SGM42540 [SGMICRO]

Single H-Bridge DC Motor Driver;
SGM42540
型号: SGM42540
厂家: Shengbang Microelectronics Co, Ltd    Shengbang Microelectronics Co, Ltd
描述:

Single H-Bridge DC Motor Driver

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中文:  中文翻译
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SGM42540  
Single H-Bridge DC Motor Driver  
GENERAL DESCRIPTION  
FEATURES  
The SGM42540 is an integrated driver IC for driving  
Motor Supply Voltage Range: 8V to 45V  
one brushed DC motor in industrial applications. The  
device operates from a single power supply and  
supports a wide input supply range from 8V to 45V.  
Single H-Bridge Motor Driver  
5-Bit Current Control Supports up to 32 Current  
Levels  
4.5A Peak Output Current at VM = 24V, TJ = +25  
Built-in 3.3V Internal Reference  
Parallel Digital Control Interface  
Full Set of Protections  
The PHASE and ENBL pins allow simple interfacing to  
controller circuits. The device has one H-bridge driver  
for driving a DC motor.  
With proper heatsinking, the SGM42540 can deliver up  
to 4.5A peak or 3.5A continuous output current (at VM =  
24V and TJ = +25). Five input pins (ISET0 - ISET4)  
are used for 32 current levels. The decay mode (slow  
or fast) can be selected by DECAY pin.  
Over-Current Protection (OCP)  
Under-Voltage Lockout (UVLO)  
Thermal Shutdown (TSD)  
Active-Low Fault Indication Pin (nFAULT)  
Available in a Green TSSOP-28 (Exposed Pad)  
Package  
A number of protection features are provided in the device  
including over-current, short-circuit, under-voltage lockout  
and thermal shutdown.  
APPLICATIONS  
The SGM42540 is available in a Green TSSOP-28  
(Exposed Pad) package.  
Massage Chair  
Robotics  
Electric Curtains  
Gaming Machines  
Factory Automation  
Office Automation Machines  
SG Micro Corp  
APRIL2023REV. A. 1  
www.sg-micro.com  
SGM42540  
Single H-Bridge DC Motor Driver IC  
PACKAGE/ORDERING INFORMATION  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE  
DESCRIPTION  
ORDERING  
NUMBER  
PACKAGE  
MARKING  
PACKING  
OPTION  
MODEL  
SGM42540  
YPTS28  
XXXXX  
TSSOP-28  
(Exposed Pad)  
SGM42540  
SGM42540YPTS28G/TR  
Tape and Reel, 4000  
-40to +85℃  
MARKING INFORMATION  
NOTE: XXXXX = Date Code, Trace Code and Vendor Code.  
X X X X X  
Vendor Code  
Trace Code  
Date Code - Year  
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If  
you have additional comments or questions, please contact your SGMICRO representative directly.  
ABSOLUTE MAXIMUM RATINGS  
OVERSTRESS CAUTION  
Power Supply Voltage Range, VM...................... -0.3V to 55V  
Digital Pins Voltage Range.................................. -0.5V to 6V  
VREF Input Voltage Range, VREF ..................... -0.3V to 5.5V  
ISEN Pin Voltage Range (1)............................... -0.7V to 0.7V  
Package Thermal Resistance  
Stresses beyond those listed in Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to  
absolute maximum rating conditions for extended periods  
may affect reliability. Functional operation of the device at any  
conditions beyond those indicated in the Recommended  
Operating Conditions section is not implied.  
TSSOP-28 (Exposed Pad), θJA .............................. 27/W  
Junction Temperature .................................................+150℃  
Storage Temperature Range.........................-65to +150℃  
Lead Temperature (Soldering, 10s) ............................+260℃  
ESD Susceptibility  
ESD SENSITIVITY CAUTION  
This integrated circuit can be damaged if ESD protections are  
not considered carefully. SGMICRO recommends that all  
integrated circuits be handled with appropriate precautions.  
Failureto observe proper handlingand installation procedures  
can cause damage. ESD damage can range from subtle  
performance degradation tocomplete device failure. Precision  
integrated circuits may be more susceptible to damage  
because even small parametric changes could cause the  
device not to meet the published specifications.  
HBM.............................................................................2000V  
CDM ............................................................................1000V  
NOTE: 1. Transients of ±1V for less than 25ns are acceptable.  
RECOMMENDED OPERATING CONDITIONS  
Power Supply Voltage Range, VM...........................8V to 45V  
VREF Input Voltage Range, VREF...........................1V to 3.5V  
V3P3 Load Current, IV3P3 ..................................0mA to 10mA  
Externally Applied PWM Frequency, fPWM..... 0kHz to 100kHz  
Operating Junction Temperature Range......-40to +125℃  
DISCLAIMER  
SG Micro Corp reserves the right to make any change in  
circuit design, or specifications without prior notice.  
SG Micro Corp  
www.sg-micro.com  
APRIL 2023  
2
SGM42540  
Single H-Bridge DC Motor Driver IC  
PIN CONFIGURATION  
(TOP VIEW)  
1
2
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
GND  
CP1  
CP2  
VCP  
VM  
ISET4  
ISET3  
ISET2  
ISET1  
ISET0  
NC  
3
4
OUT1  
ISEN  
OUT2  
OUT2  
ISEN  
OUT1  
VM  
5
6
7
GND  
8
ENBL  
9
PHASE  
DECAY  
nFAULT  
nSLEEP  
nRESET  
V3P3  
10  
11  
12  
13  
14  
VREF  
VREF  
GND  
TSSOP-28 (Exposed Pad)  
PIN DESCRIPTION  
PIN  
1
NAME  
CP1  
TYPE  
I/O  
I/O  
I/O  
-
FUNCTION  
Charge Pump Flying Capacitor Connection Pins. A 0.01μF/50V capacitor is used between CP1 and  
CP2 pins.  
2
CP2  
High-side Gate Drive Voltage. Connect a 0.1μF/16V ceramic capacitor and a parallel 1MΩ resistor  
3
VCP  
VM  
between this pin and VM.  
4, 11  
14, 28  
15  
H-Bridge Power Supply. Connect these pins to the same motor supply (8V to 45V).  
Device ground.  
GND  
V3P3  
-
3.3V Regulator Output. A 0.47μF/6.3V ceramic capacitor is used between V3P3 and GND pins. This  
source can be used to supply VREF reference input.  
O
Current Set Reference Voltage Input. Apply the reference voltage to set the winding current value.  
These pins should be tied together on the PCB.  
Active-Low Reset Input. Active-low reset with weak internal pull-down to initialize logic and disable  
H-bridge outputs.  
Active-Low Sleep Mode Input. Active-low logic input with weak internal pull-down. Apply high to  
enable device, and low to enter into the low-power sleep mode.  
Decay (Brake) Mode Selection Input. Low = slow decay (brake), high = fast decay (coast). Internal  
pull-down and pull-up.  
12, 13  
16  
VREF  
nRESET  
nSLEEP  
DECAY  
I
I
I
I
17  
19  
H-Bridge Phase (Direction) Input. Logic high for sourcing from OUT1 and sinking into OUT2. Internal  
pull-down.  
20  
21  
PHASE  
ENBL  
I
I
Enable Input for H-Bridge. Logic high on this pin enables H-bridge. Internal pull-down.  
Current Set Inputs. Set winding current as a percentage of full-scale. Internal pull-down.  
Active-Low Fault Flag. Logic low when in fault conditions (over-temperature, over-current).  
H-Bridge Output 1. Connect to motor winding. These pins should be tied together on the PCB.  
23 ~ 27  
18  
ISET0 ~ ISET4  
nFAULT  
OUT1  
I
OD  
O
I/O  
O
-
5, 10  
6, 9  
H-Bridge ISENSE (GND). Connect through a current sense resistor to GND. These pins should be tied  
together on the PCB.  
ISEN  
7, 8  
OUT2  
H-Bridge Output 2. Connect to motor winding. These pins should be tied together on the PCB.  
Exposed  
Pad  
GND  
Ground.  
NOTE: I = input, O = output, OD = open-drain output, I/O = input/output.  
SG Micro Corp  
www.sg-micro.com  
APRIL 2023  
3
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
TSSOP-28 (Exposed Pad)  
D
D1  
5.5  
E1  
E2  
E
2.6  
5.94  
1.78  
b
e
0.42  
0.65  
RECOMMENDED LAND PATTERN (Unit: mm)  
L1  
A
A1  
θ
L
c
A2  
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
MIN  
MAX  
0.047  
0.006  
0.041  
0.012  
0.008  
0.386  
0.224  
0.177  
0.110  
0.260  
A
A1  
A2  
b
1.200  
0.150  
1.050  
0.300  
0.200  
9.800  
5.700  
4.500  
2.800  
6.600  
0.050  
0.800  
0.190  
0.090  
9.600  
5.300  
4.300  
2.400  
6.200  
0.002  
0.031  
0.007  
0.004  
0.378  
0.209  
0.169  
0.094  
0.244  
c
D
D1  
E
E1  
E2  
e
0.650 BSC  
1.000 BSC  
0.026 BSC  
0.039 BSC  
L
L1  
θ
0.450  
0°  
0.750  
8°  
0.018  
0°  
0.030  
8°  
NOTES:  
1. Body dimensions do not include mode flash or protrusion.  
2. This drawing is subject to change without notice.  
3. Reference JEDEC MO-153.  
SG Micro Corp  
TX00153.001  
www.sg-micro.com  
PACKAGE INFORMATION  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
P2  
P0  
W
Q2  
Q4  
Q2  
Q4  
Q2  
Q4  
Q1  
Q3  
Q1  
Q3  
Q1  
Q3  
B0  
Reel Diameter  
P1  
A0  
K0  
Reel Width (W1)  
DIRECTION OF FEED  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF TAPE AND REEL  
Reel Width  
Reel  
Diameter  
A0  
B0  
K0  
P0  
P1  
P2  
W
Pin1  
Package Type  
W1  
(mm)  
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant  
TSSOP-28  
(Exposed Pad)  
16.4  
6.80  
10.25  
1.60  
4.0  
8.0  
2.0  
16.0  
Q1  
13  
SG Micro Corp  
TX10000.000  
www.sg-micro.com  
PACKAGE INFORMATION  
CARTON BOX DIMENSIONS  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF CARTON BOX  
Length  
(mm)  
Width  
(mm)  
Height  
(mm)  
Reel Type  
Pizza/Carton  
13″  
386  
280  
370  
5
SG Micro Corp  
www.sg-micro.com  
TX20000.000  

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