm from the input pin and returned to a clean analog
ground. Any good quality ceramic, tantalum, or film capacitor
may be used at the input.
Micro SMD Mounting
The micro SMD package requires specific mounting tech-
niques which are detailed in National Semiconductor Appli-
cation Note (AN-1112). Referring to the section Surface
Mount Technology (SMT) Assembly Considerations, it
should be noted that the pad style which must be used with
the 5 pin package is NSMD (non-solder mask defined) type.
Important: Tantalum capacitors can suffer catastrophic fail-
ures due to surge current when connected to
a
low-impedance source of power (like a battery or a very
large capacitor). If a tantalum capacitor is used at the input,
it must be guaranteed by the manufacturer to have a surge
current rating sufficient for the application.
For best results during assembly, alignment ordinals on the
PC board may be used to facilitate placement of the micro
SMD device.
There are no requirements for the ESR on the input capaci-
tor, but tolerance and temperature coefficient must be con-
sidered when selecting the capacitor to ensure the capaci-
tance will be ) 1µF over the entire operating temperature
range.
Micro SMD Light Sensitivity
Exposing the micro SMD device to direct sunlight will cause
misoperation of the device. Light sources such as Halogen
lamps can effect electrical performance if brought near to the
device.
Output Capacitor
The wavelengths which have most detrimental effect are
reds and infra-reds, which means that the fluorescent light-
ing used inside most buildings has very little effect on per-
formance. A micro SMD test board was brought to within
1cm of a fluorescent desk lamp and the effect on the regu-
lated output voltage was negligible, showing a deviation of
less than 0.1% from nominal.
The LP3984 is designed specifically to work with tantalum
output capacitors. A tantalum capacitor in 1 to 22 µF range
with 2Ω to 10Ω ESR range is suitable in the LP3984 appli-
cation circuit.
It may also be possible to use film capacitors at the output,
but these are not as attractive for reasons of size and cost
(see next section Capacitor Characteristics).
The output capacitor must meet the requirement for mini-
mum amount of capacitance and also have an ESR (Equiva-
lent Series Resistance) value which is within a stable range
(2Ω to 10Ω).
No-Load Stability
The LP3984 will remain stable and in regulation with no
external load. This is specially important in CMOS RAM
keep-alive applications.
9
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Physical Dimensions inches (millimeters)
unless otherwise noted
5-Lead Small Outline Package (MF)
NS Package Number MF05A
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10
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
NS Package Number bpa04
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
National Semiconductor
Corporation
Americas
National Semiconductor
Europe
National Semiconductor
Asia Pacific Customer
Response Group
Tel: 65-2544466
Fax: 65-2504466
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Japan Ltd.
Tel: 81-3-5639-7560
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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