U2750B-A [TEMIC]
Audio Tuner, 3-Band, PDSO28, SSO-28;
| 型号： | U2750B-A |
| 厂家： | 
TEMIC SEMICONDUCTORS |
| 描述： | Audio Tuner, 3-Band, PDSO28, SSO-28 放大器 射频 光电二极管 商用集成电路 |
| 文件： | 总10页 (文件大小：217K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
U2750B-A
Tuner IC for DAB
Description
The U2750B-A is a monolithically integrated tuner it performs two selectable mixers, one VCO, a
circuit fabricated in TEMIC’s advanced UHF5S SAW–filter driver, an LO output buffer, a tri-state band
technology. Designed for applications in DAB receivers switch and an AGC-voltage generation block.
Features
8.5 V supply voltage
Balanced LO output for PLL
SAW filter driver with low impedance output
RF frequency range 70 to 260 MHz
Two identical mixers, selectable by bandswitch input
Power measurement and generation of AGC voltage
by charge pump output
Balanced mixer input, balanced mixer output
(open collector)
Three charge pump currents selectable
(zero, low, high)
Four pin voltage controlled oscillator
Voltage regulator for stable operating characteristics
Block Diagram
MXO2
GND
LO2
MAI1
MAI2
MBI1
MBI2
SWI1 SWI2 SLI
LO1
GND
VS
MXO1
SAW-
driver
SLI
NWAGC
BUF_LO
MIXA
MIXB
VCO
C2 B1 B2 C1
Voltage
stabilization
Band-
switch
SWO2
SWO1
GND
CP
BDSW
GND VS
TH
NWAGC
12485
V
Tune
Figure 1.
TELEFUNKEN Semiconductors
1 (10)
Rev. A1, 28-Aug-96
Preliminary Information
U2750B-A
Pin Description
Pin
1
Symbol
CP
Function
Charge pump output of compa-
rator
CP
1
2
3
4
5
6
7
8
9
SLI
28
TH
27
26
2
3
TH
Threshold input of comparator
SWI1
SWI2
MXO1
BDSW Band switch input
GND Ground
BDSW
4, 5,
10, 21,
26
GND
GND
25
24
6
7
8
C1VC Collector Pin 1 of VCO
B2VC Base Pin 2 of VCO
B1VC Base Pin 1 of VCO
C2VC Collector Pin 2 of VCO
MXO2
VS
9
23
22
21
C1VC
B2VC
B1VC
11, 20
12
13
14
15
16
17
18
19
22
23
24
25
27
28
VS
Supply voltage
SWO1 Differential output of SAW-driver
SWO2 Differential output of SAW-driver
NWAGC AGC mode selection
GND
MBI2
MBI1
MAI2
SLI
AGC mode selection
SWI1 Differential input of SAW-driver
SWI2 Differential input of SAW-driver
MXO1 Differential mixer output
MXO2 Differential mixer output
MBI2 Differential input of mixer B
MBI1 Differential input of mixer B
MAI2 Differential input of mixer A
MAI1 Differential input of mixer A
20
19
C2VC
GND
VS
10
11
12
18
17
16
15
MAI1
GND
LO2
SWO1
SWO2
LO2
LO1
Differential output of LO for PLL
Differential output of LO for PLL
13
14
NWAGC
LO1
912486
Figure 2.
2 (10)
TELEFUNKEN Semiconductors
Rev. A1, 28-Aug-96
Preliminary Information
U2750B-A
Functional Description
The U2750B-A represents a tuner IC for applications in its differential output pins SWO1, SWO2 to an external
DAB receivers. It is intended to be used for receiption of SAW-filter.
band II or band III DAB signals and consists of two mix-
ers, one VCO, a SAW–filter driver, an LO output buffer,
AGC-Voltage Generation Block
a tri-state band switch and an AGC-voltage generation
The incoming RF signal which appears at the input pins
circuitry as shown in figure 1.
MAI1, MAI2 or MBI1, MBI2 depending on the selec-
tion made by the BDSW pin is amplified, weakly band
Mixers and VCO
pass filtered (transition range: 50 to 300 MHz), rectified
In order to support two different channels two identical
and finally low pass filtered.
mixers are integrated. The RF signal is fed to these mixers
The voltage derived in this ‘power measurement process’
is compared with a voltage threshold which is defined by
an external resistor connected to pin TH according to fig-
ure 3. Depending on the result of this comparison a charge
pump feeds a positive or negative current to pin CP in or-
der to charge or discharge an external capacitor. The
voltage of this external capacitor can be used to control
the gain of an external (pre-) amplifier stage. By means
of the pins NWAGC and SLI the current of the charge
pump can be selected according to the following table:
via the differential input ports MAI1, MAI2 and MBI1,
MBI2. The band switch input BDSW allows to select one
of these mixers or to switch off both.
An internal four pin (pins: B1VC, C1VC, B2VC, C2VC)
oscillator an equivalent circuit is shown in figure 5
provides the LO signal to both mixers. Via an LO-buffer
the oscillators signal can be accessed at the balanced out-
put pins LO1, LO2 in order to be fed to a frequency
synthesizer circuit (U2753B or U2733B). The result of
the mixing process of both mixers appears at the differen-
tial open collector output MXO1, MXO2. In the
application shown in figure 3 these mixer output pins are
loaded by a resonant load.
NWAGC
SLI
Charge Pump
Current / A
‘Low’
‘High’
‘High’
X
‘Low’
‘High’
off
40 A (slow mode)
250 A (fast mode)
SAW-Filter Driver
The filters’ mixer output signal is applied to the differen-
tial input pins SWI1, SWI2 of a SAW-filter driver which An overview of the functionality of this block can be
amplifies the result of the mixing process and feeds it via taken from figure 4.
TELEFUNKEN Semiconductors
3 (10)
Rev. A1, 28-Aug-96
Preliminary Information
U2750B-A
Absolute Maximum Ratings
Parameters
Supply voltage
Junction temperature
Symbol
V
S
Min.
–0.3
Typ.
Max.
9.5
+125
+125
6.9
6
Unit
V
°C
°C
V
V
V
V
Pins 11 and 20
T
j
Storage temperature
T
–40
0.4
–0.3
–0.3
–0.3
stg
Ext. applied voltage at charge pump output
Band switch input voltage
NWAGC input voltage
SLI input voltage
Pin 1
Pin 3
Pin 14
Pin 15
VCP
VBDSW
VNWAGC
VSLI
6
6
differential input voltage of SAW–driver Pins 16 and 17
VSWI
VMXO
VMXI
300
9.5
50
mV
RMS
mixer output supply voltage
Pin 19
6.5
V
differential input voltage mixer A,B
mV
RMS
Pins 22, 23, 24 and 25
Operating Range
Parameters
Supply voltage
Ambient temperature
Symbol
Min.
8.0
–40
Typ.
8.5
Max.
9.35
85
Unit
V
°C
Pins 11 and 20
V
S
T
amb
Thermal Resistance
Parameters
Symbol
R
thJA
Min.
Typ.
130
Max.
Unit
K/W
Junction ambient
SSO28
Electrical Characteristics
Test conditions (unless otherwise specified): V = 8.5 V, T
= +25°C, test circuit see figure 3
S
amb
Parameters
Overall characteristics
Supply voltage
Supply current
Voltage gain
Test Conditions / Pins
Symbol
Min.
Typ.
Max.
Unit
VS
VS
V
S
8.0
21.6
30
8.5
27
32
9.35
32.4
34
V
mA
dB
I
S
Pins MXA, MXB
GV,tot
NF,DSB
Pin, max
1)
IF-Port
Noise figure double side
band
Maximum input level
Pins MXA, MXB
8
dB
1)
IF-Port
3rd order intermodulation
distance 30 dBc
–25
–22
dBm
1)
Pins MXA,MXB
Mixer A, B
Mixer output current
Input frequency range
Input impedance
VCO
Pins 18 and 19
Pins 22, 23, 24 and 25
Pins 22, 23, 24 and 25
IOMX
2.6
70
3.3
80
4.0
260
mA
MHz
f , IMX
in
Zin, max
Phase noise
Pin LO port
f = 10 kHz
L(f)
–92
dBc/Hz
MHz
f
110
300
LO
4 (10)
TELEFUNKEN Semiconductors
Rev. A1, 28-Aug-96
Preliminary Information
U2750B-A
Electrical Characteristics (continued)
Test conditions (unless otherwise specified): V = 8.5 V, T
= +25°C, test circuit see figure 3
S
amb
Parameters
LO buffer
LO output power
Test Conditions / Pins
200 load, differential
Symbol
Min.
26
Typ.
Max.
Unit
mV
pLO
34
eff
LO output impedance
Differential
ZoutLO
200
Pins 27 and 28
SAW driver
Input impedance
Differential
Pins 16 and 17
Differential
Pins 12 and 13
Pins 16, 17 – 12, 13
ZISAW
ZOSAW
GV,SAW
580
24
Output impedance
2)
Voltage gain
18
dB
AGC unit
Internal voltage for
threshold adjustment
Maximum positive charge
pump current, fast mode
Without external resistor
Pin 2
VTH
1.94
250
V
V
=‘H’, V = ‘H’,
ICP
200
–300
32
300
–200
48
µA
NWAGC
SLI
pos,fm
neg,fm
pos,sm
neg,sm
P
RF
= –30 dBm,
R = 12 k
th
Pin 1
Maximum negative charge
pump current, fast mode
V
= ‘H’, V = ‘H’, ICP
–250
40
µA
µA
µA
NWAGC
SLI
P
RF
= –25 dBm,
R = 12 k
th
Maximum positive charge
pump current, slow mode
V
= ‘H’, V = ‘L’,
ICP
ICP
NWAGC
SLI
P
RF
= –30 dBm,
Rth = 12 k ,
Pin 1
Maximum negative charge
pump current, slow mode
V
= ‘H’, V = ‘L’,
–48
–50
–40
–32
50
NWAGC
SLI
P
RF
= –25 dBm,
Rth = 12 k ,
Pin 1
Pin 1
High impedance mode
charge pump current
Minimum gain control
voltage
Maximum gain control
voltage
V
= ‘L’
ICP
0
nA
V
NWAGC
hi
VAGC
0.5
6.9
min
VAGC
V
max
Control voltage at NWAGC NWAGC = ‘H’
Pin 14 VNWAGC-
3.0
3.0
V
H
Control voltage at NWAGC NWAGC = ‘L’
Pin 14 VNWAGC-
1.5
V
L
Control voltage at SLI
Control voltage at SLI
Bandswitch
SLI = ‘H’
SLI = ‘L’
VSLI
V
V
H
VSLI
1.5
1.0
3.0
L
Bandswitch
MXA active
VBDSW
0
5.0
V
V
V
A
MXB active
MXA,MXB inactive
VBDSW
4.0
2.0
B
VBDSW
off
1)
2)
Measurement corrected by loss of transformers.
Ratio of the output voltage at the primary coil of L4 (Pins 12 and 13) to the input voltage (MXA, MXB).
TELEFUNKEN Semiconductors
5 (10)
Rev. A1, 28-Aug-96
Preliminary Information
U2750B-A
Application Circuit
( f = 38.912 MHz )
IF
L1
VS
MXB
MXA
100 n
100 p
L3
L2
12 p
1 n 1 n 1 n 1 n
1 n
PLL
LO-Port
10 n
10 n
U2733B, U2753B
SLI
1 n
28 27 26 25 24 23 22 21 20 19 18 17 16 15
L1,L2 : Toko 617PT–1026
(3T:3Tx2)
L3 : Toko 600ENS–9272Y
(6Tx2)
U2750B-A
SSO28
L4 : Toko 600ENS–9273X
(13T:2T)
L5 : Air coil enamelled copper wire
(3.5T, d=3.0mm)
1
2
3
4
5
6
7
8
9
10 11 12 13 14
NWAGC
VS
1 n
100 p
10 n
3.3 u
V
AGC
1 n
10 n
2.7 p
2.7 p
R
th
BDSW
L4
4.7 k
IF–Port
12 p
D1
Cp
L5
V
Tune
22k
Ck
fLO
D1
Cp
Ck
L5
208 to 285 MHz
108 to 285 MHz
BB 515 4.7 p
BB 619
22 p 3.5 T, d = 3.0 mm
100 p 4.5 T, d = 3.0 mm
–
12487
Figure 3.
6 (10)
TELEFUNKEN Semiconductors
Rev. A1, 28-Aug-96
Preliminary Information
U2750B-A
Equivalent Circuit of AGC-Voltage Generation Block
BDSW
MAI
MBI
SLI
NWAGC
AGC_TP
AGC_BP
AGC_RECT
1.94 V
BUF_IN
AGC
voltage
Mixer
100
CP
CHARGE
PUMP
AGC_COMP
AGC_THRESH
TH
6.48 k
Cagc
R
th
12488
Figure 4.
Equivalent Circuit of VCO
VS
5.9 V
3.5 k
3.5 k
C1VC
V
Tune
B1VC
B2VC
C2VC
12489
Figure 5.
TELEFUNKEN Semiconductors
7 (10)
Rev. A1, 28-Aug-96
Preliminary Information
U2750B-A
Typical Operation Characteristics
Operating conditions: V = 8.5 V, T
= 27°C. Test conditions see figure 3.
S
amb
Overall Gain
RF Power Adjustment by Rth
fRF = 240 MHz
f
= 240 MHz applied to MXA-Port;
RF
pIF measured at IF-Port
–20
5
0
–25
–30
–35
–40
–5
–10
–15
–20
–25
5
10
15
20
25
30
35
40
12492
Rth / k
–40
–35
–30
–25
–20
12490
pRF / dBm
Figure 8.
Figure 6.
Output Impedance SAW-Filter Driver
Pins 12 and 13, differential
3rd Order 2-Tone Intermodulation Ratio
fRF1 = 240 MHz and fRF2 = 241 MHz applied to MXA-
Port; DIM3 measured at IF-Port
70
60
50
40
30
20
10
–40
–35
–30
–25
–20
12491
pRF / dBm
12493
Figure 7.
Figure 9.
8 (10)
TELEFUNKEN Semiconductors
Rev. A1, 28-Aug-96
Preliminary Information
U2750B-A
fPackage Information
Package: SSO28
Dimensions in mm
95 9943
TELEFUNKEN Semiconductors
9 (10)
Rev. A1, 28-Aug-96
Preliminary Information
U2750B-A
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of
continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain
such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
10 (10)
TELEFUNKEN Semiconductors
Rev. A1, 28-Aug-96
Preliminary Information
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