ITG-3400 [TDK]
Triple-axis MEMS gyroscope;
| 型号： | ITG-3400 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | Triple-axis MEMS gyroscope |
| 文件： | 总41页 (文件大小：1319K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
InvenSense Inc.
Document Number: PS-ITG-3400A-00
Revision: 1.0
Release Date: 12/24/2013
1745 Technology Drive, San Jose, CA 95110 U.S.A.
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: www.invensense.com
ITG-3400
Product Specification
Revision 1.0
1 of 41
Document Number: PS-ITG-3400A-00
Revision: 1.0
Release Date: 12/24/2013
ITG-3400 Product Specification
TABLE OF CONTENTS
TABLE OF FIGURES.........................................................................................................................................4
TABLE OF TABLES ..........................................................................................................................................5
1
DOCUMENT INFORMATION......................................................................................................................6
1.1
REVISION HISTORY ..............................................................................................................................6
PURPOSE AND SCOPE..........................................................................................................................7
PRODUCT OVERVIEW...........................................................................................................................7
APPLICATIONS .....................................................................................................................................7
1.2
1.3
1.4
2
3
FEATURES..................................................................................................................................................8
2.1
2.2
GYROSCOPE FEATURES.......................................................................................................................8
ADDITIONAL FEATURES ........................................................................................................................8
ELECTRICAL CHARACTERISTICS...........................................................................................................9
3.1
GYROSCOPE SPECIFICATIONS..............................................................................................................9
ELECTRICAL SPECIFICATIONS.............................................................................................................10
I2C TIMING CHARACTERIZATION.........................................................................................................13
SPI TIMING CHARACTERIZATION.........................................................................................................14
ABSOLUTE MAXIMUM RATINGS ...........................................................................................................15
3.2
3.3
3.4
3.5
4
APPLICATIONS INFORMATION..............................................................................................................16
4.1
PIN OUT DIAGRAM AND SIGNAL DESCRIPTION.....................................................................................16
TYPICAL OPERATING CIRCUIT.............................................................................................................17
BILL OF MATERIALS FOR EXTERNAL COMPONENTS..............................................................................17
BLOCK DIAGRAM ...............................................................................................................................18
OVERVIEW ........................................................................................................................................18
THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING................................18
I2C AND SPI SERIAL COMMUNICATIONS INTERFACES ..........................................................................19
CLOCKING.........................................................................................................................................20
SENSOR DATA REGISTERS.................................................................................................................20
FIFO ................................................................................................................................................21
INTERRUPTS......................................................................................................................................21
DIGITAL-OUTPUT TEMPERATURE SENSOR ..........................................................................................21
BIAS AND LDOS ................................................................................................................................21
CHARGE PUMP ..................................................................................................................................21
STANDARD POWER MODES................................................................................................................21
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10
4.11
4.12
4.13
4.14
4.15
5
PROGRAMMABLE INTERRUPTS............................................................................................................23
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Document Number: PS-ITG-3400A-00
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ITG-3400 Product Specification
6
DIGITAL INTERFACE ...............................................................................................................................24
6.1
I2C AND SPI SERIAL INTERFACES ......................................................................................................24
I2C INTERFACE..................................................................................................................................24
I2C COMMUNICATIONS PROTOCOL .....................................................................................................24
I2C TERMS ........................................................................................................................................27
SPI INTERFACE .................................................................................................................................28
6.2
6.3
6.4
6.5
7
8
SERIAL INTERFACE CONSIDERATIONS...............................................................................................29
7.1
ITG-3400 SUPPORTED INTERFACES...................................................................................................29
ASSEMBLY ...............................................................................................................................................30
8.1
ORIENTATION OF AXES ......................................................................................................................30
PACKAGE DIMENSIONS ......................................................................................................................31
PCB DESIGN GUIDELINES..................................................................................................................32
ASSEMBLY PRECAUTIONS ..................................................................................................................33
STORAGE SPECIFICATIONS.................................................................................................................36
PACKAGE MARKING SPECIFICATION....................................................................................................36
TAPE & REEL SPECIFICATION.............................................................................................................37
LABEL ...............................................................................................................................................38
PACKAGING.......................................................................................................................................39
REPRESENTATIVE SHIPPING CARTON LABEL .......................................................................................40
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
9
ENVIRONMENTAL COMPLIANCE...........................................................................................................41
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ITG-3400 Product Specification
Table of Figures
Figure 1 I2C Bus Timing Diagram ....................................................................................................................13
Figure 2 SPI Bus Timing Diagram ....................................................................................................................14
Figure 3 Pin out Diagram for ITG-3400 3.0x3.0x0.9mm QFN..........................................................................16
Figure 4 ITG-3400 QFN Application Schematic. (a) I2C operation, (b) SPI operation....................................17
Figure 5 ITG-3400 Block Diagram....................................................................................................................18
Figure 6 ITG-3400 Solution Using I2C Interface...............................................................................................19
Figure 7 ITG-3400 Solution Using SPI Interface ..............................................................................................20
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ITG-3400 Product Specification
Table of Tables
Table 1 Gyroscope Specifications ......................................................................................................................9
Table 2 D.C. Electrical Characteristics.............................................................................................................10
Table 3 A.C. Electrical Characteristics .............................................................................................................12
Table 4 I2C Timing Characteristics ...................................................................................................................13
Table 5 SPI Timing Characteristics ..................................................................................................................14
Table 6 fCLK = 20MHz .....................................................................................................................................15
Table 7 Absolute Maximum Ratings.................................................................................................................15
Table 8 Signal Descriptions..............................................................................................................................16
Table 9 Bill of Materials ....................................................................................................................................17
Table 10 Standard Power Modes for ITG-3400................................................................................................22
Table 11 Table of Interrupt Sources .................................................................................................................23
Table 12 Serial Interface...................................................................................................................................24
Table 13 I2C Terms...........................................................................................................................................27
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Document Number: PS-ITG-3400A-00
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ITG-3400 Product Specification
1
Document Information
1.1 Revision History
Revision
Revision Description
Date
12/24/2013
1.0
Initial Release
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Document Number: PS-ITG-3400A-00
Revision: 1.0
Release Date: 12/24/2013
ITG-3400 Product Specification
1.2 Purpose and Scope
This document is a preliminary product specification, providing a description, specifications, and design
related information on the ITG-3400™ gyroscope device. The device is housed in a small 3x3x0.9mm 24-pin
QFN package.
Specifications are subject to change without notice. Final specifications will be updated based upon
characterization of production silicon. For references to register map and descriptions of individual registers,
please refer to the ITG-3400 Register Map and Register Descriptions document.
1.3 Product Overview
The ITG-3400 is a 3-axis gyroscope that is housed in a small 3x3x0.9mm (24-pin QFN) package. It also
features a 4096-byte FIFO that can lower the traffic on the serial bus interface, and reduce power
consumption by allowing the system processor to burst read sensor data and then go into a low-power
mode. With its dedicated I2C sensor bus, the ITG-3400 directly accepts inputs from external I2C devices.
The gyroscope has a programmable full-scale range of ±250, ±500, ±1000, and ±2000 degrees/sec. Factory-
calibrated initial sensitivity of the sensor reduces production-line calibration requirements.
Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, a precision clock
with 1% drift from -40°C to 85°C, an embedded temperature sensor, and programmable interrupts. The
device features I2C and SPI serial interfaces, a VDD operating range of 1.71 to 3.6V, and a separate digital
IO supply, VDDIO from 1.71V to 3.6V.
Communication with all registers of the device is performed using either I2C at 400kHz or SPI at 1MHz. For
applications requiring faster communications, the sensor and interrupt registers may be read using SPI at
20MHz.
By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS
wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the package
size down to a footprint and thickness of 3x3x0.9mm (24-pin QFN), to provide a very small yet high
performance low cost package. The device provides high robustness by supporting 10,000g shock reliability.
1.4 Applications
Motion UI
Handset gaming
Location based services, points of interest, and dead reckoning
Health and sports monitoring
Power management
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Document Number: PS-ITG-3400A-00
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ITG-3400 Product Specification
2
Features
2.1 Gyroscope Features
The triple-axis MEMS gyroscope in the ITG-3400 includes a wide range of features:
Digital-output X-, Y-, and Z-axis angular rate sensors (gyroscopes) with a user-programmable full-
scale range of ±250, ±500, ±1000, and ±2000°/sec and integrated 16-bit ADCs
Digitally-programmable low-pass filter
Gyroscope operating current: 3.2mA
Factory calibrated sensitivity scale factor
2.2 Additional Features
The ITG-3400 includes the following additional features:
VDD supply voltage range of 1.8 – 3.3V ± 5%
Smallest and thinnest QFN package for portable devices: 3x3x0.9mm (24-pin QFN)
4096 byte FIFO buffer enables the applications processor to read the data in bursts
Digital-output temperature sensor
User-programmable digital filters for gyroscope and temp sensor
10,000 g shock tolerant
400kHz Fast Mode I2C for communicating with all registers
1MHz SPI serial interface for communicating with all registers
20MHz SPI serial interface for reading sensor and interrupt registers
MEMS structure hermetically sealed and bonded at wafer level
RoHS and Green compliant
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Document Number: PS-ITG-3400A-00
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ITG-3400 Product Specification
3
Electrical Characteristics
3.1 Gyroscope Specifications
Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
PARAMETER
CONDITIONS
GYROSCOPE SENSITIVITY
MIN
TYP
MAX
UNITS
NOTES
Full-Scale Range
FS_SEL=0
FS_SEL=1
FS_SEL=2
FS_SEL=3
±250
±500
±1000
±2000
16
º/s
º/s
º/s
º/s
Gyroscope ADC Word Length
Sensitivity Scale Factor
bits
FS_SEL=0
FS_SEL=1
FS_SEL=2
FS_SEL=3
25°C
131
LSB/(º/s)
LSB/(º/s)
LSB/(º/s)
LSB/(º/s)
%
65.5
32.8
16.4
±4
Sensitivity Scale Factor Tolerance
1
1
Sensitivity Scale Factor Variation Over
Temperature
0°C to +55°C
±10
%
Nonlinearity
Best fit straight line; 25°C
0.2
±2
%
%
1
Cross-Axis Sensitivity
ZERO-RATE OUTPUT (ZRO)
Initial ZRO Tolerance
25°C
±60
±60
º/s
º/s
1
ZRO Variation Over Temperature
0°C to +55°C
GYROSCOPE NOISE PERFORMANCE (FS_SEL=0)
Total RMS Noise
DLPFCFG=2 (92 Hz)
25
0.7
27
º/s-rms
KHz
1
1
GYROSCOPE MECHANICAL FREQUENCIES
LOW PASS FILTER RESPONSE
29
Programmable Range
From Sleep mode
5
250
Hz
1
1
GYROSCOPE START-UP TIME
OUTPUT DATA RATE
35
ms
Hz
Programmable, Normal (Filtered)
mode
4
8000
Table 1 Gyroscope Specifications
Notes:
1. Derived from validation or characterization of parts, not guaranteed in production.
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Document Number: PS-ITG-3400A-00
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ITG-3400 Product Specification
3.2 Electrical Specifications
3.2.1 D.C. Electrical Characteristics
Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
Units
Notes
SUPPLY VOLTAGES
VDD
1.71
1.71
1.8
1.8
3.45
3.45
V
V
VDDIO
SUPPLY CURRENTS
Normal Mode
3-axis Gyroscope
3.2
mA
1
Standby Mode
1.6
6
mA
µA
1
1
Full-Chip Sleep Mode
TEMPERATURE RANGE
Specified Temperature Range
Performance parameters are not applicable
beyond Specified Temperature Range
-40
+85
°C
Table 2 D.C. Electrical Characteristics
Notes:
1. Derived from validation or characterization of parts, not guaranteed in production.
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ITG-3400 Product Specification
3.2.2 A.C. Electrical Characteristics
Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
Parameter
Conditions
MIN
TYP
MAX
Units
NOTES
SUPPLIES
Monotonic ramp. Ramp rate
is 10% to 90% of the final
value
Supply Ramp Time
0.1
100
ms
1
TEMPERATURE SENSOR
Operating Range
Sensitivity
Ambient
Untrimmed
21°C
-40
85
°C
1
LSB/°C
LSB
333.87
Room Temp Offset
0
Power-On RESET
Supply Ramp Time (TRAMP
)
Valid power-on RESET
0.01
20
11
100
100
ms
ms
1
1
Start-up time for register read/write
From power-up
AD0 = 0
AD0 = 1
1101000
1101001
I2C ADDRESS
DIGITAL INPUTS (SYNC, AD0, SCLK, SDI, CS)
VIH, High Level Input Voltage
VIL, Low Level Input Voltage
CI, Input Capacitance
0.7*VDDIO
V
V
0.3*VDDIO
1
1
< 10
pF
DIGITAL OUTPUT (SDO, INT)
VOH, High Level Output Voltage
VOL1, LOW-Level Output Voltage
VOL.INT1, INT Low-Level Output Voltage
RLOAD=1MΩ;
RLOAD=1MΩ;
0.9*VDDIO
V
V
V
0.1*VDDIO
0.1
OPEN=1, 0.3mA sink
Current
Output Leakage Current
tINT, INT Pulse Width
OPEN=1
100
50
nA
µs
LATCH_INT_EN=0
I2C I/O (SCL, SDA)
VIL, LOW Level Input Voltage
VIH, HIGH-Level Input Voltage
-0.5V
0.3*VDDIO
V
V
0.7*VDDIO
VDDIO +
0.5V
Vhys, Hysteresis
0.1*VDDIO
V
V
VOL, LOW-Level Output Voltage
IOL, LOW-Level Output Current
3mA sink current
1
0
0.4
VOL=0.4V
VOL=0.6V
3
6
mA
mA
Output Leakage Current
100
nA
ns
tof, Output Fall Time from VIHmax to VILmax
Cb bus capacitance in pf
20+0.1Cb
250
INTERNAL CLOCK SOURCE
Fchoice=0,1,2
SMPLRT_DIV=0
Fchoice=3;
DLPFCFG=0 or 7
SMPLRT_DIV=0
32
8
kHz
kHz
Sample Rate
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ITG-3400 Product Specification
Parameter
Conditions
MIN
TYP
MAX
Units
NOTES
Fchoice=3;
DLPFCFG=1,2,3,4,5,6;
SMPLRT_DIV=0
1
kHz
1
1
1
1
CLK_SEL=0, 6; 25°C
CLK_SEL=1,2,3,4,5; 25°C
CLK_SEL=0,6
-5
-1
+5
+1
%
%
%
%
Clock Frequency Initial Tolerance
-10
+10
Frequency Variation over Temperature
CLK_SEL=1,2,3,4,5
±1
SERIAL INTERFACE
Low Speed Characterization
SPI Operating Frequency, All Registers
Read/Write
100 ±10%
1 ±10%
kHz
MHz
MHz
High Speed Characterization
SPI Operating Frequency, Sensor and
Interrupt Registers Read Only
I2C Operating Frequency
20 ±10%
All registers, Fast-mode
400
100
kHz
kHz
All registers, Standard-mode
Table 3 A.C. Electrical Characteristics
Notes:
1. Derived from validation or characterization of parts, not guaranteed in production.
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ITG-3400 Product Specification
3.3
I2C Timing Characterization
Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
Parameters
I2C TIMING
Conditions
I2C FAST-MODE
Min
Typical
Max
Units
Notes
fSCL, SCL Clock Frequency
400
kHz
µs
tHD.STA, (Repeated) START Condition Hold
Time
0.6
tLOW, SCL Low Period
tHIGH, SCL High Period
1.3
0.6
0.6
µs
µs
µs
tSU.STA, Repeated START Condition Setup
Time
tHD.DAT, SDA Data Hold Time
tSU.DAT, SDA Data Setup Time
tr, SDA and SCL Rise Time
tf, SDA and SCL Fall Time
0
µs
ns
ns
ns
µs
100
Cb bus cap. from 10 to 400pF
Cb bus cap. from 10 to 400pF
20+0.1Cb
20+0.1Cb
0.6
300
300
tSU.STO, STOP Condition Setup Time
tBUF, Bus Free Time Between STOP and
START Condition
1.3
µs
Cb, Capacitive Load for each Bus Line
tVD.DAT, Data Valid Time
< 400
pF
µs
µs
0.9
0.9
tVD.ACK, Data Valid Acknowledge Time
Table 4 I2C Timing Characteristics
Notes:
1. Timing Characteristics apply to both Primary and Auxiliary I2C Bus
2. Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
Figure 1 I2C Bus Timing Diagram
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Document Number: PS-ITG-3400A-00
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ITG-3400 Product Specification
3.4 SPI Timing Characterization
Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
Notes
Parameters
Conditions
Min
Typical
Max
Units
SPI TIMING
fSCLK, SCLK Clock Frequency
tLOW, SCLK Low Period
tHIGH, SCLK High Period
tSU.CS, CS Setup Time
tHD.CS, CS Hold Time
tSU.SDI, SDI Setup Time
tHD.SDI, SDI Hold Time
tVD.SDO, SDO Valid Time
1
MHz
ns
400
400
8
ns
ns
500
11
7
ns
ns
ns
Cload = 20pF
Cload = 20pF
100
50
ns
tHD.SDO, SDO Hold Time
4
ns
ns
tDIS.SDO, SDO Output Disable Time
Table 5 SPI Timing Characteristics
Notes:
3. Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
Figure 2 SPI Bus Timing Diagram
3.4.1 fSCLK = 20MHz
Parameters
Conditions
Min
Typical
Max
Units
SPI TIMING
fSCLK, SCLK Clock Frequency
tLOW, SCLK Low Period
tHIGH, SCLK High Period
tSU.CS, CS Setup Time
tHD.CS, CS Hold Time
0.9
-
20
-
MHz
ns
-
-
ns
1
ns
1
ns
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tSU.SDI, SDI Setup Time
0
ns
ns
tHD.SDI, SDI Hold Time
1
tVD.SDO, SDO Valid Time
tDIS.SDO, SDO Output Disable Time
Cload = 20pF
25
ns
ns
25
Table 6 fCLK = 20MHz
Notes:
1. Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
3.5 Absolute Maximum Ratings
Stress above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these conditions is not implied.
Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability.
Parameter
Rating
-0.5V to +4V
Supply Voltage, VDD
Supply Voltage, VDDIO
PLLFILT
-0.5V to +4V
-0.5V to 2V
Input Voltage Level (AD0, SYNC, INT, SCL, SDA)
Operating Temperature Range
Storage Temperature Range
-0.5V to VDD + 0.5V
-40°C to +85°C
-40°C to +125°C
2kV (HBM);
250V (MM)
Electrostatic Discharge (ESD) Protection
Latch-up
JEDEC Class II (2),125°C
±100mA
Table 7 Absolute Maximum Ratings
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ITG-3400 Product Specification
4
Applications Information
4.1 Pin Out Diagram and Signal Description
Pin Number
Pin Name
VDDIO
AD0 / SDO
REGOUT
FSYNC
INT
Pin Description
8
Digital I/O supply voltage
9
I2C Slave Address LSB (AD0); SPI serial data output (SDO)
10
Regulator filter capacitor connection
11
Frame synchronization digital input. Connect to GND if unused.
Interrupt digital output (totem pole or open-drain)
Power supply voltage and Digital I/O supply voltage
Power supply ground
12
13
VDD
18
GND
19
RESV
Reserved. Do not connect.
20
RESV
Reserved. Connect to GND.
22
nCS
Chip select (SPI mode only)
23
24
SCL / SCLK
SDA / SDI
NC
I2C serial clock (SCL); SPI serial clock (SCLK)
I2C serial data (SDA); SPI serial data input (SDI)
No Connect pins. Do not connect.
1 – 7, 14 – 17, 21
Table 8 Signal Descriptions
GND
NC
1
2
3
4
5
6
18
17
16
15
14
NC
NC
NC
NC
NC
NC
NC
NC
NC
ITG-3400
13 VDD
Figure 3 Pin out Diagram for ITG-3400 3.0x3.0x0.9mm QFN
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4.2 Typical Operating Circuit
nCS
VDDIO
SCL
SCLK
SDI
SDA
GND
GND
18
NC
NC
1
2
3
4
5
6
NC
NC
1
2
3
4
5
6
18
17
16
15
14
13
17
16
15
14
13
NC
NC
NC
NC
NC
NC
NC
NC
NC
ITG-3400
ITG-3400
NC
NC
NC
NC
NC
NC
NC
VDD
VDD
1.8 – 3.3VDC
C2, 0.1 mF
1.8 – 3.3VDC
C2, 0.1 mF
1.8 – 3.3VDC
1.8 – 3.3VDC
C1, 0.1 mF
C1, 0.1 mF
C3, 10 nF
C3, 10 nF
AD0
SD0
(a)
(b)
Figure 4 ITG-3400 QFN Application Schematic. (a) I2C operation, (b) SPI operation.
4.3 Bill of Materials for External Components
Component
Label
C1
Specification
Quantity
PLL Filter Capacitor
VDD Bypass Capacitor
VDDIO Bypass Capacitor
Ceramic, X7R, 0.1µF ±10%, 2V
Ceramic, X7R, 0.1µF ±10%, 4V
Ceramic, X7R, 10nF ±10%, 4V
1
1
1
C2
C3
Table 9 Bill of Materials
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ITG-3400 Product Specification
4.4 Block Diagram
ITG-3400
INT
/CS
Interrupt
Status
Register
Self
test
X Gyro
Y Gyro
Z Gyro
ADC
ADC
ADC
Slave I2C and
SPI Serial
Interface
AD0 / SDO
SCL / SCLK
SDA / SDI
Self
test
FIFO
User & Config
Registers
Self
test
FSYNC
Sensor
Registers
Temp Sensor
ADC
Charge
Pump
Bias & LDOs
VDD
GND
PLLFILT
Figure 5 ITG-3400 Block Diagram
4.5 Overview
The ITG-3400 is comprised of the following key blocks and functions:
Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning
Primary I2C and SPI serial communications interfaces
Clocking
Sensor Data Registers
FIFO
Interrupts
Digital-Output Temperature Sensor
Bias and LDOs
Charge Pump
Standard Power Modes
4.6 Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning
The ITG-3400 consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about
the X-, Y-, and Z- Axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes
a vibration that is detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filtered
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ITG-3400 Product Specification
to produce a voltage that is proportional to the angular rate. This voltage is digitized using individual on-chip
16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range of the gyro sensors
may be digitally programmed to ±250, ±500, ±1000, or ±2000 degrees per second (dps). The ADC sample
rate is programmable from 8,000 samples per second, down to 3.9 samples per second, and user-selectable
low-pass filters enable a wide range of cut-off frequencies.
4.7 I2C and SPI Serial Communications Interfaces
The ITG-3400 communicates to a system processor using either a SPI or an I2C serial interface. The ITG-
3400 always acts as a slave when communicating to the system processor. The LSB of the of the I2C slave
address is set by pin 4 (AD0).
4.7.1 ITG-3400 Solution Using I2C Interface
In the figure below, the system processor is an I2C master to the ITG-3400.
Interrupt
Status
Register
I2C Processor Bus: for reading all
sensor data from MPU
INT
ITG-3400
AD0
SCL
VDD or GND
Slave I2C
or SPI
SCL
SDA
System
Processor
Serial
Interface
SDA/SDI
FIFO
User & Config
Registers
Sensor
Register
Factory
Calibration
Bias & LDOs
VDD
GND
PLLFILT
Figure 6 ITG-3400 Solution Using I2C Interface
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4.7.2 ITG-3400 Solution Using SPI Interface
In the figure below, the system processor is an SPI master to the ITG-3400. Pins 2, 3, 4, and 5 are used to
support the SCLK, SDI, SDO, and CS signals for SPI communications.
Processor SPI Bus: for reading all
data from MPU and for configuring
MPU
Interrupt
INT
Status
Register
nCS
/CS
ITG-3400
SDO
SDI
Slave I2C
or SPI
Serial
Interface
System
Processor
SCLK
SDI
SCLK
SDO
FIFO
Config
Register
Sensor
Register
Factory
Calibration
Bias & LDOs
VDD
GND
PLLFILT
Figure 7 ITG-3400 Solution Using SPI Interface
4.8 Clocking
The ITG-3400 has a flexible clocking scheme, allowing a variety of internal clock sources to be used for the
internal synchronous circuitry. This synchronous circuitry includes the signal conditioning and ADCs, and
various control circuits and registers. An on-chip PLL provides flexibility in the allowable inputs for
generating this clock.
Allowable internal sources for generating the internal clock are:
An internal relaxation oscillator
Any of the X, Y, or Z gyros (MEMS oscillators with a variation of ±1% over temperature)
Selection of the source for generating the internal synchronous clock depends on the requirements for power
consumption and clock accuracy. These requirements will most likely vary by mode of operation.
There are also start-up conditions to consider. When the ITG-3400 first starts up, the device uses its internal
clock until programmed to operate from another source. This allows the user, for example, to wait for the
MEMS oscillators to stabilize before they are selected as the clock source.
4.9 Sensor Data Registers
The sensor data registers contain the latest gyro, auxiliary sensor, and temperature measurement data.
They are read-only registers, and are accessed via the serial interface. Data from these registers may be
read anytime.
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4.10 FIFO
The ITG-3400 contains a 4096-byte FIFO register that is accessible via the Serial Interface. The FIFO
configuration register determines which data is written into the FIFO. Possible choices include gyro data,
temperature readings, auxiliary sensor readings, and SYNC input. A FIFO counter keeps track of how many
bytes of valid data are contained in the FIFO. The FIFO register supports burst reads. The interrupt function
may be used to determine when new data is available.
For further information regarding the FIFO, please refer to the ITG-3400 Register Map and Register
Descriptions document.
4.11 Interrupts
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include
the INT pin configuration, the interrupt latching and clearing method, and triggers for the interrupt. Items that
can trigger an interrupt are (1) Clock generator locked to new reference oscillator (used when switching clock
sources); and (2) new data is available to be read (from the FIFO and Data registers). The interrupt status
can be read from the Interrupt Status register.
For further information regarding interrupts, please refer to the ITG-3400 Register Map and Register
Descriptions document.
4.12 Digital-Output Temperature Sensor
An on-chip temperature sensor and ADC are used to measure the ITG-3400 die temperature. The readings
from the ADC can be read from the FIFO or the Sensor Data registers.
4.13 Bias and LDOs
The bias and LDO section generates the internal supply and the reference voltages and currents required by
the ITG-3400. Its two inputs are an unregulated VDD and a VDDIO logic reference supply voltage. The LDO
output is bypassed by a capacitor at PLLFILT. For further details on the capacitor, please refer to the Bill of
Materials for External Components.
4.14 Charge Pump
An on-chip charge pump generates the high voltage required for the MEMS oscillators.
4.15 Standard Power Modes
The following table lists the user-accessible power modes for ITG-3400.
Mode
Name
Gyro
Off
1
2
5
Sleep Mode
Standby Mode
Gyroscope Mode
Drive On
On
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Table 10 Standard Power Modes for ITG-3400
Notes:
1. Power consumption for individual modes can be found in section 3.2.1.
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5
Programmable Interrupts
The ITG-3400 has a programmable interrupt system which can generate an interrupt signal on the INT pin.
Status flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled individually.
Interrupt Name
Module
FIFO Overflow
FIFO
Data Ready
Sensor Registers
I2C Master
I2C Master
I2C Master errors: Lost Arbitration, NACKs
I2C Slave 4
Table 11 Table of Interrupt Sources
For information regarding the interrupt enable/disable registers and flag registers, please refer to the ITG-
3400 Register Map and Register Descriptions document. Some interrupt sources are explained below.
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6
Digital Interface
6.1 I2C and SPI Serial Interfaces
The internal registers and memory of the ITG-3400 can be accessed using either I2C at 400 kHz or SPI at
1MHz. SPI operates in four-wire mode.
Pin Number
Pin Name
VDDIO
Pin Description
8
9
Digital I/O supply voltage.
AD0 / SDO
SCL / SCLK
SDA / SDI
I2C Slave Address LSB (AD0); SPI serial data output (SDO)
I2C serial clock (SCL); SPI serial clock (SCLK)
I2C serial data (SDA); SPI serial data input (SDI)
23
24
Table 12 Serial Interface
Note:
To prevent switching into I2C mode when using SPI, the I2C interface should be disabled by setting the
I2C_IF_DIS configuration bit. Setting this bit should be performed immediately after waiting for the time
specified by the “Start-Up Time for Register Read/Write” in Section 6.3.
For further information regarding the I2C_IF_DIS bit, please refer to the ITG-3400 Register Map and Register
Descriptions document.
6.2 I2C Interface
I2C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, the
lines are open-drain and bi-directional. In a generalized I2C interface implementation, attached devices can
be a master or a slave. The master device puts the slave address on the bus, and the slave device with the
matching address acknowledges the master.
The ITG-3400 always operates as a slave device when communicating to the system processor, which thus
acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is
400 kHz.
The slave address of the ITG-3400 is b110111X which is 7 bits long. The LSB bit of the 7 bit address is
determined by the logic level on pin AD0. This allows two ITG-3400s to be connected to the same I2C bus.
When used in this configuration, the address of the one of the devices should be b1101110 (pin AD0 is logic
low) and the address of the other should be b1101111 (pin AD0 is logic high).
6.3 I2C Communications Protocol
START (S) and STOP (P) Conditions
Communication on the I2C bus starts when the master puts the START condition (S) on the bus, which is
defined as a HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus is
considered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to
HIGH transition on the SDA line while SCL is HIGH (see figure below).
Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.
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SDA
SCL
S
P
START condition
STOP condition
Figure 9 START and STOP Conditions
Data Format / Acknowledge
I2C data bytes are defined to be 8-bits long. There is no restriction to the number of bytes transmitted per
data transfer. Each byte transferred must be followed by an acknowledge (ACK) signal. The clock for the
acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal
by pulling down SDA and holding it low during the HIGH portion of the acknowledge clock pulse.
If a slave is busy and cannot transmit or receive another byte of data until some other task has been
performed, it can hold SCL LOW, thus forcing the master into a wait state. Normal data transfer resumes
when the slave is ready, and releases the clock line (refer to the following figure).
DATA OUTPUT BY
TRANSMITTER (SDA)
not acknowledge
DATA OUTPUT BY
RECEIVER (SDA)
acknowledge
SCL FROM
MASTER
1
2
8
9
clock pulse for
acknowledgement
START
condition
Figure 10 Acknowledge on the I2C Bus
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Communications
After beginning communications with the START condition (S), the master sends a 7-bit slave address
followed by an 8th bit, the read/write bit. The read/write bit indicates whether the master is receiving data from
or is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge
signal (ACK) from the slave device. Each byte transferred must be followed by an acknowledge bit. To
acknowledge, the slave device pulls the SDA line LOW and keeps it LOW for the high period of the SCL line.
Data transmission is always terminated by the master with a STOP condition (P), thus freeing the
communications line. However, the master can generate a repeated START condition (Sr), and address
another slave without first generating a STOP condition (P). A LOW to HIGH transition on the SDA line while
SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the
exception of start and stop conditions.
SDA
SCL
1 – 7
8
9
1 – 7
8
9
1 – 7
8
9
S
P
START
STOP
ADDRESS
R/W
ACK
DATA
ACK
DATA
ACK
condition
condition
Figure 11 Complete I2C Data Transfer
To write the internal ITG-3400 registers, the master transmits the start condition (S), followed by the I2C
address and the write bit (0). At the 9th clock cycle (when the clock is high), the ITG-3400 acknowledges the
transfer. Then the master puts the register address (RA) on the bus. After the ITG-3400 acknowledges the
reception of the register address, the master puts the register data onto the bus. This is followed by the ACK
signal, and data transfer may be concluded by the stop condition (P). To write multiple bytes after the last
ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this case, the
ITG-3400 automatically increments the register address and loads the data to the appropriate register. The
following figures show single and two-byte write sequences.
Single-Byte Write Sequence
Master
Slave
S
AD+W
RA
RA
DATA
DATA
P
ACK
ACK
ACK
ACK
ACK
ACK
Burst Write Sequence
Master
Slave
S
AD+W
DATA
P
ACK
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To read the internal ITG-3400 registers, the master sends a start condition, followed by the I2C address and
a write bit, and then the register address that is going to be read. Upon receiving the ACK signal from the
ITG-3400, the master transmits a start signal followed by the slave address and read bit. As a result, the
ITG-3400 sends an ACK signal and the data. The communication ends with a not acknowledge (NACK)
signal and a stop bit from master. The NACK condition is defined such that the SDA line remains high at the
9th clock cycle. The following figures show single and two-byte read sequences.
Single-Byte Read Sequence
Master
Slave
S
AD+W
RA
RA
S
S
AD+R
AD+R
NACK
ACK
P
ACK
ACK
ACK
ACK
ACK DATA
ACK DATA
Burst Read Sequence
Master
Slave
S
AD+W
NACK
P
DATA
6.4 I2C Terms
Signal Description
S
AD
W
Start Condition: SDA goes from high to low while SCL is high
Slave I2C address
Write bit (0)
R
Read bit (1)
ACK
Acknowledge: SDA line is low while the SCL line is high at the
9th clock cycle
NACK Not-Acknowledge: SDA line stays high at the 9th clock cycle
RA
DATA
P
ITG-3400 internal register address
Transmit or received data
Stop condition: SDA going from low to high while SCL is high
Table 13 I2C Terms
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6.5 SPI Interface
SPI is a 4-wire synchronous serial interface that uses two control lines and two data lines. The ITG-3400
always operates as a Slave device during standard Master-Slave SPI operation.
With respect to the Master, the Serial Clock output (SCLK), the Serial Data Output (SDO) and the Serial
Data Input (SDI) are shared among the Slave devices. Each SPI slave device requires its own Chip Select
(CS) line from the master.
CS goes low (active) at the start of transmission and goes back high (inactive) at the end. Only one CS line
is active at a time, ensuring that only one slave is selected at any given time. The CS lines of the non-
selected slave devices are held high, causing their SDO lines to remain in a high-impedance (high-z) state
so that they do not interfere with any active devices.
SPI Operational Features
1. Data is delivered MSB first and LSB last
2. Data is latched on the rising edge of SCLK
3. Data should be transitioned on the falling edge of SCLK
4. The maximum frequency of SCLK is 1MHz
5. SPI read and write operations are completed in 16 or more clock cycles (two or more bytes). The
first byte contains the SPI Address, and the following byte(s) contain(s) the SPI data. The first
bit of the first byte contains the Read/Write bit and indicates the Read (1) or Write (0) operation.
The following 7 bits contain the Register Address. In cases of multiple-byte Read/Writes, data is
two or more bytes:
SPI Address format
MSB
LSB
R/W A6 A5 A4 A3 A2 A1
A0
SPI Data format
MSB
LSB
D7
D6 D5 D4 D3 D2 D1
D0
6. Supports Single or Burst Read/Writes.
SCLK
SDI
SPI Master
SPI Slave 1
SDO
/CS
/CS1
/CS2
SCLK
SDI
SDO
/CS
SPI Slave 2
Figure 12 Typical SPI Master / Slave Configuration
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7
Serial Interface Considerations
7.1 ITG-3400 Supported Interfaces
The ITG-3400 supports I2C communications on its serial interface.
The ITG-3400’s I/O logic levels are set to be VDDIO.
The figure below depicts a sample circuit of ITG-3400. It shows the relevant logic levels and voltage
connections.
VDDIO
VDD_IO
(0V - VDDIO)
SYSTEM BUS
System
Processor IO
VDD
VDDIO
(0V - VDDIO)
VDD
INT
(0V - VDDIO)
(0V - VDDIO)
SDA
SCL
(0V - VDDIO)
FSYNC
VDDIO
ITG-3400
VDDIO
(0V, VDDIO)
AD0
Figure 13 I/O Levels and Connections
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8
Assembly
This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems
(MEMS) gyros packaged in QFN package.
8.1
Orientation of Axes
The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1
identifier (•) in the figure.
+Z
+Y
+Z
I
T
+Y
G
-
3
4
0
0
+X
+X
Figure 14 Orientation of Axes of Sensitivity and Polarity of Rotation
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8.2
Package Dimensions
24 Lead QFN (3x3x0.9) mm NiPdAu Lead-frame finish
DIMENSIONS IN
MILLIMETERS
SYMBOLS
DESCRIPTION
MIN
NOM
MAX
A
A1
b
c
D
D2
E
E2
e
f (e-b)
K
L
R
R’
R’’
s
Package thickness
0.85
0.00
0.15
---
2.90
1.65
2.90
1.49
---
0.90
0.02
0.20
0.95
0.05
0.25
---
3.10
1.75
3.10
1.59
---
0.25
---
0.35
---
Lead finger (pad) seating height
Lead finger (pad) width
Lead frame (pad) height
Package width
0.20 REF
3.00
Exposed pad width
Package length
1.70
3.00
1.54
0.40
Exposed pad length
Lead finger-finger (pad-pad) pitch
Lead-lead (Pad-Pad) space
Lead (pad) to Exposed Pad Space
Lead (pad) length
0.15
---
0.20
0.35 REF
0.30
0.25
0.075
0.10
0.10
---
Lead (pad) corner radius
REF
0.11
0.11
Corner lead (pad) outer radius
Corner lead (pad) inner radius
Corner lead-lead (pad-pad) spacing
Lead conformality
0.12
0.12
---
0.25 REF
---
y
0.00
0.075
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8.3 PCB Design Guidelines
The PCB Diagram using a JEDEC type extension with solder rising on the outer edge is shown below. The
PCB Dimensions Table shows pad sizing (nominal dimensions) recommended for the ITG-3400 product.
JEDEC type extension with solder rising on outer edge
SYMBOLS
DIMENSIONS IN MILLIMETERS
Nominal Package I/O Pad (Land) Dimensions
Lead (pad) pitch, land pitch
Lead (pad) width
NOM
e
b
0.40
0.20
0.30
3.00
3.00
1.70
1.54
L
Lead (pad) length
D
Package width
E
Package length
D2
E2
Exposed pad finger width
Exposed pad finger length
I/O Land Design Dimensions (Guidelines)
I/O land finger extent width
I/O land finger extent length
Land width
D3
E3
c
3.80
3.80
0.30
0.40
0.05
0.70
0.15
0.30
Tout
Tin
L1
s
Outward extension (land beyond pad)
Inward extension (land beyond pad)
Land length
Corner land spacing
x
Silkscreen corner marker length
PCB Dimensions Table (for PCB Lay-out Diagram)
Note: The symbols used in the two tables above do not necessarily refer to the same physical dimension. For example the symbols “c”
and “s” represent different parameters in the two tables.
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8.4
Assembly Precautions
8.4.1 Gyroscope Surface Mount Guidelines
InvenSense MEMS Gyros sense rate of rotation. In addition, gyroscopes sense mechanical stress coming
from the printed circuit board (PCB). This PCB stress can be minimized by adhering to certain design rules:
When using MEMS gyroscope components in plastic packages, PCB mounting and assembly can cause
package stress. This package stress in turn can affect the output offset and its value over a wide range of
temperatures. This stress is caused by the mismatch between the Coefficient of Linear Thermal Expansion
(CTE) of the package material and the PCB. Care must be taken to avoid package stress due to mounting.
Traces connected to pads should be as symmetric as possible. Maximizing symmetry and balance for pad
connection will help component self alignment and will lead to better control of solder paste reduction after
reflow.
Any material used in the surface mount assembly process of the MEMS gyroscope should be free of
restricted RoHS elements or compounds. Pb-free solders should be used for assembly.
8.4.2 Exposed Die Pad Precautions
The ITG-3400 has very low active and standby current consumption. There is no electrical connection
between the exposed die pad and the internal CMOS circuits. The exposed die pad is not required for heat-
sinking, and should not be soldered to the PCB. Underfill is also not recommended. Soldering or adding
underfill to the e-pad can induce performance changes due to package thermo-mechanical stress.
8.4.3 Trace Routing
Routing traces or vias under the gyro package such that they run under the exposed die pad is prohibited.
Routed active signals may harmonically couple with the gyro MEMS devices, compromising gyro response.
The gyro drive frequency is 25 – 29 KHz. To avoid harmonic coupling don’t route active signals in non-
shielded signal planes directly below, or above the gyro package. Note: For best performance, design a
ground plane under the e-pad to reduce PCB signal noise from the board on which the gyro device is
mounted. If the gyro device is stacked under another PCB board, design a ground plane directly above the
gyro device to shield active signals from the PCB board mounted above.
8.4.4 Component Placement
Do not place large insertion components such as keyboard or similar buttons, connectors, or shielding boxes
at a distance of less than 6 mm from the MEMS gyro. Maintain generally accepted industry design practices
for component placement near the ITG-3400 to prevent noise coupling and thermo-mechanical stress.
8.4.5 PCB Mounting and Cross-Axis Sensitivity
Orientation errors of the gyroscope mounted to the printed circuit board can cause cross-axis sensitivity in
which one gyro sense axis responds to rotation about an orthogonal axis. For example, the X-gyro sense
axis may respond to rotation about the Y or Z axes. The orientation mounting errors are illustrated in the
figure below.
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Z
Φ
Y
I
T
G
-
3
4
0
0
X
Θ
Package Gyro & Accel Axes (
) Relative to PCB Axes (
) with Orientation Errors (Θ and Φ)
The table below shows the cross-axis sensitivity as a percentage of the gyroscope’s sensitivity for a given
orientation error, respectively.
Cross-Axis Sensitivity vs. Orientation Error
Orientation Error
Cross-Axis Sensitivity
(θ or Φ)
(sinθ or sinΦ)
0º
0.5º
1º
0%
0.87%
1.75%
The specifications for cross-axis sensitivity in Section 3.1 includes the effect of the die orientation error with
respect to the package.
8.4.6 MEMS Handling Instructions
MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundreds of
millions of consumer, automotive and industrial products. MEMS devices consist of microscopic moving
mechanical structures. They differ from conventional IC products, even though they can be found in similar
packages. Therefore, MEMS devices require different handling precautions than conventional ICs prior to
mounting onto printed circuit boards (PCBs).
The ITG-3400 has been qualified to a shock tolerance of 10,000g. InvenSense packages its gyroscopes as it
deems proper for protection against normal handling and shipping. It recommends the following handling
precautions to prevent potential damage.
Do not drop individually packaged gyroscopes, or trays of gyroscopes onto hard surfaces. Components
placed in trays could be subject to g-forces in excess of 10,000g if dropped.
Printed circuit boards that incorporate mounted gyroscopes should not be separated by manually
snapping apart. This could also create g-forces in excess of 10,000g.
Do not clean MEMS gyroscopes in ultrasonic baths. Ultrasonic baths can induce MEMS damage if the
bath energy causes excessive drive motion through resonant frequency coupling.
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8.4.7 ESD Considerations
Establish and use ESD-safe handling precautions when unpacking and handling ESD-sensitive devices.
Store ESD sensitive devices in ESD safe containers until ready for use, such as the original moisture
sealed bags, until ready for assembly.
Restrict all device handling to ESD protected work areas that measure less than 200V static charge.
Ensure that all workstations and personnel are properly grounded to prevent ESD.
8.4.8 Reflow Specification
Qualification Reflow: The ITG-3400 was qualified in accordance with IPC/JEDEC J-STD-020D.1. This
standard classifies proper packaging, storage and handling in order to avoid subsequent thermal and
mechanical damage during the solder reflow attachment phase of PCB assembly.
The qualification preconditioning process specifies a sequence consisting of a bake cycle, a moisture soak
cycle (in a temperature humidity oven), and three consecutive solder reflow cycles, followed by functional
device testing.
The peak solder reflow classification temperature requirement for package qualification is (260 +5/-0°C) for
lead-free soldering of components measuring less than 1.6 mm in thickness. The qualification profile and a
table explaining the set-points are shown below:
SOLDER REFLOW PROFILE FOR QUALIFICATION
LEAD-FREE IR/CONVECTION
F
TPmax
TPmin
E
G
10-30sec
H
D
TLiquidus
Tsmax
C
Liquidus
60-120sec
Tramp-up
( < 3 C/sec)
B
I
Tramp-down
( < 4 C/sec)
Tsmin
Preheat
60-120sec
Troom-Pmax
(< 480sec)
A
Time [Seconds]
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Temperature Set Points Corresponding to Reflow Profile Above
CONSTRAINTS
Step Setting
Temp (°C)
Time (sec)
Max. Rate (°C/sec)
A
B
C
D
Troom
TSmin
TSmax
TLiquidus
25
150
200
217
60 < tBC < 120
r(TLiquidus-TPmax) < 3
r(TLiquidus-TPmax) < 3
r(TLiquidus-TPmax) < 3
r(TPmax-TLiquidus) < 4
E
TPmin
255
[255°C, 260°C]
F
G
TPmax
TPmin
260
255
tAF < 480
10< tEG < 30
[ 260°C, 265°C]
[255°C, 260°C]
H
I
TLiquidus
Troom
217
25
60 < tDH < 120
Notes: Customers must never exceed the Classification temperature (TPmax = 260°C).
All temperatures refer to the topside of the QFN package, as measured on the package body surface.
Production Reflow: Check the recommendations of your solder manufacturer. For optimum results, use
lead-free solders that have lower specified temperature profiles (Tpmax ~ 235°C). Also use lower ramp-up and
ramp-down rates than those used in the qualification profile. Never exceed the maximum conditions that we
used for qualification, as these represent the maximum tolerable ratings for the device.
8.5
Storage Specifications
The storage specification of the ITG-3400 conforms to IPC/JEDEC J-STD-020D.1 Moisture Sensitivity Level
(MSL) 3.
Calculated shelf-life in moisture-sealed bag 12 months -- Storage conditions: <40°C and <90% RH
After opening moisture-sealed bag
168hours -- Storage conditions: ambient ≤30°C at 60%RH
8.6
Package Marking Specification
TOP VIEW
INVENSENSE
IT34
Part Number
XXXXXX-XX
XYYWWX
Lot Traceability Code
Rev Code
Package Vendor Code
YY = Year Code
WW = Work Week
Package Marking Specification
36 of 41
Document Number: PS-ITG-3400A-00
Revision: 1.0
Release Date: 12/24/2013
ITG-3400 Product Specification
8.7
Tape & Reel Specification
Tape Dimensions
Reel Outline Drawing
Reel Dimensions and Package Size
PACKAGE
REEL (mm)
SIZE
3x3
L
V
W
Z
330
102
12.8
2.3
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Document Number: PS-ITG-3400A-00
Revision: 1.0
Release Date: 12/24/2013
ITG-3400 Product Specification
Package Orientation
User Direction
of Feed
Pin 1
INVENSENSE
INVENSENSE
Cover Tape
(Anti-Static)
Carrier Tape
(Anti-Static)
Reel
Terminal Tape
Label
Tape and Reel Specification
Reel Specifications
Quantity Per Reel
Reels per Box
5,000
1
5
Boxes Per Carton (max)
Pcs/Carton (max)
25,000
8.8
Label
InvenSense
Pb-free
category (e4) HF
REEL QTY (Q): 5000
QTY (Q): 615
ITG-3400
DEVICE (1P):
PO: HUB
LOT1 (1T): Q2R994-F1
LOT2 (1T): Q3X785-G1
Reel Date: 28/04/12
D/C (D): 1204
D/C (D): 1207
QTY (Q): 4385
QC STAMP:
Barcode Label
Location of Label on Reel
38 of 41
Document Number: PS-ITG-3400A-00
Revision: 1.0
Release Date: 12/24/2013
ITG-3400 Product Specification
8.9
Packaging
REEL – with Barcode &
Vacuum-Sealed Moisture
Barrier Bag with ESD, MSL3,
Caution, and Barcode Labels
MSL3 Label
Caution labels
Caution Label
ESD Label
Inner Bubble Wrap
Pizza Box
Pizza Boxes Placed in Foam-
Lined Shipper Box
Outer Shipper Label
39 of 41
Document Number: PS-ITG-3400A-00
Revision: 1.0
Release Date: 12/24/2013
ITG-3400 Product Specification
8.10 Representative Shipping Carton Label
INV. NO:
From:
Ship To:
Customer Name
Street Address
InvenSense Taiwan, Ltd.
1F, 9 Prosperity 1st Road, Hsinchu Science
Park, HsinChu City, 30078, Taiwan
TEL: +886 3 6686999
City, State, Country
ZIP
Attn: Buyer Name
Phone: Buyer Phone Number
FAX: +886 3 6686777
SUPP PROD ID:
ITG
-
3
4
0
0
LOT#: Q2R994-F1
QTY: 5615
LOT#:
QTY:
LOT#:
QTY:
LOT#:
QTY:
LOT#:
QTY:
0
0
0
0
LOT#: Q3X785-G1
QTY: 4385
LOT#: Q3Y196-02
QTY: 5000
LOT#:
QTY:
0
Total Quantity/Carton
15000
Weight: (KG)
4.05
Shipping Carton:
Pb-free
Category (e4) HF
1
3
OF
40 of 41
Document Number: PS-ITG-3400A-00
Revision: 1.0
Release Date: 12/24/2013
ITG-3400 Product Specification
9
Environmental Compliance
The ITG-3400 is RoHS and Green compliant.
The ITG-3400 is in full environmental compliance as evidenced in report HS-ITG-3400A, Materials
Declaration Data Sheet.
Environmental Declaration Disclaimer:
InvenSense believes this environmental information to be correct but cannot guarantee accuracy or completeness. Conformity
documents for the above component constitutes are on file. InvenSense subcontracts manufacturing and the information contained
herein is based on data received from vendors and suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense
for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to
change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to
improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding
the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising
from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited
to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for
any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
©2013 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion,
MotionApps, DMP, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be
trademarks of the respective companies with which they are associated.
©2013 InvenSense, Inc. All rights reserved.
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