SGM42600 [SGMICRO]

Dual H-Bridge Motor Driver;
SGM42600
型号: SGM42600
厂家: Shengbang Microelectronics Co, Ltd    Shengbang Microelectronics Co, Ltd
描述:

Dual H-Bridge Motor Driver

文件: 总9页 (文件大小:600K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SGM42600  
Dual H-Bridge Motor Driver  
GENERAL DESCRIPTION  
FEATURES  
The SGM42600 is a motor driver device with two  
integrated H-bridges that can run one bipolar stepper  
motor or two DC brush motors. It can be used in a  
variety of applications such as printers and battery-  
powered toys.  
Power Supply Voltage Range: 2.7V to 24V  
Dual H-Bridge Motor Driver  
Drives Two DC Motors or One Bipolar Stepper Motor  
Low On-Resistance (0.41Ω for HS + LS, @ +25)  
1.5A RMS Output Current per H-Bridge  
2A Peak Current per H-Bridge at VCC = 5V, TA = +25℃  
Active Low Fault Indication Pin (nFAULT)  
Available in Green TSSOP-16 (Exposed Pad) and  
TQFN-4×4-16L Packages  
Each H-bridge consists of four N-MOSFETs to drive  
one motor winding. The SGM42600 can supply up to  
2A peak or 1.5A RMS output current (with proper  
heatsinking at VCC = 5V and TA = +25). At lower VCC  
voltages, the current capability is decreased slightly.  
Internal protection functions are provided for  
over-current protection  
(OCP), power supply  
under-voltage lockout (UVLO), charge pump  
under-voltage lockout (CPUV) and over-temperature  
protection (OTP). Fault conditions are indicated by the  
nFAULT pin.  
APPLICATIONS  
Printers  
Robotics  
Cameras  
Sleep mode allows saving power when the device is  
not driving the motor. The SGM42600 will enter into  
sleep mode when nSLEEP is low.  
Battery-Powered Toys  
Gaming Machines  
Office Automation Machines  
The SGM42600 is available in Green TQFN-4×4-16L  
and TSSOP-16 (Exposed Pad) packages. It operates  
over an ambient temperature range of -40to +125.  
SG Micro Corp  
FEBRUARY 2019 – REV. A  
www.sg-micro.com  
SGM42600  
Dual H-Bridge Motor Driver  
PACKAGE/ORDERING INFORMATION  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE  
DESCRIPTION  
ORDERING  
NUMBER  
PACKAGE  
MARKING  
PACKING  
OPTION  
MODEL  
SGM42600  
XPTS16  
XXXXX  
SGM42600  
XTQE16  
XXXXX  
TSSOP-16  
(Exposed Pad)  
SGM42600XPTS16G/TR  
Tape and Reel, 4000  
Tape and Reel, 3000  
-40to +125℃  
-40to +125℃  
SGM42600  
TQFN-4×4-16L  
SGM42600XTQE16G/TR  
MARKING INFORMATION  
NOTE: XXXXX = Date Code and Vendor Code.  
X X X X X  
Vendor Code  
Date Code - Week  
Date Code - Year  
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If  
you have additional comments or questions, please contact your SGMICRO representative directly.  
ABSOLUTE MAXIMUM RATINGS  
OVERSTRESS CAUTION  
Power Supply Voltage Range, VCC .................... -0.3V to 28V  
Digital Input Pin Voltage Range........................... -0.3V to 6V  
AISEN/BISEN Pin Voltage Range .................... -0.3V to 0.5V  
Peak Motor Drive Output Current ................ Internally limited  
Package Thermal Resistance  
Stresses beyond those listed in Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to  
absolute maximum rating conditions for extended periods  
may affect reliability. Functional operation of the device at any  
conditions beyond those indicated in the Recommended  
Operating Conditions section is not implied.  
TSSOP-16 (Exposed Pad), θJA .................................. 49/W  
TQFN-4×4-16L, θJA.................................................... 52/W  
Junction Temperature .................................................+150℃  
Storage Temperature Range........................-65to +150℃  
Lead Temperature (Soldering, 10s)............................+260℃  
ESD Susceptibility  
ESD SENSITIVITY CAUTION  
This integrated circuit can be damaged if ESD protections are  
not considered carefully. SGMICRO recommends that all  
integrated circuits be handled with appropriate precautions.  
Failureto observe proper handlingand installation procedures  
can cause damage. ESD damage can range from subtle  
performance degradation tocomplete device failure. Precision  
integrated circuits may be more susceptible to damage  
because even small parametric changes could cause the  
device not to meet the published specifications.  
HBM.............................................................................5000V  
MM.................................................................................300V  
CDM ............................................................................1000V  
RECOMMENDED OPERATING CONDITIONS  
Power Supply Voltage Range, VCC ......................2.7V to 24V  
Digital Input Pin Voltage Range........................ -0.3V to 5.5V  
AISEN/BISEN Pin Voltage Range .................... -0.3V to 0.5V  
Continuous DC/RMS Output Current per Bridge ............1.5A  
Operating Temperature Range.....................-40to +125℃  
DISCLAIMER  
SG Micro Corp reserves the right to make any change in  
circuit design, or specifications without prior notice.  
SG Micro Corp  
www.sg-micro.com  
FEBRUARY 2019  
2
SGM42600  
Dual H-Bridge Motor Driver  
PIN CONFIGURATIONS  
(TOP VIEW)  
(TOP VIEW)  
16  
15  
14  
13  
nSLEEP  
AOUT1  
AISEN  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
AIN1  
AIN2  
VINT  
GND  
VCC  
VCP  
BIN2  
BIN1  
AISEN  
AOUT2  
BOUT2  
BISEN  
1
2
3
4
12  
11  
10  
9
VINT  
GND  
VCC  
VCP  
AOUT2  
BOUT2  
BISEN  
GND  
GND  
BOUT1  
nFAULT  
5
6
7
8
TSSOP-16 (Exposed Pad)  
TQFN-4×4-16L  
PIN DESCRIPTION  
NAME  
AOUT1  
AOUT2  
BOUT1  
BOUT2  
AIN1  
I/O  
O
O
O
O
I
FUNCTION  
Bridge A Output 1.  
Bridge A Output 2.  
Bridge B Output 1.  
Bridge B Output 2.  
Bridge A Input 1. Internal pull-down.  
Bridge A Input 2. Internal pull-down.  
Bridge B Input 1. Internal pull-down.  
Bridge B Input 2. Internal pull-down.  
AIN2  
I
BIN1  
I
BIN2  
I
Active-Low Sleep Mode Input. Apply high to enable device, and low to enter in the low-power sleep  
mode.  
Active-Low Fault Flag. Go low when a fault occurs (over-current, power supply under-voltage, charge  
pump under-voltage, over-temperature).  
nSLEEP  
nFAULT  
I
OD  
AISEN  
BISEN  
VCP  
IO  
IO  
IO  
Bridge A ISENSE (GND). Connect through a current sense resistor to GND for bridge A.  
Bridge B ISENSE (GND). Connect through a current sense resistor to GND for bridge B.  
Charge Pump Output. Connect a 0.01μF, 30V (MIN) ceramic capacitor to VCC pin.  
Power Supply Pin. Connect this pin to the motor supply and bypass with a 10μF (MIN) ceramic  
capacitor to GND.  
VCC  
P
GND  
VINT  
G
Ground.  
Internal Supply Bypass. Bypass to GND with a 2.2μF, 6.3V capacitor.  
Exposed  
Pad  
G
GND.  
NOTE: I = input; O = output; IO = input or output; OD = open-drain output; G = ground; P = power for the circuit.  
SG Micro Corp  
www.sg-micro.com  
FEBRUARY 2019  
3
SGM42600  
Dual H-Bridge Motor Driver  
ELECTRICAL CHARACTERISTICS  
(VCC = 5V, Full = -40to +125. Typical values are at TA = +25, unless otherwise noted.)  
PARAMETER  
SYMBOL  
CONDITIONS  
TEMP  
MIN  
TYP  
MAX  
UNITS  
Power Supplies  
VCC Operating Supply Voltage  
VCC Operating Supply Current  
VCC Sleep Mode Supply Current  
VCC Under-Voltage Lockout Voltage  
VCC Under-Voltage Lockout Voltage Hysteresis  
Logic Level Inputs  
VCC  
IVCC  
Full  
2.7  
24  
2.3  
1.6  
2.4  
V
xIN1 = 0V, xIN2 = 0V  
1.7  
0.7  
2.3  
100  
mA  
μA  
V
+25  
+25℃  
+25℃  
+25℃  
IVCCQ  
VUVLO  
VHYS  
mV  
nSLEEP,  
VCC = 2.7V to 24V  
Full  
Full  
Full  
Full  
0.7  
0.7  
Input Low Voltage  
Input High Voltage  
VIL  
V
V
All other pins,  
VCC = 2.7V to 24V  
nSLEEP,  
VCC = 2.7V to 24V  
2.3  
2.1  
VIH  
All other pins,  
VCC = 2.7V to 24V  
Input Hysteresis  
VHYS  
RPD  
IIL  
200  
520  
160  
mV  
kΩ  
μA  
μA  
ns  
+25℃  
+25℃  
+25℃  
Full  
nSLEEP  
Input Pull-Down Resistance  
Input Low Current  
All except nSLEEP  
VIN = 0V  
-1  
1
VIN = 5V, nSLEEP  
VIN = 5V, all except nSLEEP  
VIN = 5V  
Full  
10  
32  
13  
43  
Input High Current  
IIH  
Full  
Input Deglitch Time  
tDEG  
460  
+25℃  
nFAULT Output (Open-Drain Output)  
Output Low Voltage  
VOL  
IOH  
VIN = 2V, IO = -5mA  
0.6  
1
V
+25℃  
+25℃  
Output High-Impedance Leakage Current  
H-Bridge FETs  
μA  
VCC = 5V, IO = 200mA  
VCC = 5V, IO = 200mA  
VCC = 2.7V, IO = 200mA  
VCC = 2.7V, IO = 200mA  
VCC = 5V, IO = -200mA  
VCC = 5V, IO = -200mA  
VCC = 2.7V, IO = -200mA  
VCC = 2.7V, IO = -200mA  
VCC = 24V, VOUT = 0V  
230  
290  
180  
230  
+25℃  
Full  
500  
590  
440  
HS FET On-Resistance  
LS FET On-Resistance  
RDS(ON)  
mΩ  
+25℃  
Full  
+25℃  
Full  
RDS(ON)  
mΩ  
μA  
+25℃  
Full  
490  
2
Off-State Leakage Current  
Motor Driver  
IOFF  
-4  
+25℃  
Current Control PWM Frequency  
fPWM  
tR  
Internal PWM Frequency  
45  
80  
kHz  
ns  
+25℃  
+25℃  
RL = 16Ω to GND,  
10% to 90% VCC  
Rise Time  
Fall Time  
RL = 16Ω to VCC  
,
tF  
50  
ns  
+25℃  
90% to 10% VCC  
Propagation Delay INx to OUTx  
Dead Time (1)  
tPROP  
tDEAD  
1.2  
μs  
+25℃  
+25℃  
550  
ns  
SG Micro Corp  
www.sg-micro.com  
FEBRUARY 2019  
4
SGM42600  
Dual H-Bridge Motor Driver  
ELECTRICAL CHARACTERISTICS (continued)  
(VCC = 5V, Full = -40to +125. Typical values are at TA = +25, unless otherwise noted.)  
PARAMETER  
SYMBOL  
CONDITIONS  
TEMP  
MIN  
TYP  
MAX UNITS  
Protection Circuits  
Over-Current Protection Trip Level  
OCP Deglitch Time  
IOCP  
tDEG  
tOCP  
TTSD  
THYS  
2.5  
3.7  
4.7  
1.4  
170  
20  
A
μs  
ms  
+25℃  
+25℃  
+25℃  
Over-Current Protection Period  
Thermal Shutdown Temperature  
Thermal Shutdown Temperature Hysteresis  
Current Control  
Die Temperature  
xISEN Trip Voltage  
VTRIP  
160  
195  
4
230  
1.3  
mV  
+25℃  
+25℃  
Current Sense Blanking Time  
nSLEEP Mode  
tBLANK  
μs  
nSLEEP inactive high to  
H-bridge on  
Start-Up Time  
tWAKE  
Full  
ms  
NOTE: 1. Internal dead time. External implementation is not necessary.  
REVISION HISTORY  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
Changes from Original (APRIL 2017) to REV.A  
Changed from product preview to production data.............................................................................................................................................All  
SG Micro Corp  
www.sg-micro.com  
FEBRUARY 2019  
5
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
TSSOP-16 (Exposed Pad)  
3.0  
D
D1  
2.3  
E1  
E
E2  
5.94  
1.78  
0.42  
e
b
0.65  
RECOMMENDED LAND PATTERN (Unit: mm)  
L
A
A1  
θ
A2  
H
c
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
MIN  
MAX  
0.043  
0.006  
0.039  
0.012  
0.008  
0.201  
0.122  
0.177  
0.258  
0.094  
A
A1  
A2  
b
1.100  
0.150  
1.000  
0.300  
0.200  
5.100  
3.100  
4.500  
6.550  
2.400  
0.050  
0.800  
0.190  
0.090  
4.900  
2.900  
4.300  
6.250  
2.200  
0.002  
0.031  
0.007  
0.004  
0.193  
0.114  
0.169  
0.246  
0.087  
c
D
D1  
E
E1  
E2  
e
0.650 BSC  
0.25 TYP  
0.026 BSC  
0.01 TYP  
L
0.500  
1°  
0.700  
7°  
0.02  
1°  
0.028  
7°  
H
θ
SG Micro Corp  
www.sg-micro.com  
TX00024.000  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
TQFN-4×4-16L  
D
e
N9  
D1  
L
k
E
E1  
N5  
N16  
N1  
b
BOTTOM VIEW  
TOP VIEW  
2.1  
0.85  
2.1 2.9 4.6  
A
A1  
A2  
SIDE VIEW  
0.3  
0.65  
RECOMMENDED LAND PATTERN (Unit: mm)  
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
0.800  
0.050  
MIN  
0.028  
0.000  
MAX  
0.031  
0.002  
A
A1  
A2  
D
0.700  
0.000  
0.203 REF  
0.008 REF  
3.900  
2.000  
3.900  
2.000  
4.100  
2.200  
4.100  
2.200  
0.154  
0.079  
0.154  
0.079  
0.161  
0.087  
0.161  
0.087  
D1  
E
E1  
k
0.200 MIN  
0.650 TYP  
0.008 MIN  
0.026 TYP  
b
0.250  
0.450  
0.350  
0.650  
0.010  
0.018  
0.014  
0.026  
e
L
SG Micro Corp  
www.sg-micro.com  
TX00084.000  
PACKAGE INFORMATION  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
P2  
P0  
W
Q2  
Q4  
Q2  
Q4  
Q2  
Q4  
Q1  
Q3  
Q1  
Q3  
Q1  
Q3  
B0  
Reel Diameter  
P1  
A0  
K0  
Reel Width (W1)  
DIRECTION OF FEED  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF TAPE AND REEL  
Reel Width  
Reel  
Diameter  
A0  
B0  
K0  
P0  
P1  
P2  
W
Pin1  
Package Type  
W1  
(mm)  
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant  
TSSOP-16  
(Exposed Pad)  
13″  
13″  
12.4  
12.4  
6.90  
4.30  
5.60  
4.30  
1.20  
1.10  
4.0  
4.0  
8.0  
8.0  
2.0  
2.0  
12.0  
12.0  
Q1  
Q2  
TQFN-4×4-16L  
SG Micro Corp  
TX10000.000  
www.sg-micro.com  
PACKAGE INFORMATION  
CARTON BOX DIMENSIONS  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF CARTON BOX  
Length  
(mm)  
Width  
(mm)  
Height  
(mm)  
Reel Type  
Pizza/Carton  
13″  
386  
280  
370  
5
SG Micro Corp  
www.sg-micro.com  
TX20000.000  

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