SGM42541 [SGMICRO]
Dual H-Bridge Driver IC;
| 型号： | SGM42541 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | Dual H-Bridge Driver IC |
| 文件： | 总6页 (文件大小：449K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM42541
Dual H-Bridge Driver IC
GENERAL DESCRIPTION
FEATURES
The SGM42541 is a dual H-bridge motor driver suitable
for automated positioning and movement control in
equipment such as printers, scanners and robotic
mechanisms. The SGM42541 has two H-bridge drivers,
and can drive a bipolar stepper motor or two DC motors.
The output driver block for each consists of
N-MOSFETs configured as full H-bridge to drive the
motor windings. With proper heatsinking, the
SGM42541 can deliver up to 2A peak output current
per channel (at VM = 24V and TJ = +25℃).
● Motor Supply Voltage Range: 8V to 45V
● Dual H-Bridge Motor Driver
● PWM Control Interface
● 2-Bit Current Control Supports up to 4 Current
Levels
● Low On-Resistance: 0.42Ω for HS + LS, TJ = +25℃
● Up to 2A Drive Current at VM = 24V, TJ = +25℃
● Low Current Sleep Mode
● Built-in 3.3V Reference Output
● Full Set of Protections
Under-Voltage Lockout (UVLO)
Over-Current Protection (OCP)
Thermal Shutdown (TSD)
A simple parallel digital control interface is compatible
with industry-standard devices. Decay mode is
programmable. Fast, slow and mixed decay modes can
be provided according application requirements. A 2-bit
current control scheme allows up to 4 discrete current
levels.
Fault Condition Indication Pin (nFAULT)
● Available in a Green TSSOP-28 (Exposed Pad)
Package
A number of protection features are provided in the
device including over-current, short-circuit, under-
voltage lockout and thermal shutdown.
APPLICATIONS
Printer and Scanner
Stage Lighting
The SGM42541 is available in a Green TSSOP-28
(Exposed Pad) package.
SG Micro Corp
APRIL 2023–REV. A. 1
www.sg-micro.com
SGM42541
Dual H-Bridge Driver IC
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
SGM42541
YPTS28
XXXXX
TSSOP-28
(Exposed Pad)
SGM42541
SGM42541YPTS28G/TR
Tape and Reel, 4000
-40℃ to +85℃
MARKING INFORMATION
NOTE: XXXXX = Date Code, Trace Code and Vendor Code.
X X X X X
Vendor Code
Trace Code
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
ESD SENSITIVITY CAUTION
Power Supply Voltage Range, VM...................... -0.3V to 55V
Power Supply Ramp Rate............................................. 1V/μs
Digital Pin Voltage ............................................... -0.5V to 6V
xVREF Input Voltage Range, VREF.................... -0.3V to 5.5V
ISENx Pin Voltage (1) ........................................ -0.7V to 0.7V
Package Thermal Resistance
TSSOP-28 (Exposed Pad), θJA ............................... 27℃/W
Junction Temperature .................................................+150℃
Storage Temperature Range.........................-65℃ to +150℃
Lead Temperature (Soldering, 10s) ............................+260℃
ESD Susceptibility
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
HBM.............................................................................2000V
CDM ............................................................................1000V
RECOMMENDED OPERATING CONDITIONS
Power Supply Voltage Range, VM...........................8V to 45V
xVREF Input Voltage (2), VREF ................................1V to 3.5V
V3P3 Load Current, IV3P3 ..................................0mA to 10mA
Externally Applied PWM Frequency, fPWM..... 0kHz to 100kHz
Operating Junction Temperature Range......-40℃ to +125℃
PIN CONFIGURATION
(TOP VIEW)
1
2
28
27
26
25
24
23
22
21
20
19
18
17
16
15
GND
CP1
CP2
BI1
VCP
3
BI0
NOTES:
VMA
4
AI1
1. Transients of ±1V for less than 25ns are acceptable.
2. Operational at VREF from 0V to 1V, but accuracy is
degraded.
AOUT1
ISENA
AOUT2
BOUT2
ISENB
BOUT1
5
AI0
BIN2
6
7
BIN1
GND
OVERSTRESS CAUTION
8
AIN1
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
9
AIN2
10
11
12
13
14
DECAY
nFAULT
nSLEEP
nRESET
V3P3
VMB
AVREF
BVREF
GND
TSSOP-28 (Exposed Pad)
SG Micro Corp
www.sg-micro.com
APRIL 2023
2
SGM42541
Dual H-Bridge Driver IC
PIN DESCRIPTION
PIN
1
NAME
CP1
TYPE
I/O
FUNCTION
Charge Pump Flying Capacitor Connection Pins. A 0.01μF/50V capacitor is used between CP1 and CP2
pins.
2
CP2
I/O
Gate Drive Voltage of the High-side Switches. Decouple with a 0.1μF/16V ceramic capacitor and a 1MΩ to
VM pin.
3
VCP
I/O
Connect these pins to the same motor supply (8V to 45V) and
bypass with a 0.1μF ceramic capacitor to GND. Connect
sufficient bulk capacitance to the common supply line.
4
11
5
VMA
-
-
Power Supply for Bridge A.
Power Supply for Bridge B.
Output 1 of Bridge A.
Output 2 of Bridge A.
Output 1 of Bridge B.
Output 2 of Bridge B.
VMB
AOUT1
AOUT2
BOUT1
BOUT2
ISENB
ISENA
O
Connect to motor winding A terminals 1 and 2 respectively.
Connect to motor winding B terminals 1 and 2 respectively.
7
O
10
8
O
O
9
I/O
I/O
Bridge B ISENSE (GND). Connect through a current sense resistor to GND for bridge B.
Bridge A ISENSE (GND). Connect through a current sense resistor to GND for bridge A.
6
Bridge A Current Setting Reference Voltage Input. It can be driven independently with a DAC for
microstepping, or tied to a fixed reference like V3P3.
Bridge B Current Setting Reference Voltage Input. It can be driven independently with a DAC for
microstepping, or tied to a fixed reference like V3P3.
3.3V Regulator Output. A 0.47μF/6.3V ceramic capacitor is used between V3P3 and GND pins. This
source can be used to supply AVREF or BVREF reference inputs.
Reset Input. Active-low reset input with weak internal pull-down initializes internal logic and disables
H-bridge outputs.
12
13
15
16
AVREF
BVREF
V3P3
I
I
O
I
nRESET
Sleep Mode Input. Active-low logic input with weak internal pull-down. Apply high to enable device, and low
to enter into the low-power sleep mode.
17
18
19
nSLEEP
nFAULT
DECAY
I
OD
I
Fault Indication Pin. Go low when a fault occurs (over-temperature, over-current).
Decay Mode Selection Input. Low = slow decay, open = mixed decay, high = fast decay. The pin is pulled
down and pulled up internally inside the device.
20
21
AIN2
AIN1
BIN1
BIN2
AI0
I
I
I
I
I
I
I
I
-
Input 2 of Bridge A. Logic input for AOUT2. Internal pull-down.
Input 1 of Bridge A. Logic input for AOUT1. Internal pull-down.
Input 1 of Bridge B. Logic input for BOUT1. Internal pull-down.
Input 2 of Bridge B. Logic input for BOUT2. Internal pull-down.
22
23
24
A Channel H-Bridge Current Set Inputs. 00 is for 100% full scale, 01 is for 71% full scale, 10 is for 31% full
scale, 11 is for 0%. Internal pull-down.
25
AI1
26
BI0
B Channel H-Bridge Current Set Inputs. 00 is for 100% full scale, 01 is for 71% full scale, 10 is for 31% full
scale, 11 is for 0% full scale. Internal pull-down.
27
BI1
14, 28
GND
Ground.
Ground.
Exposed
Pad
GND
-
NOTE: I = input, O = output, OD = open-drain output, I/O = input/output.
SG Micro Corp
www.sg-micro.com
APRIL 2023
3
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TSSOP-28 (Exposed Pad)
D
D1
5.5
E1
E2
E
2.6
5.94
1.78
b
e
0.42
0.65
RECOMMENDED LAND PATTERN (Unit: mm)
L1
A
A1
θ
L
c
A2
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
MIN
MAX
0.047
0.006
0.041
0.012
0.008
0.386
0.224
0.177
0.110
0.260
A
A1
A2
b
1.200
0.150
1.050
0.300
0.200
9.800
5.700
4.500
2.800
6.600
0.050
0.800
0.190
0.090
9.600
5.300
4.300
2.400
6.200
0.002
0.031
0.007
0.004
0.378
0.209
0.169
0.094
0.244
c
D
D1
E
E1
E2
e
0.650 BSC
1.000 BSC
0.026 BSC
0.039 BSC
L
L1
θ
0.450
0°
0.750
8°
0.018
0°
0.030
8°
NOTES:
1. Body dimensions do not include mode flash or protrusion.
2. This drawing is subject to change without notice.
3. Reference JEDEC MO-153.
SG Micro Corp
TX00153.001
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TSSOP-28
(Exposed Pad)
16.4
6.80
10.25
1.60
4.0
8.0
2.0
16.0
Q1
13″
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
13″
386
280
370
5
SG Micro Corp
www.sg-micro.com
TX20000.000
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