CD4034BMG4 [TI]
CMOS 8-Stage Static Bidirectional Parallel/Serial; CMOS 8级静态双向并行/串行
| 型号： | CD4034BMG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | CMOS 8-Stage Static Bidirectional Parallel/Serial |
| 文件： | 总13页 (文件大小：458K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The CD4034B types are supplied in 24-lead
hermetic dual-in-line ceramic packages (F3A
suffix), 24-lead dual-in-line plastic packages (E
suffix),24-lead small-outline packages (M, M96,
and NSR suffixes), and 24-lead thin shrink
small-outlinepackages(PWandPWRsuffixes).
Copyright © 2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
Pb-Free (RoHS)
Pb-Free (RoHS)
TBD
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
CD4034BE
ACTIVE
ACTIVE
PDIP
PDIP
N
N
24
24
15
15
CU NIPDAU N / A for Pkg Type
Contact TI Distributor
or Sales Office
CD4034BEE4
CU NIPDAU N / A for Pkg Type
Contact TI Distributor
or Sales Office
CD4034BF3A
CD4034BM
ACTIVE
ACTIVE
CDIP
SOIC
J
24
24
1
Call TI
N / A for Pkg Type
Purchase Samples
Purchase Samples
DW
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CD4034BME4
CD4034BMG4
ACTIVE
ACTIVE
SOIC
SOIC
DW
DW
24
24
25
25
Green (RoHS
& no Sb/Br)
Purchase Samples
Purchase Samples
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2010
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4034B, CD4034B-MIL :
Catalog: CD4034B
•
Military: CD4034B-MIL
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 2
MECHANICAL DATA
MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997
J (R-GDIP-T**)
CERAMIC DUAL-IN-LINE PACKAGE
24 PINS SHOWN
B
13
24
C
12
1
0.065 (1,65)
0.045 (1,14)
Lens Protrusion (Lens Optional)
0.010 (0.25) MAX
0.090 (2,29)
0.060 (1,53)
0.175 (4,45)
0.140 (3,56)
A
Seating Plane
0.018 (0,46) MIN
0.125 (3,18) MIN
0.022 (0,56)
0.014 (0,36)
0.100 (2,54)
0.012 (0,30)
0.008 (0,20)
24
28
32
40
PINS **
DIM
”A”
NARR
WIDE
NARR
WIDE
NARR
WIDE
NARR
WIDE
0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85)
0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99)
1.265(32,13) 1.265(32,13) 1.465(37,21) 1.465(37,21) 1.668(42,37) 1.668(42,37) 2.068(52,53) 2.068(52,53)
1.235(31,37) 1.235(31,37) 1.435(36,45) 1.435(36,45) 1.632(41,45) 1.632(41,45) 2.032(51,61) 2.032(51,61)
0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19)
0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50)
MAX
MIN
MAX
MIN
”B”
”C”
MAX
MIN
4040084/C 10/97
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Window (lens) added to this group of packages (24-, 28-, 32-, 40-pin).
D. This package can be hermetically sealed with a ceramic lid using glass frit.
E. Index point is provided on cap for terminal identification.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002
N (R–PDIP–T24)
PLASTIC DUAL–IN–LINE
1.222 (31,04) MAX
24
13
0.360 (9,14) MAX
1
12
0.070 (1,78) MAX
0.200 (5,08) MAX
0.020 (0,51) MIN
0.425 (10,80) MAX
Seating Plane
0.125 (3,18) MIN
0.100 (2,54)
0.010 (0,25)
0’–15’
0.021 (0,53)
0.015 (0,38)
0.010 (0,25) NOM
4040051–3/D 09/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS–010
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI008 – OCTOBER 1994
N (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
24 PIN SHOWN
A
24
13
0.560 (14,22)
0.520 (13,21)
1
12
0.060 (1,52) TYP
0.200 (5,08) MAX
0.020 (0,51) MIN
0.610 (15,49)
0.590 (14,99)
Seating Plane
0.100 (2,54)
0.125 (3,18) MIN
0.010 (0,25) NOM
0°–15°
0.021 (0,53)
0.015 (0,38)
0.010 (0,25)
PINS **
M
24
28
32
40
48
52
DIM
1.270
1.450
1.650
2.090
2.450
2.650
A MAX
(32,26) (36,83) (41,91) (53,09) (62,23) (67,31)
1.230
1.410
1.610
2.040
2.390
2.590
A MIN
(31,24) (35,81) (40,89) (51,82) (60,71) (65,79)
4040053/B 04/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-011
D. Falls within JEDEC MS-015 (32 pin only)
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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