首页 |元器件品牌

BD2046AFJ-E2 [ROHM]

0.5A Current Limit High Side Switch ICs;
BD2046AFJ-E2
型号： BD2046AFJ-E2
厂家： ROHM    ROHM
描述：

0.5A Current Limit High Side Switch ICs
文件： 总27页 (文件大小：1011K)
中文：  中文翻译
下载：  下载PDF数据表文档文件
 查看货源
Datasheet  
2ch High Side Switch ICs  
0.5A Current Limit High Side Switch ICs  
BD2046AFJ BD2056AFJ  
General Description  
Key Specifications  
Input Voltage Range:  
ON-Resistance:  
BD2046AFJ and BD2056AFJ are dual channel high  
side switch ICs with an over current protection for  
Universal Serial Bus (USB) power supply line. The IC’s  
switch unit has two channels of N-Channel power  
MOSFET. Over current detection circuit, thermal  
shutdown circuit, under voltage lockout and soft start  
circuit are built in.  
2.7V to 5.5V  
100mΩ(Typ)  
0.25A  
0.3A (Min), 0.9A (Max)  
0.01μA (Typ)  
Continuous Current Load:  
Over-Current Threshold:  
Standby Current:  
Output Rise Time:  
Operating Temperature Range:  
1.8ms (Typ)  
-40°C to +85°C  
Features  
Package  
W(Typ) D(Typ) H(Max)  
Dual N-MOS High Side Switch  
Control Input Logic  
Active-Low:  
Active-High:  
BD2046AFJ  
BD2056AFJ  
Soft Start Circuit  
Over Current Detection  
Thermal Shutdown  
Under Voltage Lockout  
Open Drain Error Flag Output  
Reverse-Current Protection when Switch Off  
Flag Output Delay  
SOP-J8  
4.90mm x 6.00mm x 1.65mm  
Applications  
USB Hub in Consumer Appliances, Note PC, PC  
Peripheral Equipment, and so forth  
Typical Application Circuit  
5V(Typ)  
GND  
IN  
/OC1  
OUT1  
OUT2  
/OC2  
L
C
CIN  
/EN1  
(EN1)  
/EN2  
(EN2)  
Data  
CL  
Data  
Lineup  
Over-Current Threshold  
Control Input  
Logic  
Package  
Reel of 2500 BD2046AFJ-E2  
Reel of 2500 BD2056AFJ-E2  
Orderable Part Number  
Min  
Typ  
Max  
0.3A  
0.5A  
0.9A  
Low  
SOP-J8  
SOP-J8  
0.3A  
0.5A  
0.9A  
High  
○Product structure：Silicon monolithic integrated circuit ○This product has not designed protection against radioactive rays  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
1/23  
TSZ22111･14･001  
Datasheet  
BD2046AFJ BD2056AFJ  
Block Diagram  
/EN1  
EN1  
TSD1  
Delay  
/OC1  
Gate  
Logic1  
Charge  
Pump1  
OCD1  
IN  
OUT1  
OUT2  
UVLO  
/EN2  
EN2  
Charge  
Pump2  
OCD2  
Gate  
/OC2  
Logic2  
Delay  
TSD2  
GND  
Pin Configurations  
BD2046AFJ  
TOP VIEW  
BD2056AFJ  
TOP VIEW  
GND  
GND  
/OC1  
/OC1  
OUT1  
OUT1  
IN  
IN  
/EN1  
EN1  
EN2  
OUT2  
/OC2  
OUT2  
/OC2  
/EN2  
Pin Description  
Pin No.  
1
Symbol  
I / O  
I
Pin Function  
GND  
IN  
Ground.  
Power supply input.  
2
I
Input terminal to the switch and power supply input terminal of the internal circuit.  
Enable input.  
/EN: Switch on at low level. (BD2046AFJ)  
EN: Switch on at high level. (BD2056AFJ)  
High level input > 2.0V, low level input < 0.8V.  
3, 4  
EN, /EN  
I
Error flag output. low at over current, thermal shutdown.  
Open drain output.  
5, 8  
6, 7  
/OC  
O
O
OUT  
Switch output.  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
© 2013 ROHM Co., Ltd. All rights reserved.  
2/23  
TSZ22111･15･001  
21.Aug.2014 Rev.002  
Datasheet  
BD2046AFJ BD2056AFJ  
Absolute Maximum Ratings(Ta=25°C)  
Parameter  
Supply Voltage  
Symbol  
Rating  
-0.3 to +6.0  
-0.3 to +6.0  
-0.3 to +6.0  
10  
Unit  
V
VIN  
VEN, V/EN  
V/OC  
Enable Voltage  
/OC Voltage  
V
V
/OC Current  
I/OC  
mA  
V
OUT Voltage  
VOUT  
Tstg  
-0.3 to +6.0  
-55 to +150  
0.67(Note 1)  
Storage Temperature  
Power Dissipation  
°C  
W
Pd  
(Note 1) Mounted on 70mm x 70mm x 1.6mm glass-epoxy PCB. Derating : 5.4mW/ oC above Ta=25 oC  
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit  
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated  
over the absolute maximum ratings.  
Recommended Operating Conditions  
Rating  
Parameter  
Symbol  
Unit  
Min  
2.7  
-40  
0
Typ  
Max  
5.5  
Operating Voltage  
VIN  
Topr  
ILO  
-
-
-
V
Operating Temperature  
Continuous Output Current  
+85  
250  
°C  
mA  
Electrical Characteristics  
BD2046AFJ (Unless otherwise specified, VIN = 5.0V, Ta = 25°C)  
Limit  
Parameter  
Symbol  
IDD  
Unit  
Conditions  
Min  
-
Typ  
110  
Max  
140  
Operating Current  
Standby Current  
μA  
μA  
V/EN = 0V, OUT = OPEN  
V/EN = 5V, OUT = OPEN  
ISTB  
-
0.01  
1
V/ENH  
2.0  
-
-
-
-
V
V
V
High Input  
-
-
0.8  
0.4  
Low Input  
/EN Input Voltage  
V/ENL  
Low Input 2.7V≤ VIN ≤4.5V  
/EN Input Current  
I/EN  
V/OC  
IL/OC  
t/OC  
-1.0  
+0.01  
-
+1.0  
0.5  
1
μA  
V
V/EN = 0V or V/EN = 5V  
I/OC = 5mA  
/OC Output Low Voltage  
/OC Output Leak Current  
/OC Delay Time  
-
-
0.01  
2.5  
100  
0.5  
0.5  
1.8  
2.1  
1
μA  
ms  
mΩ  
A
V/OC = 5V  
-
8
ON-Resistance  
RON  
ITH  
-
130  
0.9  
0.7  
10  
20  
20  
40  
IOUT = 250mA  
Over-Current Threshold  
Short Circuit Output Current  
Output Rise Time  
0.3  
VIN = 5V, VOUT = 0V,  
CL = 100μF (RMS)  
ISC  
0.3  
A
tON1  
tON2  
tOFF1  
tOFF2  
-
-
-
-
ms  
ms  
μs  
μs  
Output Turn ON Time  
Output Fall Time  
RL = 20Ω , CL = OPEN  
Output Turn OFF Time  
3
VTUVH  
VTUVL  
2.1  
2.0  
2.3  
2.2  
2.5  
2.4  
V
V
Increasing VIN  
Decreasing VIN  
UVLO Threshold  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
3/23  
TSZ22111･15･001  
Datasheet  
BD2046AFJ BD2056AFJ  
Electrical Characteristics - continued  
BD2056AFJ (Unless otherwise specified, VIN = 5.0V, Ta = 25°C)  
Limit  
Parameter  
Symbol  
IDD  
Unit  
Conditions  
Min  
-
Typ  
110  
Max  
140  
Operating Current  
Standby Current  
μA  
μA  
VEN = 5V , OUT = OPEN  
VEN = 0V , OUT = OPEN  
ISTB  
-
0.01  
1
VENH  
2.0  
-
-
-
-
V
V
V
High Input  
Low Input  
/EN Input Voltage  
-
-
0.8  
0.4  
VENL  
Low Input 2.7V≤ VIN ≤4.5V  
VEN = 0V or VEN = 5V  
/EN Input Current  
IEN  
-1.0  
+0.01  
-
+1.0  
0.5  
1
μA  
V
/OC Output Low Voltage  
/OC Output Leak Current  
/OC Delay Time  
V/OC  
IL/OC  
-
-
I/OC = 5mA  
V/OC = 5V  
0.01  
μA  
t/OC  
RON  
ITH  
-
2.5  
100  
0.5  
0.5  
1.8  
2.1  
1
8
ms  
mΩ  
A
ON-Resistance  
-
130  
0.9  
0.7  
10  
IOUT = 250mA  
Over-Current Threshold  
Short Circuit Output Current  
Output Rise Time  
0.3  
VIN = 5V , VOUT = 0V,  
CL = 100μF (RMS)  
ISC  
0.3  
A
tON1  
tON2  
tOFF1  
tOFF2  
-
-
-
-
ms  
ms  
μs  
μs  
Output Turn ON Time  
Output Fall Time  
20  
RL = 20Ω , CL = OPEN  
20  
Output Turn OFF Time  
3
40  
VTUVH  
VTUVL  
2.1  
2.0  
2.3  
2.2  
2.5  
2.4  
V
V
Increasing VIN  
Decreasing VIN  
UVLO Threshold  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
4/23  
TSZ22111･15･001  
Datasheet  
BD2046AFJ BD2056AFJ  
Measurement Circuit  
VDD  
V
DD  
1µF  
GND  
1µF  
GND  
A
/OC1  
OUT1  
OUT2  
/OC2  
/OC1  
OUT1  
OUT2  
/OC2  
IN  
IN  
RL  
CL  
V
EN  
EN  
EN1  
EN2  
V
EN  
EN  
EN1  
EN2  
RL  
CL  
V
V
A. Operating Current  
B. EN, /EN Input Voltage, Output Rise / Fall Time  
V
DD  
VDD  
VDD  
I
OUT  
10k  
10k  
IOUT  
1µF  
GND  
IN  
1µF  
GND  
/OC1  
OUT1  
OUT2  
/OC2  
/OC1  
OUT1  
OUT2  
/OC2  
IN  
I
OUT  
V
EN  
EN  
EN1  
EN2  
V
EN  
EN  
EN1  
EN2  
I
OUT  
V
V
C.ON-Resistance, Over Current Detection  
D. /OC Output Low Voltage  
Figure 1. Measurement Circuit  
Timing Diagram  
tOFF1  
tOFF1  
tON1  
tON1  
90%  
90%  
90%  
90%  
VOUT  
VOUT  
10%  
10%  
10%  
10%  
tON2  
tON2  
tOFF2  
tOFF2  
V/EN  
V/ENL  
V/ENH  
VEN  
VENH  
VENL  
Figure 2. Timing Diagram (BD2046AFJ)  
Figure 3. Timing Diagram (BD2056AFJ)  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
5/23  
TSZ22111･15･001  
Datasheet  
BD2046AFJ BD2056AFJ  
Typical Performance Curves  
140  
Ta=25°C  
120  
140  
120  
100  
80  
VIN=5.0V  
100  
80  
60  
40  
20  
0
60  
40  
20  
0
2
3
4
5
6
-50  
0
50  
100  
Supply Voltage: VIN[V]  
Ambient Temperature: Ta[°C]  
Figure 4. Operating Current vs Supply Voltage  
(EN, /EN Enable)  
Figure 5. Operating Current vs Ambient Temperature  
(EN, /EN Enable)  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
1.0  
VIN=5.0V  
Ta=25°C  
0.8  
0.6  
0.4  
0.2  
0.0  
2
3
4
5
6
-50  
0
50  
100  
Ambient Temperature: Ta[°C]  
Supply Voltage: VIN[V]  
Figure 6. Standby Current vs Supply Voltage  
(EN, /EN Disable)  
Figure 7. Standby Current vs Ambient Temperature  
(EN, /EN Disable)  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
6/23  
TSZ22111･15･001  
Datasheet  
BD2046AFJ BD2056AFJ  
Typical Performance Curves - continued  
2.0  
2.0  
1.5  
1.0  
0.5  
0.0  
VIN=5.0V  
Ta=25°C  
1.5  
Low to High  
High to Low  
Low to High  
High to Low  
1.0  
0.5  
0.0  
-50  
0
50  
100  
2
3
4
5
6
Ambient Temperature: Ta[°C]  
Supply Voltage: VIN[V]  
Figure 8. EN, /EN Input Voltage vs  
Supply Voltage  
Figure 9. EN, /EN Input Voltage vs  
Ambient Temperature  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
0.5  
Ta=25°C  
VIN=5.0V  
0.4  
0.3  
0.2  
0.1  
0.0  
-50  
0
50  
100  
2
3
4
5
6
Supply Voltage: VIN[V]  
Ambient Temperature: Ta[°C]  
Figure 10. /OC Output Low Voltage vs  
Supply Voltage  
Figure 11. /OC Output Low Voltage vs  
Ambient Temperature  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
7/23  
TSZ22111･15･001  
Datasheet  
BD2046AFJ BD2056AFJ  
Typical Performance Curves - continued  
200  
200  
150  
100  
50  
Ta=25°C  
150  
VIN=5.0V  
100  
50  
0
0
2
3
4
5
6
-50  
0
50  
re Ta  
Figure 13. ON-Resistance vs Ambient Temperature  
100  
Supply Voltage: V [V]  
IN
Ambient Temperatu : [°C]  
Figure 12. ON-Resistance vs Supply Voltage  
2.0  
1.5  
1.0  
0.5  
0.0  
2.0  
Ta=25°C  
VIN=5.0V  
1.5  
1.0  
0.5  
0.0  
2
3
4
5
6
-50  
0
50  
100  
Supply Voltage: VIN[V]  
Ambient Temperature: Ta[°C]  
Figure 14. Over-Current Threshold vs  
Supply Voltage  
Figure 15. Over-Current Threshold vs  
Ambient Temperature  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
8/23  
TSZ22111･15･001  
Datasheet  
BD2046AFJ BD2056AFJ  
Typical Performance Curves - continued  
2.0  
2.0  
1.5  
1.0  
0.5  
0.0  
Ta=25°C  
1.5  
VIN=5.0V  
1.0  
0.5  
0.0  
-50  
0
50  
100  
2
3
4
5
6
Supply Voltage: VIN[V]  
Ambient Temperature: Ta[°C]  
Figure 16. Short Circuit Output Current vs  
Supply Voltage  
Figure 17. Short Circuit Output Current vs  
Ambient Temperature  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
VIN=5.0V  
Ta=25°C  
2
3
4
5
6
-50  
0
50  
Ambient Temperature: Ta[°C]  
100  
Supply Voltage: V [V]
IN  
Figure 18. Output Rise Time vs  
Supply Voltage  
Figure 19. Output Rise Time vs  
Ambient Temperature  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
9/23  
TSZ22111･15･001  
Datasheet  
BD2046AFJ BD2056AFJ  
Typical Performance Curves - continued  
5.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
Ta=25°C  
4.0  
VIN=5.0V  
3.0  
2.0  
1.0  
0.0  
-50  
0
50  
100  
2
3
4
5
6
Ambient Temperature: Ta[°C]  
S
u
p
p
ly  
V
ol  
ta  
g
e
: VIN
[
V]  
Figure 20. Output Turn ON Time vs  
Supply Voltage  
Figure 21. Output Turn ON Time vs  
Ambient Temperature  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
5.0  
VIN=5.0V  
Ta=25°C  
4.0  
3.0  
2.0  
1.0  
0.0  
-50  
0
50  
e:  
100  
2
3
4
5
6
A
m
bi  
en  
t
Te  
m
p
e
ra  
tu  
r
T
a[  
°C
]
Supply Voltage: VIN[V]  
Figure 22. Output Fall Time vs  
Supply Voltage  
Figure 23. Output Fall Time vs  
Ambient Temperature  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
10/23  
TSZ22111･15･001  
Datasheet  
BD2046AFJ BD2056AFJ  
Typical Performance Curves - continued  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
6.0  
Ta=25°C  
5.0  
VIN=5.0V  
4.0  
3.0  
2.0  
1.0  
0.0  
-50  
0
50  
100  
2
3
4
5
6
Ambient Temperature: Ta[°C]  
Supply Voltage: VIN[V]  
Figure 24. Output Turn OFF Time vs  
Supply Voltage  
Figure 25. Output Turn OFF Time vs  
Ambient Temperature  
2.0  
1.5  
1.0  
0.5  
0.0  
2.0  
Ta=25°C  
1.5  
1.0  
0.5  
0.0  
VIN=5.0V  
2
3
4
5
6
-50  
0
50  
100  
Supply Voltage: VIN[V]  
Figure 26. /OC Delay Time vs Supply Voltage  
Ambient Temperature: Ta[°C]  
Figure 27. /OC Delay Time vs  
Ambient Temperature  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
11/23  
TSZ22111･15･001  
Datasheet  
BD2046AFJ BD2056AFJ  
Typical Performance Curves - continued  
2.5  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
2.4  
VTUVH  
2.3  
VTUVL  
2.2  
2.1  
2.0  
-50  
0
50  
Ambient Temperature: Ta[°C]  
100  
-50  
0
50  
100  
Ambient Temperature: Ta[°C]  
Figure 28. UVLO Threshold Voltage vs  
Ambient Temperature  
Figure 29. UVLO Hysteresis Voltage vs  
Ambient Temperature  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
12/23  
TSZ22111･15･001  
Datasheet  
BD2046AFJ BD2056AFJ  
Typical Wave Forms  
VEN  
(5V/div.)  
VEN  
(5V/div.)  
V/OC  
(5V/div.)  
VOUT  
(5V/div.)  
VOUT  
(5V/div.)  
VIN=5V  
RL=10Ω  
CL=100μF  
VIN=5V  
RL=10Ω  
CL=100μF  
IOUT  
(0.5A/div.)  
IOUT  
(0.5A/div.)  
TIME(1ms/div.)  
TIME(1ms/div.)  
Figure 31. Output Fall Characteristic  
(BD2056AFJ)  
Figure 30. Output Rise Characteristic  
(BD2056AFJ)  
V/OC  
VEN  
(5V/div.)  
(5V/div.)  
V/OC  
VOUT  
(5V/div.)  
(5V/div.)  
VIN=5V  
RL=20Ω  
CL=200µF  
CL=147µF  
VIN=5V  
IOUT  
(0.2A/div.)  
IOUT  
(0.5A/div.)  
CL=100µF  
CL=47µF  
TIME(20ms/div.)  
Figure 33. Over Current Response  
Ramped Load  
TIME(500µs/div.)  
Figure 32. Inrush Current Response  
(BD2056AFJ)  
(BD2056AFJ)  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
13/23  
TSZ22111･15･001  
Datasheet  
BD2046AFJ BD2056AFJ  
Typical Wave Forms - continued  
VEN  
(5V/div.)  
V/OC  
(5V/div.)  
V/OC  
(5V/div.)  
VOUT  
(5V/div.)  
VOUT  
(5V/div.)  
VIN=5V  
VIN=5V  
CL=100μF  
IOUT  
IOUT  
(0.5A/div.)  
(0.5A/div.)  
TIME(2ms/div.)  
TIME (2ms/div.)  
Figure 34. Over Current Response  
Ramped Load  
Figure 35. Over Current Response  
Enable to Short Circuit  
(BD2056AFJ)  
(BD2056AFJ)  
V/OC  
(5V/div.)  
V/OC  
(5V/div.)  
VOUT  
VOUT  
(5V/div.)  
(5V/div.)  
VIN=5V  
CL=100μF  
VIN=5V  
CL=100μF  
Thermal Shutdown  
IOUT  
(1.0A/div.)  
IOUT  
(1.0A/div.)  
TIME (1ms/div.)  
Figure 36. Over Current Response  
1Ω short at Enable  
TIME (500ms/div.)  
Figure 37. Over Current Response  
1Ω short at Enable  
(BD2056AFJ)  
(BD2056AFJ)  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
14/23  
TSZ22111･15･001  
Datasheet  
BD2046AFJ BD2056AFJ  
Typical Wave Forms - continued  
VIN  
VIN  
(5V/div.)  
(5V/div.)  
VOUT  
(5V/div.)  
VOUT  
(5V/div.)  
IOUT  
(0.5A/div.)  
IOUT  
(0.5A/div.)  
V/OC  
(5V/div.)  
V/OC  
(5V/div.)  
RL=20Ω  
RL=20Ω  
CL=100μF  
CL=100μF  
TIME (1s/div.)  
TIME (1s/div.)  
Figure 38. UVLO Response when  
Figure 39. UVLO Response when  
Decreasing VIN  
Increasing VIN  
(BD2056AFJ)  
(BD2056AFJ)  
Regarding the output rise/fall and over current detection characteristics of BD2046AFJ, refer to the characteristic of BD2056AFJ.  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
15/23  
TSZ22111･15･001  
Datasheet  
BD2046AFJ BD2056AFJ  
Typical Application Circuit  
5V(Typ)  
10k to 100k  
10k to 100k  
VBUS  
IN  
OUT  
ON/OFF  
GND  
IN  
/OC1  
OUT1  
OUT2  
/OC2  
D+  
C
L
L
OC  
OC  
CIN  
D-  
/EN1  
(EN1)  
/EN2  
(EN2)  
Regulator  
GND  
Data  
Data  
ON/OFF  
C
Data  
BD2046AFJ/56AFJ  
USB Controller  
Application Information  
When excessive current flows due to output short-circuit or so, ringing occurs because of inductance between power source  
line and IC. This may cause bad effects on IC operations. In order to avoid this case, connect a bypass capacitor across IN  
terminal and GND terminal of IC. 1μF or higher is recommended.  
Pull up /OC output by a resistance value of 10kΩ to 100kΩ.  
Set up values for CL which satisfies the application.  
This application circuit does not guarantee its operation.  
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external  
components including AC/DC characteristics as well as dispersion of the IC.  
Functional Description  
1.  
Switch Operation  
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. The IN terminal  
is also used as power source input to internal control circuit.  
When the switch is turned on from EN/EN control input, the IN terminal and OUT terminal are connected by a 100mΩ  
switch. In ON status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of the  
IN terminal, current flows from OUT terminal to IN terminal.  
Since a parasitic diode between the drain and the source of switch MOSFET is not present during OFF status, it is  
possible to prevent current from flowing reversely from OUT to IN.  
2.  
Thermal Shutdown Circuit (TSD)  
Thermal shutdown circuit have dual thermal shutdown threshold. Thermal shutdown works when a high junction  
temperature due to an over current occurs, then the switch turns off and outputs an error flag (/OC).  
Thermal shut down action has hysteresis. When the junction temperature goes down, the switch automatically turns on  
and resets the error flag. Unless the cause of increase of the chip’s temperature is removed or the output of power  
switch is turned off, this operation repeats. The thermal shutdown circuit works when the switch of either OUT1 or OUT2  
is on (EN, /EN signal is active).  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
16/23  
TSZ22111･15･001  
Datasheet  
BD2046AFJ BD2056AFJ  
3.  
Over Current Detection (OCD)  
The over current detection circuit limits current (ISC) and outputs an error flag (/OC) when current flowing in each switch  
MOSFET exceeds a specified value. There are three types of response against over current. The over current detection  
circuit works when the switch is on (EN, /EN signal is active).  
(1) When the switch is turned on while the output is in short-circuit status, the switch goes into current limit status  
immediately.  
(2) When the output short-circuits or high-current load is connected while the switch is on, very large current flows until  
the over current limit circuit reacts. When the current detection and limit circuit works, current limitation is carried out.  
(3) When the output current increases gradually, current limitation does not work until the output current exceeds the  
over current detection value. When it exceeds the detection value, current limitation is carried out.  
4.  
5.  
Under Voltage Lockout (UVLO)  
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V (Typ). If VIN drops below 2.2V (Typ) while  
the switch is still ON, then UVLO shuts off the switch. UVLO has a hysteresis of 100mV (Typ).  
Note: Under voltage lockout circuit works when the switch of either OUT1 or OUT2 is on (EN, /EN signal is active).  
Error Flag (/OC) Output  
Error flag output is N-MOS open drain output. At over current and/or thermal shutdown detection, the output level is low.  
Over current detection has a delay filter. This delay filter prevents current detection flags from being sent during  
instantaneous events such as surge current at switch on or hot plug. If fault flag output is unused, /OC pin should be  
connected to open or ground line.  
V/EN  
Output Short Circuit  
Thermal Shutdown  
VOUT  
IOUT  
V/OC  
/OC Delay Time  
Figure 40. Over Current Detection, Thermal Shutdown Timing  
(BD2046AFJ)  
VEN  
Output Short Circuit  
Thermal Shutdown  
VOUT  
IOUT  
V/OC  
/OC Delay Time  
Figure 41. Over Current Detection, Thermal Shutdown Timing  
(BD2056AFJ)  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
17/23  
TSZ22111･15･001  
Datasheet  
BD2046AFJ BD2056AFJ  
Power Dissipation  
(SOP-J8)  
700  
600  
500  
400  
300  
200  
100  
0
0
25  
50  
75  
100  
125  
150  
Ambient Temperature: Ta[°C]  
70mm x 70mm x 1.6mm Glass Epoxy Board  
Figure 42. Power Dissipation Curve (Pd-Ta Curve)  
I/O Equivalence Circuit  
Symbol  
Pin No  
3, 4  
Equivalence Circuit  
/EN1(EN1)  
/EN2(EN2)  
EN1(/EN1)  
EN2(/EN2)  
/OC1  
/OC2  
/OC1  
/OC2  
5, 8  
OUT1  
OUT2  
OUT1  
OUT2  
6, 7  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
18/23  
TSZ22111･15･001  
Datasheet  
BD2046AFJ BD2056AFJ  
Operational Notes  
1. Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power  
supply pins.  
2. Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the  
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog  
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and  
aging on the capacitance value when using electrolytic capacitors.  
3. Ground Voltage  
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.  
4. Ground Wiring Pattern  
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but  
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal  
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations  
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5. Thermal Consideration  
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in  
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when  
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum  
rating, increase the board size and copper area to prevent exceeding the Pd rating.  
6. Recommended Operating Conditions  
These conditions represent a range within which the expected characteristics of the IC can be approximately  
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.  
7. In rush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may  
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power  
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,  
and routing of connections.  
8. Operation Under Strong Electromagnetic Field  
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.  
9. Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may  
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply  
should always be turned off completely before connecting or removing it from the test setup during the inspection  
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during  
transport and storage.  
10. Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)  
and unintentional solder bridge deposited in between pins during assembly to name a few.  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
19/23  
TSZ22111･15･001  
Datasheet  
BD2046AFJ BD2056AFJ  
Operational Notes - continued  
11. Unused Input Pins  
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and  
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small  
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and  
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the  
power supply or ground line.  
12. Regarding the Input Pin of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them  
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a  
parasitic diode or transistor. For example (refer to figure below):  
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.  
When GND > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to  
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should  
be avoided.  
Resistor  
Transistor (NPN)  
Pin A  
Pin B  
Pin B  
B
E
C
Pin A  
B
C
E
P
P+  
P+  
N
P+  
P
P+  
N
N
N
N
N
N
N
Parasitic  
Elements  
Parasitic  
Elements  
P Substrate  
GND GND  
P Substrate  
GND  
GND  
Parasitic  
Elements  
Parasitic  
Elements  
N Region  
close-by  
Figure 43. Example of monolithic IC structure  
13. Ceramic Capacitor  
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with  
temperature and the decrease in nominal capacitance due to DC bias and others.  
14. Thermal Shutdown Circuit(TSD)  
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always  
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction  
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below  
the TSD threshold, the circuits are automatically restored to normal operation.  
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no  
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from  
heat damage.  
15. Thermal design  
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in  
actual states of use.  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
20/23  
TSZ22111･15･001  
Datasheet  
BD2046AFJ BD2056AFJ  
Ordering Information  
B D  
2
0
0
4
5
6
6
A
A
F
J
-
-
E 2  
Part Number  
Package  
FJ: SOP-J8  
Packaging and forming specification  
E2: Embossed tape and reel  
B D  
2
F
J
E 2  
Part Number  
Package  
FJ: SOP-J8  
Packaging and forming specification  
E2: Embossed tape and reel  
Marking Diagram  
SOP-J8 (TOP VIEW)  
Part Number Marking  
LOT Number  
1PIN MARK  
Part Number  
Part Number Marking  
BD2046AFJ  
BD2056AFJ  
D046A  
D056A  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
21/23  
TSZ22111･15･001  
Datasheet  
BD2046AFJ BD2056AFJ  
Physical Dimension, Tape and Reel Information  
Package Name  
SOP-J8  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
21.Aug.2014 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
22/23  
TSZ22111･15･001  
Datasheet  
BD2046AFJ BD2056AFJ  
Revision History  
Date  
11.Mar.2013  
21.Aug.2014  
Revision  
001  
Changes  
New Release  
Applied the ROHM Standard Style.  
002  
Add Typical Performance Curves for Over-Current Threshold and /OC Delay Time.  
www.rohm.com  
TSZ02201-0E3E0H300140-1-2  
© 2013 ROHM Co., Ltd. All rights reserved.  
23/23  
TSZ22111･15･001  
21.Aug.2014 Rev.002  
Daattaasshheeeett  
Notice  
Precaution on using ROHM Products  
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific  
Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASSⅢ  
CLASSⅣ  
CLASSⅡb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual  
ambient temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the  
ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice – GE  
Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
QR code printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,  
please consult with ROHM representative in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable  
for infringement of any intellectual property rights or other damages arising from use of such information or data.:  
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the information contained in this document.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice – GE  
Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.  
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s  
representative.  
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2014 ROHM Co., Ltd. All rights reserved.  
Datasheet  
Buy  
BD2046AFJ - Web Page  
Distribution Inventory  
Part Number  
Package  
Unit Quantity  
BD2046AFJ  
SOP-J8  
2500  
Minimum Package Quantity  
Packing Type  
Constitution Materials List  
RoHS  
2500  
Taping  
inquiry  
Yes  

相关型号：

BD2046AFJ_09

 2ch Small Current Output USB High Side Switch ICs
ROHM

BD2046AFJ_11

 2ch High Side Switch ICs for USB Devices and Memory Cards
ROHM

BD2046AFJ_14

 0.5A Current Limit High Side Switch ICs
ROHM

BD204F

 isc Silicon PNP Power Transistor
ISC

BD205

 10 AMPERE POWER TRANSISTOR NPN SILICON
MOTOROLA

BD2051AFJ

 Silicon monolithic integrated circuit USB high side switch IC
ROHM

BD2051AFJ-E2

 1.0A Current Limit High Side Switch ICs
ROHM

BD2052AFJ

 High-Side Switch
ROHM

BD2052AFJ-E2

 Buffer/Inverter Based Peripheral Driver, 2 Driver, 1A, PDSO8, SOP-8
ROHM

BD2055AFJ

 Silicon monolithic integrated circuit USB high side switch IC
ROHM

BD2056AFJ

 2ch Small Current Output USB High Side Switch ICs
ROHM

BD206

 10 AMPERE POWER TRANSISTOR PNP SILICON
MOTOROLA
©2020 ICPDF网 联系我们和版权申明