BD16912EFV-C_技术文档

Datasheet

Motor/Actuator Driver DC Brush Motor Series

40V/3A Rating H Bridge Driver

for Automotive

BD16912EFV-C

General Description

Key Specifications

 Operating Power Supply Voltage Range:6 V to 18 V

 Motor Drive Output Current Rating: 3 A

 Junction Temperature Range: –40 °C to +150 °C

 Motor Drive Output ON Resistance(Sum of High Side

BD16912EFV-C is a 1-ch H-bridge DMOS FET driver for

automotive application.

High efficiency driving is possible by direct PWM control

or constant current PWM control.

It is equipped with Output Current Detection Amplifier,

Abnormality Detection Signal Output, low ON resistance

and small package, contributing to high reliability, low

power consumption and space saving of the set.

and Low Side):

0.36 Ω during V_VS=12 V (Typ)

Package

HTSSOP-B20

W (Typ) x D (Typ) x H (Max)

6.50 mm x 6.40 mm x 1.00 mm

Features

 AEC-Q100 Qualified ^{(Note 1)}

 Small Package with Backside Exposed PAD

 Driver with Built-in Power DMOS FET

 2 Input Control (Forward Rotation, Reverse Rotation,

Idle Rotation, Brake)

 Direct PWM Control

 Constant Current PWM Control (Current limit)

 Power Save (Standby)

 Through Current Prevention

 Output Current Detection Amplifier

 Abnormality Detection Signal Output

 Abnormality Detection (Over Current, Over Voltage,

Thermal Shutdown: TSD, Thermal Warning: TW)

 Output Protection (Over Current, Over Voltage,

Thermal Shutdown: TSD)

HTSSOP-B20

Application

 Under Voltage Lock Out: UVLO

 Automotive DC Brush Motor

(Note 1) Grade 1

Typical Application Circuit

5V

1

2

GND

IN+

ST2

ST1

20

19

18

17

16

15

14

13

12

11

Controller

3

IN−

AMPO

N.C.

VS

4

PSB

VREF

N.C.

OUT+

RNF

5

12V

6

VS

7

OUT−

GND

CS

8

9

10

M

Figure 1. Basic Application Circuit

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays

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Contents

General Description........................................................................................................................................................................1

Features..........................................................................................................................................................................................1

Key Specifications ..........................................................................................................................................................................1

Package..........................................................................................................................................................................................1

Application ......................................................................................................................................................................................1

Typical Application Circuit ...............................................................................................................................................................1

Contents .........................................................................................................................................................................................2

Absolute Maximum Ratings ............................................................................................................................................................3

Recommended Operating Conditions.............................................................................................................................................3

Thermal Resistance........................................................................................................................................................................3

Pin Configuration ............................................................................................................................................................................4

Block Diagram ................................................................................................................................................................................4

Pin Description................................................................................................................................................................................4

I / O Truth Table ..............................................................................................................................................................................5

Electrical Characteristics.................................................................................................................................................................6

Typical Performance Curves...........................................................................................................................................................8

Application Example .....................................................................................................................................................................24

1.

2.

Variable Speed Control Application by Direct PWM Control. ..........................................................................................24

Variable Speed Control Application by Constant Current PWM Control .........................................................................25

Description of Blocks ....................................................................................................................................................................26

1.

2.

3.

4.

5.

6.

7.

8.

Under Voltage Lock Out: UVLO......................................................................................................................................26

Over Voltage Protection: OVP........................................................................................................................................26

Over Current Protection: OCP........................................................................................................................................27

Thermal Warning: TW, Thermal Shutdown: TSD............................................................................................................28

Direct PWM Control........................................................................................................................................................29

Output Current Detection Amp (AMPO Pin) ...................................................................................................................30

Constant Current PWM Control (Current Limit)..............................................................................................................30

Power Save (PSB Pin) ...................................................................................................................................................31

I / O Equivalence Circuits..............................................................................................................................................................32

Heat Loss......................................................................................................................................................................................33

1.

2.

3.

Thermal Resistance........................................................................................................................................................33

Power Dissipation...........................................................................................................................................................33

Thermal De-rating Curve................................................................................................................................................33

Safety Measures...........................................................................................................................................................................34

1.

2.

3.

4.

Countermeasure against Destruction of Reverse Connection Power Supply.................................................................34

Measures to Raise the Power Supply Pin Voltage by Back Electromotive Force...........................................................34

Countermeasures against Unstable Power Supply ........................................................................................................35

Prohibition of Ground Line PWM Switching Input...........................................................................................................35

Operational Notes.........................................................................................................................................................................36

Ordering Information.....................................................................................................................................................................38

Marking Diagram ..........................................................................................................................................................................38

Physical Dimension and Packing Information...............................................................................................................................39

Revision History............................................................................................................................................................................40

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Absolute Maximum Ratings (Ta=25°C)

Parameter

Symbol

V_VS

V_O

Rating

Unit

V

Power Supply Voltage

–0.3 to +40

–3.0 to +3.0^{(Note 1)}

–0.3 to +1

Motor Drive Output (OUT+, OUT–) Voltage

Motor Drive Output (OUT+, OUT–) Current

Motor Drive Ground (RNF) Voltage

V

I_O

A

V_RNF

V_ST

V

Abnormality Detection Signal (ST1, ST2) Output Voltage

Abnormality Detection Signal (ST1, ST2) Output Current

Motor Drive Current Detection Signal (AMPO) Output Voltage

Motor Drive Current Detection Signal (AMPO) Output Current

Control Input Voltage (IN+, IN–, PSB, CS, VREF)

Junction Temperature

–0.3 to +7

V

I_ST

0 to 10

mA

V

V_AMPO

I_AMPO

V_IN

–0.3 to +3.6

–0.05 to +0.3

–0.3 to +7

mA

V

Tj

–40 to +150

–55 to +150

°C

Storage Temperature Range

Tstg

For the current parameter, the current inflow into the IC is indicated as a positive notation, and the current outflow from the IC as a negative notation.

(Note 1) Do not exceed power dissipation (Pd), and area of safe operation (ASO).

The power dissipation is determined by the maximum junction temperature, the thermal resistance in the board’s mounted state, and the ambient

temperature.

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration

by increasing board size and copper area so as not to exceed the maximum junction temperature rating.

Recommended Operating Conditions

Limit

Parameter

Symbol

Unit

Min

6

Typ

12

–

Max

18

Power Supply Voltage

Operating Temperature

V_VS

Topr

f_PWM

V

–40

–

+125

100

°C

Control Input PWM Frequency (IN+, IN–)

–

kHz

Thermal Resistance^{(Note 2)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 4)}

2s2p^{(Note 5)}

HTSSOP-B20

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 3)}

θ_JA

°C/W

143.0

8

26.8

4

Ψ_JT

(Note 2) Based on JESD51-2A(Still-Air).

(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 4) Using a PCB board based on JESD51-3.

(Note 5) Using a PCB board based on JESD51-5, 7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

70 μm

Footprints and Traces

Thermal Via^{(Note 6)}

Layer Number of

Measurement Board

Material

FR-4

Board Size

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

Pitch

Diameter

4 Layers

1.20 mm

Φ0.30 mm

Top

Copper Pattern

Bottom

Thickness

70 μm

Copper Pattern

Thickness

35 μm

Copper Pattern

Thickness

70 μm

Footprints and Traces

74.2 mm x 74.2 mm

(Note 6) This thermal via connects with the copper pattern of all layers.

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Pin Configuration

Block Diagram

VS

(TOP VIEW)

15 16

1

20

19

18

17

16

15

14

13

12

11

GND

ST2

Power Supply

Clamper

V source

I source

UVLO

2

IN+

ST1

3

PSB

IN+

IN–

Power

Save

Power ON

Reset

4

2

Clock

IN-

AMPO

N.C.

VS

4

OUT+

OUT–

RNF

PSB

7

8

5

VREF

Package Rear

Exposed PAD

EXP-PAD

Control

Logic

Pre

Driver

H Brigde

3

6

N.C.

VS

CURRENT

LIMITATION COMP.

7

5

13 14

OUT+

OUT-

GND

CS

VREF

CURRENT

DETECTION

8

OUT+

AMPO

CS

AMP.

18

19

20

1

x5

11

10

9

RNF

TSD

TW

ST1

10

9

RNF

ST2

OCP

OVP

GND

12

EXP-PAD

–

Pin Description

Pin No. Pin Name

Function

Pin No. Pin Name

Function

Motor output current detection amplifier

input

1

GND

Ground (small signal ground)

11

CS

Motor drive logic input +

Motor drive logic input –

2

3

4

5

6

7

IN+

IN–

12

13

14

15

16

17

GND

Ground (small signal ground)

OUT– Motor drive output –

PSB

Power save input

VREF Motor drive current setting voltage input

VS

Power supply

N.C.

No connection

Motor drive output +

Power supply

OUT+

N.C.

No connection

Motor drive output +

Motor output current detection amplifier

output

8

OUT+

18

AMPO

Motor drive ground

9

RNF

19

20

–

ST1

ST2

Abnormality detection signal 1 output

Abnormality detection signal 2 output

10

EXP-PAD Package rear exposed PAD

Although the unconnected pin (NC) is not connected inside the IC, there is a possibility of causing unexpected troubles such as oscillation, so open on the

board pattern without making it as a relay point for other wiring.

Motor drive related pins (VS, RNF, OUT+, OUT–) are short-circuited within the IC within the same name, but in order to lower the impedance of the motor drive

current path, short between the same name pins on the board pattern.

Package Rear Exposed PAD should be at the same potential as the ground pin.

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I / O Truth Table

Signal Output

(During Resistance Pull-up for

ST1 and ST2)

Driver Input

Driver Output

Driver Output State

Name

PSB

L

IN+

X

IN–

X

OUT+

OUT–

Hi-Z

L

ST1

H

ST2

H

AMPO

L

Hi-Z

H

Power Save

Idle Rotation

Forward Rotation

Reverse Rotation

Brake

H

L

Active

H

L

H

L

H

L

H

L

H: High, L: Low, X: Don’t care, Hi-Z: High impedance

Signal Output ^{(Note 1)}

Driver State

Driver Output

(During Resistance Pull-up for

ST1 and ST2)

UVLO

Disable

Enable

Disable

OCP

TW

TSD

OVP

OUT+

Active

Hi-Z

Active

Hi-Z

L

OUT–

Active

Hi-Z

Active

Hi-Z

L

ST1

H

L

ST2

H

L

AMPO

Active

L

Disable

X

Disable

X

Disable

X

Disable

X

Enable

Disable

Enable

Disable

Enable

Disable

Enable

Disable

Enable

Disable

Enable

Disable

Enable

Disable

Enable

Disable

Enable

Disable

Enable

Disable

Enable

Active

M

L

H

L

Hi-Z

L

Hi-Z

L

M

L

Hi-Z

L

H: High, M: Middle, L: Low, X: Don’t care, Hi-Z: High impedance

If both IN+ and IN–are Low, driver output goes to Hi-Z although over voltage is detected.

(Note 1) 4.7 kΩ for ST1, Middle for pull up

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Electrical Characteristics

(Unless otherwise specified Tj=–40 °C to +150 °C, V_VS=6 V to 18 V, V_PSB=5 V, V_CS=V_RNF=0 V, V_VREF=5 V)

Limit

Parameter

Circuit Current (During Operation)

Circuit Current (At Standby)

Symbol

I_Q

I_STBY1

I_STBY2

Unit

Condition

Min

-

Typ

3

Max

6

mA V_PSB=H

V_PSB=L, Tj=–40 °C to

+125 °C

-

0

-

10

40

μA

V_PSB=L, Tj=+125 °C to

+150 °C

Circuit Current (At Standby)

V_VS=6 V to 12 V, I_O=±2 A,

Tj=+25 °C, Sum of High Side

and Low Side

Motor Drive Output ON Resistance 1

R_ON1

R_ON2

R_ON3

R_ON4

R_ON5

R_ON6

-

0.40

0.59

0.56

0.45

0.88

0.43

0.83

Ω

V_VS=12 V to 18 V, I_O=±2 A,

Tj=+25 °C, Sum of High Side

and Low Side

Motor Drive Output ON Resistance 2

0.36

V_VS=6 V to 12 V, I_O=±2 A,

Tj=–40 °C, Sum of High Side

and Low Side

Motor Drive Output ON Resistance 3

(Reference Value) ^{(Note 1)}

-

V_VS=6 V to 12 V, I_O=±2 A,

Tj=+150 °C, Sum of High

Side and Low Side

Motor Drive Output ON Resistance 4

(Reference Value) ^{(Note 1)}

V_VS=12 V to 18 V, I_O=±2 A,

Tj=–40 °C, Sum of High Side

and Low Side

Motor Drive Output ON Resistance 5

(Reference Value) ^{(Note 1)}

V_VS=12 V to 18 V, I_O=±2 A,

Tj=+150 °C, Sum of High

Side and Low Side

Motor Drive Output ON Resistance 6

(Reference Value) ^{(Note 1)}

Motor Drive Output Higher-Side

V_FOH1

V_FOH2

V_FOH3

V_FOL1

V_FOL2

V_FOL3

-

1.0

1.3

1.4

1.2

1.3

1.4

1.2

V

I_O=+2 A, Tj=+25 °C

I_O=+2 A, Tj=–40 °C

I_O=+2 A, Tj=+150 °C

I_O=–2 A, Tj=+25 °C

I_O=–2 A, Tj=–40 °C

I_O=–2 A, Tj=+150 °C

Body Diode Voltage 1

Motor Drive Output Higher-Side

Body Diode Voltage 2 (Reference Value) ^{(Note 1)}

-

Motor Drive Output Higher-Side

-

1.0

-

Body Diode Voltage 3 (Reference Value) ^{(Note 1)}

Motor Drive Output Lower-Side

Body Diode Voltage 1

Motor Drive Output Lower-Side

Body Diode Voltage 2 (Reference Value) ^{(Note 1)}

Motor Drive Output Lower-Side

-

Body Diode Voltage 3 (Reference Value) ^{(Note 1)}

Motor Drive Output Higher-Side Leakage Current

Motor Drive Output Lower-Side Leakage Current

Abnormality Detection Signal ST1 Output Middle

Output Impedance (Reference Value) ^{(Note 1)}

Abnormality Detection Signal

I_OLH

I_OLL

–40

-

μA V_O=0 V

μA V_O=V_VS

20

I_ST1=+0.5 mA, Thermal

R_ST1

V_STL1

V_STL2

I_ST

3.3

4.7

0.1

-

6.1

0.3

10

kΩ

V

Warning (TW)

I_ST1=+1.1 mA, Overcurrent

Detection

-

ST1 Output Low Voltage

Abnormality Detection Signal

I_ST2=+1.1 mA, Overvoltage

Detection

V

ST2 Output Low Voltage

Abnormality Detection Signal

μA V_ST=7 V

Output Leakage Current

Motor Drive Logic Input High Level Input Voltage

Motor Drive Logic Input Low Level Input Voltage

Motor Drive Logic Input High Level Input Current

Motor Drive Logic Input Low Level Input Current

V_INH

V_INL

I_INH

I_INL

2.5

-

V

0.8

100

+10

V

25

–10

50

0

μA V_IN+, V_IN–=5 V

μA V_IN+, V_IN–=0 V

For the current parameter, the current inflow into the IC is indicated as a positive notation, and the current outflow from the IC as a negative notation.

(Note 1) Reference value is the design value on which evaluation confirmation was carried out, and shipment inspection is not carried out.

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Electrical Characteristics - continued

(Unless otherwise specified Tj=–40 °C to +150 °C, V_VS=6 V to 18 V, V_PSB=5 V, V_CS=V_RNF=0 V, V_VREF=5 V)

Limit

Parameter

Symbol

Unit

Condition

Min

2.7

-

Typ

-

Max

-

Power Save Input High Voltage

Power Save Input Low Voltage

Power Save Input High Current

Power Save Input Low Current

CS Pin Input Bias Current

V_PSBH

V_PSBL

I_PSBH

I_PSBL

I_CS

V

-

0.8

V

25

50

0

100

+10

+0.1

μA V_PSB=5 V

μA V_PSB=0 V

–10

–0.1

0

μA V_CS=0 V to 1 V

μA V_VREF=0 V to 5 V

VREF Pin Input Bias Current

I_VREF

0

Motor Drive Current Setting Input Voltage Range

(Constant Current PWM Control Setting Range)

AMPO Output Saturation Voltage

Current Limit Comparator Offset Voltage

Motor Output Current Detection Amplifier

Output Voltage 1

V_RVREF

0

-

2.8

V

V_AMPOMAX

V_OFFSET

-

3.0

0

3.2

V

V_CS=0.7 V

–20

+20

mV V_AMPO=0 V to 2.8 V

V_AMPO1

V_AMPO2

G_AMP

0.4

2.25

4.8

0.5

2.5

5.0

33

0.6

2.75

5.2

V

V_CS1=0.1 V

Motor Output Current Detection Amplifier

Output Voltage 2

V_CS2=0.5 V

G_AMP=(V_AMPO2-V_AMPO1)/(V_CS2

-

Motor Output Current Detection Amplifier Gain

V/V

kHz

V_CS1

)

For Constant Current PWM

Control

Constant Current PWM Control Carrier Frequency f_VREF

19

49

OCP Detect Current

I_OCP

3.0

-

8.0

0.7

8

A

μs

ms

V

OCP Output ON Time (Reference Value) ^{(Note 1)}

OCP Output OFF Time

OVP Detect Voltage

t_ON

-

2

0.4

4

t_OFF

V_OVPON

V_OVPHYS

30

-

33

2

36

-

OVP Hysteresis

V

TSD Detect Temperature (Reference Value) ^{(Note 1)}T_TSDON

150

-

175

25

160

25

5.0

0.5

200

-

°C

V

TSD Hysteresis (Reference Value) ^{(Note 1)}

TW Detect Temperature (Reference Value) ^{(Note 1)}

TW Hysteresis (Reference Value) ^{(Note 1)}

UVLO Detect Voltage

T_TSDHYS

T_TWON

135

-

185

-

T_TWHYS

V_UVLOON

V_UVLOHYS

4.5

-

5.5

-

UVLO Hysteresis

V

From IN+, IN– to OUT+,

OUT–

Motor Drive I/O Delay Time ^(Note2)

t_INOUT

-

10

μs

For the current parameter, the current inflow into the IC is indicated as a positive notation, and the current outflow from the IC as a negative notation.

(Note 1) Reference value is the design value on which evaluation confirmation was carried out, and shipment inspection is not carried out.

(Note 2) t_INOUTis total delay time of logic and through current prevention.

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Typical Performance Curves

(Reference Data)

6.0

5.0

4.0

3.0

2.0

1.0

0.0

V_PSB=5 V

V_IN+=0 V

V_IN-=0 V

V_PSB=5 V

V_IN+=0 V

V_IN-=5 V

5.0

4.0

3.0

2.0

1.0

0.0

+150 °C

+25 °C

-40 °C

+150 °C

+25 °C

-40 °C

Operating Voltage Range

0

5

10

15

20

0

5

10

15

20

Power Supply Voltage : V_VS[V]

Figure 2. Circuit Current vs Power Supply Voltage

(During Operation, V_IN+/V_IN-=L/L)

Figure 3. Circuit Current vs Power Supply Voltage

(During Operation, V_IN+/V_IN-=L/H)

6.0

V_PSB=5 V

V_IN+=5 V

V_IN-=0 V

V_PSB=5 V

V_IN+=5 V

V_IN-=5 V

5.0

4.0

3.0

2.0

1.0

0.0

5.0

4.0

3.0

2.0

1.0

0.0

+150 °C

+25 °C

-40 °C

+150 °C

+25 °C

-40 °C

Operating Voltage Range

0

5

10

15

20

0

5

10

15

20

Power Supply Voltage : V_VS[V]

Figure 4. Circuit Current vs Power Supply Voltage

(During Operation, V_IN+/V_IN-=H/L)

Figure 5. Circuit Current vs Power Supply Voltage

(During Operation, V_IN+/V_IN-=H/H)

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Typical Performance Curves - continued

(Reference Data)

10

40

30

20

10

0

V_PSB=0 V

8

6

4

Operating Voltage Range

2

+25 °C

-40 °C

+150 °C

0

5

10

15

20

0

5

10

15

20

Power Supply Voltage : V_VS[V]

Figure 6. Circuit Current vs Power Supply Voltage

(At Standby)

Figure 7. Circuit Current vs Power Supply Voltage

(At Standby)

1.0

V_VS=6 V

0.8

0.6

0.4

0.2

0.0

0.8

0.6

0.4

0.2

0.0

+150 °C

+25 °C

-40 °C

+150 °C

+25 °C

-40 °C

0

1

2

3

0

1

2

3

Motor Drive Output Current : I_OUT[A]

Figure 8. Motor Drive Output ON Resistance

vs Motor Drive Output Current

Figure 9. Motor Drive Output ON Resistance

vs Motor Drive Output Current

(Sum of OUT+ High Side + OUT- Low Side)

(Sum of OUT+ Low Side + OUT- High Side)

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Typical Performance Curves - continued

(Reference Data)

1.0

0.8

0.6

0.4

0.2

0.0

V_VS=12 V

0.8

0.6

0.4

0.2

0.0

+150 °C

+25 °C

-40 °C

+150 °C

+25 °C

-40 °C

0

1

2

3

0

1

2

3

Motor Drive Output Current : I_OUT[A]

Figure 10. Motor Drive Output ON Resistance

vs Motor Drive Output Current

Figure 11. Motor Drive Output ON Resistance

vs Motor Drive Output Current

(Sum of OUT+ High Side + OUT- Low Side)

(Sum of OUT+ Low Side + OUT- High Side)

1.0

0.8

0.6

0.4

0.2

0.0

1.0

0.8

0.6

0.4

0.2

0.0

V_VS=18 V

+150 °C

+25 °C

-40 °C

+150 °C

+25 °C

-40 °C

0

1

2

3

0

1

2

3

Motor Drive Output Current : I_OUT[A]

Figure 12. Motor Drive Output ON Resistance

vs Motor Drive Output Current

Figure 13. Motor Drive Output ON Resistance

vs Motor Drive Output Current

(Sum of OUT+ High Side + OUT- Low Side)

(Sum of OUT+ Low Side + OUT- High Side)

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Typical Performance Curves - continued

(Reference Data)

1.0

0.8

0.6

0.4

0.2

0.0

I_O=2 A

0.8

0.6

+150 °C

+25 °C

-40 °C

+150 °C

+25 °C

-40 °C

0.4

0.2

0.0

Operating Voltage Range

0

5

10

15

20

0

5

10

15

20

Power Supply Voltage : V_VS[V]

Figure 14. Motor Drive Output ON Resistance

vs Power Supply Voltage

Figure 15. Motor Drive Output ON Resistance

vs Power Supply Voltage

(Sum of OUT+ High Side + OUT- Low Side)

(Sum of OUT+ Low Side + OUT- High Side)

1.4

1.0

0.6

0.2

1.4

1.0

0.6

0.2

-40 °C

+25 °C

+150 °C

-40 °C

+25 °C

+150 °C

0

1

2

3

0

1

2

3

Motor Drive Output Current : I_OUT[A]

Figure 16. Motor Drive Output High Side Body Diode Voltage Figure 17. Motor Drive Output High Side Body Diode Voltage

vs Motor Drive Output Current

(OUT+)

vs Motor Drive Output Current

(OUT-)

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BD16912EFV-C

Typical Performance Curves - continued

(Reference Data)

1.4

1.0

1.4

1.0

0.6

0.2

-40 °C

+25 °C

+150 °C

-40 °C

+25 °C

+150 °C

0.6

0.2

-3

-2

-1

0

-3

-2

-1

0

Motor Drive Output Current : I_OUT[A]

Figure 18. Motor Drive Output Low Side Body Diode Voltage

Figure 19. Motor Drive Output Low Side Body Diode Voltage

vs Motor Drive Output Current

(OUT+)

vs Motor Drive Output Current

(OUT-)

40

V_VS=18 V

V_O=0 V

V_VS=18 V

V_O=0 V

30

20

30

20

10

Junction Temperature Range

0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature : Tj [°C]

Figure 20. Motor Drive Output Higher-Side Leakage Current

Figure 21. Motor Drive Output Higher-Side Leakage Current

vs Junction Temperature

(OUT+)

vs Junction Temperature

(OUT-)

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Typical Performance Curves - continued

(Reference Data)

20

15

10

5

V_VS=18 V

V_O=18 V

V_VS=18 V

V_O=18 V

15

10

5

Junction Temperature Range

0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature : Tj [°C]

Figure 22. Motor Drive Output Lower-Side Leakage Current

Figure 23. Motor Drive Output Lower-Side Leakage Current

vs Junction Temperature

(OUT+)

vs Junction Temperature

(OUT-)

6.1

0.30

Overcurrent

Detection

IST1=+0.5 mA

Thermal Warning

5.7

0.25

5.3

4.9

4.5

0.20

+150 °C

+25 °C

-40 °C

0.15

0.10

0.05

0.00

4.1

TW Detect Temperature Range

3.7

Junction Temperature Range

3.3

-50

0

50

100

150

200

0

2

4

6

8

10

Junction Temperature : Tj [°C]

ST1 Current : I_ST1[mA]

Figure 24. Abnormality Detection Signal ST1 Output

Middle Output Impedance vs Junction Temperature

Figure 25. Abnormality Detection Signal ST1 Output

Low Voltage vs ST1 Current

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Typical Performance Curves - continued

(Reference Data)

0.30

10

8

V_ST1=7 V

Overcurrent

Detection

0.25

0.20

6

+150 °C

+25 °C

-40 °C

0.15

0.10

0.05

0.00

4

2

Junction Temperature Range

0

2

4

6

8

10

-50

0

50

100

150

ST2 Current : I_ST2[mA]

Junction Temperature : Tj [°C]

Figure 26. Abnormality Detection Signal ST2 Output

Low Voltage vs ST2 Current

Figure 27. Abnormality Detection Signal Output

Leakage Current vs Junction Temperature

(ST1)

10

V_ST2=7 V

2.4

2.0

1.6

1.2

0.8

8

6

4

+150 °C

+25 °C

-40 °C

+25 °C

-40 °C

150 °C

2

Operating Voltage Range

Junction Temperature Range

0

-50

0

50

100

150

0

5

10

15

20

Junction Temperature : Tj [°C]

Power Supply Voltage : V_VS[V]

Figure 28. Abnormality Detection Signal Output

Leakage Current vs Junction Temperature

(ST2)

Figure 29. Motor Drive Logic Input High/Low Level

Input Voltage vs Power Supply Voltage

(IN+)

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Typical Performance Curves - continued

(Reference Data)

100

75

50

25

0

2.4

+150 °C

+25 °C

-40 °C

2.0

+25 °C

-40 °C

+150 °C

1.6

1.2

0.8

+150 °C

+25 °C

-40 °C

Operating Voltage Range

0

5

10

15

20

0

1

2

3

4

5

Power Supply Voltage : V_VS[V]

IN+ Voltage : V_IN+[V]

Figure 30. Motor Drive Logic Input High/Low Level

Input Voltage vs Power Supply Voltage

(IN-)

Figure 31. Motor Drive Logic Input High/Low Level

Input Current vs Control Input Voltage

(IN+)

100

2.4

75

50

25

0

-40 °C

+25 °C

+150 °C

2.0

1.6

1.2

0.8

+150 °C

+25 °C

-40 °C

Operating Voltage Range

0

1

2

3

4

5

0

5

10

15

20

IN- Voltage : V_IN-[V]

Power Supply Voltage : V_VS[V]

Figure 32. Motor Drive Logic Input High/Low Level

Input Current vs Control Input Voltage

(IN-)

Figure 33. Power Save Input High/Low Voltage

vs Power Supply Voltage

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Typical Performance Curves - continued

(Reference Data)

100

75

0.10

0.05

+150 °C

+25 °C

-40 °C

50

0.00

+150 °C

+25 °C

-40 °C

25

0

-0.05

-0.10

0

1

2

3

4

5

0.0

0.2

0.4

0.6

0.8

1.0

PSB Voltage : V_PSB[V]

CS Voltage : V_CS[V]

Figure 34. Power Save Input High/Low Current vs PSB Voltage

Figure 35. CS Pin Input Bias Current vs CS Voltage

0.10

3.5

3.0

2.5

2.0

0.05

+150 °C

+25 °C

-40 °C

+150 °C

+25 °C

-40 °C

0.00

-0.05

-0.10

Constant

Current PWM

Control Setting

Range:

1.5

1.0

0.5

0.0

V_RVREF

0

1

2

3

4

5

0.00

0.25

0.50

0.75

1.00

VREF Voltage : V_VREF[V]

CS Voltage : V_CS[V]

Figure 36. VREF Pin Input Bias Current vs VREF Voltage

Figure 37. Motor Drive Current Detection Signal (AMPO)

Output Voltage vs CS Voltage

(Motor Drive Current Setting Input Voltage Range

(Constant Current PWM Control Setting Range))

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Typical Performance Curves - continued

(Reference Data)

3.50

20

15

10

5

V_CS=0.7 V

3.25

+150 °C

+25 °C

-40 °C

+150 °C

3.00

2.75

2.50

+25 °C

-40 °C

0

-5

-10

-15

-20

Operating Voltage Range

0

5

10

15

20

0.0

0.5

1.0

1.5

2.0

2.5

Motor Drive Current Detection Signal (AMPO)

Output Voltage : V_AMPO[V]

Power Supply Voltage : V_VS[V]

Figure 38. AMPO Output Saturation Voltage

vs Power Supply Voltage

Figure 39. Current Limit Comparator Offset Voltage vs

Motor Drive Current Detection Signal (AMPO) Output Voltage

0.60

0.55

0.50

0.45

0.40

2.75

V_CS=0.1 V

V_CS=0.5 V

2.65

2.55

+150 °C

+25 °C

-40 °C

+150 °C

+25 °C

-40 °C

2.45

2.35

Operating Voltage Range

2.25

0

5

10

15

20

0

5

10

15

20

Power Supply Voltage : V_VS[V]

Figure 40. Motor Output Current Detection Amplifier

Output Voltage 1 vs Power Supply Voltage

Figure 41. Motor Output Current Detection Amplifier

Output Voltage 2 vs Power Supply Voltage

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Typical Performance Curves - continued

(Reference Data)

5.2

49.0

44.0

39.0

34.0

29.0

24.0

19.0

V_VREF=1.4 V

V_RNF=V_CS

For Constant Current PWM Control

V_CS=0.1 V to 0.5 V

5.1

+150 °C

+25 °C

-40 °C

5.0

4.9

4.8

+150 °C

+25 °C

-40 °C

Operating Voltage Range

0

5

10

15

20

0

5

10

15

20

Power Supply Voltage : V_VS[V]

Figure 42. Motor Output Current Detection Amplifier Gain

vs Power Supply Voltage

Figure 43. Constant Current PWM Control Carrier Frequency

vs Power Supply Voltage

8.0

7.0

V_VS=6 V

12 V

18 V

12 V

18 V

6.0

5.0

4.0

3.0

6.0

5.0

4.0

3.0

Junction Temperature Range

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature : Tj [°C]

Figure 44. OCP Detect Current vs Junction Temperature

Figure 45. OCP Detect Current vs Junction Temperature

(OUT- High Side)

(OUT+ High Side)

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BD16912EFV-C

Typical Performance Curves - continued

(Reference Data)

8.0

7.0

8.0

7.0

6.0

5.0

4.0

3.0

6.0

5.0

4.0

3.0

V_VS=6 V

12 V

V_VS=6 V

12 V

18 V

Junction Temperature Range

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature : Tj [°C]

Figure 46. OCP Detect Current vs Junction Temperature

(OUT+ Low Side)

Figure 47. OCP Detect Current vs Junction Temperature

(OUT- Low Side)

0.7

0.6

8.0

7.0

6.0

5.0

0.5

-40 °C

+25 °C

+150 °C

0.4

0.3

0.2

0.1

0.0

-40 °C

+25 °C

+150 °C

4.0

3.0

2.0

Operating Voltage Range

0

5

10

15

20

0

5

10

15

20

Power Supply Voltage : V_VS[V]

Figure 48. OCP Output ON Time vs Power Supply Voltage

Figure 49. OCP Output OFF Time vs Power Supply Voltage

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Typical Performance Curves - continued

(Reference Data)

36

35

34

33

32

3.0

2.5

2.0

1.5

1.0

31

Junction Temperature Range

30

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature : Tj [°C]

Figure 50. OVP Detect Voltage vs Junction Temperature

Figure 51. OVP Hysteresis vs Junction Temperature

200

190

180

170

50

40

30

20

160

10

Operating Voltage Range

150

0

5

10

15

20

0

5

10

15

20

Power Supply Voltage : V_VS[V]

Figure 52. TSD Detect Temperature vs Power Supply Voltage

Figure 53. TSD Hysteresis vs Power Supply Voltage

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Typical Performance Curves - continued

(Reference Data)

185

175

165

155

40

35

30

25

20

15

10

145

Operating Voltage Range

135

0

5

10

15

20

0

5

10

15

20

Power Supply Voltage : V_VS[V]

Figure 54. TW Detect Temperature vs Power Supply Voltage

Figure 55. TW Hysteresis vs Power Supply Voltage

5.50

5.25

5.00

0.80

0.70

0.60

0.50

0.40

4.75

0.30

Junction Temperature Range

4.50

0.20

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature : Tj [°C]

Figure 56. UVLO Detect Voltage vs Junction Temperature

Figure 57. UVLO Hysteresis vs Junction Temperature

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Typical Performance Curves - continued

(Reference Data)

100

10

1

V_VS=28 V

Ta=25 °C

X : Breakdown Point

V_VS=28 V

Ta=25 °C

X : Breakdown Point

10

1

Motor Drive Output Current Range

0.1

1

10

100

1000

0.1

1

10

100

1000

Current Pulse ON Time : t_DSON[ms]

Figure 58. Drain-Source Current vs Current Pulse ON Time

(Motor Drive Output Channel Operating Limit,

Output High State, OUT+ Higher MOS)

Figure 59. Drain-Source Current vs Current Pulse ON Time

(Motor Drive Output Channel Operating Limit,

Output High State, OUT- Higher MOS)

100

X : Breakdown Point

V_VS=28 V

Ta=25 °C

X : Breakdown Point

V_VS=28 V

Ta=25 °C

10

1

Motor Drive Output Current Range

0.1

1

10

100

1000

0.1

1

10

100

1000

Current Pulse ON Time : t_DSON[ms]

Figure 60. Drain-Source Current vs Current Pulse ON Time

(Motor Drive Output Channel Operating Limit,

Output Low State, OUT+ Lower MOS)

Figure 61. Drain-Source Current vs Current Pulse ON Time

(Motor Drive Output Channel Operating Limit,

Output Low State, OUT- Lower MOS)

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Typical Performance Curves - continued

(Reference Data)

100

10

1

X : Breakdown Point

V_VS=28 V

Ta=150 °C

V_VS=28 V

Ta=150 °C

10

1

Motor Drive Output Current Range

0.1

1

10

100

1000

0.1

1

10

100

1000

Current Pulse ON Time : t_D[ms]

Figure 62. Body Diode Current vs Current Pulse ON Time

(Motor Drive Output Body Diode Operating Limit,

Output Hi-Z State, OUT+, OUT- Higher MOS)

Figure 63. Body Diode Current vs Current Pulse ON Time

(Motor Drive Output Body Diode Operating Limit,

Output Hi-Z State, OUT+, OUT- Lower MOS)

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BD16912EFV-C

Application Example

(External components can be used if necessary. Refer to the below values.)

1. Variable Speed Control Application by Direct PWM Control.

This is an application circuit example that directly PWM controls the motor drive output by the PWM duty input to the

motor drive logic input pin (IN+, IN-) and varies the motor rotation speed.

Bypass Capacitor and Voltage Clamp Zener Diodes.

Located near the power supply pin and on the side of the

current inflow path as countermeasures against power rise by

disturbance and regenerative braking

VS

15 16

Power Supply

Clamper

V Source

I Source

UVLO

Reverse Protection Diode

Noise removal snubber.

Insert if necessary.

PSB

IN+

IN–

Power

Save

Power ON

Reset

4

2

Clock

OUT+

OUT–

RNF

7

8

Controls the number

of motor rotations by

input of PWM duty

Control

Logic

Pre

Driver

H Bridge

3

M

5 V

CURRENT

LIMITATION COMP.

Controller

5

13 14

VREF

CURRENT

DETECTION

0 Ω

to 10 kΩ

AMPO

CS

100 pF

to 1 μF

AMP.

18

19

20

1

x5

11

10

5 V

1 kΩ

TSD

TW

to 47 kΩ

ST1

9

5 V

0 Ω

to 1 Ω

1 kΩ

to 47 kΩ

ST2

OCP

OVP

GND

12

EXP-PAD

–

Because the abnormality

detection signal is an open

drain output, connect a pull-

up resistor externally

RNF voltage false

Motor drive current

detection resistor.

Pay attention to the

power consumption of

resistance.

detection prevention low

pass filter.

Insert if necessary.

Pay attention to the

common impedance with

the current detection path.

Figure 64. Direct PWM Control Application Circuit

OUT± Pins

Current: I_O[A]

When VREF voltage＞3.2 V

(Current Limit Function OFF)

I_SET

Current limit setting (I_SET) can

be varied by VREF voltage

IN± Pins

PWM Input

ON Duty

D_IN[%]

0

100

Figure 65. OUT± Pins Current vs VREF Pin Input Voltage

Characteristic Image

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BD16912EFV-C

Application Example - continued

(External components can be used if necessary. Refer to the below values.)

2. Variable Speed Control Application by Constant Current PWM Control

This is an application circuit example in which the motor drive output is subjected to constant current PWM control

depending on the DC voltage that is input to the motor drive current setting voltage input pin (VREF), and varies the

motor rotation speed.

Bypass Capacitor and Voltage Clamp Zener Diodes.

Located near the power supply pin and on the side of the

current inflow path as countermeasures against power rise by

disturbance and regenerative braking

VS

15 16

Power Supply

Clamper

V source

I Source

UVLO

Noise removal snubber.

Insert if necessary.

Reverse protection diode

PSB

IN+

IN–

Power

Save

Power ON

Reset

4

2

Clock

OUT+

OUT–

RNF

7

8

Input is used to

change the output

state (Forward,

reverse, idling and

brake)

Control

Logic

Pre

H Bridge

3

M

Driver

CURRENT

LIMITATION COMP.

Controller

5

13 14

VREF

CURRENT

DETECTION

0 Ω

to 10 kΩ

Output current is

controlled by DC

voltage to apply on

VREF pin

AMPO

CS

100 pF

to 1 μF

AMP.

18

19

20

1

x5

11

10

5 V

1 kΩ

to 47 kΩ

TSD

TW

ST1

9

5 V

0 Ω

to 1 Ω

1 kΩ

to 47 kΩ

ST2

OCP

OVP

GND

12

EXP-PAD

RNF voltage false

–

Because the abnormality

detection signal is an open

drain output, connect a pull-

up resistor externally

detection prevention low

pass filter.

Motor drive current

detection resistor.

Pay attention to the

power consumption of

resistance.

Insert if necessary.

Pay attention to the

common impedance with

the current detection path.

Figure 66. Constant Current PWM Control Application Circuit

OUT± Pins

Current: I_O[A]

Depending on the

RNF resistance and

Input Duty, output

current adjustment

is possible

VREF Pin

Input Voltage

V_VREF[V]

0

3.0(Typ)

Figure 67. VREF Pin Input Voltage vs OUT± Pins Current

Characteristic Image

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BD16912EFV-C

Description of Blocks

1. Under Voltage Lock Out: UVLO.

When the voltage applied to the VS pin becomes 5.0 V (Typ) or less, the driver output becomes Hi-Z.

It returns when the voltage applied to the VS pin becomes 5.5 V (Typ) or more.

UVLO function, and Abnormality Detection Signal Output ST1 and ST2 are not linked.

Normal

Protection

Normal

VS

V_UVLOOFF=5.5 V (Typ)

V_UVLOON=5.0 V(Typ)

VUVLOHYS=0.5 V(Typ)

ACTIVE

Hi-Z

OUT+,OUT-

Figure 68. UVLO Timing Chart

2. Over Voltage Protection: OVP

When the voltage applied to the VS pin becomes 33 V (Typ) or more, the driver output and the ST2 output becomes

Low.

If the driver output is HI-Z during this state, output remains at HI-Z

It returns when the voltage applied to the VS pin becomes 31 V (Typ) or less.

Normal

Protection

Normal

V_OVPON=33 V(Typ)

V_OVPOFF=31 V(Typ)

V_OVPHYS=2 V(Typ)

VS

ACTIVE

OUT+,OUT-

L

H

L

ST1

H

L

ST2

Figure 69. OVP Timing Chart

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Description of Blocks - continued

3. Over Current Protection: OCP

When the output current exceeds the rated current, OCP is detected at OUT+/OUT– pins, higher/lower sides respectively

and both the driver outputs (OUT+/OUT–) go to Hi-Z at the same time. The driver output turns ON for t_ON=0.4 μs (Typ)

or more and turns OFF for t_OFF=4 ms (Typ).

If overcurrent state is continued, Hi-Z is repeated again. Also, when overcurrent is detected, ST1 goes low and retains

low while the overcurrent continues.

ST1 goes high after t_MASK=1 ms (Typ) once recovering from overcurrent.

Output Load: Abnormal

Output Load: Normal

ACTIVE

Output Load: Normal

OUT+,OUT-

Hi-Z

IOCP

I_O

0

t_ON

t_OFF

t_ON

t_OFF

t_ON

t_OFF

H

ST1

ST2

L

H

L

t_MASK

Figure 70. OCP Timing Chart

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Description of Blocks - continued

4. Thermal Warning: TW, Thermal Shutdown: TSD

To prevent IC from thermal destruction, thermal warning and thermal shutdown are built-in.

Make sure that the junction temperature Tj is 150 °C and below, but if that is crossed by any possibility, and the junction

temperature reaches 160 °C (Typ) or higher, the thermal warning is in operation and ST1 pin voltage V_ST1depends on

the pull up resistance value.

The formula is as follows.

V_PULLUP(External)

R_PULLUP(External)

푅

ꢀꢁꢂ

푉

푆푇1

=

푉_{ꢃꢄꢅꢅꢄꢃ}[V]

ST1(Pin19)

V_ST1

푅

×푅

ꢀꢁꢂ

푃푈퐿퐿푈푃

R_ST1(Internal)=4.7 kΩ(Typ)

where:

V

R

_PULLUPis ST1 pin resistance pull up power supply voltage.

_PULLUPis ST1 pin pull up resistance value.

_STꢆis ST1 pin internal impedance for thermal warning.

NMOS(Internal):ON at TW

Figure 71. ST1 Pin Circuit for TW

R_ST1is 4.7 kΩ (Typ).

If V_PULLUP=5V for example, V_ST1=2.5 V (Middle) for R_PULLUP=4.7 kΩ, V_ST1=0.45 V (Low) for R_PULLUP=47 kΩ.

When the junction temperature further rises to 175 °C (Typ) or more, TSD is in operation and sets the driver output to

Hi-Z. After that, when the temperature reaches 150 °C (Typ) or less, the driver output returns, and when the temperature

reaches 135 °C (Typ) or less, ST1 also returns.

Note: While the thermal warning and thermal shutdown is in operation, ST1 goes the above voltage V_ST1, but since it is

in the state exceeding the rated temperature, there is a possibility that the state of ST1 and other functions cannot be

retained.

Thermal Warning(TW)

Normal

Thermal Shutdown(TSD)

T_TSDON=175 °C(Typ)

T_TWON=160 °C(Typ)

T_TSDOFF=150 °C(Typ)

T_TWOFF=135 °C(Typ)

T_TSDHYS=25 °C(Typ)

T_TWHYS=25 °C(Typ)

Tj

ACTIVE

Hi-Z

OUT+,OUT-

H

M

L

ST1

H

L

ST2

Figure 72 TW, TSD Timing Chart

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Description of Blocks - continued

5. Direct PWM Control

Direct PWM control by IN+ and IN- pins is possible.

There is no restriction to input for pin switching order of PSB, IN+ and IN-.

Regarding the DECAY mode, it supports both SLOW DECAY and FAST DECAY modes.

Because of RNF pin voltage and the output pin voltage may swing to GND or less at the FAST DECAY status, set within

the absolute maximum ratings.

SLOW DECAY (Forward Rotation)

Driver Input

Driver Output

State

PSB

H

IN+

H

IN–

L

OUT+

OUT–

H

L

ON

SLOW DECAY

ON

H

L

H

L

H

L

SLOW DECAY

ON

H

FAST DECAY (Synchronous Rectification, Forward Rotation)

Driver Input

Driver Output

State

PSB

H

IN+

H

IN–

L

OUT+

OUT–

H

L

H

L

ON

FAST DECAY

ON

H

L

H

L

H

L

H

L

H

L

H

L

FAST DECAY

ON

H

SLOW DECAY

FAST DECAY

H

L

IN+

IN-

H

L

H

L

H

L

H

L

OUT+

OUT-

I_O

H

L

(1) (2)

(1)Output ON (2)Current Decay

Figure 73. I/O Waveform of Each DECAY Mode

SLOW DECAY

FAST DECAY

ON→OFF

OFF

ON→OFF

OFF→ON

M

OFF→ON

ON

OFF→ON

ON→OFF

(1) Output ON

(2) Current Decay

(1) Output ON

(2) Current Decay

Figure 74. Current Path of Each DECAY Mode

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Description of Blocks - continued

6. Output Current Detection Amp (AMPO Pin)

The AMPO pin outputs G_AMP=5 times (Typ) of the CS pin voltage with reference to the ground voltage.

For example, V_AMPO=0.5 V (Typ) for V_CS=0.1 V.

By connecting the current detection resistor R_RNFto the RNF pin and connecting it with the CS pin, the AMPO pin voltage

can be used for output current monitoring.

In the case that this function is not used, set the AMPO pin to OPEN.

The AMPO pin has the circuit to limit the output voltage internally. The limit voltage is V_AMPOMAXis 3 V (Typ).

When the AMPO pin voltage exceeds 3.6 V, the test mode function for Mass Production check is enabled and the driver

output is set to Hi-Z. Do not exceed the pin rated 3.6 V and add a capacitor between AMPO pin and GND if necessary

to smooth AMPO pin voltage. In case of that AMPO pin has 25 kΩ (Typ) resistance as output impedance internally and

there will be delay due to additional capacitor and time constant of internal resistance. Note: The delay has effect on

constant current PWM control.

In the case of constant current PWM control and the output current detection amplifier not being used together, set the

VREF pin to be 3.2 V or higher and 7 V or lower, and connect the RNF pin and CS pin to the ground.

7. Constant Current PWM Control (Current Limit)

Constant current PWM control with VREF pin is possible.

The motor drive current I_SETcan be set by the VREF pin voltage V_VREF,the current detection resistor R_RNFconnected to

the RNF pin, and the current detection amplifier gain G_AMP

.

The relation between I_SET, V_VREF, R_RNFand G_AMPis given below.

ꢇ

ꢈꢉꢊ퐹

퐼_푆퐸푇

=

[A]

퐺

×푅

ꢉ푁퐹

퐴푀푃

The constant current PWM control setting range of VREF pin V_RVREFis 0 V to 2.8 V and it is the output range for PWM.

If I_SETtends to 0, percentage error of I_Owith I_SETincreases. Consider the below following characteristic and use in the

appropriate range according to applications. However, this reference characteristic isn't guaranteed value but evaluation

value.

50

V_VS=12 V

V_PSB=5 V

V_IN+=5 V

V_IN-=0 V

40

V_CS=RNF

Motor Inductance=2.3 mH

30

20

10

0

50

100

150

200

250

Motor Drive Current : I_SET[mA]

Figure 75. Error of I_Owith I_SET((I_O-I_SET)/I_SET) vs Motor Drive Current I_SET

(Reference Data)

The voltage generated at the RNF pin is detected from the CS pin. If necessary, a low-pass filter can be added between

the RNF pin and the CS pin to smooth the RNF pin voltage fluctuation.

Carrier frequency is 33 kHz (Typ).

In the case of constant current PWM control and the output current detection amplifier not being used together, set the

VREF pin to be 3.2 V or higher and 7 V or lower, and connect the RNF pin and CS pin to the ground.

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7. Constant Current PWM Control (Current Limit) - continued

Ex. VREF=1 V

Ex. VREF=2 V

H

IN+

IN-

L

2 V

VREF

Internal Clock

OUT+

OUT-

RNF

1 V

H

L

H

L

H

L

H

L

CS

ISET

I_O

I_SET

1

2

퐼_푆퐸푇

=

[A] 퐼_푆퐸푇

=

[A]

퐺

퐴푀푃

×푅

퐺

×푅

퐴푀푃 ꢉ푁퐹

ꢉ푁퐹

Figure 76. I/O Waveform during Constant Current PWM Control

8. Power Save (PSB Pin)

IC internal circuits can be used as power saved state and power consumption can be reduced by lowering PSB pin

voltage. Driver output goes Hi-Z at the time. Refer I/O truth table for details of other pin state.

There is no restriction to input for pin switching order of PSB, IN+ and IN-.

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I / O Equivalence Circuits (Resistance Values are Typical)

2.IN+, 3.IN–

4.PSB

Internal

Regulator

30 kΩ 100 kΩ

Pin4

10 kΩ

20 kΩ

50 kΩ

Pin2,3

100 kΩ

Pin1,12

Pin1,12 Pin1,12 Pin1,12 Pin1,12

Pin1,12

5.VREF

7,8.OUT+, 9,10.RNF, 13,14.OUT–

Internal

Regulator

Pin15,16

10 kΩ

Pin7, 8, 13, 14

Pin9,10

Pin5

Pin1,12

11.CS

15,16.VS

Internal

Regulator

Pin15,16

10 kΩ

Pin11

Pin1,12

18.AMPO

19.ST1

Internal

Regulator

Internal

Regulator

15 Ω

Pin19

4.7 kΩ

Pin18

25 kΩ

20 kΩ

5 kΩ

Internal

Regulator

1 kΩ

Pin1,12

Pin1,12 Pin1,12

Pin1,12 Pin1,12 Pin1,12 Pin1,12

20.ST2

-

15 Ω

Pin20

Pin1,12

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Heat Loss

1. Thermal Resistance

The heat generated by the consumption of power by the IC is dissipated from the mold resin of the package or the lead

frame etc.

The parameter indicating the heat dissipation property (heat dissipation difficulty) is called thermal resistance, and the

thermal resistance from the chip junction to the ambient environment in the board mounted state is represented by θja

[°C/W], and the thermal characteristic parameter from the chip junction to top surface center of package is expressed

as ψjt [°C/W].

The thermal resistance is divided into the package part and the substrate part, the thermal resistance of the package

part depends on the constituent material such as the mold resin or the lead frame etc., on the other hand, the thermal

resistance of the substrate part depends on the substrate heat dissipation properties such as quality of material, size,

copper foil area etc.

Therefore, by heat dissipating counter-measures like installing a heat sink on the mounting board, thermal resistance

can be reduced.

The thermal resistance model is shown in Figure 77, and the thermal resistance calculation formula is shown in Equation

1, Equation 2 respectively.

Tj Ta

Ambient Temperature Ta[°C]

ja 

jt 

[C/W] (Equation1)

[C/W] (Equation 2)

P

Tj Tt

P

Package Surface Temperature Tt[°C]

θja[°C/W]

Chip Junction Temperature Tj[°C]

θja: Thermal Resistance from the Junction to the Ambient

Environment [°C/W]

ψjt[°C/W]

ψjt: Thermal Characteristic Parameter from the Junction to

Top Surface Center of Package [°C/W]

Tj: Junction Temperature [°C]

Backside Heat Sink

Mounting Board

Ta: Ambient Temperature [°C]

Tt: Package Surface Temperature [°C]

P: Power Consumption [W]

Figure 77. Thermal Resistance Model of

Backside Exposed Package with Heat Sink

Thermal resistances θja, ψjt vary depending on the measurement environment such as chip size or

power consumption of the mounted IC, and ambient temperature, mounting conditions, wind speed, etc.

even if the same package is used.

2. Power Dissipation

Power dissipation (total loss) is the power that the IC can consume at ambient temperature Ta = 25 °C (normal

temperature). The IC generates heat when it consumes electric power, and the temperature of the IC chip becomes

higher than the ambient temperature. The allowable temperature of the IC chip in the package (the junction temperature

specified by the absolute maximum rating) is determined by the circuit configuration or the manufacturing process etc.

Power dissipation is determined by its maximum junction temperature, thermal resistance in board mounted condition,

and ambient temperature.

3. Thermal De-rating Curve

The thermal de-rating curve shows the power (power dissipation) that the IC can consume against the ambient

temperature. The power dissipation decays from ambient temperature 25 °C, and becomes zero at the maximum

junction temperature 150 °C. The slope is reduced by the reciprocal of the thermal resistance θja.

Ta=25 °C or higher, it is reduced with a

slope of 1 / θja

(1) 4.66 W

Ta=25 °C

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

(1) 114.3 mm x 76.2 mm x 1.6 mmt

FR-4 4 layer substrate (Backside

copper foil area 74.2 mm x 74.2 mm)

(2) 114.3 mm x 76.2 mm x 1.57 mmt

FR-4 1 layer substrate

(1) 0.93 W, Ta=125 °C

(2) 0.17 W, Ta=125 °C

(1) –1/θja=–37.3 [mW/°C]

(2) –1/θja=–7.0 [mW/°C]

(2) 0.87 W

Ta=25 °C

0

25

50

75

100

125

150

Ambient Temperature: Ta[°C]

Figure 78. Thermal De-rating Curve by Mounting Board (Reference Value)

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Safety Measures

1. Countermeasure against Destruction of Reverse Connection Power Supply

In reverse connection of the power supply, current flows through a route different from the normal one, which may cause

IC breakdown or deterioration. If there is a possibility of reverse connection, it is necessary to insert the reverse

connection breakdown prevention diode between power supply and power supply pin.

During normal energization

Without reverse connection prevention measure

During reverse connection of power supply

Reverse protection diode insertion

During reverse connection of power supply

VS

Circuit

block

Circuit

block

Circuit

block

I/O

GND

Internal circuit impedance is high

High current flow

Will not destroy

 Low current flow

 Thermal destruction, detorioration

Figure 79. Current Flow during Supply Power Reverse Connection

2. Measures to Raise the Power Supply Pin Voltage by Back Electromotive Force

Back EMF generates regenerative current to supply power-source. However, when the reverse connection breakdown

prevention diode is connected, or when the power source supplied does not have sufficient current absorption ability,

the power supply pin and motor drive output pin voltage will rise during regenerative braking.

ON

Phase

switching

ON

M

ON

Figure 80. Power Supply Pin and Motor Drive Output Pin Voltage Rise by Back Electromotive Force

If there is a possibility of exceeding the absolute maximum rating due to voltage rise by the back electromotive force,

connect a capacitor, a Zener diode, or both as a regenerative current path between the power supply pin and the ground

pin. Also connect a Zener diode between output pin and the ground pin.

ON

M

ON

Figure 81. Voltage Rise Countermeasure of Power Supply Pin and Output Pin during Regenerative Braking

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Safety Measures - continued

3. Countermeasures against Unstable Power Supply

If there is a possibility that the power supply pin may exceed the absolute maximum rating or the reduced voltage

malfunction prevention is operating due to the fluctuation of the power supply, insert an inductor such as a resistor or

ferrite beads between the supplied power and the power supply pin and then form a filter.

In that case, use a bypass capacitor together, lower the impedance of the power supply line and supply a stable voltage

to the driver.

Motor Unit

Driver

Inductor

＋

Resistor

VS

＋

VS

Connector

－

GND

－

GND

Connector

Place the bypass capacitor near the power supply pin

Figure 83. Stable Power Supply

Measure (LC Filter)

Figure 82. Stable Power Supply

Measure (RC Filter)

4. Prohibition of Ground Line PWM Switching Input

The control method of varying the motor speed by PWM switching the ground line is prohibited as it cannot keep the IC

ground pin at the lowest potential.

Motor Unit

Driver

＋

VS

Controller

OUT+

PWM Input

RNF

GND

M

OUT−

Prohibition －

Figure 84. Prohibition of Ground Line PWM Switching

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Operational Notes

1.

2.

3.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,

pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground

due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below

ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions

such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.

4.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

6.

Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing

of connections.

7.

8.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

9.

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

10. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line.

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Operational Notes – continued

11. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 85. Example of Monolithic IC Structure

12. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

13. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within

the Area of Safe Operation (ASO).

14. Thermal Shutdown Circuit (TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

15. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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BD16912EFV-C

Ordering Information

B

D

1

6

9

1

2

E

F

V

―

C

E

2

Parts Number

Package Type

Product Rank

Packaging Specification

･EFV; HTSSOP-B20

･C; for Automotive

･E2; Embossed Type and Reel

Marking Diagram

HTSSOP-B20 (TOP VIEW)

Part Number Marking

LOT Number

1 6 9 1 2

Pin 1 Mark

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Physical Dimension and Packing Information

Package Name

HTSSOP-B20

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BD16912EFV-C

Revision History

Date

Revision

001

Contents

20.Mar.2018

Newly created

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.003


型号：	BD16912EFV-C
厂家：	ROHM
描述：	BD16912EFV-C是内置通过功率DMOSFET由H桥构成的1ch电机驱动部的车载用驱动器。通过直接PWM控制或恒流PWM控制可实现高效率驱动。搭载输出电流检测放大器和异常检测信号输出功能，实现了低导通电阻、小型封装，有助于实现整机的高可靠性化、低耗电量化、省空间化。放大器电机驱动驱动器
文件：	总43页 (文件大小：3066K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD16912EFV-C [ROHM]

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