STD1NK60 [STMICROELECTRONICS]

N-CHANNEL 600V - 8 - 1A DPAK / IPAK / TO-92 SuperMESH Power MOSFET; N沟道600V - 8 - 1A的DPAK / IPAK / TO- 92超网功率MOSFET
STD1NK60
型号: STD1NK60
厂家: ST    ST
描述:

N-CHANNEL 600V - 8 - 1A DPAK / IPAK / TO-92 SuperMESH Power MOSFET
N沟道600V - 8 - 1A的DPAK / IPAK / TO- 92超网功率MOSFET

晶体 晶体管 功率场效应晶体管 开关 脉冲
文件: 总13页 (文件大小:749K)
中文:  中文翻译
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STD1NK60 - STD1NK60-1  
STQ1HNK60R  
N-CHANNEL 600V - 8- 1A DPAK / IPAK / TO-92  
SuperMESH™Power MOSFET  
TYPE  
V
R
I
D
Pw  
DSS  
DS(on)  
STD1NK60  
STD1NK60-1  
STQ1HNK60R  
600 V  
600 V  
600 V  
< 8.5 Ω  
< 8.5 Ω  
< 8.5 Ω  
1 A  
1 A  
0.4 A  
30 W  
30 W  
3 W  
3
3
2
1
1
IPAK  
DPAK  
TYPICAL R (on) = 8 Ω  
DS  
EXTREMELY HIGH dv/dt CAPABILITY  
100% AVALANCHE TESTED  
GATE CHARGE MINIMIZED  
NEW HIGH VOLTAGE BENCHMARK  
TO-92 (Ammopack)  
TO-92  
DESCRIPTION  
The SuperMESH™ series is obtained through an  
extreme optimization of ST’s well established strip-  
based PowerMESH™ layout. In addition to pushing  
on-resistance significantly down, special care is tak-  
en to ensure a very good dv/dt capability for the  
most demanding applications. Such series comple-  
ments ST full range of high voltage MOSFETs in-  
cluding revolutionary MDmesh™ products.  
INTERNAL SCHEMATIC DIAGRAM  
APPLICATIONS  
SWITCH MODE LOW POWER SUPPLIES  
(SMPS)  
LOW POWER, LOW COST CFL (COMPACT  
FLUORESCENT LAMPS)  
LOW POWER BATTERY CHARGERS  
ORDERING INFORMATION  
SALES TYPE  
MARKING  
D1NK60  
PACKAGE  
PACKAGING  
TAPE & REEL  
TUBE  
STD1NK60T4  
STD1NK60-1  
DPAK  
IPAK  
D1NK60  
STQ1HNK60R  
STQ1HNK60R-AP  
1HNK60R  
1HNK60R  
TO-92  
TO-92  
BULK  
AMMOPAK  
June 2003  
1/13  
STD1NK60 - STD1NK60-1 - STQ1HNK60R  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Unit  
STD1NK60  
STD1NK60-1  
STQ1HNK60R  
V
Drain-source Voltage (V = 0)  
600  
600  
± 30  
V
V
DS  
GS  
V
Drain-gate Voltage (R = 20 k)  
DGR  
GS  
V
Gate- source Voltage  
V
GS  
I
Drain Current (continuous) at T = 25°C  
1.0  
0.63  
4
0.4  
0.25  
1.6  
A
D
C
I
Drain Current (continuous) at T = 100°C  
A
D
C
I
( )  
Drain Current (pulsed)  
A
DM  
P
TOT  
Total Dissipation at T = 25°C  
30  
3
W
C
Derating Factor  
0.24  
0.025  
W/°C  
V/ns  
dv/dt (1)  
Peak Diode Recovery voltage slope  
3
T
T
stg  
Operating Junction Temperature  
Storage Temperature  
j
-55 to 150  
°C  
( ) Pulse width limited by safe operating area  
(1) I 1.0A, di/dt 100A/µs, V V  
, T T  
j JMAX.  
SD  
DD  
(BR)DSS  
THERMAL DATA  
DPAK / IPAK  
TO-92  
Rthj-case  
Rthj-amb  
Rthj-lead  
Thermal Resistance Junction-case Max  
Thermal Resistance Junction-ambient Max  
Thermal Resistance Junction-lead Max  
4.16  
100  
°C/W  
°C/W  
°C/W  
°C  
120  
40  
T
Maximum Lead Temperature For Soldering  
Purpose  
275  
260  
l
AVALANCHE CHARACTERISTICS  
Symbol  
Parameter  
Max Value  
DPAK / IPAK  
Unit  
TO-92  
I
AR  
Avalanche Current, Repetitive or Not-Repetitive  
1
A
(pulse width limited by T max)  
j
E
Single Pulse Avalanche Energy  
25  
mJ  
AS  
(starting T = 25 °C, I = I , V = 50 V)  
j
D
AR  
DD  
2/13  
STD1NK60 - STD1NK60-1 - STQ1HNK60R  
ELECTRICAL CHARACTERISTICS (T  
=25°C UNLESS OTHERWISE SPECIFIED)  
CASE  
ON/OFF  
Symbol  
Parameter  
Drain-source  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
I
= 1 mA, V = 0  
600  
V
(BR)DSS  
D
GS  
Breakdown Voltage  
I
Zero Gate Voltage  
V
V
= Max Rating  
= Max Rating, T = 125 °C  
1
50  
µA  
µA  
DSS  
DS  
DS  
Drain Current (V = 0)  
GS  
C
I
Gate-body Leakage  
V
= ± 30V  
±100  
nA  
GSS  
GS  
Current (V = 0)  
DS  
V
V
V
= V , I = 250µA  
Gate Threshold Voltage  
2.25  
3
8
3.7  
8.5  
V
GS(th)  
DS  
GS  
GS  
D
R
Static Drain-source On  
Resistance  
= 10V, I = 0.5 A  
DS(on)  
D
DYNAMIC  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
g
(1)  
Forward Transconductance  
V
> I  
x R  
DS(on)max,  
1
S
fs  
DS  
D(on)  
I
= 0.5 A  
D
C
Input Capacitance  
Output Capacitance  
Reverse Transfer  
Capacitance  
V
= 25V, f = 1 MHz, V = 0  
156  
23.5  
3.8  
pF  
pF  
pF  
iss  
DS  
GS  
C
oss  
C
rss  
SWITCHING ON  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
t
Turn-on Delay Time  
Rise Time  
V
R
= 300 V, I = 0.5 A  
= 4.7V = 10 V  
GS  
6.5  
5
ns  
ns  
d(on)  
DD  
D
t
r
G
(Resistive Load see, Figure 3)  
Q
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
V
V
= 480V, I = 1.0 A,  
7
1.1  
3.4  
10  
nC  
nC  
nC  
g
DD  
GS  
D
Q
gs  
gd  
= 10V, R = 4.7Ω  
G
Q
SWITCHING OFF  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
t
Turn-off Delay Time  
Fall Time  
V
= 300 V, I = 0.5 A  
19  
25  
ns  
ns  
d(off)  
DD  
D
t
f
R = 4.7V = 10 V  
G GS  
(Resistive Load see, Figure 3)  
t
V
R
= 480V, I = 1.0 A,  
Off-voltage Rise Time  
Fall Time  
Cross-over Time  
24  
25  
44  
ns  
ns  
ns  
r(Voff)  
DD  
D
t
f
= 4.7Ω, V = 10V  
G
GS  
t
c
(Inductive Load see, Figure 5)  
SOURCE DRAIN DIODE  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
I
1
4
A
A
Source-drain Current  
Source-drain Current (pulsed)  
SD  
(2)  
I
SDM  
V
(1)  
I
I
= 1.0 A, V = 0  
Forward On Voltage  
1.6  
V
SD  
SD  
SD  
GS  
t
= 1.0 A, di/dt = 100A/µs  
= 25V, T = 150°C  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
229  
377  
3.3  
ns  
µC  
A
rr  
Q
V
DD  
rr  
RRM  
j
I
(see test circuit, Figure 5)  
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.  
2. Pulse width limited by safe operating area.  
3/13  
STD1NK60 - STD1NK60-1 - STQ1HNK60R  
Safe Operating Area For DPAK/IPAK  
Thermal Impedance For DPAK/IPAK  
Thermal Impedance For TO-92  
Transfer Characteristics  
Safe Operating Area For TO-92  
Output Characteristics  
4/13  
STD1NK60 - STD1NK60-1 - STQ1HNK60R  
Static Drain-source On Resistance  
Transconductance  
Gate Charge vs Gate-source Voltage  
Capacitance Variations  
Normalized Gate Threshold Voltage vs Temp.  
Normalized On Resistance vs Temperature  
5/13  
STD1NK60 - STD1NK60-1 - STQ1HNK60R  
Source-drain Diode Forward Characteristics  
Normalized BVDSS vs Temperature  
Max Id Current vs Tc  
Maximum Avalanche Energy vs Temperature  
6/13  
STD1NK60 - STD1NK60-1 - STQ1HNK60R  
Fig. 1: Unclamped Inductive Load Test Circuit  
Fig. 2: Unclamped Inductive Waveform  
Fig. 3: Switching Times Test Circuit For  
Fig. 4: Gate Charge test Circuit  
Resistive Load  
Fig. 5: Test Circuit For Inductive Load Switching  
And Diode Recovery Times  
7/13  
STD1NK60 - STD1NK60-1 - STQ1HNK60R  
TO-251 (IPAK) MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
2.2  
TYP.  
MAX.  
2.4  
MIN.  
0.086  
0.035  
0.027  
0.025  
0.204  
MAX.  
0.094  
0.043  
0.051  
0.031  
0.212  
0.033  
A
A1  
A3  
B
0.9  
1.1  
0.7  
1.3  
0.64  
5.2  
0.9  
B2  
B3  
B5  
B6  
C
5.4  
0.85  
0.3  
0.012  
0.95  
0.6  
0.6  
6.2  
6.6  
4.6  
16.3  
9.4  
1.2  
1
0.037  
0.023  
0.023  
0.244  
0.260  
0.181  
0.641  
0.370  
0.047  
0.039  
0.45  
0.48  
6
0.017  
0.019  
0.236  
0.252  
0.173  
0.626  
0.354  
0.031  
C2  
D
E
6.4  
4.4  
15.9  
9
G
H
L
L1  
L2  
0.8  
0.8  
0.031  
H
L
D
L2  
L1  
0068771-E  
8/13  
STD1NK60 - STD1NK60-1 - STQ1HNK60R  
TO-252 (DPAK) MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
2.20  
0.90  
0.03  
0.64  
5.20  
0.45  
0.48  
6.00  
6.40  
4.40  
9.35  
TYP.  
MAX.  
2.40  
1.10  
0.23  
0.90  
5.40  
0.60  
0.60  
6.20  
6.60  
4.60  
10.10  
MIN.  
0.087  
0.035  
0.001  
0.025  
0.204  
0.018  
0.019  
0.236  
0.252  
0.173  
0.368  
MAX.  
0.094  
0.043  
0.009  
0.035  
0.213  
0.024  
0.024  
0.244  
0.260  
0.181  
0.398  
A
A1  
A2  
B
B2  
C
C2  
D
E
G
H
L2  
L4  
V2  
0.8  
0.031  
0.60  
0o  
1.00  
8o  
0.024  
0o  
0.039  
0o  
P032P_B  
9/13  
STD1NK60 - STD1NK60-1 - STQ1HNK60R  
TO-92 MECHANICAL DATA  
mm.  
TYP  
inch  
TYP.  
DIM.  
MIN.  
4.32  
0.36  
4.45  
3.30  
2.41  
1.14  
12.70  
2.16  
0.92  
0.41  
MAX.  
4.95  
0.51  
4.95  
3.94  
2.67  
1.40  
15.49  
2.41  
1.52  
0.56  
MIN.  
0.170  
0.014  
0.175  
0.130  
0.094  
0.044  
0.50  
MAX.  
0.194  
0.020  
0.194  
0.155  
0.105  
0.055  
0.610  
0.094  
0.060  
0.022  
A
b
D
E
e
e1  
L
R
S1  
W
V
0.085  
0.036  
0.016  
5°  
5°  
10/13  
STD1NK60 - STD1NK60-1 - STQ1HNK60R  
DPAK FOOTPRINT  
TUBE SHIPMENT (no suffix)*  
All dimensions  
are in millimeters  
All dimensions are in millimeters  
TAPE AND REEL SHIPMENT (suffix ”T4”)*  
REEL MECHANICAL DATA  
mm  
MIN. MAX. MIN. MAX.  
330 12.992  
inch  
DIM.  
A
B
C
D
G
N
T
1.5  
12.8  
20.2  
16.4  
50  
0.059  
13.2 0.504 0.520  
0.795  
18.4 0.645 0.724  
1.968  
22.4  
0.881  
BASE QTY  
BULK QTY  
2500  
TAPE MECHANICAL DATA  
2500  
mm  
MIN. MAX. MIN. MAX.  
6.8 0.267 0.275  
10.4 10.6 0.409 0.417  
12.1 0.476  
inch  
DIM.  
A0  
B0  
B1  
D
7
1.5  
1.5  
1.6 0.059 0.063  
0.059  
D1  
E
1.65 1.85 0.065 0.073  
7.4 7.6 0.291 0.299  
2.55 2.75 0.100 0.108  
F
K0  
P0  
P1  
P2  
R
3.9  
7.9  
1.9  
40  
4.1 0.153 0.161  
8.1 0.311 0.319  
2.1 0.075 0.082  
1.574  
W
15.7  
16.3 0.618 0.641  
* on sales type  
11/13  
STD1NK60 - STD1NK60-1 - STQ1HNK60R  
TO-92 AMMOPACK  
mm.  
TYP  
inch  
TYP.  
DIM.  
MIN.  
MAX.  
4.8  
MIN.  
MAX.  
0.19  
0.15  
0.06  
0.09  
0.02  
0.51  
0.27  
0.11  
0.08  
0.74  
0.24  
0.36  
0.02  
0.80  
0.65  
0.98  
0.16  
0.035  
0.43  
A1  
T
3.8  
T1  
1.6  
T2  
2.3  
d
0.458  
12.5  
5.65  
2.44  
-2  
0.505  
12.9  
7.05  
2.94  
2
0.018  
0.49  
0.22  
0.09  
-0.08  
0.69  
0.22  
0.33  
P0  
12.7  
6.35  
2.54  
0.5  
0.25  
0.1  
P2  
F1, F2  
delta H  
W
17.5  
5.7  
18  
6
19  
0.71  
0.23  
0.35  
W0  
W1  
W2  
H
6.3  
8.5  
9
9.25  
0.5  
18.5  
15.5  
20.5  
16.5  
25  
0.72  
0.61  
H0  
H1  
D0  
t
16  
4
0.63  
3.8  
4.2  
0.15  
0.157  
0.9  
L
11  
l1  
3
0.11  
delta P  
-1  
1
-0.04  
0.04  
12/13  
STD1NK60 - STD1NK60-1 - STQ1HNK60R  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the  
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from  
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications  
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information  
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or  
systems without express written approval of STMicroelectronics.  
© The ST logo is a registered trademark of STMicroelectronics  
© 2003 STMicroelectronics - Printed in Italy - All Rights Reserved  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco  
Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.  
© http://www.st.com  
13/13  

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