BQ3287AMT- [TI]

Real-Time Clock RTC Module; 实时时钟RTC模块
BQ3287AMT-
型号: BQ3287AMT-
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Real-Time Clock RTC Module
实时时钟RTC模块

时钟
文件: 总6页 (文件大小:79K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
bq3287/bq3287A  
(
)
Real-Time Clock RTC Module  
Calendar in day of the week, day  
of the month, months, and years  
with automatic leap-year adjust-  
ment  
bq3287A version is identical to the  
bq3287, with the addition of the RAM  
clear input.  
Features  
Dir ect clock/ca len da r r epla ce-  
m en t for IBM® AT-com pa t ible  
computers and other applications  
The bq3287 is a fully compatible  
r e a l-t im e clock for I B M AT-  
compatible computers and other ap-  
p lica t ion s . T h e b q 3 2 8 7 w r it e -  
pr ot ect s t h e clock, ca len da r, a n d  
storage registers during power fail-  
u r e. Th e in t egr a l ba cku p en er gy  
source then maintains data and op-  
erates the clock and calendar.  
Programmable square wave out-  
Functionally compatible with the  
put  
DS1287/DS1287A and MC146818A  
Three individually maskable in-  
114 bytes of general nonvolatile  
terrupt event flags:  
storage  
- Periodic rates from 122 µs to  
Integral lithium cell and crystal  
500 ms  
160 ns cycle time allows fast bus  
As shipped from Benchma rq, the  
real time clock is turned off to maxi-  
mize battery capacity for in-system  
operation.  
- Time-of-day alarm once per  
operation  
second to once per day  
Selectable Intel or Motorola bus  
timing  
- End-of-clock update cycle  
B e t t e r t h a n on e m in u t e p e r  
14 bytes for clock/calendar and  
The bq3287 is functionally equiva-  
lent to the bq3285, except that the  
battery (16, 20) and crystal (2, 3)  
pins are not accessible. These pins  
are connected internally to a coin  
cell and quartz crystal. The coin cell  
is sized to provide 10 years of data  
retention and clock operation in the  
absence of power. For a complete de-  
scription of features, operating con-  
dit ion s, elect r ica l ch a r a ct er ist ics,  
bus timing, and pin descriptions, see  
the bq3285 data sheet.  
control  
month clock accuracy  
BCD or binary format for clock  
and calendar data  
General Description  
Time of day in seconds, minutes,  
Th e CMOS bq3287/bq3287A is a  
low-power microprocessor periph-  
eral providing a time-of-day clock  
and 100-year calendar with alarm  
fea t u r es a n d ba t t er y oper a t ion .  
O t h e r fe a t u r e s in clu d e t h r e e  
maskable interrupt sources, square-  
wave output, and 114 bytes of gen-  
e r a l n on vola t ile s t or a ge. Th e  
and hours  
- 12- or 24-hour format  
- Optional daylight saving  
adjustment  
Pin Connections  
Pin Names  
AD0–AD7 Multiplexed address/data  
RST  
SQW  
NC  
Reset input  
input/output  
MOT  
24  
1
V
CC  
Square wave output  
No connect  
MOT  
CS  
Bus type select input  
Chip select input  
NC  
NC  
23  
22  
2
3
SQW  
NC  
4
NC/RCL  
NC  
AD  
AD  
AD  
AD  
AD  
AD  
AD  
21  
20  
19  
18  
17  
16  
15  
14  
13  
0
1
2
3
4
5
6
5
RCL  
RAM clear input  
(bq3287A only)  
AS  
Address strobe input  
Data strobe input  
6
INT  
7
RST  
DS  
NC  
DS  
8
9
VCC  
VSS  
+5V supply  
Ground  
R/W  
INT  
Read/write input  
10  
11  
12  
R/W  
AS  
CS  
AD  
7
Interrupt request output  
V
SS  
24-Pin DIP Module  
PN328701.eps  
Sept. 1996 D  
1
bq3287/bq3287A  
Absolute Maximum Ratings  
Symbol  
Parameter  
Value  
Unit  
Conditions  
VCC  
DC voltage applied on VCC relative to VSS  
-0.3 to 7.0  
V
DC voltage applied on any pin excluding VCC  
relative to VSS  
VT  
V
VT VCC + 0.3  
-0.3 to 7.0  
0 to +70  
-20 to +70  
-40 to +70  
-40 to +70  
-10 to +70  
-20 to +70  
260  
°C  
°C  
°C  
°C  
°C  
°C  
°C  
Commercial  
Extended I”  
Commercial  
Extended I”  
Commercial  
Extended I”  
For 10 seconds  
TOPR  
Operating temperature  
Storage temperature  
Temperature under bias  
TSTG  
TBIAS  
TSOLDER Soldering temperature  
Note:  
Permanent device damage may occur if Absolu te Ma xim u m Ra tin gs are exceeded. Functional opera-  
tion should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Expo-  
sure to conditions beyond the operational limits for extended periods of time may affect device reliability.  
Recommended DC Operating Conditions (T = T  
)
OPR  
A
Symbol  
VCC  
Parameter  
Supply voltage  
Minimum  
Typical  
Maximum  
Unit  
V
4.5  
0
5.0  
5.5  
0
VSS  
VIL  
VIH  
Supply voltage  
0
-
V
Input low voltage  
Input high voltage  
-0.3  
2.2  
0.8  
V
-
VCC + 0.3  
V
Note:  
Typical values indicate operation at TA = 25°C.  
DC Electrical Characteristics (T = T  
, V  
= 5V ± 10%)  
A
OPR CC  
Symbol  
Parameter  
Minimum Typical Maximum  
Unit  
Conditions/Notes  
VIN = VSS to VCC  
ILI  
Input leakage current  
-
-
-
-
± 1  
± 1  
µA  
AD0–AD7, INT and SQW  
in high impedance  
ILO  
Output leakage current  
µA  
VOH  
VOL  
Output high voltage  
Output low voltage  
2.4  
-
-
-
-
V
V
IOH = -1.0 mA  
IOL = 4.0 mA  
0.4  
Min. cycle, duty = 100%,  
IOH = 0mA, IOL = 0mA  
ICC  
Operating supply current  
-
7
15  
mA  
VSO  
Supply switch-over voltage  
Power-fail-detect voltage  
-
3.0  
-
V
V
VPFD  
4.0  
4.17  
4.35  
Internal 30K pull-up  
(bq3287A only)  
IRCL  
Input current when RCL = VSS  
-
-
-
-
185  
µA  
µA  
IMOTH  
Input current when MOT =  
VCC  
-185  
Internal 30K pull-down  
Note:  
Typical values indicate operation at TA = 25°C, VCC = 5V.  
Sept. 1996 D  
2
bq3287/bq3287A  
Power-Down/Power-Up Timing (T = T  
A
OPR)  
Symbol  
Parameter  
Minimum  
300  
Typical  
Maximum  
Unit  
µs  
Conditions  
tF  
VCC slew from 4.5V to 0V  
VCC slew from 0V to 4.5V  
-
-
-
-
tR  
100  
µs  
Internal write-protection  
period after VCC passes VPFD  
on power-up.  
tCSR  
CS at VIH after power-up  
20  
10  
-
-
200  
-
ms  
Data-retention and time-  
keeping time  
tDR  
years TA = 25°C.  
Note:  
Clock accuracy is better than ± 1 minute per month at 25°C for the period of tDR.  
Ca u tion : Nega tive u n d er sh oots below th e a bsolu te m a xim u m r a tin g of -0.3V in ba tter y-ba ck u p m od e  
m a y a ffect d a ta in tegr ity.  
Power-Down/Power-Up Timing  
Sept. 1996 D  
3
bq3287/bq3287A  
24-Pin MT (T-type module)  
24-Pin MT (T-type module)  
Dimension  
Minimum  
0.360  
0.015  
0.015  
0.008  
1.320  
0.685  
0.590  
0.090  
0.120  
0.100  
Maximum  
0.375  
-
A
A1  
B
C
D
E
0.022  
0.013  
1.335  
0.700  
0.620  
0.110  
0.130  
0.120  
e
G
L
S
All dimensions are in inches.  
Sept. 1996 D  
4
bq3287/bq3287A  
Data Sheet Revision History  
Change No.  
Page No.  
Description  
Address strobe input  
Nature of Change  
1
1
Clarification  
Was 4.1 min, 4.25 max;  
is 4.0 min, 4.35 max  
1
2
2
1
Power-fail detect voltage VPFD  
Was : As shipped from Benchmarq, the backup cell  
is electrically isolated from the memory. ”  
Is: As shipped from Benchmarq, the backup cell is  
electrically isolated from the active circuitry. ”  
Clarification  
Changed temperature from N (industrial, -40 to  
+85°C) to I (extended, -20 to +70°C)  
2
3
2, 4  
2
Specification change  
Changed values  
IRCL max. was 275; is now 185. Pull-up = 30K  
IMOTH max. was -275; is now -185. Pull-down = 30K  
Notes:  
Change 1 = Nov. 1992 B changes from June 1991 A.  
Change 2 = Nov. 1995 C changes from Nov. 1992 B.  
Change 3 = Sept. 1996 D changes from Nov. 1995 C.  
Ordering Information  
bq3287  
MT -  
Tem p er a tu r e:  
blank = Commercial (0 to +70°C)  
I = Extended* (-20 to +70°C)  
Pa ck a ge Op tion :  
MT = T-type module  
RAM Clea r Op tion :  
A = RAM clear on pin 21  
no mark = No connect on pin 21  
Device:  
bq3287 Real-Time Clock Module  
*Contact factory for availability.  
Sept. 1996 D  
5
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 1999, Texas Instruments Incorporated  

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