BQ3287AMT [TI]
暂无描述;
TEXAS INSTRUMENTS 
Not Recommended For New Designs
bq3287/bq3287A
(
)
Real-Time Clock RTC Module
➤ Calendar in day of the week, day
of the month, months, and years
with automatic leap-year adjust-
ment
bq3287A version is identical to the
bq3287, with the addition of the RAM
clear input.
Features
➤ Dir ect clock/ca len da r r epla ce-
m en t for IBM® AT-com pa t ible
computers and other applications
The bq3287 is a fully compatible
r e a l-t im e clock for I B M AT-
compatible computers and other ap-
p lica t ion s . T h e b q 3 2 8 7 w r it e -
pr ot ect s t h e clock, ca len da r, a n d
storage registers during power fail-
u r e. Th e in t egr a l ba cku p en er gy
source then maintains data and op-
erates the clock and calendar.
➤ Programmable square wave out-
➤ Functionally compatible with the
put
DS1287/DS1287A and MC146818A
➤ Three individually maskable in-
➤ 114 bytes of general nonvolatile
terrupt event flags:
storage
- Periodic rates from 122 µs to
➤ Integral lithium cell and crystal
500 ms
➤ 160 ns cycle time allows fast bus
As shipped from Benchma rq, the
real time clock is turned off to maxi-
mize battery capacity for in-system
operation.
- Time-of-day alarm once per
operation
second to once per day
➤ Selectable Intel or Motorola bus
timing
- End-of-clock update cycle
➤ B e t t e r t h a n on e m in u t e p e r
➤ 14 bytes for clock/calendar and
The bq3287 is functionally equiva-
lent to the bq3285, except that the
battery (16, 20) and crystal (2, 3)
pins are not accessible. These pins
are connected internally to a coin
cell and quartz crystal. The coin cell
is sized to provide 10 years of data
retention and clock operation in the
absence of power. For a complete de-
scription of features, operating con-
dit ion s, elect r ica l ch a r a ct er ist ics,
bus timing, and pin descriptions, see
the bq3285 data sheet.
control
month clock accuracy
➤ BCD or binary format for clock
and calendar data
General Description
➤ Time of day in seconds, minutes,
Th e CMOS bq3287/bq3287A is a
low-power microprocessor periph-
eral providing a time-of-day clock
and 100-year calendar with alarm
fea t u r es a n d ba t t er y oper a t ion .
O t h e r fe a t u r e s in clu d e t h r e e
maskable interrupt sources, square-
wave output, and 114 bytes of gen-
e r a l n on vola t ile s t or a ge. Th e
and hours
- 12- or 24-hour format
- Optional daylight saving
adjustment
Pin Connections
Pin Names
AD0–AD7 Multiplexed address/data
RST
SQW
NC
Reset input
input/output
MOT
24
1
V
CC
Square wave output
No connect
MOT
CS
Bus type select input
Chip select input
NC
NC
23
22
2
3
SQW
NC
4
NC/RCL
NC
AD
AD
AD
AD
AD
AD
AD
21
20
19
18
17
16
15
14
13
0
1
2
3
4
5
6
5
RCL
RAM clear input
(bq3287A only)
AS
Address strobe input
Data strobe input
6
INT
7
RST
DS
NC
DS
8
9
VCC
VSS
+5V supply
Ground
R/W
INT
Read/write input
10
11
12
R/W
AS
CS
AD
7
Interrupt request output
V
SS
24-Pin DIP Module
PN328701.eps
Sept. 1996 D
1
Not Recommended For New Designs
bq3287/bq3287A
Absolute Maximum Ratings
Symbol
Parameter
Value
Unit
Conditions
VCC
DC voltage applied on VCC relative to VSS
-0.3 to 7.0
V
DC voltage applied on any pin excluding VCC
relative to VSS
VT
V
VT ≤ VCC + 0.3
-0.3 to 7.0
0 to +70
-20 to +70
-40 to +70
-40 to +70
-10 to +70
-20 to +70
260
°C
°C
°C
°C
°C
°C
°C
Commercial
Extended “I”
Commercial
Extended “I”
Commercial
Extended “I”
For 10 seconds
TOPR
Operating temperature
Storage temperature
Temperature under bias
TSTG
TBIAS
TSOLDER Soldering temperature
Note:
Permanent device damage may occur if Absolu te Ma xim u m Ra tin gs are exceeded. Functional opera-
tion should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Expo-
sure to conditions beyond the operational limits for extended periods of time may affect device reliability.
Recommended DC Operating Conditions (T = T
)
OPR
A
Symbol
VCC
Parameter
Supply voltage
Minimum
Typical
Maximum
Unit
V
4.5
0
5.0
5.5
0
VSS
VIL
VIH
Supply voltage
0
-
V
Input low voltage
Input high voltage
-0.3
2.2
0.8
V
-
VCC + 0.3
V
Note:
Typical values indicate operation at TA = 25°C.
DC Electrical Characteristics (T = T
, V
= 5V ± 10%)
A
OPR CC
Symbol
Parameter
Minimum Typical Maximum
Unit
Conditions/Notes
VIN = VSS to VCC
ILI
Input leakage current
-
-
-
-
± 1
± 1
µA
AD0–AD7, INT and SQW
in high impedance
ILO
Output leakage current
µA
VOH
VOL
Output high voltage
Output low voltage
2.4
-
-
-
-
V
V
IOH = -1.0 mA
IOL = 4.0 mA
0.4
Min. cycle, duty = 100%,
IOH = 0mA, IOL = 0mA
ICC
Operating supply current
-
7
15
mA
VSO
Supply switch-over voltage
Power-fail-detect voltage
-
3.0
-
V
V
VPFD
4.0
4.17
4.35
Internal 30K pull-up
(bq3287A only)
IRCL
Input current when RCL = VSS
-
-
-
-
185
µA
µA
IMOTH
Input current when MOT =
VCC
-185
Internal 30K pull-down
Note:
Typical values indicate operation at TA = 25°C, VCC = 5V.
Sept. 1996 D
2
Not Recommended For New Designs
bq3287/bq3287A
Power-Down/Power-Up Timing (T = T
A
OPR)
Symbol
Parameter
Minimum
300
Typical
Maximum
Unit
µs
Conditions
tF
VCC slew from 4.5V to 0V
VCC slew from 0V to 4.5V
-
-
-
-
tR
100
µs
Internal write-protection
period after VCC passes VPFD
on power-up.
tCSR
CS at VIH after power-up
20
10
-
-
200
-
ms
Data-retention and time-
keeping time
tDR
years TA = 25°C.
Note:
Clock accuracy is better than ± 1 minute per month at 25°C for the period of tDR.
Ca u tion : Nega tive u n d er sh oots below th e a bsolu te m a xim u m r a tin g of -0.3V in ba tter y-ba ck u p m od e
m a y a ffect d a ta in tegr ity.
Power-Down/Power-Up Timing
Sept. 1996 D
3
Not Recommended For New Designs
bq3287/bq3287A
24-Pin MT (T-type module)
24-Pin MT (T-type module)
Dimension
Minimum
0.360
0.015
0.015
0.008
1.320
0.685
0.590
0.090
0.120
0.100
Maximum
0.375
-
A
A1
B
C
D
E
0.022
0.013
1.335
0.700
0.620
0.110
0.130
0.120
e
G
L
S
All dimensions are in inches.
Sept. 1996 D
4
Not Recommended For New Designs
bq3287/bq3287A
Data Sheet Revision History
Change No.
Page No.
Description
Address strobe input
Nature of Change
Clarification
1
1
Was 4.1 min, 4.25 max;
is 4.0 min, 4.35 max
1
2
2
1
Power-fail detect voltage VPFD
Was : “As shipped from Benchmarq, the backup cell
is electrically isolated from the memory. ”
Is: “As shipped from Benchmarq, the backup cell is
electrically isolated from the active circuitry. ”
Clarification
Changed temperature from N (industrial, -40 to
+85°C) to I (extended, -20 to +70°C)
2
3
2, 4
2
Specification change
Changed values
IRCL max. was 275; is now 185. Pull-up = 30K
IMOTH max. was -275; is now -185. Pull-down = 30K
Notes:
Change 1 = Nov. 1992 B changes from June 1991 A.
Change 2 = Nov. 1995 C changes from Nov. 1992 B.
Change 3 = Sept. 1996 D changes from Nov. 1995 C.
Ordering Information
bq3287
MT -
Tem p er a tu r e:
blank = Commercial (0 to +70°C)
I = Extended* (-20 to +70°C)
Pa ck a ge Op tion :
MT = T-type module
RAM Clea r Op tion :
A = RAM clear on pin 21
no mark = No connect on pin 21
Device:
bq3287 Real-Time Clock Module
*Contact factory for availability.
Sept. 1996 D
5
PACKAGE OPTION ADDENDUM
www.ti.com
6-Jun-2013
PACKAGING INFORMATION
Orderable Device
BQ3287AMT-I
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-20 to 70
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
LIFEBUY DIP MODULE
MT
24
24
24
24
15
Pb-Free
(RoHS)
Call TI
Call TI
Call TI
Call TI
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
BQ3287AMT-SB2
BQ3287MT-I
LIFEBUY DIP MODULE
LIFEBUY DIP MODULE
LIFEBUY DIP MODULE
MT
MT
MT
15
15
15
Pb-Free
(RoHS)
Pb-Free
(RoHS)
-20 to 70
0 to 70
BQ3287MT-SB2
Pb-Free
(RoHS)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Jun-2013
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDI064 – MAY 2001
MT (R-PDIP-T**)
PLASTIC DUAL-IN-LINE
28 PINS SHOWN
Inches
Max.
Millimeters
Min.
9.14
Max.
Dimension
Min.
0.360
0.015
0.015
0.008
1.320
1.520
0.710
0.590
0.090
0.110
0.100
0.390
–
A
9.91
–
A1
B
0.38
0.022
0.56
0.33
0.38
0.20
C
0.013
1.335
1.535
0.740
D/24 PIN
D/28 PIN
33.53
38.61
18.03
33.91
38.99
18.80
16.00
2.79
E
e
D
14.99
2.29
0.630
0.110
G
L
3.30
2.79
2.54
0.130
0.120
S
3.05
E
A1
A
C
B
L
S
G
e
4201978/A 03/01
NOTES: A. All linear dimensions are in inches (mm).
B. This drawing is subject to change without notice.
1
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