STD1NK80Z-1 [STMICROELECTRONICS]

N-CHANNEL 800V - 13 ヘ - 1 A TO-92 /SOT-223/DPAK/IPAK Zener - Protected SuperMESH⑩ MOSFET; N沟道800V - 13ヘ - 1 A TO- 92 / SOT- 223 / DPAK / IPAK齐纳 - 保护SuperMESH⑩ MOSFET
STD1NK80Z-1
型号: STD1NK80Z-1
厂家: ST    ST
描述:

N-CHANNEL 800V - 13 ヘ - 1 A TO-92 /SOT-223/DPAK/IPAK Zener - Protected SuperMESH⑩ MOSFET
N沟道800V - 13ヘ - 1 A TO- 92 / SOT- 223 / DPAK / IPAK齐纳 - 保护SuperMESH⑩ MOSFET

晶体 晶体管 功率场效应晶体管 开关 脉冲
文件: 总15页 (文件大小:633K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
STQ1NK80ZR-AP - STN1NK80Z  
STD1NK80Z - STD1NK80Z-1  
N-CHANNEL 800V - 13 - 1 A TO-92 /SOT-223/DPAK/IPAK  
Zener - Protected SuperMESH™ MOSFET  
Table 1: General Features  
Figure 1: Package  
TYPE  
V
DSS  
R
I
D
Pw  
DS(on)  
2
STQ1NK80ZR-AP 800 V < 16 Ω  
0.3 A  
3 W  
STN1NK80Z  
STD1NK80Z  
STD1NK80Z-1  
800 V < 16 0.25A 2.5 W  
3
2
800 V < 16 Ω  
800 V < 16 Ω  
1.0 A 45 W  
1.0 A 45 W  
1
TYPICAL R (on) = 13Ω  
SOT-223  
DS  
TO-92 (Ammopack)  
EXTREMELY HIGH dv/dt CAPABILITY  
ESD IMPROVED CAPABILITY  
100% AVALANCHE TESTED  
NEW HIGH VOLTAGE BENCHMARK  
GATE CHARGE MINIMIZED  
3
3
1
2
1
DESCRIPTION  
DPAK  
IPAK  
The SuperMESH™ series is obtained through an  
extreme optimization of ST’s well established  
strip-based PowerMESH™ layout. In addition to  
pushing on-resistance significantly down, special  
care is taken to ensure a very good dv/dt capability  
for the most demanding applications. Such series  
complements ST full range of high voltage MOS-  
FETs including revolutionary MDmesh™ products.  
Figure 2: Internal Schematic Diagram  
APPLICATIONS  
AC ADAPTORS AND BATTERY CHARGERS  
SWITH MODE POWER SUPPLIES (SMPS)  
Table 2: Order Codes  
SALES TYPE  
STQ1NK80ZR-AP  
STN1NK80Z  
MARKING  
Q1NK80ZR  
N1NK80Z  
D1NK80Z  
D1NK80Z  
PACKAGE  
TO-92  
PACKAGING  
AMMOPAK  
TAPE & REEL  
TAPE & REEL  
TUBE  
SOT-223  
DPAK  
STD1NK80ZT4  
STD1NK80Z-1  
IPAK  
Rev. 3  
January 2006  
1/15  
STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1  
Table 3: Absolute Maximum ratings  
Symbol  
Parameter  
Value  
SOT-223  
800  
Unit  
TO-92  
DPAK/IPAK  
V
DS  
Drain-source Voltage (V = 0)  
V
V
GS  
V
DGR  
Drain-gate Voltage (R = 20 k)  
800  
GS  
V
Gate- source Voltage  
± 30  
0.25  
0.16  
5
V
GS  
I
Drain Current (continuous) at T = 25°C  
0.3  
1.0  
A
D
C
I
Drain Current (continuous) at T = 100°C  
0.19  
0.63  
A
D
C
I
( )  
Drain Current (pulsed)  
A
DM  
P
TOT  
Total Dissipation at T = 25°C  
3
2.5  
45  
W
C
Derating Factor  
0.025  
0.02  
1000  
4.5  
0.36  
W /°C  
V
V
Gate source ESD (HBM-C= 100pF, R= 1.5KΩ)  
Peak Diode Recovery voltage slope  
ESD(G-S)  
dv/dt (1)  
V/ns  
T
T
stg  
Operating Junction Temperature  
Storage Temperature  
j
-55 to 150  
°C  
( ) Pulse width limited by safe operating area  
(1) I 1 A, di/dt 200 A/µs, V 640  
SD  
DD  
Table 4: Thermal Data  
TO-92  
--  
SOT-223  
DPAK/IPAK  
Unit  
°C/W  
°C/W  
°C/W  
°C  
Rthj-case  
Thermal Resistance Junction-case Max  
--  
50  
--  
2.78  
100  
--  
Rthj-amb(#) Thermal Resistance Junction-ambient Max  
120  
40  
Rthj-lead  
Thermal Resistance Junction-lead Max  
T
Maximum Lead Temperature For Soldering  
Purpose  
260  
--  
300  
l
(#) When mounted on 1inch² FR-4 BOARD, 2 oz Cu  
Table 5: Avalanche Characteristics  
Symbol  
Parameter  
Max Value  
Unit  
I
Avalanche Current, Repetitive or Not-Repetitive  
1
A
AR  
(pulse width limited by T max)  
j
E
Single Pulse Avalanche Energy  
50  
mJ  
AS  
(starting T = 25 °C, I = I , V = 50 V)  
j
D
AR  
DD  
Table 6: GATE-SOURCE ZENER DIODE  
Symbol  
BV  
Parameter  
Gate-Source Breakdown Igs=± 1mA (Open  
Voltage Drain)  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
30  
V
GSO  
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES  
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s  
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be  
applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and  
cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the  
usage of external components.  
2/15  
STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1  
ELECTRICAL CHARACTERISTICS (T  
=25°C UNLESS OTHERWISE SPECIFIED)  
CASE  
Table 7: On/Off  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
Drain-source  
I
D
= 1 mA, V = 0  
800  
V
(BR)DSS  
GS  
Breakdown Voltage  
Zero Gate Voltage  
I
V
V
= Max Rating  
= Max Rating, T = 125 °C  
1
50  
µA  
µA  
DSS  
DS  
Drain Current (V = 0)  
GS  
DS  
C
I
Gate-body Leakage  
V
GS  
= ± 20V  
±10  
µA  
GSS  
Current (V = 0)  
DS  
V
V
V
= V , I = 50 µA  
Gate Threshold Voltage  
3
3.75  
13  
4.5  
16  
V
GS(th)  
DS  
GS  
D
R
Static Drain-source On  
Resistance  
= 10V, I = 0.5 A  
DS(on)  
GS  
D
Table 8: Dynamic  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
g
(1)  
Forward Transconductance  
V
V
= 15 V I = 0.5 A  
0.8  
S
fs  
DS  
, D  
C
C
C
Input Capacitance  
Output Capacitance  
Reverse Transfer  
Capacitance  
= 25 V f = 1 MHz, V = 0  
160  
26  
6.7  
pF  
pF  
pF  
iss  
DS  
,
GS  
oss  
rss  
C
(3) Equivalent Output  
Capacitance  
V
V
= 0V, V = 0V to 640V  
9.5  
pF  
oss eq.  
GS  
DS  
t
t
Turn-on Delay Time  
Rise Time  
Turn-off Delay Time  
= 400 V, I = 0.5 A  
8
ns  
ns  
ns  
ns  
d(on)  
DD  
D
30  
22  
55  
t
r
R = 4.7V = 10 V  
G GS  
(see Figure 21)  
d(off)  
Fall Time  
t
f
Q
V
V
= 640V, I = 1.0 A,  
= 10V  
7.7  
1.4  
4.5  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
nC  
nC  
nC  
g
DD  
D
Q
gs  
gd  
GS  
Q
(see Figure 24)  
Table 9: Source Drain Diode  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
I
1.0  
5
A
A
Source-drain Current  
Source-drain Current (pulsed)  
SD  
(2)  
I
SDM  
V
(1)  
I
I
= 1.0 A, V = 0  
GS  
Forward On Voltage  
1.6  
V
SD  
SD  
t
rr  
= 1.0 A, di/dt = 100 A/µs  
= 50 V, T = 25°C  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
365  
802  
4.4  
ns  
nC  
A
SD  
Q
V
DD  
(see Figure 22)  
rr  
j
I
RRM  
t
Q
I
= 1.0 A, di/dt = 100 A/µs  
= 50 V, T = 150°C  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
388  
802.7  
4.6  
ns  
nC  
A
rr  
SD  
V
DD  
(see Figure 22)  
rr  
j
I
RRM  
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.  
2. Pulse width limited by safe operating area.  
3. C  
V
is defined as a constant equivalent capacitance giving the same charging time as C  
when V increases from 0 to 80%  
oss DS  
oss eq.  
DSS  
3/15  
STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1  
Figure 3: Safe Operating Area for SOT-223  
Figure 4: Safe Operating Area for TO-92  
Figure 5: Safe Operating Area for IPAK-DPAK  
Figure 6: Thermal Impedance for SOT-223  
Figure 7: Thermal Impedance for TO-92  
Figure 8: Thermal Impedance for DPAK-IPAK  
4/15  
STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1  
Figure 9: Output Characteristics  
Figure 12: Transfer Characteristics  
Figure 13: Static Drain-source On Resistance  
Figure 14: Capacitance Variations  
Figure 10: Transconductance  
Figure 11: Gate Charge vs Gate-source Voltage  
5/15  
STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1  
Figure 15: Normalized Gate Thereshold Volt-  
age vs Temperature  
Figure 18: Normalized On Resistance vs Tem-  
perature  
Figure 16: Source-Drain Diode Forward Char-  
acteristics  
Figure 19: Normalized BVdss vs Temperature  
Figure 17: Avalanche Energy vs Starting Tj  
6/15  
STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1  
Figure 20: Unclamped Inductive Load Test Cir-  
Figure 23: Unclamped Inductive Wafeform  
cuit  
Figure 21: Switching Times Test Circuit For  
Resistive Load  
Figure 24: Gate Charge Test Circuit  
Figure 22: Test Circuit For Inductive Load  
Switching and Diode Recovery Times  
7/15  
STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1  
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These  
packages have a Lead-free second level interconnect . The category of second level interconnect is  
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The  
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an  
ST trademark. ECOPACK specifications are available at: www.st.com  
8/15  
STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1  
DPAK FOOTPRINT  
All dimensions are in millimeters  
TAPE AND REEL SHIPMENT  
REEL MECHANICAL DATA  
mm  
MIN. MAX. MIN. MAX.  
330 12.992  
inch  
DIM.  
A
B
C
D
G
N
T
1.5  
12.8  
20.2  
16.4  
50  
0.059  
13.2 0.504 0.520  
0.795  
18.4 0.645 0.724  
1.968  
22.4  
0.881  
BASE QTY  
BULK QTY  
2500  
TAPE MECHANICAL DATA  
2500  
mm  
MIN. MAX. MIN. MAX.  
6.8 0.267 0.275  
10.4 10.6 0.409 0.417  
12.1 0.476  
inch  
DIM.  
A0  
B0  
B1  
D
7
1.5  
1.5  
1.6 0.059 0.063  
0.059  
D1  
E
1.65 1.85 0.065 0.073  
7.4 7.6 0.291 0.299  
2.55 2.75 0.100 0.108  
F
K0  
P0  
P1  
P2  
R
3.9  
7.9  
1.9  
40  
4.1 0.153 0.161  
8.1 0.311 0.319  
2.1 0.075 0.082  
1.574  
W
15.7  
16.3 0.618 0.641  
9/15  
STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1  
TO-92 MECHANICAL DATA  
mm.  
inch  
TYP.  
DIM.  
MIN.  
4.32  
0.36  
4.45  
3.30  
2.41  
1.14  
12.70  
2.16  
0.92  
0.41  
TYP  
MAX.  
4.95  
0.51  
4.95  
3.94  
2.67  
1.40  
15.49  
2.41  
1.52  
0.56  
MIN.  
0.170  
0.014  
0.175  
0.130  
0.094  
0.044  
0.50  
MAX.  
0.194  
0.020  
0.194  
0.155  
0.105  
0.055  
0.610  
0.094  
0.060  
0.022  
A
b
D
E
e
e1  
L
R
S1  
W
V
0.085  
0.036  
0.016  
5°  
5°  
10/15  
STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1  
SOT-223 MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
TYP.  
MAX.  
1.80  
0.80  
3.10  
0.32  
6.70  
MIN.  
MAX.  
0.071  
0.031  
0.122  
0.013  
0.264  
A
B
0.60  
2.90  
0.24  
6.30  
0.70  
3.00  
0.26  
6.50  
2.30  
4.60  
3.50  
7.00  
0.024  
0.114  
0.009  
0.248  
0.027  
0.118  
0.010  
0.256  
0.090  
0.181  
0.138  
0.276  
B1  
c
D
e
e1  
E
3.30  
6.70  
3.70  
7.30  
10o  
0.130  
0.264  
0.146  
0.287  
10o  
H
V
A1  
0.02  
P008B  
11/15  
STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1  
TO-252 (DPAK) MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
2.20  
0.90  
0.03  
0.64  
5.20  
0.45  
0.48  
6.00  
6.40  
4.40  
9.35  
TYP.  
MAX.  
2.40  
1.10  
0.23  
0.90  
5.40  
0.60  
0.60  
6.20  
6.60  
4.60  
10.10  
MIN.  
0.087  
0.035  
0.001  
0.025  
0.204  
0.018  
0.019  
0.236  
0.252  
0.173  
0.368  
MAX.  
0.094  
0.043  
0.009  
0.035  
0.213  
0.024  
0.024  
0.244  
0.260  
0.181  
0.398  
A
A1  
A2  
B
B2  
C
C2  
D
E
G
H
L2  
L4  
V2  
0.8  
0.031  
0.60  
0o  
1.00  
8o  
0.024  
0o  
0.039  
0o  
P032P_B  
12/15  
STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1  
TO-251 (IPAK) MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
2.2  
TYP.  
MAX.  
2.4  
MIN.  
0.086  
0.035  
0.027  
0.025  
0.204  
MAX.  
0.094  
0.043  
0.051  
0.031  
0.212  
0.033  
A
A1  
A3  
B
0.9  
1.1  
0.7  
1.3  
0.64  
5.2  
0.9  
B2  
B3  
B5  
B6  
C
5.4  
0.85  
0.3  
0.012  
0.95  
0.6  
0.6  
6.2  
6.6  
4.6  
16.3  
9.4  
1.2  
1
0.037  
0.023  
0.023  
0.244  
0.260  
0.181  
0.641  
0.370  
0.047  
0.039  
0.45  
0.48  
6
0.017  
0.019  
0.236  
0.252  
0.173  
0.626  
0.354  
0.031  
C2  
D
E
6.4  
4.4  
15.9  
9
G
H
L
L1  
L2  
0.8  
0.8  
0.031  
H
L
D
L2  
L1  
0068771-E  
13/15  
STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1  
Table 10: Revision History  
Date  
Revision  
Description of Changes  
08-Jun-2005  
06-Sep-2005  
16-Jan-2006  
1
2
3
First Release  
Inserted Ecopack indication  
Corrected value on Table 3  
14/15  
STQ1NK80ZR-AP - STN1NK80Z - STD1NK80Z - STD1NK80Z-1  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted  
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject  
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not  
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is a registered trademark of STMicroelectronics  
All other names are the property of their respective owners  
© 2006 STMicroelectronics - All Rights Reserved  
STMicroelectronics group of companies  
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -  
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America  
15/15  

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