E-STE101P [STMICROELECTRONICS]
10/100 Fast ethernet 3.3V transceiver; 10/100快速以太网收发器3.3V
| 型号： | E-STE101P |
| 厂家： | 
ST |
| 描述： | 10/100 Fast ethernet 3.3V transceiver |
| 文件： | 总5页 (文件大小：104K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STE101P
10/100 Fast ethernet 3.3V transceiver
Data Brief
Feature summary
■ IEEE802.3u 100Base-TX and IEEE802.3
10Base-T transceiver
■ Support for IEEE802.3x flow control
■ MII /RMII / SMII interface
■ Auto MDIX supported
■ Provides Full-duplex operation on both
TQFP64
(10x10x1.4mm)
100Mbps and 10Mbps modes
■ Provides MLT-3 transceiver with DC
restoration for Base-line wander compensation
■ Provides loop-back modes for diagnostics
Description
■ Supports external transformer with turn ratio
The STE101P is a high performance Fast
Ethernet physical layer interface for 10Base-T and
100Base-TX applications.
1.414:1 on Tx/Rx side.
■ Five LED display for operating mode and
functionaliity signalling
It was designed with advanced CMOS technology
to provide MII, RMII and SMII interfaces for easy
attachment to 10/100 Media Access Controllers
(MAC) and a physical media interface for
100Base-TX of IEEE802.3u and 10Base-T of
IEEE802.3.
■ Operation from single 3.3V supply
■ High Cable ESD tolerance
■ Standard 64-pin QFP package pinout
■ Industrial temperature compliant
■ Self termination transceiver for external
components and power saving
The STE101P supports both half-duplex and full-
duplex operation at 10 and 100 Mbps operation.
Its operating mode can be set using auto-
negotiation, parallel detection or manual control. It
also allows for the support of auto-negotiation
functions for speed and duplex detection. The
Automatic MDI / MDIX feature compensates for
using a cross over cable. With Auto MDIX, the
STE101P automatically detects what is on the
other end of the network cable and switches the
TX & RX pins accordingly.
■ Power dissipation < 200mW
Applications
■ Switches/Routers/Hubs
■ Nic adapters
■ Game consoles
■ VoIP gateways/phones
■ Network Printers
■ DTVs/DVD-Rs
Order codes
Part number
Temp range, °C
Package
Packing
E-STE101P(1)
-40 to 85
TQFP64 (14x14x1.4mm)
Tube
(1) E-: ECOPACK® (see Chapter 2)
February 2006
Rev 1
1/5
For further information contact your local STMicroelectronics sales office.
www.st.com
5
System diagram of the STE101P application
STE101P
1
System diagram of the STE101P application
Figure 1.
System diagram of the STE101P application
Serial
EEPROM
LEDs
MAC
RJ-45
STE101P
Device
25 MHz
Crystal
Boot ROM
2/5
STE101P
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 2. TQFP64 (10 x 10 x 1.4mm) Mechanical Data & Package Dimensions
mm
inch
DIM.
OUTLINE AND
MECHANICAL DATA
MIN. TYP. MAX. MIN.
TYP. MAX.
0.063
A
A1
A2
B
1.60
0.05
1.35
0.17
0.09
0.15 0.002
0.006
1.40
0.22
1.45 0.053 0.055 0.057
0.27 0.0066 0.0086 0.0106
0.0035
C
D
11.80 12.00 12.20 0.464 0.472 0.480
9.80 10.00 10.20 0.386 0.394 0.401
D1
D3
e
7.50
0.50
0.295
0.0197
E
11.80 12.00 12.20 0.464 0.472 0.480
9.80 10.00 10.20 0.386 0.394 0.401
E1
E3
L
7.50
0.60
1.00
0.295
0.75 0.0177 0.0236 0.0295
0.0393
0.45
L1
K
TQFP64 (10 x 10 x 1.4mm)
0˚ (min.), 3.5˚ (min.), 7˚(max.)
0.080
ccc
0.0031
D
D1
D3
A
A2
A1
48
33
32
49
0.08mm ccc
Seating Plane
17
16
64
1
C
e
K
TQFP64
0051434 E
3/5
Revision history
STE101P
3
Revision history
Table 1.
Date
10-Feb-2006
Document revision history
Revision
Changes
1
Initial release.
4/5
STE101P
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