BD2046AFJ [ROHM]
2ch Small Current Output USB High Side Switch ICs; 2ch的小电流输出USB高端开关IC
| 型号： | BD2046AFJ |
| 厂家： | 
ROHM |
| 描述： | 2ch Small Current Output USB High Side Switch ICs |
| 文件： | 总14页 (文件大小：353K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Power Management Switch IC Series for PCs and Digital Consumer Product
2ch Small Current Output
USB High Side Switch ICs
BD2046AFJ, BD2056AFJ
No.09029JAT05
Description
High side switch for USB is a high side switch having over current protection used in power supply line of universal serial bus
(USB). Its switch unit has two channels of N-channel power MOSFET. And, over current detection circuit, thermal shutdown
circuit, under voltage lockout and soft start circuit are built in.
Features
1) Dual N-MOS high side switch
2) Continuous current load 0.25A
3) Control input logic
Active-Low : BD2046AFJ
Active-High : BD2056AFJ
4) Soft start circuit
5) Over current detection
6) Thermal shutdown
7) Under voltage lockout
8) Open drain error flag output
9) Reverse-current protection when switch off
10) Flag output delay filter built in
Applications
USB hub in consumer appliances, Car accessory, PC, PC peripheral equipment, and so forth
Lineup
Parameter
BD2046AFJ
0.25
BD2056AFJ
0.25
Continuous current load (A)
Over current detection (A)
Control input logic
0.5
0.5
Low
High
Absolute Maximum Ratings
Parameter
Symbol
VIN
Limits
-0.3 to 6.0
-0.3 to 6.0
-0.3 to 6.0
10
Unit
V
Supply voltage
Enable voltage
/OC voltage
VEN, V/EN
V/OC
V
V
/OC current
IS/OC
VOUT
TSTG
mA
V
OUT voltage
-0.3 to 6.0
-55 to 150
560*1
Storage temperature
Power dissipation
°C
mW
Pd
*1
*
In the case of exceeding Ta = 25°C, 4.48mW should be reduced per 1°C.
This chip is not designed to protect itself against radioactive rays.
Operating conditions
Parameter
Symbol
VIN
Limits
Unit
V
Operating voltage
2.7 to 5.5
-40 to 85
Operating temperature
Continuous output current
TOPR
ILO
°C
0
to 250
mA
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Technical Note
BD2046AFJ, BD2056AFJ
Electrical characteristics
○BD2046AFJ (Unless otherwise specified, VIN = 5.0V, Ta = 25°C)
Limits
Parameter
Symbol
Unit
Condition
Min.
Typ.
110
0.01
-
Max.
140
1
Operating Current
Standby Current
IDD
-
μA
μA
V
V/EN = 0V, OUT = OPEN
V/EN = 5V, OUT = OPEN
High input
ISTB
-
2.0
-
/EN input voltage
V/EN
-
-
0.8
0.4
1.0
0.5
1
V
Low input
-
-
V
Low input 2.7V≤ VIN ≤4.5V
V/EN = 0V or V/EN = 5V
I/OC = 5mA
/EN input current
I/EN
V/OC
IL/OC
RON
-1.0
0.01
-
μA
V
/OC output LOW voltage
/OC output leak current
ON resistance
-
-
-
0.01
100
μA
mΩ
V/OC = 5V
130
IOUT = 250mA
VIN = 5V, VOUT = 0V,
CL = 100μF (RMS)
Output current at short
ISC
0.3
0.5
0.7
A
Output rise time
Output turn on time
Output fall time
TON1
TON2
-
-
1.8
2.1
1
10
20
ms
ms
μs
μs
V
RL = 20Ω , CL = OPEN
TOFF1
TOFF2
VTUVH
VTUVL
-
20
Output turn off time
-
3
40
2.1
2.0
2.3
2.2
2.5
2.4
Increasing VIN
Decreasing VIN
UVLO threshold
V
○BD2056AFJ (Unless otherwise specified, VIN = 5.0V, Ta = 25°C)
Limits
Parameter
Symbol
Unit
Condition
Min.
Typ.
110
0.01
-
Max.
140
1
Operating Current
Standby Current
IDD
-
μA
μA
V
VEN = 5V , OUT = OPEN
VEN = 0V , OUT = OPEN
High input
ISTB
-
2.0
-
/EN input voltage
VEN
-
-
0.8
0.4
1.0
0.5
1
V
Low input
-
-
V
Low input 2.7V≤ VIN ≤4.5V
VEN = 0V or VEN = 5V
I/OC = 5mA
/EN input current
IEN
-1.0
0.01
-
μA
V
/OC output LOW voltage
/OC output leak current
ON resistance
V/OC
IL/OC
RON
-
-
-
0.01
100
μA
mΩ
V/OC = 5V
130
IOUT = 250mA
VIN = 5V , VOUT = 0V,
CL = 100μF (RMS)
Output current at short
ISC
0.3
0.5
0.7
A
Output rise time
Output turn on time
Output fall time
TON1
TON2
-
-
1.8
2.1
1
10
20
ms
ms
μs
μs
V
RL = 20Ω , CL = OPEN
TOFF1
TOFF2
VTUVH
VTUVL
-
20
Output turn off time
-
3
40
2.1
2.0
2.3
2.2
2.5
2.4
Increasing VIN
Decreasing VIN
UVLO threshold
V
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.05 - Rev.A
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Technical Note
BD2046AFJ, BD2056AFJ
Measurement circuit
VDD
1µF
VDD
1µF
GND
A
/OC1
OUT1
OUT2
/OC2
GND
/OC1
OUT1
OUT2
/OC2
IN
IN
L
R
L
C
VEN
VEN
EN1
EN2
EN
EN
V
EN1
EN2
RL CL
V
Operating current
10k
EN, /EN input voltage, Output rise, fall time
VDD
OUT
VDD
VDD
I
OUT
I
10k
1µF
1µF
GND
GND
IN
/OC1
OUT1
OUT2
/OC2
/OC1
OUT1
OUT2
/OC2
IN
OUT
I
EN
EN
EN
EN
V
EN1
EN2
V
EN1
EN2
OUT
I
V
V
ON resistance, Over current detection
OC output LOW voltage
Fig.1 Measurement circuit
Timing diagram
○BD2046AFJ
○BD2056AFJ
OFF1
T
OFF1
T
ON1
T
ON1
T
90%
90%
90%
90%
OUT
V
OUT
V
10%
10%
10%
10%
ON2
T
ON2
T
OFF2
T
OFF2
T
EN
CTRL
V
50%
50%
V
50%
50%
Fig.2 Timing diagram
Fig.3 Timing diagram
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2009.05 - Rev.A
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Technical Note
BD2046AFJ, BD2056AFJ
Reference data
140
140
120
100
80
1.0
0.8
0.6
0.4
0.2
0.0
Ta=25°C
120
VIN=5.0V
Ta=25°C
100
80
60
40
20
0
60
40
20
0
2
3
4
5
6
-50
0
50
100
2
3
4
5
6
SUPPLY VOLTAGE : VIN[V]
Fig.6 Operating current
EN,/EN Disable
AMBIENT TEMPERATURE : Ta[
]
℃
SUPPLY VOLTAGE : VIN[V]
Fig.4 Operating current
EN,/EN Enable
Fig.5 Operating current
EN,/EN Enable
1.0
0.8
0.6
0.4
0.2
0.0
2.0
1.5
1.0
0.5
0.0
2.0
1.5
1.0
0.5
0.0
VIN=5.0V
VIN=5.0V
Ta=25°C
Low to High
High to Low
Low to High
High to Low
-50
0
50
100
-50
0
50
100
]
2
3
4
5
6
SUPPLY VOLTAGE : VIN[V]
AMBIENT TEMPERATURE : Ta[ ]
℃
AMBIENT TEMPERATURE : Ta[
℃
Fig.9 EN,/EN input voltage
Fig.8 EN,/EN input voltage
Fig.7 Operating current
EN,/EN Disable
0.5
0.4
0.3
0.2
0.1
0.0
0.5
0.4
0.3
0.2
0.1
0.0
200
150
100
50
Ta=25°C
Ta=25°C
VIN=5.0V
0
-50
0
50
100
2
3
4
5
6
2
3
4
5
6
SUPPLY VOLTAGE : VDD[V]
AMBIENT TEMPERATURE : Ta[
]
℃
SUPPLY VOLTAGE : VDD[V]
Fig.10 /OC output LOW voltage
Fig.11 /OC output LOW voltage
Fig. ON resistance
200
2.0
2.0
1.5
1.0
0.5
0.0
VIN=5.0V
VIN=5.0V
Ta=25°C
150
100
50
1.5
1.0
0.5
0.0
0
-50
0
50
AMBIENT TEMPERATURE : Ta[ ]
℃
100
-50
0
50
100
2
3
4
5
6
AMBIENT TEMPERATURE : Ta[
]
SUPPLY VOLTAGE : VIN[V]
℃
Fig.14 Output current at shortcircuit
Fig.15 Output current at short circuit
Fig.13 ON resistance
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2009.05 - Rev.A
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Technical Note
BD2046AFJ, BD2056AFJ
5.0
5.0
4.0
3.0
2.0
1.0
0.0
5.0
4.0
3.0
2.0
1.0
0.0
Ta=25°C
Ta=25°C
4.0
VIN=5.0V
3.0
2.0
1.0
0.0
2
3
4
5
6
-50
0
50
100
2
3
4
5
6
SUPPLY VOLTAGE : VIN[V]
SUPPLY VOLTAGE : VIN[V]
AMBIENT TEMPERATURE : Ta[
]
℃
Fig.16 Output rise time
Fig.17 Output rise time
Fig.18 Output turn on time
5.0
4.0
3.0
2.0
1.0
0.0
5.0
4.0
3.0
2.0
1.0
0.0
5.0
Ta=25°C
VIN=5.0V
VIN=5.0V
4.0
3.0
2.0
1.0
0.0
-50
0
50
100
2
3
4
5
6
-50
0
50
100
AMBIENT TEMPERATURE : Ta[
]
SUPPLY VOLTAGE : VIN[V]
℃
AMBIENT TEMPERATURE : Ta[
]
℃
Fig.19 Output turn on time
Fig.20 Output fall time
Fig.21 Output fall time
5.0
4.0
3.0
2.0
1.0
0.0
2.5
2.4
2.3
2.2
2.1
2.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
VIN=5.0V
Ta=25°C
VUVLOH
VUVLOL
-50
0
50
100
-50
0
50
100
2
3
4
5
6
AMBIENT TEMPERATURE : Ta[
]
AMBIENT TEMPERATURE : Ta[
]
℃
℃
SUPPLY VOLTAGE : VIN[V]
Fig.24 UVLO threshold voltage
Fig.23 Output turn off time
Fig.22 Output turn off time
1.0
0.8
0.6
0.4
0.2
0.0
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.25 UVLO hysteresis voltage
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Technical Note
BD2046AFJ, BD2056AFJ
Waveform data
V/EN
(1V/div.)
V/EN
(5V/div.)
V/EN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
V/OC
(1V/div.)
VIN=5V
VOUT
(5V/div.)
VOUT
(5V/div.)
RL=20Ω
VIN=5V
CL=200µF
CL=147µF
RL=10Ω
VIN=5V
CL=100uF
RL=10Ω
CL=100uF
CL=100µ
CL=47µF
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
IOUT
(0.1A/div.)
TIME(1ms/div.)
TIME(1ms/div.)
TIME(500us/div.)
Fig.27 Output fall characteristic
(BD2056AFJ)
Fig.26 Output rise characteristic
(BD2056AFJ)
Fig.28 Inrush current response
(BD2056AFJ)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VIN=5V
VIN=5V
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
TIME(20ms/div.)
TIME(2ms/div.)
Fig.29 Over current response
Ramped load
Fig.30 Over current response
Ramped load
(BD2056AFJ)
(BD2056AFJ)
V/OC
(5V/div.)
V/EN
(5V/div.)
VIN=2.5V
CL=100uF
V/OC
(1V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VOUT
(1V/div.)
VIN=5V
CL=100uF
VIN=5V
CL=100uF
Thermal Shutdown
TIME (500ms/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
TIME (1ms/div.)
TIME (2ms/div.)
Fig.32 Over current response
Enable to short circuit
(BD2056AFJ)
Fig.33 Over current response
Enable to short circuit
(BD2056AFJ)
Fig.31 Over current response
Enable to short circuit
(BD2056AFJ)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
RL=20Ω
RL=20Ω
CL=100uF
CL=100uF
TIME (1s/div.)
TIME (1s/div.)
Fig.34 UVLO response
Increasing VIN
Fig.35 UVLO response
Decreasing VIN
(BD2056AFJ)
(BD2056AFJ)
Regarding the output rise/fall and over current detection characteristics of BD2046AFJ, refer to the characteristic of BD2056AFJ.
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Technical Note
BD2046AFJ, BD2056AFJ
Block diagram
/EN1
EN1
TSD1
Delay
/OC1
Gate
Logic1
Charge
Pump1
OCD1
IN
OUT1
OUT2
GND 1
IN 2
8 /OC1
7 OUT1
6 OUT2
5 /OC2
UVLO
/EN2
EN2
Top View
Charge
Pump2
OCD2
/EN1
3
(EN1)
Gate
/OC2
/EN2
(EN2)
4
Logic2
GND
Delay
TSD2
Fig.36 Block diagram
Fig.37 Pin Configuration
Pin description
○BD2046AFJ
Pin No.
Symbol
I / O
I
Pin function
1
GND
IN
Ground.
Power supply input.
2
I
I
Input terminal to the switch and power supply input terminal of the internal circuit.
Enable input.
Switch on at Low level.
3, 4
/EN
High level input > 2.0V, Low level input < 0.8V.
Error flag output. Low at over current, thermal shutdown.
Open drain output.
5, 8
6, 7
/OC
O
O
OUT
Switch output.
○BD2056AFJ
Pin No.
Symbol
GND
I / O
I
Pin function
1
Ground.
Power supply input.
2
IN
I
Input terminal to the switch and power supply input terminal of the internal circuit.
Enable input. Switch on at High level.
High level input > 2.0V, Low level input < 0.8V
3, 4
5, 8
6, 7
EN
I
Error flag output. Low at over current, thermal shutdown.
Open drain output.
/OC
OUT
O
O
Switch output.
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Technical Note
BD2046AFJ, BD2056AFJ
I/O circuit
Symbol
Pin No
3, 4
Equivalent circuit
/EN1(EN1)
/EN2(EN2)
EN1(/EN1)
EN2(/EN2)
/OC1
/OC2
/OC1
/OC2
5, 8
OUT1
OUT2
OUT1
OUT2
6, 7
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Technical Note
BD2046AFJ, BD2056AFJ
Functional description
1. Switch operation
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. And the IN
terminal is used also as power source input to internal control circuit.
When the switch is turned on from EN/EN control input, IN terminal and OUT terminal are connected by a 100mΩ switch.
In on status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of IN terminal,
current flows from OUT terminal to IN terminal.
Since a parasitic diode between the drain and the source of switch MOSFET is canceled, in the off status, it is possible to
prevent current from flowing reversely from OUT to IN.
2. Thermal shutdown circuit (TSD)
Thermal shut down circuit have dual thermal shutdown threshold. Since thermal shutdown works at a lower junction
temperature when an overcurrent occurs, only the switch of an overcurrent state become off and error flag is output.
Thermal shut down action has hysteresis. Therefore, when the junction temperature goes down, switch on and error flag
output automatically recover. However, until cause of junction temperature increase such as output shortcircuit is removed
or the switch is turned off, thermal shut down detection and recovery are repeated. The thermal shut down circuit works
when the switch of either OUT1 or OUT2 is on (EN,/EN signal is active).
3. Over current detection (OCD)
The over current detection circuit limits current (ISC) and outputs error flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. There are three types of response against over current. The over current detection
circuit works when the switch is on (EN,/EN signal is active).
3-1. When the switch is turned on while the output is in shortcircuit status
When the switch is turned on while the output is in shortcircuit status or so, the switch gets in current limit status soon.
3-2. When the output shortcircuits while the switch is on
When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the
over current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out.
3-3. When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the over
current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under voltage lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.) while
the switch turns on, then UVLO shuts off the switch. UVLO has hysteresis of a 100mV(Typ).
Under voltage lockout circuit works when the switch of either OUT1 or OUT2 is on (EN,/EN signal is active).
5. Error flag (/OC) output
Error flag output is N-MOS open drain output. At detection of over current, thermal shutdown, low level is output.
Over current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at
switch on, hot plug from being informed to outside.
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Technical Note
BD2046AFJ, BD2056AFJ
/EN
V
Output shortcircuit
Thermal shut down
OUT
V
OUT
I
/OC
V
delay
Fig.38 Over current detection, thermal shutdown timing
(BD2046AFJ)
EN
V
Output shortcircuit
Thermal shut down
OUT
V
OUT
I
/OC
V
delay
Fig.39 Over current detection, thermal shutdown timing
(BD2056AFJ)
Typical application circuit
5V(Typ)
10k~100k
10k~100k
Ferrite
Beads
VBUS
IN
OUT
ON/OFF
OC
GND
IN
/OC1
OUT1
OUT2
/OC2
L
L
D+
D-
C
IN
C
/EN1
(EN1)
/EN2
(EN2)
OC
Regulator
GND
Data
Data
ON/OFF
C
Data
BD2046AFJ/56AFJ
USB Controller
Fig.40 Typical application circuit
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2009.05 - Rev.A
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Technical Note
BD2046AFJ, BD2056AFJ
Application information
When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC, and
may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor by IN terminal and GND
terminal of IC. 1uF or higher is recommended.
Pull up /OC output by resistance 10kΩ ~ 100kΩ.
Set up value which satisfies the application as CL and Ferrite Beads.
This system connection diagram doesn’t guarantee operating as the application.
The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account
external parts or dispersion of IC including not only static characteristics but also transient characteristics.
This system connection diagram doesn’t guarantee operating as the application.
The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account
external parts or dispersion of IC including not only static characteristics but also transient characteristics.
Power dissipation character
(SOP-J8)
600
500
400
300
200
100
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE: Ta [
]
℃
Fig.41 Power dissipation curve (Pd-Ta Curve)
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Technical Note
BD2046AFJ, BD2056AFJ
Notes for use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due
to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the
same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used
present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig.
After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition,
for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the
transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a
voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to
the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a
switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible,
is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit
operating or use the LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use.
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2009.05 - Rev.A
12/13
© 2009 ROHM Co., Ltd. All rights reserved.
Technical Note
BD2046AFJ, BD2056AFJ
Ordering part number
B D
2
0
4
6
A
F
J
-
E
2
Part No.
Part No.
2046A
2056A
Package
FJ: SOP-J8
Packaging and forming specification
E2: Embossed tape and reel
(SOP-J8)
SOP-J8
<Tape and Reel information>
4.9 0.2
(MAX 5.25 include BURR)
Tape
Embossed carrier tape
2500pcs
+
6°
4°
−4°
Quantity
8
7
6
5
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
4
0.545
0.2 0.1
S
1.27
0.42 0.1
Direction of feed
1pin
0.1
S
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.05 - Rev.A
13/13
Notice
N o t e s
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
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may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
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such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
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More detail product informations and catalogs are available, please contact us.
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http://www.rohm.com/contact/
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© 2009 ROHM Co., Ltd. All rights reserved.
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