STP3NC60 [STMICROELECTRONICS]

N-CHANNEL 600V - 3.3ohm - 3A TO-220/TO-220FP PowerMeshII MOSFET; N沟道600V - 3.3ohm - 3A TO- 220 / TO- 220FP PowerMeshII MOSFET
STP3NC60
型号: STP3NC60
厂家: ST    ST
描述:

N-CHANNEL 600V - 3.3ohm - 3A TO-220/TO-220FP PowerMeshII MOSFET
N沟道600V - 3.3ohm - 3A TO- 220 / TO- 220FP PowerMeshII MOSFET

文件: 总9页 (文件大小:110K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
STP3NC60  
STP3NC60FP  
- 3A TO-220/TO-220FP  
N-CHANNEL 600V - 3.3  
PowerMesh II MOSFET  
TYPE  
STP3NC60  
V
R
I
D
DSS  
DS(on)  
600 V  
600V  
<3.6 Ω  
<3.6 Ω  
3 A  
2 A  
STP3NC60FP  
TYPICAL R (on) = 3.3 Ω  
DS  
EXTREMELY HIGH dv/dt CAPABILITY  
100% AVALANCHE TESTED  
NEW HIGH VOLTAGE BENCHMARK  
GATE CHARGE MINIMIZED  
3
3
2
2
1
1
TO-220FP  
TO-220  
DESCRIPTION  
The PowerMESH II is the evolution of the first  
generation of MESH OVERLAY . The layout re-  
finements introduced greatly improve the Ron*area  
figure of merit while keeping the device at the lead-  
ing edge for what concerns swithing speed, gate  
charge and ruggedness.  
INTERNAL SCHEMATIC DIAGRAM  
APPLICATIONS  
HIGH CURRENT, HIGH SPEED SWITCHING  
SWITH MODE POWER SUPPLIES (SMPS)  
DC-AC CONVERTERS FOR WELDING  
EQUIPMENT AND UNINTERRUPTIBLE  
POWER SUPPLIES AND MOTOR DRIVER  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Unit  
STP3NC60  
STP3NC60FP  
V
Drain-source Voltage (V  
= 0)  
GS  
600  
600  
±30  
V
V
DS  
V
Drain-gate Voltage (R = 20 k)  
DGR  
GS  
V
Gate- source Voltage  
V
GS  
I
Drain Current (continuos) at T = 25°C  
3
1.9  
12  
3
A
D
C
I
Drain Current (continuos) at T = 100°C  
1.9(*)  
12(*)  
40  
A
D
C
I
()  
Drain Current (pulsed)  
A
DM  
P
Total Dissipation at T = 25°C  
80  
W
TOT  
C
Derating Factor  
0.64  
0.32  
W/°C  
V/ns  
dv/dt (1)  
Peak Diode Recovery voltage slope  
Insulation Withstand Voltage (DC)  
Storage Temperature  
3.5  
V
-
2000  
ISO  
T
stg  
–60 to 150  
150  
°C  
°C  
T
Max. Operating Junction Temperature  
j
()Pulse width limited by safe operating area  
(1)I 3A, di/dt 100A/µs, V V  
, T T  
(BR)DSS j JMAX.  
SD  
DD  
(*)Limited only by maximum temperature allowed  
May 2000  
1/9  
STP3NC60/FP  
THERMAL DATA  
TO-220  
TO-220FP  
Rthj-case  
Rthj-amb  
Rthc-sink  
Thermal Resistance Junction-case Max  
1.56  
3.12  
°C/W  
°C/W  
°C/W  
°C  
Thermal Resistance Junction-ambient Max  
Thermal Resistance Case-sink Typ  
62.5  
0.5  
T
l
Maximum Lead Temperature For Soldering Purpose  
300  
AVALANCHE CHARACTERISTICS  
Symbol  
Parameter  
Max Value  
Unit  
Avalanche Current, Repetitive or Not-Repetitive  
I
3
A
AR  
(pulse width limited by T max)  
j
Single Pulse Avalanche Energy  
E
100  
mJ  
AS  
(starting T = 25 °C, I = I , V = 50 V)  
j
D
AR DD  
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)  
OFF  
Symbol  
Parameter  
Drain-source  
Breakdown Voltage  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
I
= 250 µA, V = 0  
600  
V
(BR)DSS  
D
GS  
V
V
= Max Rating  
1
µA  
µA  
DS  
Zero Gate Voltage  
I
DSS  
Drain Current (V = 0)  
GS  
= Max Rating, T = 125 °C  
50  
DS  
GS  
C
Gate-body Leakage  
I
V
= ±30V  
±100  
nA  
GSS  
Current (V = 0)  
DS  
ON (1)  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
3
Max.  
4
Unit  
V
V
V
V
= V , I = 250µA  
Gate Threshold Voltage  
2
GS(th)  
DS  
GS  
GS  
D
= 10V, I = 1.5 A  
3.3  
3.6  
D
Static Drain-source On  
Resistance  
R
DS(on)  
V
V
> I  
= 10V  
x R  
DS  
GS  
D(on) DS(on)max,  
I
On State Drain Current  
3
A
D(on)  
DYNAMIC  
Symbol  
Parameter  
Test Conditions  
> I x R  
D(on)  
= 1.5A  
Min.  
Typ.  
Max.  
Unit  
V
DS  
DS(on)max,  
g
fs  
(1)  
Forward Transconductance  
2
S
I
D
C
Input Capacitance  
Output Capacitance  
400  
57  
pF  
pF  
iss  
C
oss  
V
= 25V, f = 1 MHz, V = 0  
GS  
DS  
Reverse Transfer  
Capacitance  
C
rss  
7
pF  
2/9  
STP3NC60/FP  
ELECTRICAL CHARACTERISTICS (CONTINUED)  
SWITCHING ON  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
t
V
R
= 300 V, I = 1.5 A  
9
ns  
d(on)  
DD  
D
Turn-on Delay Time  
Rise Time  
= 4.7V  
= 10 V  
GS  
G
t
13  
ns  
r
(see test circuit, Figure 3)  
Q
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
13  
2.3  
4.4  
18.2  
nC  
nC  
nC  
g
V
V
= 480V, I = 3 A,  
= 10V  
DD  
GS  
D
Q
gs  
Q
gd  
SWITCHING OFF  
Symbol  
Parameter  
Off-voltage Rise Time  
Fall Time  
Test Conditions  
Min.  
Typ.  
13  
Max.  
Unit  
ns  
t
r(Voff)  
V
R
= 480V, I = 3 A,  
DD  
D
t
= 4.7Ω, V = 10V  
15  
ns  
f
G
GS  
(see test circuit, Figure 5)  
t
Cross-over Time  
21  
ns  
c
SOURCE DRAIN DIODE  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
3
Unit  
A
I
Source-drain Current  
SD  
I
(2)  
(1)  
Source-drain Current (pulsed)  
Forward On Voltage  
12  
A
SDM  
V
I
I
= 3 A, V  
= 0  
GS  
1.6  
V
SD  
SD  
SD  
t
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
420  
1.5  
7.1  
ns  
µC  
A
rr  
= 3 A, di/dt = 100A/µs, V  
DD  
Q
= 100V, T = 150°C  
(see test circuit, Figure 5)  
rr  
RRM  
j
I
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.  
2. Pulse width limited by safe operating area.  
Safe Operating Area for TO-220  
Safe Operating Area for TO-220FP  
3/9  
STP3NC60/FP  
Thermal Impedence for TO-220  
Thermal Impedence for TO-220FP  
Output Characteristics  
Transfer Characteristics  
Transconductance  
Static Drain-source On Resistance  
4/9  
STP3NC60/FP  
Gate Charge vs Gate-source Voltage  
Capacitance Variations  
Normalized Gate Threshold Voltage vs Temp.  
Normalized On Resistance vs Temperature  
Source-drain Diode Forward Characteristics  
5/9  
STP3NC60/FP  
Fig. 1: Unclamped Inductive Load Test Circuit  
Fig. 2: Unclamped Inductive Waveform  
Fig. 3: Switching Times Test Circuit For  
Fig. 4: Gate Charge test Circuit  
Resistive Load  
Fig. 5: Test Circuit For Inductive Load Switching  
And Diode Recovery Times  
6/9  
STP3NC60/FP  
TO-220 MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
4.40  
1.23  
2.40  
TYP.  
MAX.  
4.60  
1.32  
2.72  
MIN.  
0.173  
0.048  
0.094  
MAX.  
0.181  
0.051  
0.107  
A
C
D
D1  
E
1.27  
0.050  
0.49  
0.61  
1.14  
1.14  
4.95  
2.4  
0.70  
0.88  
1.70  
1.70  
5.15  
2.7  
0.019  
0.024  
0.044  
0.044  
0.194  
0.094  
0.393  
0.027  
0.034  
0.067  
0.067  
0.203  
0.106  
0.409  
F
F1  
F2  
G
G1  
H2  
L2  
L4  
L5  
L6  
L7  
L9  
DIA.  
10.0  
10.40  
16.4  
0.645  
13.0  
2.65  
15.25  
6.2  
14.0  
2.95  
15.75  
6.6  
0.511  
0.104  
0.600  
0.244  
0.137  
0.147  
0.551  
0.116  
0.620  
0.260  
0.154  
0.151  
3.5  
3.93  
3.85  
3.75  
L2  
Dia.  
L5  
L9  
L7  
L6  
L4  
P011C  
7/9  
STP3NC60/FP  
TO-220FP MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
4.4  
TYP.  
MAX.  
4.6  
2.7  
2.75  
0.7  
1
MIN.  
0.173  
0.098  
0.098  
0.017  
0.030  
0.045  
0.045  
0.195  
0.094  
0.393  
MAX.  
0.181  
0.106  
0.108  
0.027  
0.039  
0.067  
0.067  
0.204  
0.106  
0.409  
A
B
2.5  
D
2.5  
E
0.45  
0.75  
1.15  
1.15  
4.95  
2.4  
F
F1  
F2  
G
1.7  
1.7  
5.2  
2.7  
10.4  
G1  
H
10  
L2  
L3  
L4  
L6  
L7  
Ø
16  
0.630  
28.6  
9.8  
15.9  
9
30.6  
10.6  
16.4  
9.3  
1.126  
0.385  
0.626  
0.354  
0.118  
1.204  
0.417  
0.645  
0.366  
0.126  
3
3.2  
L3  
L6  
L7  
¯
1 2 3  
L2  
L4  
8/9  
STP3NC60/FP  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is  
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are  
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products  
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is a trademark of STMicroelectronics  
2000 STMicroelectronics – Printed in Italy – All Rights Reserved  
STMicroelectronics GROUP OF COMPANIES  
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http://www.st.com  
9/9  

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