LP3985IBL-2.7/NOPB [TI]

2.7 V FIXED POSITIVE LDO REGULATOR, 0.1 V DROPOUT, PBGA5;
LP3985IBL-2.7/NOPB
型号: LP3985IBL-2.7/NOPB
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

2.7 V FIXED POSITIVE LDO REGULATOR, 0.1 V DROPOUT, PBGA5

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National Semiconductor is now part of  
Texas Instruments.  
Search http://www.ti.com/ for the latest technical  
information and details on our current products and services.  
August 2005  
LP3985  
Micropower, 150mA Low-Noise Ultra Low-Dropout CMOS  
Voltage Regulator  
2.6V, 2.7V, 2.8V, 2.85V, 2.9V, 3.0V. 3.1V, 3.2V, 3.3V, 4.7V,  
General Description  
4.75V, 4.8V and 5.0V output voltages. For other output volt-  
The LP3985 is designed for portable and wireless applica-  
age options between 2.5V to 5.0V or for a dual LP3985,  
tions with demanding performance and space requirements.  
please contact National Semiconductor sales office.  
The LP3985 is stable with a small 1µF 30% ceramic or  
high-quality tantalum output capacitor. The micro SMD re-  
quires the smallest possible PC board area - the total appli-  
cation circuit area can be less than 2.0mm x 2.5mm, a  
fraction of a 1206 case size.  
Key Specifications  
n 2.5 to 6.0V input range  
n 150mA guaranteed output  
@
n 50dB PSRR at 1kHz VIN = VOUT + 0.2V  
The LP3985’s performance is optimized for battery powered  
systems to deliver ultra low noise, extremely low dropout  
voltage and low quiescent current. Regulator ground current  
increases only slightly in dropout, further prolonging the  
battery life.  
n 1.5µA quiescent current when shut down  
n Fast Turn-On time: 200 µs (typ.)  
n 100mV maximum dropout with 150mA load  
n 30µVrms output noise (typ) over 10Hz to 100kHz  
n −40 to +125˚C junction temperature range for operation  
n 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 2.9V, 3.0V, 3.1V, 3.2V,  
3.3V, 4.7V, 4.75V, 4.8V and 5.0V outputs standard  
An optional external bypass capacitor reduces the output  
noise without slowing down the load transient response.  
Fast start-up time is achieved by utilizing an internal  
power-on circuit that actively pre-charges the bypass capaci-  
tor.  
Features  
Power supply rejection is better than 50 dB at low frequen-  
cies and starts to roll off at 1kHz. High power supply rejection  
is maintained down to low input voltage levels common to  
battery operated circuits.  
n Miniature 5-I/O micro SMD and SOT-23-5 package  
n Logic controlled enable  
n Stable with ceramic and high quality tantalum capacitors  
n Fast turn-on  
n Thermal shutdown and short-circuit current limit  
The device is ideal for mobile phone and similar battery  
powered wireless applications. It provides up to 150 mA,  
from a 2.5V to 6V input. The LP3985 consumes less than  
1.5µA in disable mode and has fast turn-on time less than  
200µs.  
Applications  
n CDMA cellular handsets  
n Wideband CDMA cellular handsets  
n GSM cellular handsets  
The LP3985 is available in a 5 bump small bump micro SMD,  
a 5 bump large bump micro SMD, a 5 bump thin micro SMD  
and a 5 pin SOT-23 package. Performance is specified for  
−40˚C to +125˚C temperature range and is available in 2.5V,  
n Portable information appliances  
Typical Application Circuit  
10136402  
Note: Pin Numbers in parenthesis indicate micro SMD package.  
* Optional Noise Reduction Capacitor.  
© 2005 National Semiconductor Corporation  
DS101364  
www.national.com  
Block Diagram  
10136401  
Pin Description  
Name  
* micro SMD  
SOT  
Function  
Enable Input Logic, Enable High  
Common Ground  
VEN  
GND  
A1  
B2  
C1  
C3  
A3  
3
2
5
1
4
VOUT  
Output Voltage of the LDO  
Input Voltage of the LDO  
VIN  
BYPASS  
Optional Bypass Capacitor for Noise  
Reduction  
* The pin numbering scheme for the micro SMD package was revised in April 2002 to conform to JEDEC standard. Only the pin numbers were  
revised. No changes to the physical location of the inputs/outputs were made. For reference purposes, the obsolete numbering scheme had VEN  
as pin 1, GND as pin 2, VOUT as pin 3, VIN as pin 4, and BYPASS as pin 5.  
Connection Diagrams  
SOT 23-5 Package (MF)  
5 Bump micro SMD Package (BPA05, BLA05, TLA05)  
10136407  
Top View  
See NS Package Number MF05A  
10136470  
Top View  
See NS Package Number BPA05, BLA05, TLA05  
www.national.com  
2
Ordering Information  
BP refers to 0.170mm bump size, 0.900mm height for micro SMD Package  
Output  
Voltage (V)  
2.5  
LP3985 Supplied as 250  
Units, Tape and Reel  
LP3985IBP-2.5  
LP3985IBP-2.6  
LP3985IBP-2.7  
LP3985IBP-2.8  
LP3985IBP-285  
LP3985IBP-2.9  
LP3985IBP-3.0  
LP3985IBP-3.1  
LP3985IBP-3.2  
LP3985IBP-3.3  
LP3985IBP-4.7  
LP3985IBP-5.0  
LP3985 Supplied as 3000  
Units, Tape and Reel  
LP3985IBPX-2.5  
LP3985IBPX-2.6  
LP3985IBPX-2.7  
LP3985IBPX-2.8  
LP3985IBPX-285  
LP3985IBPX-2.9  
LP3985IBPX-3.0  
LP3985IBPX-3.1  
LP3985IBPX-3.2  
LP3985IBPX-3.3  
LP3985IBPX-4.7  
LP3985IBPX-5.0  
Grade  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
2.6  
2.7  
2.8  
2.85  
2.9  
3.0  
3.1  
3.2  
3.3  
4.7  
5.0  
BL refers to 0.300mm bump size, 0.995mm height for micro SMD Package  
Output  
Voltage (V)  
2.5  
LP3985 Supplied as 250  
Units, Tape and Reel  
LP3985IBL-2.5  
LP3985IBL-2.6  
LP3985IBL-2.7  
LP3985IBL-2.8  
LP3985IBL-285  
LP3985IBL-2.9  
LP3985IBL-3.0  
LP3985IBL-3.1  
LP3985IBL-3.2  
LP3985IBL-3.3  
LP3985IBL-4.8  
LP3985IBL-5.0  
LP3985 Supplied as 3000  
Grade  
Units, Tape and Reel  
LP3985IBLX-2.5  
LP3985IBLX-2.6  
LP3985IBLX-2.7  
LP3985IBLX-2.8  
LP3985IBLX-285  
LP3985IBLX-2.9  
LP3985IBLX-3.0  
LP3985IBLX-3.1  
LP3985IBLX-3.2  
LP3985IBLX-3.3  
LP3985IBLX-4.8  
LP3985IBLX-5.0  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
2.6  
2.7  
2.8  
2.85  
2.9  
3.0  
3.1  
3.2  
3.3  
4.8  
5.0  
TL refers to 0.300mm bump size, 0.600mm height for micro SMD Package  
Output  
Voltage (V)  
2.5  
LP3985 Supplied as 250  
Units, Tape and Reel  
LP3985ITL-2.5  
LP3985ITL-2.6  
LP3985ITL-2.7  
LP3985ITL-2.8  
LP3985ITL-285  
LP3985ITL-2.9  
LP3985ITL-3.0  
LP3985ITL-3.1  
LP3985ITL-3.2  
LP3985ITL-3.3  
LP3985ITL-4.75  
LP3985ITL-4.8  
LP3985ITL-5.0  
LP3985 Supplied as 3000  
Grade  
Units, Tape and Reel  
LP3985ITLX-2.5  
LP3985ITLX-2.6  
LP3985ITLX-2.7  
LP3985ITLX-2.8  
LP3985ITLX-285  
LP3985ITLX-2.9  
LP3985ITLX-3.0  
LP3985ITLX-3.1  
LP3985ITLX-3.2  
LP3985ITLX-3.3  
LP3985ITLX-4.75  
LP3985ITLX-4.8  
LP3985ITLX-5.0  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
2.6  
2.7  
2.8  
2.85  
2.9  
3.0  
3.1  
3.2  
3.3  
4.75  
4.8  
5.0  
3
www.national.com  
Ordering Information (Continued)  
For SOT Package  
LP3985 Supplied as 1000  
Units, Tape and Reel  
Output  
Voltage (V)  
2.5  
LP3985 Supplied as 3000  
Units, Tape and Reel  
LP3985IM5X-2.5  
LP3985IM5X-2.6  
LP3985IM5X-2.7  
LP3985IM5X-2.8  
LP3985IM5X-285  
LP3985IM5X-2.9  
LP3985IM5X-3.0  
LP3985IM5X-3.1  
LP3985IM5X-3.2  
LP3985IM5X-3.3  
LP3985IM5X-4.7  
LP3985IM5X-5.0  
Grade  
Package Marking  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
STD  
LP3985IM5-2.5  
LP3985IM5-2.6  
LP3985IM5-2.7  
LP3985IM5-2.8  
LP3985IM5-285  
LP3985IM5-2.9  
LP3985IM5-3.0  
LP3985IM5-3.1  
LP3985IM5-3.2  
LP3985IM5-3.3  
LP3985IM5-4.7  
LP3985IM5-5.0  
LCSB  
LCTB  
LCUB  
LCJB  
LCXB  
LCYB  
LCRB  
LCZB  
LDPB  
LDQB  
LDRB  
LDSB  
2.6  
2.7  
2.8  
2.85  
2.9  
3.0  
3.1  
3.2  
3.3  
4.7  
5.0  
www.national.com  
4
Absolute Maximum Ratings (Notes 1, 2)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Operating Ratings (Notes 1, 2)  
VIN  
2.5 to 6V  
VEN  
0 to (VIN+0.3) 6V  
Junction Temperature  
Thermal Resistance  
θJA (SOT23-5)  
θJA (micro SMD)  
Maximum Power Dissipation  
SOT23-5 (Note 6)  
micro SMD (Note 6)  
−40˚C to +125˚C  
VIN, VEN  
−0.3 to 6.5V  
-0.3 to (VIN+0.3) 6.5V  
150˚C  
VOUT  
220˚C/W  
255˚C/W  
Junction Temperature  
Storage Temperature  
Lead Temp.  
−65˚C to +150˚C  
235˚C  
250mW  
244mW  
Pad Temp. (Note 3)  
Maximum Power Dissipation  
SOT23-5 (Note 4)  
micro SMD (Note 4)  
ESD Rating(Note 5)  
Human Body Model  
Machine Model  
235˚C  
364mW  
355mW  
2kV  
150V  
Electrical Characteristics  
Unless otherwise specified: VIN = VOUT(nom) + 0.5V, CIN = 1 µF, IOUT = 1mA, COUT = 1 µF, CBYPASS = 0.01µF. Typical values  
and limits appearing in standard typeface are for TJ = 25˚C. Limits appearing in boldface type apply over the entire junction  
temperature range for operation, −40˚C to +125˚C. (Note 7) (Note 8)  
Limit  
Symbol  
Parameter  
Output Voltage  
Conditions  
Typ  
Units  
Min  
−2  
Max  
2
IOUT = 1mA  
% of  
Tolerance  
−3  
3
VOUT(nom)  
Line Regulation Error  
VIN = (VOUT(nom) + 0.5V) to 6.0V,  
For 4.7 to 5.0 options  
For all other options  
IOUT = 1 mA to 150 mA  
LP3985IM5 (SOT23-5)  
LP3985 (micro SMD)  
VIN = VOUT(nom) + 1V,  
IOUT = 150 mA (Figure 1)  
VIN = VOUT(nom) + 0.2V,  
f = 1 kHz,  
−0.19  
−0.1  
0.19  
0.1  
%/V  
VOUT  
Load Regulation Error  
(Note 9)  
0.0025  
0.005  
%/mA  
mVP-P  
0.0004  
1.5  
0.002  
Output AC Line Regulation  
50  
40  
IOUT = 50 mA (Figure 2)  
VIN = VOUT(nom) + 0.2V,  
f = 10 kHz,  
PSRR  
Power Supply Rejection Ratio  
Quiescent Current  
dB  
IOUT = 50 mA (Figure 2)  
VEN = 1.4V, IOUT = 0 mA  
For 4.7 to 5.0 options  
For all other options  
VEN = 1.4V, IOUT = 0 to 150 mA  
For 4.7 to 5.0 options  
For all other options  
VEN = 0.4V  
IQ  
100  
85  
165  
150  
µA  
155  
140  
0.003  
0.4  
250  
200  
1.5  
2
Dropout Voltage (Note 10)  
IOUT = 1 mA  
IOUT = 50 mA  
20  
35  
mV  
IOUT = 100 mA  
45  
70  
IOUT = 150 mA  
60  
100  
ISC  
Short Circuit Current Limit  
Peak Output Current  
Output Grounded  
600  
mA  
mA  
(Steady State)  
IOUT(PK)  
VOUT VOUT(nom) - 5%  
550  
300  
5
www.national.com  
Electrical Characteristics (Continued)  
Unless otherwise specified: VIN = VOUT(nom) + 0.5V, CIN = 1 µF, IOUT = 1mA, COUT = 1 µF, CBYPASS = 0.01µF. Typical values  
and limits appearing in standard typeface are for TJ = 25˚C. Limits appearing in boldface type apply over the entire junction  
temperature range for operation, −40˚C to +125˚C. (Note 7) (Note 8)  
Limit  
Symbol  
TON  
Parameter  
Turn-On Time  
Conditions  
CBYPASS = 0.01 µF  
Typ  
Units  
Min  
Max  
200  
µs  
(Note 11)  
en  
Output Noise Voltage(Note 12)  
BW = 10 Hz to 100 kHz,  
COUT = 1µF  
30  
230  
1
µVrms  
Output Noise Density  
CBP = 0  
nV/  
IEN  
VIL  
Maximum Input Current at EN  
Maximum Low Level Input  
Voltage at EN  
VEN = 0.4 and VIN = 6.0  
VIN = 2.5 to 6.0V  
nA  
V
0.4  
VIH  
Minimum High Level Input  
Voltage at EN  
VIN = 2.5 to 6.0V  
1.4  
V
Thermal Shutdown Temperature  
Thermal Shutdown Hysteresis  
160  
20  
˚C  
˚C  
TSD  
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device  
is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical  
Characteristics tables.  
Note 2: All voltages are with respect to the potential at the GND pin.  
Note 3: Additional information on lead temperature and pad temperature can be found in National Semiconductor Application Note (AN-1112).  
Note 4: The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using the formula: P = (T - T )/θ ,  
JA  
D
J
A
where T is the junction temperature, T is the ambient temperature, and θ is the junction-to-ambient thermal resistance. The 364mW rating for SOT23-5  
JA  
J
A
appearing under Absolute Maximum Ratings results from substituting the Absolute Maximum junction temperature, 150˚C, for T , 70˚C for T , and 220˚C/W for θ .  
J
A
JA  
More power can be dissipated safely at ambient temperatures below 70˚C . Less power can be dissipated safely at ambient temperatures above 70˚C. The Absolute  
Maximum power dissipation can be increased by 4.5mW for each degree below 70˚C, and it must be derated by 4.5mW for each degree above 70˚C.  
Note 5: The human body model is 100pF discharged through 1.5kresistor into each pin. The machine model is a 200 pF capacitor discharged directly into each  
pin.  
Note 6: Like the Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature. The 250mW rating for  
SOT23-5 appearing under Operating Ratings results from substituting the maximum junction temperature for operation, 125˚C, for T , 70˚C for T , and 220˚C/W for  
J
A
θ
into (Note 4) above. More power can be dissipated at ambient temperatures below 70˚C . Less power can be dissipated at ambient temperatures above 70˚C.  
JA  
The maximum power dissipation for operation can be increased by 4.5mW for each degree below 70˚C, and it must be derated by 4.5mW for each degree above  
70˚C.  
Note 7: All limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production with T = 25˚C or correlated using  
J
Statistical Quality Control (SQC) methods. All hot and cold limits are guaranteed by correlating the electrical characteristics to process and temperature variations  
and applying statistical process control.  
Note 8: The target output voltage, which is labeled V  
, is the desired voltage option.  
OUT(nom)  
Note 9: An increase in the load current results in a slight decrease in the output voltage and vice versa.  
Note 10: Dropout voltage is the input-to-output voltage difference at which the output voltage is 100mV below its nominal value. This specification does not apply  
for input voltages below 2.5V.  
Note 11: Turn-on time is time measured between the enable input just exceeding V and the output voltage just reaching 95% of its nominal value.  
IH  
Note 12: The output noise varies with output voltage option. The 30µVrms is measured with 2.5V voltage option. To calculate an approximated output noise for other  
options, use the equation: (30µVrms)(X)/2.5, where X is the voltage option value.  
Recommended Output Capacitor  
Limit  
Nominal  
Value  
Parameter  
Output Capacitor  
Conditions  
Symbol  
Min  
0.7  
5
Max  
500  
Units  
µF  
Capacitance(Note 13)  
ESR  
1.0  
COUT  
mΩ  
Note 13: The minimum value of capacitance for stability and correct operation is 0.7µF. The Capacitor tolerance should be 30% or better over the temperature  
range. The full range of operating conditions for the capacitor in the application should be considered during device selection to ensure this minimum capacitance  
specification is met. The recommended capacitor type is X7R to meet the full device temperature spec of -40oC to 125oC. See the capacitor section in Application  
Hints.  
www.national.com  
6
10136408  
FIGURE 1. Line Transient Input Test Signal  
10136409  
FIGURE 2. PSRR Input Test Signal  
Typical Performance Characteristics Unless otherwise specified, CIN = COUT = 1 µF Ceramic,  
CBYPASS = 0.01 µF, VIN = VOUT + 0.2V, TA = 25˚C, Enable pin is tied to VIN  
.
Output Voltage Change vs Temperature  
Dropout Voltage vs Load Current  
10136433  
10136441  
@
Ground Current vs VIN 25˚C  
Ground Current vs Load Current  
10136440  
10136435  
7
www.national.com  
Typical Performance Characteristics Unless otherwise specified, CIN = COUT = 1 µF Ceramic,  
CBYPASS = 0.01 µF, VIN = VOUT + 0.2V, TA = 25˚C, Enable pin is tied to VIN. (Continued)  
@
@
Ground Current vs VIN 125˚C  
Ground Current vs VIN −40˚C  
10136437  
10136439  
Short Circuit Current (micro SMD)  
Short Circuit Current (micro SMD)  
10136445  
10136446  
Short Circuit Current (SOT)  
Short Circuit Current (SOT)  
10136447  
10136448  
www.national.com  
8
Typical Performance Characteristics Unless otherwise specified, CIN = COUT = 1 µF Ceramic,  
CBYPASS = 0.01 µF, VIN = VOUT + 0.2V, TA = 25˚C, Enable pin is tied to VIN. (Continued)  
Short Circuit Current (SOT)  
Short Circuit Current (SOT)  
10136450  
10136449  
Short Circuit Current (micro SMD)  
Short Circuit Current (micro SMD)  
10136452  
10136451  
Output Noise Spectral Density  
Ripple Rejection (VIN = VOUT + 0.2V)  
10136410  
10136411  
9
www.national.com  
Typical Performance Characteristics Unless otherwise specified, CIN = COUT = 1 µF Ceramic,  
CBYPASS = 0.01 µF, VIN = VOUT + 0.2V, TA = 25˚C, Enable pin is tied to VIN. (Continued)  
Ripple Rejection (VIN = VOUT + 1V)  
Ripple Rejection (VIN = 5.0V)  
10136412  
10136413  
Start Up Time (VIN = VOUT + 0.2V)  
Start Up Time (VIN = 4.2V)  
10136414  
10136415  
Start Up Time (VIN = VOUT + 0.2V)  
Start Up Time (VIN = 4.2V)  
10136417  
10136416  
www.national.com  
10  
Typical Performance Characteristics Unless otherwise specified, CIN = COUT = 1 µF Ceramic,  
CBYPASS = 0.01 µF, VIN = VOUT + 0.2V, TA = 25˚C, Enable pin is tied to VIN. (Continued)  
Start Up Time (VIN = VOUT + 0.2V)  
Start Up Time (VIN = 4.2V)  
10136418  
10136419  
Line Transient Response  
Line Transient Response  
10136420  
10136421  
Load Transient Response (VIN = 3.2V)  
Load Transient Response (VIN = 4.2V)  
10136423  
10136422  
11  
www.national.com  
Typical Performance Characteristics Unless otherwise specified, CIN = COUT = 1 µF Ceramic,  
CBYPASS = 0.01 µF, VIN = VOUT + 0.2V, TA = 25˚C, Enable pin is tied to VIN. (Continued)  
Load Transient Response (VIN = 3.2V)  
Load Transient Response (VIN = 4.2V)  
10136424  
10136425  
Enable Response (VIN = VOUT + 0.2V)  
Enable Response (VIN = 4.2V)  
10136453  
10136454  
Enable Response (VIN = VOUT + 0.2V)  
Enable Response (VIN = 4.2V)  
10136455  
10136456  
www.national.com  
12  
Typical Performance Characteristics Unless otherwise specified, CIN = COUT = 1 µF Ceramic,  
CBYPASS = 0.01 µF, VIN = VOUT + 0.2V, TA = 25˚C, Enable pin is tied to VIN. (Continued)  
Output Impedance (VIN = 4.2V)  
Output Impedance (VIN = VOUT + 0.2V)  
10136465  
10136466  
may be used but have a narrower temperature range. With  
these and other capacitor types (Y5V, Z6U) that may be  
used, selection is dependant on the range of operating con-  
ditions and temperature range for that application. (see sec-  
tion on Capacitor Characteristics).  
Application Hints  
EXTERNAL CAPACITORS  
Like any low-dropout regulator, the LP3985 requires external  
capacitors for regulator stability. The LP3985 is specifically  
designed for portable applications requiring minimum board  
space and smallest components. These capacitors must be  
correctly selected for good performance.  
It may also be possible to use tantalum or film capacitors at  
the output, but these are not as attractive for reasons of size  
and cost (see next section Capacitor Characteristics).  
It is also recommended that the output capacitor be placed  
within 1cm from the output pin and returned to a clean  
ground line.  
INPUT CAPACITOR  
An input capacitance of ) 1µF is required between the  
LP3985 input pin and ground (the amount of the capacitance  
may be increased without limit).  
CAPACITOR CHARACTERISTICS  
The LP3985 is designed to work with ceramic capacitors on  
the output to take advantage of the benefits they offer: for  
capacitance values in the range of 1µF to 4.7µF range,  
ceramic capacitors are the smallest, least expensive and  
have the lowest ESR values (which makes them best for  
eliminating high frequency noise). The ESR of a typical 1µF  
ceramic capacitor is in the range of 20 mto 40 m, which  
easily meets the ESR requirement for stability by the  
LP3985.  
This capacitor must be located a distance of not more than  
1cm from the input pin and returned to a clean analog  
ground. A ceramic capacitor is recommended although a  
good quality tantalum or film capacitor may be used at the  
input.  
Important: Tantalum capacitors can suffer catastrophic fail-  
ures due to surge current when connected to a low-  
impedance source of power (like a battery or a very large  
capacitor). If a tantalum capacitor is used at the input, it must  
be guaranteed by the manufacturer to have a surge current  
rating sufficient for the application.  
For both input and output capacitors careful interpretation of  
the capacitor specification is required to ensure correct de-  
vice operation. The capacitor value can change greatly de-  
pendant on the conditions of operation and capacitor type.  
There are no requirements for the ESR on the input capaci-  
tor, but tolerance and temperature coefficient must be con-  
sidered when selecting the capacitor to ensure the capaci-  
tance will remain within the operational range over the full  
range of temperature and operating conditions.  
In particular the output capacitor selection should take ac-  
count of all the capacitor parameters to ensure that the  
specification is met within the application. Capacitance value  
can vary with DC bias conditions as well as temperature and  
frequency of operation. Capacitor values will also show  
some decrease over time due to aging. The capacitor pa-  
rameters are also dependant on the particular case size with  
smaller sizes giving poorer performance figures in general.  
As an example Figure 3 shows a typical graph showing a  
comparison of capacitor case sizes in a Capacitance vs. DC  
Bias plot. As shown in the graph, as a result of the DC Bias  
condition the capacitance value may drop below the mini-  
mum capacitance value given in the recommended capacitor  
table (0.7µF in this case). Note that the graph shows the  
capacitance out of spec for the 0402 case size capacitor at  
higher bias voltages. It is therefore recommended that the  
capacitor manufacturers’ specifications for the nominal value  
OUTPUT CAPACITOR  
Correct selection of the output capacitor is important to  
ensure stable operation in the intended application.  
The output capacitor must meet all the requirements speci-  
fied in the recommended capacitor table over all conditions  
in the application. These conditions include DC-bias, fre-  
quency and temperature. Unstable operation will result if the  
capacitance drops below the minimum specified value. (See  
the next section Capacitor Characteristics).  
The LP3985 is designed specifically to work with very small  
ceramic output capacitors. A 1.0µF ceramic capacitor (dia-  
lectric type X7R) with ESR between 5mto 500mis  
suitable in the LP3985 application circuit. X5R capacitors  
13  
www.national.com  
The types of capacitors best suited for the noise bypass  
capacitor are ceramic and film. High-quality ceramic capaci-  
tors with either NPO or COG dielectric typically have very  
low leakage. Polypropolene and polycarbonate film capaci-  
tors are available in small surface-mount packages and  
typically have extremely low leakage current.  
Application Hints (Continued)  
capacitor are consulted for all conditions as some capacitor  
sizes (e.g. 0402) may not be suitable in the actual applica-  
tion.  
Unlike many other LDO’s, addition of a noise reduction  
capacitor does not effect the load transient response of the  
device.  
NO-LOAD STABILITY  
The LP3985 will remain stable and in regulation with no  
external load. This is specially important in CMOS RAM  
keep-alive applications.  
ON/OFF INPUT OPERATION  
The LP3985 is turned off by pulling the VEN pin low, and  
turned on by pulling it high. If this feature is not used, the VEN  
pin should be tied to VIN to keep the regulator output on at all  
time. To assure proper operation, the signal source used to  
drive the VEN input must be able to swing above and below  
the specified turn-on/off voltage thresholds listed in the Elec-  
trical Characteristics section under VIL and VIH  
.
10136467  
FAST ON-TIME  
FIGURE 3. Graph Showing A Typical Variation in  
Capacitance vs DC Bias  
The LP3985 output is turned on after Vref voltage reaches its  
final value (1.23V nomial). To speed up this process, the  
noise reduction capacitor at the bypass pin is charged with  
an internal 70uA current source. The current source is turned  
off when the bandgap voltage reaches approximately 95% of  
its final value. The turn on time is determined by the time  
constant of the bypass capacitor. The smaller the capacitor  
value, the shorter the turn on time, but less noise gets  
reduced. As a result, turn on time and noise reduction need  
to be taken into design consideration when choosing the  
value of the bypass capacitor.  
The ceramic capacitor’s capacitance can vary with tempera-  
ture. The capacitor type X7R, which operates over a tem-  
perature range of -55˚C to +125˚C, will only vary the capaci-  
tance to within 15%. The capacitor type X5R has a similar  
tolerance over a reduced temperature range of -55˚C to  
+85˚C. Most large value ceramic capacitors () 2.2µF) are  
manufactured with Z5U or Y5V temperature characteristics.  
Their capacitance can drop by more than 50% as the tem-  
perature goes from 25˚C to 85˚C. Therefore X7R is recom-  
mended over Z5U and Y5V in applications where the ambi-  
ent temperature will change significantly above or below  
25˚C.  
micro SMD MOUNTING  
The micro SMD package requires specific mounting tech-  
niques which are detailed in National Semiconductor Appli-  
cation Note (AN-1112). Referring to the section Surface  
Mount Technology (SMT) Assembly Considerations, it  
should be noted that the pad style which must be used with  
the 5 pin package is NSMD (non-solder mask defined) type.  
Tantalum capacitors are less desirable than ceramic for use  
as output capacitors because they are more expensive when  
comparing equivalent capacitance and voltage ratings in the  
1µF to 4.7µF range.  
Another important consideration is that tantalum capacitors  
have higher ESR values than equivalent size ceramics. This  
means that while it may be possible to find a tantalum  
capacitor with an ESR value within the stable range, it would  
have to be larger in capacitance (which means bigger and  
more costly ) than a ceramic capacitor with the same ESR  
value. It should also be noted that the ESR of a typical  
tantalum will increase about 2:1 as the temperature goes  
from 25˚C down to −40˚C, so some guard band must be  
allowed.  
For best results during assembly, alignment ordinals on the  
PC board may be used to facilitate placement of the micro  
SMD device.  
micro SMD LIGHT SENSITIVITY  
Exposing the micro SMD device to direct sunlight will cause  
misoperation of the device. Light sources such as halogen  
lamps can effect electrical performance if brought near to the  
device.  
The wavelengths which have most detrimental effect are  
reds and infra-reds, which means that the fluorescent light-  
ing used inside most buildings has very little effect on per-  
formance. A micro SMD test board was brought to within  
1cm of a fluorescent desk lamp and the effect on the regu-  
lated output voltage was negligible, showing a deviation of  
less than 0.1% from nominal.  
NOISE BYPASS CAPACITOR  
Connecting a 0.01µF capacitor between the CBYPASS pin  
and ground significantly reduces noise on the regulator out-  
put. This cap is connected directly to a high impedance node  
in the band gap reference circuit. Any significant loading on  
this node will cause a change on the regulated output volt-  
age. For this reason, DC leakage current through this pin  
must be kept as low as possible for best output voltage  
accuracy.  
www.national.com  
14  
Physical Dimensions inches (millimeters)  
unless otherwise noted  
5-Lead Small Outline Package (MF)  
NS Package Number MF05A  
micro SMD, 5 Bump, Package (BPA05)  
NS Package Number BPA05DNC  
The dimensions for X1, X2 and X3 are as given:  
X1 = 0.853 +/− 0.03mm  
X2 = 1.412 +/− 0.03mm  
X3 = 0.900 +/− 0.10mm  
15  
www.national.com  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
micro SMD, 5 Bump, Package (BLA05)  
NS Package Number BLA05AEC  
The dimensions for X1, X2 and X3 are as given:  
X1 = 1.006 +/- 0.03mm  
X2 = 1.463 +/- 0.03mm  
X3 = 0.995 +/- 0.10mm  
www.national.com  
16  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
thin micro SMD, 5 Bump, Package (TLA05)  
NS Package Number TLA05AEA  
The dimensions for X1, X2 and X3 are as given:  
X1 = 1.006 +/- 0.03mm  
X2 = 1.463 +/- 0.03mm  
X3 = 0.6 +/- 0.075mm  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves  
the right at any time without notice to change said circuitry and specifications.  
For the most current product information visit us at www.national.com.  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS  
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and whose failure to perform when  
properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to result  
in a significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or  
system, or to affect its safety or effectiveness.  
BANNED SUBSTANCE COMPLIANCE  
National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products  
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain  
no ‘‘Banned Substances’’ as defined in CSP-9-111S2.  
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