STL75NH3LL [STMICROELECTRONICS]

N-channel 30 V, 0.004 ヘ, 20 A, PowerFLAT⑩ (6x5) ultra low gate charge STripFET⑩ Power MOSFET; N沟道30 V , 0.004ヘ, 20 A , PowerFLAT⑩ (引脚6x5 )超低栅极电荷STripFET⑩功率MOSFET
STL75NH3LL
型号: STL75NH3LL
厂家: ST    ST
描述:

N-channel 30 V, 0.004 ヘ, 20 A, PowerFLAT⑩ (6x5) ultra low gate charge STripFET⑩ Power MOSFET
N沟道30 V , 0.004ヘ, 20 A , PowerFLAT⑩ (引脚6x5 )超低栅极电荷STripFET⑩功率MOSFET

晶体 栅极 晶体管 功率场效应晶体管 开关 脉冲 光电二极管
文件: 总12页 (文件大小:349K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
STL75NH3LL  
N-channel 30 V, 0.004 , 20 A, PowerFLAT™ (6x5)  
ultra low gate charge STripFET™ Power MOSFET  
Features  
RDS(on)  
max  
< 0.0057 20 A (1)  
Type  
VDSS  
30V  
ID  
STL75NH3LL  
1. This value is according Rthj-pcb  
Improved die-to-footprint ratio  
Very low profile package (1mm max)  
Very low thermal resistance  
Very low gate charge  
PowerFLAT™(6x5)  
Low threshold device  
Application  
Figure 1.  
Internal schematic diagram  
Switching applications  
Description  
This application specific Power MOSFET is the  
latest generation of STMicroelectronics unique  
“STripFET™” technology. The resulting transistor  
is optimized for low on-resistance and minimal  
gate charge. The chip-scaled PowerFLAT™  
package allows a significant board space saving,  
still boosting the performance.  
Table 1.  
Order code  
STL75NH3LL  
Device summary  
Marking  
Package  
Packaging  
L75NH3LL  
PowerFLAT™ (6 x 5)  
Tape and reel  
June 2008  
Rev 1  
1/12  
www.st.com  
12  
Contents  
STL75NH3LL  
Contents  
1
2
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
2.1  
Electrical characteristics (curves)  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3
4
5
Test circuits  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
2/12  
STL75NH3LL  
Electrical ratings  
1
Electrical ratings  
Table 2.  
Symbol  
Absolute maximum ratings  
Parameter  
Value  
30  
16  
Unit  
VDS  
VGS  
Drain-source voltage (VGS = 0)  
Gate-source voltage  
V
V
(1)  
ID  
Drain current (continuous) at TC = 25 °C  
Drain current (continuous) at TC = 100 °C  
Drain current (continuous) at TC = 25 °C  
Drain current (continuous) at TC = 100 °C  
Drain current (pulsed)  
75  
47  
A
(1)  
ID  
A
(2)  
ID  
20  
A
(2)  
ID  
12.5  
80  
A
(3)  
IDM  
A
(1)  
PTOT  
Total dissipation at TC = 25 °C  
Total dissipation at TC = 25 °C  
Derating factor  
60  
W
W
W/°C  
(2)  
PTOT  
4
0.03  
Tj  
Operating junction temperature  
Storage temperature  
-55 to 150  
°C  
Tstg  
1. The value is rated according Rthj-C  
2. This value is according Rthj-pcb  
3. Pulse width limited by safe operating area  
Table 3.  
Symbol  
Thermal resistance  
Parameter  
Value  
Unit  
Rthj-case  
Thermal resistance junction-case (drain) max  
Thermal resistance junction-pcb max  
2.08  
31.3  
°C/W  
°C/W  
(1)  
Rthj-pcb  
1. When mounted on FR-4 board of 1inch2, 2 oz Cu, t < 10 sec  
3/12  
Electrical characteristics  
STL75NH3LL  
2
Electrical characteristics  
(T  
=25°C unless otherwise specified)  
CASE  
Table 4.  
Symbol  
On/off states  
Parameter  
Test conditions  
Min.  
Typ.  
Max. Unit  
Drain-source breakdown  
voltage  
V(BR)DSS  
ID = 250 µA, VGS= 0  
30  
V
VDS = Max rating,  
1
µA  
µA  
Zero gate voltage drain  
current (VGS = 0)  
IDSS  
VDS = Max rating,@125 °C  
10  
Gate body leakage current  
(VDS = 0)  
IGSS  
VDS  
=
16 V  
100  
nA  
V
VGS(th) Gate threshold voltage  
VDS = VGS, ID = 250 µA  
1
VGS= 10 V, ID= 10 A  
VGS= 4.5 V, ID= 10 A  
0.004 0.0057  
0.005 0.0075  
Static drain-source on  
resistance  
RDS(on)  
Table 5.  
Symbol  
Dynamic  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
Input capacitance  
Ciss  
Coss  
Crss  
1810  
565  
41  
pF  
pF  
pF  
Output capacitance  
VDS = 25 V, f = 1 MHz,  
VGS=0  
Reverse transfer  
capacitance  
Qg  
Qgs  
Qgd  
Total gate charge  
Gate-source charge  
Gate-drain charge  
VDD = 15 V, ID = 20 A,  
VGS = 4.5 V  
18  
4.8  
5.3  
24  
3
nC  
nC  
nC  
(see Figure 14)  
f=1 MHz Gate DC Bias = 0  
Test signal level = 20 mV  
open drain  
RG  
Gate input resistance  
0.5  
1.5  
4/12  
STL75NH3LL  
Electrical characteristics  
Min. Typ. Max. Unit  
Table 6.  
Switching times  
Parameter  
Symbol  
Test conditions  
VDD = 15 V, ID = 10 A  
RG= 4.7 , VGS= 10 V  
(see Figure 16)  
td(on)  
tr  
Turn-on delay time  
Rise time  
8
ns  
ns  
65  
VDD = 15 V, ID = 10 A  
RG= 4.7 , VGS= 10 V  
(see Figure 16)  
td(off)  
tf  
Turn-off delay time  
Fall time  
30  
20  
ns  
ns  
Table 7.  
Symbol  
Source drain diode  
Parameter  
Test conditions  
Min Typ. Max Unit  
ISD  
Source-drain current  
20  
80  
A
A
ISDM  
Source-drain current (pulsed)  
(1)  
VSD  
Forward on voltage  
ISD = 20 A, VGS = 0  
1.3  
V
ISD = 20 A,  
trr  
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
22  
32  
ns  
nC  
A
di/dt = 100 A/µs  
VDD = 20 V  
Qrr  
IRRM  
1.9  
(see Figure 15)  
1. Pulsed: Pulse duration = 300µs, duty cycle 1.5%  
5/12  
Electrical characteristics  
STL75NH3LL  
2.1  
Electrical characteristics (curves)  
Figure 2. Safe operating area  
Figure 3. Thermal impedance  
Figure 4. Output characteristics  
Figure 5. Transfer characteristics  
Figure 6. Normalized B  
vs temperature  
Figure 7. Static drain-source on resistance  
VDSS  
6/12  
STL75NH3LL  
Electrical characteristics  
Figure 8. Gate charge vs gate-source voltage Figure 9. Capacitance variations  
Figure 10. Normalized gate threshold voltage Figure 11. Normalized on resistance vs  
vs temperature  
temperature  
Figure 12. Source-drain diode forward  
characteristics  
7/12  
Test circuits  
STL75NH3LL  
3
Test circuits  
Figure 13. Switching times test circuit for  
resistive load  
Figure 14. Gate charge test circuit  
Figure 15. Test circuit for inductive load  
switching and diode recovery times  
Figure 16. Unclamped inductive load test  
circuit  
Figure 17. Unclamped inductive waveform  
Figure 18. Switching time waveform  
8/12  
STL75NH3LL  
Package mechanical data  
4
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in ECOPACK®  
packages. These packages have a Lead-free second level interconnect. The category of  
second level interconnect is marked on the package and on the inner box label, in  
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering  
conditions are also marked on the inner box label. ECOPACK is an ST trademark.  
ECOPACK specifications are available at: www.st.com  
9/12  
Package mechanical data  
STL75NH3LL  
PowerFLAT™ (6x5) MECHANICAL DATA  
mm.  
inch  
TYP.  
DIM.  
MIN.  
TYP  
0.83  
0.02  
0.20  
0.40  
5.00  
4.75  
4.20  
6.00  
5.75  
3.48  
2.63  
1.27  
0.80  
MAX.  
0.93  
0.05  
MIN.  
MAX.  
0.036  
A
A1  
A3  
b
0.80  
0.031  
0.032  
0.0007  
0.007  
0.015  
0.196  
0.187  
0.165  
0.236  
0.226  
0.137  
0.103  
0.050  
0.031  
0.0019  
0.35  
4.15  
0.47  
4.25  
0.013  
0.163  
0.135  
0.027  
0.018  
0.167  
D
D1  
D2  
E
E1  
E2  
E4  
e
3.43  
2.58  
3.53  
2.68  
0.139  
0.105  
L
0.70  
0.90  
0.035  
10/12  
STL75NH3LL  
Revision history  
5
Revision history  
Table 8.  
Date  
12-Jun-2008  
Document revision history  
Revision  
Changes  
1
First release  
11/12  
STL75NH3LL  
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12/12  

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