SGM61006 [SGMICRO]
600mA, 1.8V to 5.5V Synchronous Buck Converter;型号: | SGM61006 |
厂家: | Shengbang Microelectronics Co, Ltd |
描述: | 600mA, 1.8V to 5.5V Synchronous Buck Converter |
文件: | 总18页 (文件大小:962K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SGM61006
600mA, 1.8V to 5.5V
Synchronous Buck Converter
GENERAL DESCRIPTION
FEATURES
The SGM61006 is a high efficiency and miniature size
synchronous Buck converter for low input voltage
applications. This high frequency device does not need
external compensation and is a perfect solution for
compact designs. The 1.8V to 5.5V input voltage range
is suitable for kinds of battery applications. The
minimum input voltage can be as low as 1.6V after
startup. It operates in PWM mode at heavy loads and
automatically enters power-save mode (PSM) at light
loads to maintain its high efficiency.
● 1.8V to 5.5V Input Voltage Range
● 0.5V to VIN Adjustable Output Voltage
● AHP-COT Architecture for Fast Transient
Regulation
● 3.5MHz Switching Frequency
● Up to 90% Efficiency
● Low RDSON MOSFET Switches (100mΩ/95mΩ)
● 26μA (TYP) Operating Quiescent Current
● Power-Save Mode for Light Load Efficiency
● 100% Duty Cycle for Lowest Dropout
● Output Discharge Function
With its adaptive hysteresis and pseudo-constant
on-time control (AHP-COT) architecture, the load
transient performance is excellent and the output
voltage regulation accuracy is achieved. The device is
available in a Green WLCSP-0.9×1.3-6B-A package.
● Power Good Output
● Thermal Shutdown Protection
● Available in a Green WLCSP-0.9×1.3-6B-A
Package
APPLICATIONS
Battery-Powered Application
Point-of-Load
Processor Supply
OLED/LCD Module Power Supply
TYPICAL APPLICATION
L1
0.47μH
VIN
1.8V to 5.5V
VOUT
0.9V
VIN
SW
C4
22μF
C5
NS
C1
NS
C2
10μF
R1
C3
6.8pF
EN
R3
100kΩ
91kΩ
SGM61006
FB
R2
91kΩ
PG
GND
Figure 1. Typical Application Circuit
SG Micro Corp
www.sg-micro.com
MARCH 2023 – REV. A
SGM61006
600mA, 1.8V to 5.5V Synchronous Buck Converter
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
XXX
MBX
SGM61006 WLCSP-0.9×1.3-6B-A
SGM61006XG/TR
Tape and Reel, 3000
-40℃ to +125℃
MARKING INFORMATION
NOTE: XXX = Date Code and Trace Code.
Date Code - Year
Trace Code
X X X
Y Y Y
Serial Number
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
Voltages Referred to GND
VIN, FB, EN, PG.................................................. -0.3V to 6V
SW (DC) ...................................................-0.3V to VIN + 0.3V
SW (AC, less than 10ns) while Switching ............... -2V to 8V
Package Thermal Resistance
WLCSP-0.9×1.3-6B-A, θJA....................................... 158℃/W
Junction Temperature.................................................+150℃
Storage Temperature Range .......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................2000V
CDM ............................................................................1000V
RECOMMENDED OPERATING CONDITIONS
Input Voltage Range, VIN ....................................1.8V to 5.5V
Output Voltage Range, VOUT................................. 0.5V to VIN
Sink Current at PG Pin, ISINK_PG ......................................1mA
Pull-Up Resistor Voltage, VPG .........................................5.5V
Operating Junction Temperature .................-40℃ to +125℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
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MARCH 2023
2
SGM61006
600mA, 1.8V to 5.5V Synchronous Buck Converter
PIN CONFIGURATION
(TOP VIEW)
1
2
EN
VIN
A
B
C
PG
FB
SW
GND
WLCSP-0.9×1.3-6B-A
PIN DESCRIPTION
PIN
NAME
I/O
FUNCTION
Active High Device Enable Input Pin. Pull this pin to logic high to enable the device and pull it
low to disable it. An internal 450kΩ (TYP) pull-down resistor disables the device by default.
This resistor is removed when the device is enabled.
A1
EN
I
A2
B1
B2
C1
C2
VIN
PG
P
O
P
I
Input Voltage Pin.
Open-Drain Power Good Output Pin. This output is released to go high if the device is in
power good status. Pull up this pin to a 5.5V or less voltage rail. It can be left open if not used.
SW
FB
Switch Node of the Power Converter. Connect it to the output inductor.
Feedback Pin. Connect a resistor divider between the output voltage sense point and ground
and tap it to the FB pin to set the output voltage.
GND
G
Ground Pin.
SG Micro Corp
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MARCH 2023
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SGM61006
600mA, 1.8V to 5.5V Synchronous Buck Converter
ELECTRICAL CHARACTERISTICS
(VIN = 3.3V, TJ = -40℃ to +125℃, and all typical values are at TJ = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply
Quiescent Current into VIN Pin
Shutdown Current into VIN Pin
IQ
VIN = 1.8V to 5.5V, not switching
VIN = 1.8V to 5.5V, EN = Low
VIN rising
26
0.1
40
3
µA
µA
V
ISD
1.47
1.57
70
1.65
Under-Voltage Lockout Threshold
Thermal Shutdown
VUVLO
Hysteresis
mV
℃
Junction temperature rising
Junction temperature falling
150
135
TJSD
℃
Logic Interface
High-Level Threshold at EN Pin
Low-Level Threshold at EN Pin
Pull-Down Resistance at EN Pin
EN Input Leakage Current
Power Good
VIH
VIL
VIN = 1.8V to 5.5V
VIN = 1.8V to 5.5V
EN = Low
1
V
V
0.4
620
1
RPD
250
450
kΩ
µA
IENLKG
VEN = VIN = 5.5V
0.01
VPG rising, VFB referenced to VFB nominal
VPG falling, VFB referenced to VFB nominal
VPG rising, VFB referenced to VFB nominal
VPG falling, VFB referenced to VFB nominal
96
91
Power Good Threshold
VPG
%
%
110
105
VOUT Over-Voltage Threshold
VOVP
Power Good Low-Level Output
Voltage
VPG_OL
IPG_LKG
ISINK = 1mA
VPG = 5.0V
0.15
0.1
V
Input Leakage Current into PG Pin
Output
0.01
µA
Feedback Regulation Voltage
Feedback Input Leakage Current
Output Discharge Resistor
Power Switch
VFB
IFB
PWM mode
0.443
750
0.450
0.001
1100
0.457
0.01
V
µA
Ω
VFB = 0.45V
RDIS
EN = Low, VOUT = 1.8V
1450
VIN = 1.8V, ISW = 500mA
VIN = 3.3V, ISW = 500mA
VIN = 1.8V, ISW = 500mA
VIN = 3.3V, ISW = 500mA
Rising inductor current
VOUT = 1.2V
180
100
170
95
High-side FET On-Resistance
Low-side FET On-Resistance
mΩ
mΩ
RDSON
High-side FET Current Limit
Switching Frequency
ILIM
fSW
1.0
1.2
3.5
1.5
A
MHz
SG Micro Corp
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MARCH 2023
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SGM61006
600mA, 1.8V to 5.5V Synchronous Buck Converter
TYPICAL PERFORMANCE CHARACTERISTICS
High-side FET On-Resistance vs. Input Voltage
Low-side FET On-Resistance vs. Input Voltage
260
220
180
140
100
60
260
220
180
140
100
60
TA = -40℃
TA = +25℃
TA = -40℃
TA = +25℃
TA = +85℃
TA = +85℃
TA = +125℃
TA = +125℃
20
20
1.5
2.5
3.5
4.5
5.5
1.5
2.5
3.5
4.5
5.5
Input Voltage (V)
Input Voltage (V)
Shutdown Current vs. Input Voltage
Quiescent Current vs. Input Voltage
1450
1200
950
700
450
200
-50
38
35
32
29
26
23
20
TA = -40℃
TA = +25℃
TA = -40℃
TA = +25℃
TA = +85℃
TA = +85℃
TA = +125℃
TA = +125℃
1.5
2.5
3.5
4.5
5.5
1.5
2.5
3.5
4.5
5.5
Input Voltage (V)
Input Voltage (V)
Under-Voltage Lockout Threshold vs. Temperature
Regulated FB Voltage vs. Temperature
1.59
1.57
1.55
1.53
1.51
1.49
1.47
1.45
0.452
0.451
0.45
0.449
0.448
0.447
0.446
0.445
UVLO rising
UVLO falling
-55
-15
25
65
105
145
-55
-15
25
65
105
145
Temperature (℃)
Temperature (℃)
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MARCH 2023
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SGM61006
600mA, 1.8V to 5.5V Synchronous Buck Converter
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25℃, VIN = 1.8V, VOUT = 0.9V, COUT = 22μF and L = 0.47μH, unless otherwise noted.
Efficiency vs. Load Current
VOUT = 0.9V, DCR = 20mΩ
Efficiency vs. Load Current
VOUT = 0.6V, DCR = 20mΩ
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VIN = 2.5V
VIN = 3.3V
VIN = 4.2V
VIN = 2.5V
VIN = 3.3V
VIN = 4.2V
VIN = 5V
VIN = 5V
0.00001 0.0001
0.001
0.01
0.1
1
0.00001 0.0001
0.001
0.01
0.1
1
Load Current (A)
Load Current (A)
Efficiency vs. Load Current
Efficiency vs. Load Current
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VIN = 2.5V
VIN = 3.3V
VIN = 4.2V
VIN = 4.2V
VOUT = 3.3V, DCR = 20mΩ
VIN = 5V
VIN = 5V
VOUT = 1.8V, DCR = 20mΩ
0.00001 0.0001
0.001
0.01
0.1
1
0.00001 0.0001
0.001
0.01
0.1
1
Load Current (A)
Load Current (A)
Load Regulation vs. Load Current
VOUT = 0.6V
Load Regulation vs. Load Current
VOUT = 0.9V
0.620
0.615
0.610
0.605
0.600
0.595
0.590
0.920
0.915
0.910
0.905
0.900
0.895
0.890
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 5V
V
IN = 5V
0.00001 0.0001
0.001
0.01
0.1
1
0.00001 0.0001
0.001
0.01
0.1
1
Load Current (A)
Load Current (A)
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MARCH 2023
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SGM61006
600mA, 1.8V to 5.5V Synchronous Buck Converter
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25℃, VIN = 1.8V, VOUT = 0.9V, COUT = 22μF and L = 0.47μH, unless otherwise noted.
Load Regulation vs. Load Current
VOUT = 1.8V
Load Regulation vs. Load Current
VOUT = 3.3V
3.335
3.330
3.325
3.320
3.315
3.310
3.305
3.300
3.295
1.825
1.820
1.815
1.810
1.805
1.800
1.795
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 4.2V
IN = 5V
V
IN = 5V
V
0.00001 0.0001
0.001
0.01
0.1
1
0.00001 0.0001
0.001
0.01
0.1
1
Load Current (A)
Load Current (A)
Line Regulation vs. Input Voltage
VOUT = 0.6V
Line Regulation vs. Input Voltage
VOUT = 0.9V
0.630
0.625
0.620
0.615
0.610
0.605
0.600
0.595
0.590
0.585
0.930
0.925
0.920
0.915
0.910
0.905
0.900
0.895
0.890
0.885
IOUT = 0.01A
IOUT = 0.6A
IOUT = 0.01A
IOUT = 0.6A
1.6 2.1 2.6 3.1 3.6 4.1 4.6 5.1 5.6
Input Voltage (V)
1.6 2.1 2.6 3.1 3.6 4.1 4.6 5.1 5.6
Input Voltage (V)
Line Regulation vs. Input Voltage
Line Regulation vs. Input Voltage
1.820
1.815
1.810
1.805
1.800
1.795
1.790
3.335
3.325
3.315
3.305
3.295
3.285
3.275
IOUT = 0.01A
IOUT = 0.6A
IOUT = 0.01A
VOUT = 3.3V
VOUT = 1.8V
IOUT = 0.6A
2.4 2.8 3.2 3.6 4.0 4.4 4.8 5.2 5.6
Input Voltage (V)
3.4
3.7
4.0
4.3
4.6
4.9
5.2
5.5
Input Voltage (V)
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MARCH 2023
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SGM61006
600mA, 1.8V to 5.5V Synchronous Buck Converter
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25℃, VIN = 1.8V, VOUT = 0.9V, COUT = 22μF and L = 0.47μH, unless otherwise noted.
Frequency vs. Input Voltage
Frequency vs. Input Voltage
4
3.5
3
4
3.5
3
2.5
2
2.5
2
1.5
1
1.5
1
IOUT = 0.01A
IOUT = 0.01A
VOUT = 0.9V
VOUT = 3.3V
I
I
OUT = 0.3A
OUT = 0.6A
0.5
0
I
I
OUT = 0.3A
OUT = 0.6A
0.5
0
1.8
2.3
2.8
3.3
3.8
4.3
4.8
4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0
Input Voltage (V)
Input Voltage (V)
Frequency vs. Load Current
VOUT = 0.9V
Frequency vs. Load Current
VOUT = 3.3V
4
3.5
3
4
3.5
3
2.5
2
2.5
2
1.5
1
1.5
1
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
0.5
0
0.5
0
VIN = 4.2V
VIN = 5V
VIN = 5V
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.0
0.1
0.2
0.3
0.4
0.5
0.6
Load Current (A)
Load Current (A)
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SGM61006
600mA, 1.8V to 5.5V Synchronous Buck Converter
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25℃, VIN = 1.8V, VOUT = 0.9V, COUT = 22μF and L = 0.47μH, unless otherwise noted.
PWM Operation
PSM Operation
IOUT = 1mA
IOUT = 600mA
IL
IL
AC Coupled
VOUT
VOUT
VSW
VSW
Time (500ns/div)
Time (50μs/div)
Startup and Shutdown without Load
Startup and Shutdown with Load
IOUT = 600mA
VEN
VEN
VOUT
VPG
VOUT
VPG
IL
IL
Time (20ms/div)
Line Transient
Time (500μs/div)
Short Circuit Entry & Exit
VIN
VPG
VOUT
IL
VOUT
IL
VIN = 1.8V to 3.3V, ILOAD = 600mA
Time (100μs/div)
Time (50μs/div)
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SGM61006
600mA, 1.8V to 5.5V Synchronous Buck Converter
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25℃, VIN = 1.8V, VOUT = 0.9V, COUT = 22μF and L = 0.47μH, unless otherwise noted.
Load Transient
Load Transient
ILOAD
ILOAD
IL
IL
AC Coupled
AC Coupled
VOUT
VOUT
IOUT = 10mA to 600mA, Slew Rate = 4A/μs
IOUT = 10mA to 600mA, Slew Rate = 0.5A/μs
Time (50μs/div)
Time (50μs/div)
Load Transient
Load Transient
IOUT = 10mA to 600mA
IOUT = 10mA to 600mA
ILOAD
ILOAD
IL
IL
AC Coupled
VOUT
VOUT
VIN = 4.2V, VOUT = 1.8V, Slew Rate = 4A/μs
VIN = 4.2V, VOUT = 1.8V, Slew Rate = 0.5A/μs
Time (50μs/div)
Time (50μs/div)
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SGM61006
600mA, 1.8V to 5.5V Synchronous Buck Converter
FUNCTIONAL BLOCK DIAGRAM
VIN
VHCL
UVLO
HCL
High-side
Current Limit
Enable
EN
Thermal
Shutdown
450kΩ
MIN_ON
MIN_OFF
VIN
Adaptive
On-Time
Control
Logic
Gate
Driver
SW
SW
Ripple
Injection
FB
Active
Output
PWM
Discharge
LCL
VLCL
GND
Low-side
Current Limit
0.45V
PSM
Bandgap
Soft-Start
+
SS
EA
+
-
ZCD
VZCD
FB
PG
VFB
+
-
VOVP
VPG
VFB
+
-
Figure 2. Block Diagram
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SGM61006
600mA, 1.8V to 5.5V Synchronous Buck Converter
DETAILED DESCRIPTION
Table 1. Logic Table of PG Pin
Device Information
Overview
The SGM61006 is a high efficiency Buck converter with
AHP-COT architecture and advanced regulation
topology.
Logic Status
High Z Low
EN = High, VFB Rising ≥ 0.432V
√
√
√
√
At medium to heavy loads, the device works in pulse
width modulation (PWM) mode. At light loads, it
automatically switches to power-save mode (PSM). In
PWM mode, the device works with a nominal switching
frequency of 3.5MHz. When the load current falls, the
device goes into PSM to achieve high efficiency with
reducing switching frequency and minimizing quiescent
current. PSM mode can reduce the standby energy
consumption of system. During shutdown mode, the
energy consumption falls below 3μA.
EN = High, VFB Falling ≤ 0.410V
EN = High, VFB Rising ≥ 0.495V
EN = High, VFB Falling ≤ 0.473V
Enable
(EN = High)
Shutdown
(EN = Low)
√
√
√
UVLO
0.7V < VIN < VUVLO
TJ > TJSD
Thermal
Shutdown
Power Supply
Removal
VIN < 0.7V
undefined
100% Duty Cycle
Under-Voltage Lockout (UVLO)
The device provides low input-to-output voltage drop by
going into 100% duty cycle mode. In this mode, the
high-side MOSFET is constantly turned on and the
low-side MOSFET is turned off. This function can
increase the operation time to the utmost extent for
battery powered applications. To maintain an
appropriate output voltage, the minimum input voltage
is calculated by:
The device implements the under-voltage lockout
(UVLO) with a 70mV (TYP) hysteresis. When the input
voltage falls below the VUVLO, it shuts down the device.
Enable and Disable
A logic high input to EN activates the device, and a
logic low disables the device. An internal 450kΩ (TYP)
pull-down resistor disables the device by default. This
resistor is removed when the device is enabled.
(1)
V
= VOUT +IOUT_MAX × RDSON +RL
(
)
IN_MIN
where:
• VIN_MIN is the minimum input voltage.
Soft-Start
When EN is set to logic high and after about 260μs
delay, the device starts switching and VOUT increases
with 600μs (typical timing is from the first pulse to 95%
regulated voltage) internal soft-start circuit.
• IOUT_MAX is the maximum output current.
• RDSON is the high-side MOSFET on-resistance.
• RL is the inductor ohmic resistance.
Output Discharge
Power Good (PG)
Whenever the device is disabled by enable, thermal
shutdown or under-voltage lockout, the output is
discharged by the SW pin through a typical discharge
The power good output of SGM61006 will be low in the
condition that the output voltage is less than its nominal
value. If the output is between 96% and 105% of the
regulated voltage, the power good is in high-impedance
state. If the output voltage is less than 91% or greater
than 110% of the regulated voltage, the power good is
driven to low.
resistor of RDIS
.
Power-Save Mode (PSM)
Once the load current decreases, the SGM61006 will
enter power-save mode. Then, the device has a
reduced switching frequency and works with the
minimum quiescent current to keep high efficiency. In
power-save mode, the inductor current is discontinuous.
Then a fixed on-time architecture is activated and the
typical on-time is tON = 286ns × (VOUT/VIN).
The PG pin is an open-drain output with a maximum
sink current of 1mA. A pull-up resistor connecting to
power good output is required. When the device is
disabled or under-voltage lockout, the PG pin is driven
to low (see Table 1). The PG signal connected to the
EN pin of other converters can be used for multiple rails
sequences. Leave the PG pin floating when not in use.
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SGM61006
600mA, 1.8V to 5.5V Synchronous Buck Converter
DETAILED DESCRIPTION (continued)
Inductor Current Limit
Thermal Shutdown
To protect the device from overheating damage,
thermal protection is included in the device. If the
junction temperature exceeds the typical TJSD (+150℃
TYP), the switching will stop. When the device
temperature drops below the threshold minus
hysteresis, the switching will resume automatically.
The device implements an inductor current limit if
over-current or short-circuit exists. Both the peak
current of high-side and valley current of low-side
power MOSFETs are limited to protect the device. The
high-side MOSFET is turned off and the low-side
MOSFET is turned on to reduce the inductor current
when the high-side switch current limit is triggered. The
low-side MOSFET is turned off and the high-side switch
is turned on again when the inductor current drops to
the low-side switch current limit. It repeats until the
inductor current falls below the high-side switch current
limit. The actual current limit value may be larger than
the static current limit due to internal propagation
delays.
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MARCH 2023
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SGM61006
600mA, 1.8V to 5.5V Synchronous Buck Converter
APPLICATION INFORMATION
The SGM61006 is a synchronous Buck converter with output voltage adjusted by feedback dividers. Taking
SGM61006 typical application as a reference, the following sections discuss the design of external components and
how to achieve the application.
L1
0.47μH
VIN
VOUT
0.9V
VIN
EN
SW
1.8V to 5.5V
C4
22μF
C5
NS
C1
NS
C2
10μF
R1
C3
6.8pF
R3
100kΩ
91kΩ
SGM61006
FB
R2
91kΩ
PG
GND
Figure 3. SGM61006 Typical Application Circuit
R1
R2
R
Requirements
The design parameters given in Table 2 are used for
(2)
1
VOUT = VFB × 1+
= 0.45V× 1+
R2
this design example.
A lower value of R2 increases the robustness against
noise injection, and a higher value reduces the current
consumption of the voltage divider, thereby improving
the efficiency of light load.
Table 2. Design Parameters
Design Parameter
Input Voltage
Example Value
1.8V to 5.5V
0.9V
Output Voltage
A feed-forward capacitor is recommended to improve
the performance of smooth transition into power-save
mode and reduce undershoot during load transient.
5pF to 10pF is enough for typical applications.
Output Ripple Voltage
Output Current (MAX)
< 20mV
600mA
Design Details
Table 3 shows the components included in this
Inductor Design
Equation 3 is conventionally used to calculating the
output inductance of a Buck converter. The inductor
should be selected by its value and the saturation
current. The saturation current of inductor should be
higher than IL_MAX in Equation 3, and sufficient margin
should be reserved. Typically, the current above
high-side current limit is enough, and a 20% to 40%
ripple current is selected to calculate the inductance.
Larger inductor can reduce the ripple current, but with
an increasing response time.
example.
Table 3. Components List
Reference
Description
Manufacturer
0.47µH, Power Inductor,
DCR = 45mΩ, ISAT = 3.3A, IRMS = 2.6A
DFE18SANR47MG0L
10μF, Ceramic Capacitor, 10V, X5R,
Size 0603
6.8pF, Ceramic Capacitor, 50V, C0G,
Size 0603
22μF, Ceramic Capacitor, 10V, X5R,
Size 0603
91kΩ, Chip Resistor, 1/16W, 1%, Size
0603
91kΩ, Chip Resistor, 1/16W, 1%, Size
0603
100kΩ, Chip Resistor, 1/16W, 1%,
Size 0603
L1
Murata
C2
C3
C4
R1
R2
R3
Standard
Standard
Standard
Standard
Standard
Standard
ΔIL
IL_MAX = IOUT_MAX
+
2
VOUT
1−
V
IN
(3)
ΔIL = VOUT
×
L×fSW
Adjustable Output Voltage
where:
An external resistor divider connected to FB pin is used
for setting the output voltage. Through adjusting R1 and
R2, the output voltage can be programmed to the
desired value. Calculate R1 and R2 with Equation 2.
• IOUT_MAX is the maximum output current.
• ΔIL is the inductor current ripple.
• fSW is the switching frequency.
• L is the inductor value.
SG Micro Corp
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MARCH 2023
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SGM61006
600mA, 1.8V to 5.5V Synchronous Buck Converter
APPLICATION INFORMATION (continued)
∆I
L
Capacitor Design
For input capacitor design, an X5R/X7R dielectric
COUT
>
(6)
8 × f
× V
OUT_RIPPLE
SW
Both the input and output capacitors should be placed
as close to VIN and GND pins as possible to reduce
noise caused by PCB parasitic parameters.
ceramic capacitor should be selected for its low ESR
and high-frequency performance. 10μF is enough for
most applications. The voltage rating of input capacitor
must be considered for its significant bias effect. The
input ripple voltage can be calculated from Equation 4.
Layout Considerations
Good PCB layout is the key factor for high performance
operation of a device regarding the stability, regulation,
efficiency and other performance measures.
I
OUT ×D× (1− D)
(4)
ΔVIN
=
CIN × fSW
A list of guidelines for designing the PCB layout of
SGM61006 is provided below:
The ripple current rating of input capacitor should be
greater than ICIN_RMS in Equation 5 and the maximum
value occurs at 50% duty cycle. A bulk capacitor is
suggested to add if the input wire long.
Place the power components close together and
connect them with short and wide routes. The
low-side of the capacitors must be connected to
GND properly to avoid potential shift.
V
× ꢀV -V
ꢁ
OUT
IN OUT
�
�
ICIN_RMS = IOUT
×
= IOUT× D×ꢀ1-Dꢁ
(5)
V
× V
IN
IN
For output capacitor design, output ripple, transient
response and loop stability should be considered.
Minimum capacitance of output ripple criteria can be
calculated from Equation 6.
FB pin is noise sensitive and must be placed
away from SW. Connect the inductor with a short
trace to minimize noise.
Figure 4. Top Layer
Figure 5. Bottom Layer
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (MARCH 2023) to REV.A
Page
Changed from product preview to production data .................................................................................................................................................All
SG Micro Corp
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MARCH 2023
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PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
WLCSP-0.9×1.3-6B-A
0.40
0.20
6 × Φ
0.18
D
A1 CORNER
E
0.40
RECOMMENDED LAND PATTERN (Unit: mm)
TOP VIEW
2
1
6 × Φd
A
B
C
e
C
A
A1
SEATING PLANE
ccc
C
e
SIDE VIEW
BOTTOM VIEW
Dimensions In Millimeters
Symbol
MIN
-
MOD
MAX
A
A1
D
-
0.545
0.210
0.930
1.330
0.260
0.170
0.870
1.270
0.200
-
-
E
-
-
d
e
0.400 BSC
0.050
ccc
NOTE: This drawing is subject to change without notice.
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PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
WLCSP-0.9×1.3-6B-A
7″
9.5
1.00
1.40
0.62
4.0
4.0
2.0
8.0
Q1
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PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
7″ (Option)
7″
368
442
227
410
224
224
8
18
SG Micro Corp
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相关型号:
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