BQ3287AMTI [ETC]
Real-Time Clock (RTC) Module; 实时时钟（ RTC ）模块
| 型号： | BQ3287AMTI |
| 厂家： | 
ETC |
| 描述： | Real-Time Clock (RTC) Module |
| 文件： | 总8页 (文件大小：117K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
bq3287/bq3287A
(
)
Real-Time Clock RTC Module
➤ Calendar in day of the week, day
of the month, months, and years
with automatic leap-year adjust-
ment
bq3287A version is identical to the
bq3287, with the addition of the RAM
clear input.
Features
➤ Dir ect clock/ca len da r r epla ce-
m en t for IBM® AT-com pa t ible
computers and other applications
The bq3287 is a fully compatible
r e a l-t im e clock for I B M AT-
compatible computers and other ap-
p lica t ion s . T h e b q 3 2 8 7 w r it e -
pr ot ect s t h e clock, ca len da r, a n d
storage registers during power fail-
u r e. Th e in t egr a l ba cku p en er gy
source then maintains data and op-
erates the clock and calendar.
➤ Programmable square wave out-
➤ Functionally compatible with the
put
DS1287/DS1287A and MC146818A
➤ Three individually maskable in-
➤ 114 bytes of general nonvolatile
terrupt event flags:
storage
- Periodic rates from 122 µs to
➤ Integral lithium cell and crystal
500 ms
➤ 160 ns cycle time allows fast bus
As shipped from Benchma rq, the
real time clock is turned off to maxi-
mize battery capacity for in-system
operation.
- Time-of-day alarm once per
operation
second to once per day
➤ Selectable Intel or Motorola bus
timing
- End-of-clock update cycle
➤ B e t t e r t h a n on e m in u t e p e r
➤ 14 bytes for clock/calendar and
The bq3287 is functionally equiva-
lent to the bq3285, except that the
battery (16, 20) and crystal (2, 3)
pins are not accessible. These pins
are connected internally to a coin
cell and quartz crystal. The coin cell
is sized to provide 10 years of data
retention and clock operation in the
absence of power. For a complete de-
scription of features, operating con-
dit ion s, elect r ica l ch a r a ct er ist ics,
bus timing, and pin descriptions, see
the bq3285 data sheet.
control
month clock accuracy
➤ BCD or binary format for clock
and calendar data
General Description
➤ Time of day in seconds, minutes,
Th e CMOS bq3287/bq3287A is a
low-power microprocessor periph-
eral providing a time-of-day clock
and 100-year calendar with alarm
fea t u r es a n d ba t t er y oper a t ion .
O t h e r fe a t u r e s in clu d e t h r e e
maskable interrupt sources, square-
wave output, and 114 bytes of gen-
e r a l n on vola t ile s t or a ge. Th e
and hours
- 12- or 24-hour format
- Optional daylight saving
adjustment
Pin Connections
Pin Names
AD0–AD7 Multiplexed address/data
RST
SQW
NC
Reset input
input/output
MOT
24
1
V
CC
Square wave output
No connect
MOT
CS
Bus type select input
Chip select input
NC
NC
23
22
2
3
SQW
NC
4
NC/RCL
NC
AD
AD
AD
AD
AD
AD
AD
21
20
19
18
17
16
15
14
13
0
1
2
3
4
5
6
5
RCL
RAM clear input
(bq3287A only)
AS
Address strobe input
Data strobe input
6
INT
7
RST
DS
NC
DS
8
9
VCC
VSS
+5V supply
Ground
R/W
INT
Read/write input
10
11
12
R/W
AS
CS
AD
7
Interrupt request output
V
SS
24-Pin DIP Module
PN328701.eps
Sept. 1996 D
1
bq3287/bq3287A
Absolute Maximum Ratings
Symbol
Parameter
Value
Unit
Conditions
VCC
DC voltage applied on VCC relative to VSS
-0.3 to 7.0
V
DC voltage applied on any pin excluding VCC
relative to VSS
VT
V
VT ≤ VCC + 0.3
-0.3 to 7.0
0 to +70
-20 to +70
-40 to +70
-40 to +70
-10 to +70
-20 to +70
260
°C
°C
°C
°C
°C
°C
°C
Commercial
Extended “I”
Commercial
Extended “I”
Commercial
Extended “I”
For 10 seconds
TOPR
Operating temperature
Storage temperature
Temperature under bias
TSTG
TBIAS
TSOLDER Soldering temperature
Note:
Permanent device damage may occur if Absolu te Ma xim u m Ra tin gs are exceeded. Functional opera-
tion should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Expo-
sure to conditions beyond the operational limits for extended periods of time may affect device reliability.
Recommended DC Operating Conditions (T = T
)
OPR
A
Symbol
VCC
Parameter
Supply voltage
Minimum
Typical
Maximum
Unit
V
4.5
0
5.0
5.5
0
VSS
VIL
VIH
Supply voltage
0
-
V
Input low voltage
Input high voltage
-0.3
2.2
0.8
V
-
VCC + 0.3
V
Note:
Typical values indicate operation at TA = 25°C.
DC Electrical Characteristics (T = T
, V
= 5V ± 10%)
A
OPR CC
Symbol
Parameter
Minimum Typical Maximum
Unit
Conditions/Notes
VIN = VSS to VCC
ILI
Input leakage current
-
-
-
-
± 1
± 1
µA
AD0–AD7, INT and SQW
in high impedance
ILO
Output leakage current
µA
VOH
VOL
Output high voltage
Output low voltage
2.4
-
-
-
-
V
V
IOH = -1.0 mA
IOL = 4.0 mA
0.4
Min. cycle, duty = 100%,
IOH = 0mA, IOL = 0mA
ICC
Operating supply current
-
7
15
mA
VSO
Supply switch-over voltage
Power-fail-detect voltage
-
3.0
-
V
V
VPFD
4.0
4.17
4.35
Internal 30K pull-up
(bq3287A only)
IRCL
Input current when RCL = VSS
-
-
-
-
185
µA
µA
IMOTH
Input current when MOT =
VCC
-185
Internal 30K pull-down
Note:
Typical values indicate operation at TA = 25°C, VCC = 5V.
Sept. 1996 D
2
bq3287/bq3287A
Power-Down/Power-Up Timing (T = T
A
OPR)
Symbol
Parameter
Minimum
300
Typical
Maximum
Unit
µs
Conditions
tF
VCC slew from 4.5V to 0V
VCC slew from 0V to 4.5V
-
-
-
-
tR
100
µs
Internal write-protection
period after VCC passes VPFD
on power-up.
tCSR
CS at VIH after power-up
20
10
-
-
200
-
ms
Data-retention and time-
keeping time
tDR
years TA = 25°C.
Note:
Clock accuracy is better than ± 1 minute per month at 25°C for the period of tDR.
Ca u tion : Nega tive u n d er sh oots below th e a bsolu te m a xim u m r a tin g of -0.3V in ba tter y-ba ck u p m od e
m a y a ffect d a ta in tegr ity.
Power-Down/Power-Up Timing
Sept. 1996 D
3
bq3287/bq3287A
24-Pin MT (T-type module)
24-Pin MT (T-type module)
Dimension
Minimum
0.360
0.015
0.015
0.008
1.320
0.685
0.590
0.090
0.120
0.100
Maximum
0.375
-
A
A1
B
C
D
E
0.022
0.013
1.335
0.700
0.620
0.110
0.130
0.120
e
G
L
S
All dimensions are in inches.
Sept. 1996 D
4
bq3287/bq3287A
Data Sheet Revision History
Change No.
Page No.
Description
Address strobe input
Nature of Change
1
1
Clarification
Was 4.1 min, 4.25 max;
is 4.0 min, 4.35 max
1
2
2
1
Power-fail detect voltage VPFD
Was : “As shipped from Benchmarq, the backup cell
is electrically isolated from the memory. ”
Is: “As shipped from Benchmarq, the backup cell is
electrically isolated from the active circuitry. ”
Clarification
Changed temperature from N (industrial, -40 to
+85°C) to I (extended, -20 to +70°C)
2
3
2, 4
2
Specification change
Changed values
IRCL max. was 275; is now 185. Pull-up = 30K
IMOTH max. was -275; is now -185. Pull-down = 30K
Notes:
Change 1 = Nov. 1992 B changes from June 1991 A.
Change 2 = Nov. 1995 C changes from Nov. 1992 B.
Change 3 = Sept. 1996 D changes from Nov. 1995 C.
Ordering Information
bq3287
MT -
Tem p er a tu r e:
blank = Commercial (0 to +70°C)
I = Extended* (-20 to +70°C)
Pa ck a ge Op tion :
MT = T-type module
RAM Clea r Op tion :
A = RAM clear on pin 21
no mark = No connect on pin 21
Device:
bq3287 Real-Time Clock Module
*Contact factory for availability.
Sept. 1996 D
5
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
BQ3287AMT-I
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
DIP MOD
ULE
MT
24
24
24
24
1
1
1
1
Pb-Free
(RoHS)
CU SN
CU SN
CU SN
CU SN
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
BQ3287AMT-SB2
BQ3287MT-I
DIP MOD
ULE
MT
MT
MT
Pb-Free
(RoHS)
DIP MOD
ULE
Pb-Free
(RoHS)
BQ3287MT-SB2
DIP MOD
ULE
Pb-Free
(RoHS)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDI064 – MAY 2001
MT (R-PDIP-T**)
PLASTIC DUAL-IN-LINE
28 PINS SHOWN
Inches
Max.
Millimeters
Min.
9.14
Max.
Dimension
Min.
0.360
0.015
0.015
0.008
1.320
1.520
0.710
0.590
0.090
0.110
0.100
0.390
–
A
9.91
–
A1
B
0.38
0.022
0.56
0.33
0.38
0.20
C
0.013
1.335
1.535
0.740
D/24 PIN
D/28 PIN
33.53
38.61
18.03
33.91
38.99
18.80
16.00
2.79
E
e
D
14.99
2.29
0.630
0.110
G
L
3.30
2.79
2.54
0.130
0.120
S
3.05
E
A1
A
C
B
L
S
G
e
4201978/A 03/01
NOTES: A. All linear dimensions are in inches (mm).
B. This drawing is subject to change without notice.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明