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CD4011B [TI]

CMOS NAND GATES; CMOS非门
CD4011B
型号： CD4011B
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

CMOS NAND GATES
CMOS非门
文件： 总13页 (文件大小：524K)
中文：  中文翻译
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The CD4011B, CD4012B, and CD4023B types  
are supplied in 14-lead hermetic dual-in-line  
ceramic packages (F3A suffix), 14-lead  
dual-in-line plastic packages (E suffix), 14-lead  
small-outline packages (M, MT, M96, and NSR  
suffixes), and 14-lead thin shrink small-outline  
packages (PWR suffix). The CD4011B and  
CD4023Btypes also are supplied in 14-lead thin  
shrink small-outline packages (PW suffix).  
Copyright 2003, Texas Instruments Incorporated  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Oct-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CFP  
CFP  
CFP  
PDIP  
Drawing  
89265AKB3T  
89266AKB3T  
89273AKB3T  
CD4011BE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
ACTIVE  
WR  
14  
16  
14  
14  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
WR  
WR  
N
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
CD4011BEE4  
ACTIVE  
PDIP  
N
14  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
CD4011BF  
CD4011BF3A  
CD4011BK3  
CD4011BM  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
CFP  
J
J
14  
14  
14  
14  
1
1
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Level-NC-NC-NC  
Level-NC-NC-NC  
Call TI  
OBSOLETE  
ACTIVE  
WR  
D
SOIC  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4011BM96  
CD4011BM96E4  
CD4011BM96G4  
CD4011BME4  
CD4011BMG4  
CD4011BMT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4011BMTE4  
CD4011BNSR  
CD4011BNSRE4  
CD4011BPW  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
NS  
NS  
PW  
PW  
PW  
PW  
N
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PDIP  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4011BPWE4  
CD4011BPWR  
CD4011BPWRE4  
CD4012BE  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25  
25  
1
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
CD4012BEE4  
PDIP  
N
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
CD4012BF3A  
CD4012BM  
ACTIVE  
ACTIVE  
CDIP  
SOIC  
J
14  
14  
TBD  
Call TI  
Level-NC-NC-NC  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4012BM96  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
D
D
14  
14  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4012BM96E4  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Oct-2005  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
no Sb/Br)  
CD4012BME4  
CD4012BMT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SO  
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4012BMTE4  
CD4012BNSR  
CD4012BNSRE4  
CD4012BPWR  
CD4012BPWRE4  
CD4023BE  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
NS  
NS  
PW  
PW  
N
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
PDIP  
PDIP  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
CD4023BEE4  
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
CD4023BF  
CD4023BF3A  
CD4023BM  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
SOIC  
J
J
14  
14  
14  
1
1
TBD  
TBD  
Call TI  
Call TI  
Level-NC-NC-NC  
Level-NC-NC-NC  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4023BM96  
CD4023BM96E4  
CD4023BME4  
CD4023BMT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4023BMTE4  
CD4023BNSR  
CD4023BNSRE4  
CD4023BPW  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
NS  
NS  
PW  
PW  
PW  
PW  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4023BPWE4  
CD4023BPWR  
CD4023BPWRE4  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
JM38510/05051BCA  
JM38510/05052BCA  
JM38510/05053BCA  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
CDIP  
J
J
J
14  
14  
14  
1
1
1
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Oct-2005  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 3  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°–8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
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TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
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