BD2041AFJ_09 [ROHM]
1ch Large Current Output USB High Side Switch ICs; 代上大电流输出USB高端开关IC
| 型号： | BD2041AFJ_09 |
| 厂家： | 
ROHM |
| 描述： | 1ch Large Current Output USB High Side Switch ICs |
| 文件： | 总19页 (文件大小：469K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PowerManagementSwitchIC Seriesor PCsand DigitalConsumerProduct
1ch Large Current Output
USB High Side Switch ICs
BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ
No.09029EAT03
Description
Single channel high side switch IC for USB port is a high side switch having over current protection used in power supply line
of universal serial bus (USB).
N-channel power MOSFET of low on resistance and low supply current are realized in this IC.
And, over current detection circuit, thermal shutdown circuit, under voltage lockout and soft start circuit are built in.
Features
1) Built-in low on resistance Nch MOS FET Switch.
Typ = 80mΩ (BD2041AF/BD2051AFJ)
Typ = 100mΩ (BD6518F/BD6519FJ)
2) Continuous current load 0.5A
3) Control input logic
Active-Low : BD2041AFJ/ BD6519FJ
Active-High : BD2051AFJ/ BD6518FJ
4) Soft start circuit
5) Over current detection
6) Thermal shutdown
7) Under voltage lockout
8) Open drain error flag output
9) Reverse-current protection when power switch off
10) Power supply voltage range
2.7V~5.5V (BD2041AF/BD2051AFJ)
3.0V~5.5V (BD6518F/BD6519FJ)
11) Operating temperature range -40°C~85°C
Applications
USB hub in consumer appliances, Car accessory, PC, PC peripheral equipment, and so forth
Lineup
Parameter
BD2041AFJ
BD2051AFJ
0.5
BD6518FJ
0.5
BD6519FJ
0.5
Continuous current load (A)
Output current at short (A)
Control input logic
0.5
1.0
1.0
1.1
1.1
Low
High
High
Low
Absolute Maximum Ratings
Parameter
Symbol
Limits
Unit
Supply voltage
Enable voltage
/OC voltage
VIN
VEN, V/EN
V/OC
-0.3 to 6.0
-0.3 to 6.0
-0.3 to 6.0
10
V
V
V
/OC current
IS/OC
VOUT
TSTG
mA
V
OUT voltage
-0.3 to 6.0
-55 to 150
560*1
Storage temperature
°C
mW
Power dissipation
PD
*1 In the case of exceeding Ta = 25°C, 4.48mW should be reduced per 1°C.
*
This chip is not designed to protect itself against radioactive rays.
※ IN, EN (/EN), and /OC terminal of BD2041AFJ/BD2051AFJ correspond to VDD, CTRL, and FLAG terminal of BD6518FJ/BD6519FJ, respectively.
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2009.05 - Rev.A
1/18
Technical Note
BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ
Operating conditions
◎BD2041AF/BD2051AFJ
Parameter
Operating voltage
Symbol
VIN
Limits
Unit
V
2.7 to 5.5
-40 to 85
Operating temperature
Continuous output current
TOPR
ILO
°C
0
to 500
mA
◎BD6518FJ/BD6519FJ
Parameter
Symbol
VIN
Limits
Unit
V
Operating voltage
3.0 to 5.5
-40 to 85
Operating temperature
Continuous output current
TOPR
ILO
°C
0
to 500
mA
Electrical characteristics
◎BD2041AFJ (Unless otherwise specified, VIN = 5.0V, Ta = 25°C)
Limits
Parameter
Symbol
Unit
Condition
Min.
Typ.
90
0.01
-
Max.
120
1
Operating Current
Standby Current
IDD
ISTB
V/EN
-
μA
μA
V
V/EN = 0V, OUT = OPEN
V/EN = 5V, OUT = OPEN
High input
-
2.0
-
/EN input voltage
-
-
0.8
0.4
1.0
0.5
1
V
Low input
V/EN
-
-
V
Low input 2.7V≤ VIN ≤4.5V
V/EN = 0V or V/EN = 5V
I/OC = 5mA
/EN input current
I/EN
V/OC
IL/OC
RON
-1.0
0.01
-
μA
V
/OC output LOW voltage
/OC output leak current
ON resistance
-
-
-
0.01
80
μA
mΩ
V/OC = 5V
100
IOUT = 500mA
VIN = 5V, VOUT = 0V,
CL = 100μF (RMS)
Output current at short
ISC
0.7
1.0
1.3
A
Output rise time
Output turn on time
Output fall time
TON1
TON2
-
-
1.2
1.5
1
10
20
ms
ms
μs
μs
V
RL = 10Ω , CL = OPEN
TOFF1
TOFF2
VTUVH
VTUVL
-
20
Output turn off time
-
3
40
2.1
2.0
2.3
2.2
2.5
2.4
Increasing VIN
Decreasing VIN
UVLO threshold
V
◎BD6519FJ (Unless otherwise specified, VDD = 5.0V, Ta = 25°C)
Limits
Parameter
Symbol
IDD
Unit
Condition
Min.
Typ.
90
0.01
-
Max.
140
2
Operating Current
Standby Current
-
μA
μA
V
VCTRL= 0V, OUT = OPEN
VCTRL= 5V, OUT = OPEN
High input
-
2.5
-
CTRL input voltage
VCTRL
-
-
0.7
1.0
450
1
V
Low input
CTRL input voltage
ICTRL
RFLAG
ILFLAG
TDFLAG
-1.0
0.01
180
0.01
2.5
100
140
-
μA
Ω
VCTRL = 0V or VCTRL = 5V
IFLAG = 1mA
FLAG output resistance
FLAG output leak current
FLAG output delay
-
-
μA
ms
mΩ
mΩ
A
VFLAG = 5V
-
8
-
140
180
1.6
10
4
VDD = 5V, IOUT = 500mA
VDD = 3.3V, IOUT = 500mA
VDD = 5V , VOUT = 0V
VCTRL = 5V
ON resistance
RON
-
Short circuit output current
Output leak current
ISC
0.6
ILEAK
TON1
TON2
TOFF1
TOFF2
TTS
-
-
μA
ms
ms
μs
μs
°C
V
Output rise time
-
1
Output turn on delay time
Output fall time
-
-
1.3
1
6
RL = 10Ω , CL = OPEN
20
20
-
Output turn off delay time
Thermal shutdown threshold
-
3
-
135
2.5
2.3
Tj increase
VTUVH
VTUVL
2.3
2.1
2.7
2.5
VDD increasing
VDD decreasing
UVLO threshold
V
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.05 - Rev.A
2/18
Technical Note
BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ
◎BD2051AFJ (Unless otherwise specified, VIN = 5.0V, Ta = 25°C)
Limits
Parameter
Symbol
Unit
Condition
Min.
Typ.
90
0.01
-
Max.
120
1
Operating Current
Standby Current
IDD
ISTB
VEN
-
μA
μA
V
VEN = 5V, OUT = OPEN
VEN = 0V, OUT = OPEN
High input
-
2.0
-
EN input voltage
-
-
0.8
0.4
1.0
0.5
1
V
Low input
VEN
-
-
V
Low input 2.7V≤ VIN ≤4.5V
VEN = 0V or VEN = 5V
I/OC = 5mA
EN input current
IEN
-1.0
0.01
-
μA
V
/OC output LOW voltage
/OC output leak current
ON resistance
V/OC
IL/OC
RON
-
-
-
0.01
80
μA
mΩ
V/OC = 5V
100
IOUT = 500mA
VIN = 5V, VOUT = 0V,
CL = 100μF (RMS)
Output current at short
ISC
0.7
1.0
1.3
A
Output rise time
Output turn on time
Output fall time
TON1
TON2
-
-
1.2
1.5
1
10
20
ms
ms
μs
μs
V
RL = 10Ω , CL = OPEN
TOFF1
TOFF2
VTUVH
VTUVL
-
20
Output turn off time
-
3
40
2.1
2.0
2.3
2.2
2.5
2.4
Increasing VIN
Decreasing VIN
UVLO threshold
V
◎BD6518FJ (Unless otherwise specified, VDD = 5.0V, Ta = 25°C)
Limits
Parameter
Symbol
IDD
Unit
Condition
Min.
Typ.
90
0.01
-
Max.
140
2
Operating Current
Standby Current
-
μA
μA
V
VCTRL= 5V, OUT = OPEN
VCTRL= 0V, OUT = OPEN
High input
-
2.5
-
CTRL input voltage
VCTRL
-
-
0.7
1.0
450
1
V
Low input
CTRL input voltage
ICTRL
RFLAG
ILFLAG
TDFLAG
-1.0
0.01
180
0.01
2.5
100
140
-
μA
Ω
VCTRL = 0V or VCTRL = 5V
IFLAG = 1mA
FLAG output resistance
FLAG output leak current
FLAG output delay
-
-
μA
ms
mΩ
mΩ
A
VFLAG = 5V
-
8
-
140
180
1.6
10
4
VDD = 5V, IOUT = 500mA
VDD = 3.3V, IOUT = 500mA
VDD = 5V , VOUT = 0V
VCTRL = 0V
ON resistance
RON
-
Short circuit output current
Output leak current
ISC
0.6
ILEAK
TON1
TON2
TOFF1
TOFF2
TTS
-
-
μA
ms
ms
μs
μs
°C
V
Output rise time
-
1
Output turn on delay time
Output fall time
-
-
1.3
1
6
RL = 10Ω , CL = OPEN
20
20
-
Output turn off delay time
Thermal shutdown threshold
-
3
-
135
2.5
2.3
Tj increase
VTUVH
VTUVL
2.3
2.1
2.7
2.5
VDD increasing
VDD decreasing
UVLO threshold
V
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.05 - Rev.A
3/18
Technical Note
BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ
Measurement circuit
VIN
VIN
A
1uF
1uF
GND
OUT
GND
OUT
IN
OUT
OUT
/OC
IN
IN
OUT
OUT
/OC
IN
RL
CL
EN(/EN)
EN(/EN)
VEN(V/EN
)
VEN (V/EN
)
Operating current
EN, /EN input voltage, Output rise, fall time
VIN
VIN
VIN
VIN
10k
1uF
1uF
I/OC
GND
OUT
GND
OUT
IN
IN
OUT
OUT
IN
OUT
OUT
/OC
IN
CL
EN(/EN)
/OC
IOUT
EN(/EN)
VEN(V/EN
)
VEN(V/EN
)
ON resistance, Over current detection
/OC output LOW voltage
Fig.1 Measurement circuit
Timing diagram
◎BD2041AFJ/BD6519FJ
◎BD2051AFJ/BD6518FJ
TOFF1
TOFF1
TON1
TON1
VOUT
VOUT
90%
90%
10%
TOFF2
90%
90%
10%
TOFF2
10%
10%
TON2
TON2
V
/EN
VEN
50%
50%
50%
50%
Fig.2 Timing diagram
Fig.3 Timing diagram
※IN, EN (/EN), and /OC terminal of BD2041AFJ/BD2051AFJ correspond to VDD, CTRL, and FLAG terminal of BD6518FJ/BD6519FJ, respectively.
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.05 - Rev.A
4/18
Technical Note
BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ
Reference data (BD2041AFJ/BD2051AFJ)
120
100
80
60
40
20
0
120
100
80
60
40
20
0
1.0
0.8
0.6
0.4
0.2
0.0
Ta=25°C
VIN=5.0V
Ta=25°C
2
3
4
5
6
-50
0
50
100
2
3
4
5
6
SUPPLY VOLTAGE : VIN[V]
Fig.6 Operating current
EN,/EN Disable
AMBIENT TEMPERATURE : Ta[
]
SUPPLY VOLTAGE : VIN[V]
Fig.4 Operating current
EN,/EN Enable
℃
Fig.5 Operating current
EN,/EN Enable
1.0
0.8
0.6
0.4
0.2
0.0
2.0
1.5
1.0
0.5
0.0
2.0
1.5
1.0
0.5
0.0
VIN=5.0V
VIN=5.0V
Ta=25°C
Low to High
High to Low
Low to High
High to Low
-50
0
50
100
-50
0
50
100
]
2
3
4
5
6
SUPPLY VOLTAGE : VIN[V]
AMBIENT TEMPERATURE : Ta[
]
℃
AMBIENT TEMPERATURE : Ta[
℃
Fig.9 EN,/EN input voltage
Fig.8 EN,/EN input voltage
Fig.7 Operating current
EN,/EN Disable
0.5
0.4
0.3
0.2
0.1
0.0
200
150
100
50
0.5
0.4
0.3
0.2
0.1
0.0
Ta=25°C
Ta=25°C
VIN=5.0V
0
-50
0
50
100
2
3
4
5
6
2
3
4
5
6
AMBIENT TEMPERATURE : Ta[
]
SUPPLY VOLTAGE : VIN[V]
SUPPLY VOLTAGE : VIN [V]
℃
Fig.10 /OC output LOW voltage
Fig.11 /OC output LOW voltage
Fig.12 ON resistance
200
2.0
2.0
1.5
1.0
0.5
0.0
VIN=5.0V
VIN=5.0V
Ta=25°C
150
100
50
1.5
1.0
0.5
0.0
0
-50
0
50
AMBIENT TEMPERATURE : Ta[ ]
℃
100
-50
0
50
100
2
3
4
5
6
AMBIENT TEMPERATURE : Ta[
]
SUPPLY VOLTAGE : VIN[V]
℃
Fig.14 Output current at shortcircuit
(BD2041AFJ/51AFJ)
Fig.15 Output current at shortcircuit
(BD2041AFJ/51AFJ)
Fig.13 ON resistance
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2009.05 - Rev.A
5/18
Technical Note
BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ
5.0
4.0
3.0
2.0
1.0
0.0
5.0
4.0
3.0
2.0
1.0
0.0
5.0
4.0
3.0
2.0
1.0
0.0
Ta=25°C
VIN=5.0V
Ta=25°C
2
3
4
5
6
-50
0
50
100
2
3
4
5
6
SUPPLY VOLTAGE : VIN[V]
SUPPLY VOLTAGE : VIN[V]
AMBIENT TEMPERATURE : Ta[
]
℃
Fig.17 Output rise time
Fig.18 Output turn on time
Fig.16 Output rise time
5.0
4.0
3.0
2.0
1.0
0.0
5.0
4.0
3.0
2.0
1.0
0.0
5.0
4.0
3.0
2.0
1.0
0.0
Ta=25°C
VIN=5.0V
VIN=5.0V
-50
0
50
100
2
3
4
5
6
-50
0
50
100
AMBIENT TEMPERATURE : Ta[
]
SUPPLY VOLTAGE : VIN [V]
℃
AMBIENT TEMPERATURE : Ta[
]
℃
Fig.20 Output fall time
Fig.19 Output turn on time
Fig.21 Output fall time
5.0
4.0
3.0
2.0
1.0
0.0
2.5
2.4
2.3
2.2
2.1
2.0
5.0
4.0
3.0
2.0
1.0
0.0
Ta=25°C
VIN=5.0V
VUVLOH
VUVLOL
2
3
4
5
6
-50
0
50
100
-50
0
50
100
AMBIENT TEMPERATURE : Ta[
]
℃
AMBIENT TEMPERATURE : Ta[
]
SUPPLY VOLTAGE : VIN[V]
℃
Fig.24 UVLO threshold voltage
Fig.23 Output turn off time
Fig.22 Output turn off time
1.0
0.8
0.6
0.4
0.2
0.0
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.25 UVLO hysteresis voltage
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© 2009 ROHM Co., Ltd. All rights reserved.
Technical Note
BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ
Waveform data (BD2041AFJ/BD2051AFJ)
V/EN
(5V/div.)
V/EN
(5V/div.)
V/EN
(1V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IOUT
330μF
220μF
147μF
(0.2A/div.)
VIN=5V
V/OC
RL=10Ω
CL=100μF
(1V/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
VIN=5V
47μF
RL=10Ω
CL=100μF
VIN=5V
RL=10Ω
TIME(1ms/div.)
TIME(1ms/div.)
TIME(0.5ms/div.)
Fig.27 Output fall characteristic
(BD2041AFJ)
Fig.26 Output rise characteristic
(BD2041AFJ)
Fig.28 Inush current
(BD2041AFJ)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
VIN=5V
VIN=5V
TIME(20ms/div.)
TIME(2ms/div.)
Fig.29 Over current response
Ramped load
Fig.30 Over current response
Ramped load
(BD2041AFJ)
(BD2041AFJ)
V/OC
(5V/div.)
V/OC
(5V/div.)
V/EN
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VIN=5V
Thermal Shutdown
CL=100μF
IOUT
(0.5A/div.)
IOUT
(1A/div.)
IOUT
(0.5A/div.)
VIN=5V
CL=100μF
VIN=5V
CL=100μF
TIME (2ms/div.)
TIME (2ms/div.)
TIME (500ms/div.)
Fig.32 Over current response
Output shortcircuit at Enable
(BD2041AFJ)
Fig.31 Over current response
Enable to shortcircuit
(BD2041AFJ)
Fig.33 Over current response
Output shortcircuit at Enable
(BD2041AFJ)
VIN
(5V/div.)
VIN
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
RL=10Ω
CL=147μF
RL=10Ω
CL=147μF
TIME (10ms/div.)
TIME (10ms/div.)
Fig.35 UVLO
Fig.34 UVLO
VDD increasing
(BD2041AFJ)
V
DD decreasing
(BD2041AFJ)
Regarding the output rise/fall and over current detection characteristics of BD2051AFJ, refer to the characteristic of BD2041AFJ.
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.05 - Rev.A
7/18
Technical Note
BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ
Reference data (BD6518F/BD6519FJ)
120
100
80
60
40
20
0
120
100
80
60
40
20
0
1.0
0.8
0.6
0.4
0.2
0.0
Ta=25°C
VDD=5.0V
Ta=25°C
2
3
4
5
6
-50
0
50
100
2
3
4
5
6
100
6
SUPPLY VOLTAGE : VDD[V]
Fig.38 Operating current
CTRL Disable
SUPPLY VOLTAGE : VDD[V]
Fig.36 Operating current
CTRL Enable
AMBIENT TEMPERATURE : Ta[
]
℃
Fig.37 Operating current
CTRL Enable
2.5
2.0
1.5
1.0
0.5
0.0
2.5
2.0
1.5
1.0
0.5
0.0
1.0
0.8
0.6
0.4
0.2
0.0
VDD=5.0V
Ta=25°C
VDD=5.0V
Low to High
High to Low
Low to High
High to Low
2
3
4
5
6
-50
0
50
100
-50
0
50
SUPPLY VOLTAGE : VDD[V]
AMBIENT TEMPERATURE : Ta[
]
℃
AMBIENT TEMPERATURE : Ta[
]
℃
Fig.41 CTRL input voltage
Fig.40 CTRL input voltage
Fig.39 Operating current
CTRL Disable
250
200
150
100
50
250
200
150
100
50
200
150
100
50
Ta=25°C
Ta=25°C
VDD=5.0V
0
0
0
2
3
4
5
6
2
3
4
5
-50
0
50
100
SUPPLY VOLTAGE : VDD[V]
SUPPLY VOLTAGE : VDD[V]
AMBIENT TEMPERATURE : Ta[
]
℃
Fig.42 FLAG output resistance
Fig.44 ON resistance
Fig.43 FLAG output resistance
2.0
1.5
1.0
0.5
0.0
200
2.0
1.5
1.0
0.5
0.0
VDD=5.0V
Ta=25°C
VDD=5.0V
150
100
50
0
-50
0
50
AMBIENT TEMPERATURE : Ta[ ]
℃
100
2
3
4
5
6
-50
0
50
100
SUPPLY VOLTAGE : VDD[V]
AMBIENT TEMPERATURE : Ta[
]
℃
Fig.46 Output current at shortcircuit
Fig.47 Output current at shortcircuit
Fig.45 ON resistance
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2009.05 - Rev.A
8/18
Technical Note
BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ
5.0
4.0
3.0
2.0
1.0
0.0
5.0
4.0
3.0
2.0
1.0
0.0
5.0
4.0
3.0
2.0
1.0
0.0
Ta=25°C
VDD=5.0V
Ta=25°C
2
3
4
5
6
-50
0
50
100
2
3
4
5
6
AMBIENT TEMPERATURE : Ta[
]
℃
SUPPLY VOLTAGE : VDD[V]
SUPPLY VOLTAGE : VDD[V]
Fig.48 FLAG output delay
Fig.49 FLAG output delay
Fig.50 Output rise time
5.0
4.0
3.0
2.0
1.0
0.0
5.0
4.0
3.0
2.0
1.0
0.0
5.0
4.0
3.0
2.0
1.0
0.0
Ta=25°C
VDD=5.0V
VDD=5.0V
-50
0
50
100
-50
0
50
100
2
3
4
5
6
SUPPLY VOLTAGE : VDD[V]
AMBIENT TEMPERATURE : Ta[
]
℃
AMBIENT TEMPERATURE : Ta[
]
℃
Fig.52 Output turn on delay time
Fig.53 Output turn on delay time
Fig.51 Output rise time
5.0
4.0
3.0
2.0
1.0
0.0
5.0
5.0
4.0
3.0
2.0
1.0
0.0
Ta=25°C
VDD=5.0V
Ta=25°C
4.0
3.0
2.0
1.0
0.0
2
3
4
5
6
-50
0
50
100
2
3
4
5
6
SUPPLY VOLTAGE : VDD[V]
AMBIENT TEMPERATURE : Ta[
]
℃
SUPPLY VOLTAGE : VDD[V]
Fig.54 Output fall time
Fig.55 Output fall time
Fig.56 Output turn off delay time
5.0
4.0
3.0
2.0
1.0
0.0
1.0
2.7
2.6
2.5
2.4
2.3
2.2
2.1
VDD=5.0V
0.8
0.6
0.4
0.2
0.0
VTUVH
VTUVL
-50
0
50
100
-50
0
50
100
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
AMBIENT TEMPERATURE : Ta[
]
AMBIENT TEMPERATURE : Ta[
]
℃
℃
Fig.58 UVLO threshold voltage
Fig.59 UVLO hysteresis voltage
Fig.57 Output turn off delay time
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2009.05 - Rev.A
9/18
© 2009 ROHM Co., Ltd. All rights reserved.
Technical Note
BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ
Waveform data (BD6518F/BD6519FJ)
VDD=5V
VCTRL
VCTRL
VDD=5V
VCTRL
RL=10Ω
(1V/div.)
(5V/div.)
(1V/div.)
VDD=5V
RL=10Ω
CL=147μF
RL=10Ω
CL=147μF
VOUT
(1V/div.)
VOUT
(1V/div.)
CL=330μF
CL=220μF
IOUT
(0.2A/div.)
IOUT
(0.2A/div.)
CL=147μF
IOUT
(0.2A/div.)
CL=47μF
VFLAG
(5V/div.)
VFLAG
(1V/div.)
VFLAG
(1V/div.)
TIME(1ms/div.)
TIME(1ms/div.)
TIME(0.5ms/div.)
Fig.61 Output fall characteristic
(BD6519FJ)
Fig.60 Output rise characteristic
(BD6519FJ)
Fig.62 Inrush current characteristic
(BD6519FJ)
VOUT
(1V/div.)
VOUT
(1V/div.)
IOUT
(0.2A/div.)
IOUT
(0.2A/div.)
VFLAG
(1V/div.)
VFLAG
(1V/div.)
VDD=5V
VDD=5V
TIME(2ms/div.)
TIME(20ms/div.)
Fig.64 Over current response
Ramped load
Fig.63 Over current response
Ramped load
(BD6519FJ)
(BD6519FJ)
VCTRL
(1V/div.)
VDD=5V
CL=100μF
VOUT
(1V/div.)
VOUT
(1V/div.)
VOUT
(1V/div.)
Thermal Shutdown
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
IOUT
(0.2A/div.)
VFLAG
(1V/div.)
VFLAG
(1V/div.)
VDD=5V
CL=100μF
VDD=5V
CL=100μF
VFLAG
(1V/div.)
TIME (200ms/div.)
TIME (1ms/div.)
TIME (1ms/div.)
Fig.67 Over current response
Output shortcircuit at Enable
(BD6519FJ)
Fig.66 Over current response
Output shortcircuit at Enable
(BD6519FJ)
Fig.65 Over current response
Enable to shortcircuit
(BD6519FJ)
VDD
(1V/div.)
VDD
(1V/div.)
VOUT
(1V/div.)
VOUT
(1V/div.)
IOUT
(0.2A/div.)
IOUT
(0.2A/div.)
VFLAG
(1V/div.)
RL=10Ω
CL=147μF
VFLAG
(1V/div.)
RL=10Ω
CL=147μF
TIME (10ms/div.)
TIME (10ms/div.)
Fig.68 UVLO
VIN increasing
(BD6519FJ)
Fig.69 UVLO
VIN decreasing
(BD6519FJ)
Regarding the output rise/fall and over current detection characteristics of BD6518FJ, refer to the characteristic of BD6519FJ.
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.05 - Rev.A
10/18
Technical Note
BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ
Block diagram (BD2041AFJ/2051AFJ)
GND
OUT
OUT
OUT
/OC
Charge
pump
IN
UVLO
OCD
OUT
8
GND
IN
1
2
3
4
OUT
7
IN
Gate logic
TSD
Top View
IN
OUT
/OC
6
5
EN(/EN)
EN(/EN)
Fig.70 Block diagram
Pin description (BD2041AFJ/2051AFJ)
Fig.71 Pin Configuration
Pin No.
1
Symbol
GND
I / O
I
Pin function
Ground.
Power supply input.
Input terminal to the power switch and power supply input terminal of the
internal circuit.
At use, connect each pin outside.
2, 3
IN
I
I
Enable input.
Power switch on at Low level. (BD2041AFJ)
Power switch on at High level. (BD2051AFJ)
High level input > 2.0V, Low level input < 0.8V.
4
EN (/EN)
Error flag output.
5
/OC
O
O
Low at over current, thermal shutdown.
Open drain output.
Power switch output.
At use, connect each pin outside.
6, 7, 8
OUT
I/O circuit (BD2041AFJ/2051AFJ)
Symbol
Pin No
Equivalent circuit
EN(/EN)
4
/OC
5
OUT
6,7,8
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2009.05 - Rev.A
11/18
© 2009 ROHM Co., Ltd. All rights reserved.
Technical Note
BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ
Block diagram (BD6518FJ/BD6519FJ)
GND
OUT
OUT
OUT
FLAG
Charge
pump
VDD
UVLO
OCD
OUT
8
GND
VDD
1
2
3
4
OUT
7
VDD
Gate logic
TSD
Top View
VDD
OUT
6
5
CTRL
FLAG
CTRL
Fig.72 Block diagram
Pin description (BD6518FJ/BD6519FJ)
Fig.73 Pin Configuration
Pin No.
1
Symbol
GND
I / O
I
Pin function
Ground.
Power supply input.
Input terminal to the power switch and power supply input terminal of the
internal circuit.
At use, connect each pin outside.
2, 3
4
VDD
I
I
Enable input.
Power switch on at High level. (BD6518FJ)
Power switch on at Low level. (BD6519FJ)
High level input > 2.5V, Low level input < 0.7V.
CTRL
Error flag output.
5
FLAG
OUT
O
O
Low at over current, thermal shutdown.
Open drain output.
Power switch output.
At use, connect each pin outside.
6, 7, 8
I/O circuit (BD6518FJ/BD6519FJ)
Symbol
Pin No
Equivalent circuit
CTRL
4
FLAG
OUT
5
6,7,8
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2009.05 - Rev.A
12/18
© 2009 ROHM Co., Ltd. All rights reserved.
Technical Note
BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ
Functional description (BD2041AFJ/2051AFJ)
1. Switch operation
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. And the IN
terminal is used also as power source input to internal control circuit.
When the switch is turned on from EN/EN control input, IN terminal and OUT terminal are connected by a 80mΩ switch. In
on status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of IN terminal,
current flows from OUT terminal to IN terminal.
Since a parasitic diode between the drain and the source of switch MOSFET is canceled, in the off status, it is possible to
prevent current from flowing reversely from OUT to IN.
2. Thermal shutdown circuit (TSD)
If over current would continue, the temperature of the IC would increase drastically. If the junction temperature were
beyond 140°C (typ.) in the condition of over current detection, thermal shutdown circuit operates and makes power switch
turn off and outputs error flag (/OC). Then, when the junction temperature decreases lower than 120°C (typ.), power switch
is turned on and error flag (/OC) is cancelled. Unless the fact of the increasing chips temperature is removed or the output
of power switch is turned off, this operation repeats.
The thermal shutdown circuit operates when the switch is on (EN,/EN signal is active).
3. Over current detection (OCD)
The over current detection circuit limits current (ISC) and outputs error flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. There are three types of response against over current. The over current detection
circuit works when the switch is on (EN,/EN signal is active).
3-1. When the switch is turned on while the output is in shortcircuit status
When the switch is turned on while the output is in shortcircuit status or so, the switch gets in current limit status soon.
3-2. When the output shortcircuits while the switch is on
When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the
over current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out.
3-3. When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the over
current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under voltage lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.) while
the switch turns on, then UVLO shuts off the power switch. UVLO has hysteresis of a 100mV(Typ).
Under voltage lockout circuit works when the switch is on (EN,/EN signal is active).
5. Error flag (/OC) output
Error flag output is N-MOS open drain output. At detection of over current, thermal shutdown, low level is output.
Over current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at
switch on, hot plug from being informed to outside.
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2009.05 - Rev.A
13/18
Technical Note
BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ
Functional description (BD6518FJ/BD6519FJ)
1. Switch operation
VDD terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. And the VDD
terminal is used also as power source input to internal control circuit.
When the switch is turned on from CTRL control input, VDD terminal and OUT terminal are connected by a 100mΩ switch.
In on status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of VDD terminal,
current flows from OUT terminal to VDD terminal.
Since a parasitic diode between the drain and the source of switch MOSFET is canceled, in the off status, it is possible to
prevent current from flowing reversely from OUT to VDD.
2. Thermal shutdown circuit (TSD)
If over current would continue, the temperature of the IC would increase drastically. If the junction temperature were
beyond 135°C (typ.) in the condition of over current detection, thermal shutdown circuit operates and makes power switch
turn off and outputs error flag (FALG). Then, when the junction temperature decreases lower than 125°C (typ.), power
switch is turned on and error flag (FLAG) is cancelled. Unless the fact of the increasing chips temperature is removed or
the output of power switch is turned off, this operation repeats.
The thermal shutdown circuit operates when the switch is on (CTRL signal is active).
3. Over current detection (OCD)
The over current detection circuit limits current (ISC) and outputs error flag (FLAG) when current flowing in each switch
MOSFET exceeds a specified value. There are three types of response against over current. The over current detection
circuit works when the switch is on (CTRL signal is active).
3-1. When the switch is turned on while the output is in shortcircuit status
When the switch is turned on while the output is in shortcircuit status or so, the switch gets in current limit status soon.
3-2. When the output shortcircuits while the switch is on
When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the
over current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out.
3-3. When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the over
current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under voltage lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VDD exceeds 2.5V(Typ.). If the VDD drops below 2.3V(Typ.)
while the switch turns on, then UVLO shuts off the power switch. UVLO has hysteresis of a 200mV(Typ).
Under voltage lockout circuit works when the switch is on (CTRL signal is active).
5. Error flag (FLAG) output
Error flag output (FLAG) is N-MOS open drain output. At detection of over current, thermal shutdown, low level is output.
Over current detection has delay filter on 2.5ms(Typ.). This delay filter prevents instantaneous current detection such as
inrush current at switch on, hot plug from being informed to outside.
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2009.05 - Rev.A
14/18
Technical Note
BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ
/EN
V
Output shortcircuit
Thermal shut down
OUT
V
OUT
I
/OC
V
delay
Fig.74 Over current detection, thermal shutdown timing
(BD2041AFJ/BD6519FJ)
EN
V
Output shortcircuit
Thermal shut down
OUT
V
OUT
I
/OC
V
delay
Fig.75 Over current detection, thermal shutdown timing
(BD2051AFJ/BD6518FJ)
※
IN, EN (/EN), and /OC terminal of BD2041AFJ/BD2051AFJ correspond to VDD, CTRL, and FLAG terminal of BD6518FJ/BD6519FJ, respectively.
Typical application circuit
5V(typ.)
VBUS
D+
IN
Regulator
OUT
D-
Ferrite
Beads
GND
VBUS
GND
IN
OUT
OUT
OUT
10k~
100kΩ
D+
USB
Controller
+
-
IN
C
CL
D-
IN
GND
EN(/EN) /OC
Ferrite
Beads
Fig.76 Typical application circuit (BD2041AFJ/51AFJ)
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2009.05 - Rev.A
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© 2009 ROHM Co., Ltd. All rights reserved.
Technical Note
BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ
Application information
When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC, and
may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor by IN terminal and GND
terminal of IC. 1μF or higher is recommended.
Pull up /OC output by resistance 10kΩ ~ 100kΩ.
Set up value which satisfies the application as CL and Ferrite Beads.
This system connection diagram doesn’t guarantee operating as the application.
The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account
external parts or dispersion of IC including not only static characteristics but also transient characteristics.
※
IN, EN (/EN), and /OC terminal of BD2041AFJ/BD2051AFJ correspond to VDD, CTRL, and FLAG terminal of BD6518FJ/BD6519FJ, respectively.
Power dissipation character
(SOP-J8)
600
500
400
300
200
100
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE: Ta [
]
℃
Fig.77 Power dissipation curve (Pd-Ta Curve)
Notes for use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected.
The electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown
due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply
terminal.
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2009.05 - Rev.A
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© 2009 ROHM Co., Ltd. All rights reserved.
Technical Note
BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to
be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the
constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig.
After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition,
for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the
transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a
voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to
the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a
switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible,
is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit
operating or use the LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual
states of use.
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2009.05 - Rev.A
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© 2009 ROHM Co., Ltd. All rights reserved.
Technical Note
BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ
Ordering part number
B D
6
5
1
8
F
J
-
E
2
Part No.
Part No.
2041A
2051A
6518
Package
FJ: SOP-J8
Packaging and forming specification
E2: Embossed tape and reel
(SOP-J8)
6519
SOP-J8
<Tape and Reel information>
4.9 0.2
(MAX 5.25 include BURR)
Tape
Embossed carrier tape
2500pcs
+
6°
4°
−4°
Quantity
8
7
6
5
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
4
0.545
0.2 0.1
S
1.27
0.42 0.1
Direction of feed
1pin
0.1
S
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
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2009.05 - Rev.A
18/18
Notice
N o t e s
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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