BD16922EFV-M_15 [ROHM]

Automotive 2ch 60V Max, H-bridge Drivers;


型号：	BD16922EFV-M_15
厂家：	ROHM
描述：	Automotive 2ch 60V Max, H-bridge Drivers
文件：	总31页 (文件大小：1837K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

Motor/Actuator Drivers for DC Brush Motor series

Automotive 2ch

60V Max, H-bridge Drivers

BD16922EFV-M

General Description

Key Specifications

The BD16922EFV-M is a 1.0A-output, 2-channel

automotive reversible motor driver that allows for

operation mode selection from four modes; brake,

forward, reverse, and standby, according to two-input

logical operation. This motor driver provides high voltage

(up to a rating of 60V), low ON resistance, and compact

package, thus leading to contribution to enhancing the

reliability, reducing the power consumption, and cutting

the cost of sets.

 Power Supply Voltage

 Output Current

 Output ON Resistance

(Total of upper and lower resistance)

 Operating Temperature Range -40°C to +110°C

8V to 36V

1.0A (Max)

2.25Ω (Typ)

Package(s)

HTSSOP-B24

W (Typ) x D (Typ) x H (Max)

7.8mm×7.6mm×1.00mm

Features



AEC-Q100 Qualified^{(Note 1)}

1 Built-in 1.0A DMOS H Bridge Output 2 Circuit

2 Input Control (Stand By, Forward Rotation,

Reverse Rotation, Brake)



Low Standby Current

Built-in output counter-electromotive force

absorption diode



Built-in Overcurrent Protection Circuit (Detection

and Timer) (OCP)



Built-in Overvoltage Protection (OVP)

Built-in Thermal Shutdown (TSD)

Built-in Overcurrent Protection State Output

Terminal (PO)

(Note1 : Grade 2)

Applications^{(Note 2)}

For Automotive (Air conditioner, and door mirror)

Typical Application Circuit

IN1P

IN1N

IN2P

IN2N

SGND1

PO1

SGND2

PO2

PGND2

PGND1

PGND2

^PGND1BD16922EFV-M

OUT2P 18

OUT2P 17

OUT2N 16

OUT2N 15

PVCC2 14

PVCC2 13

OUT1P

OUT1N

10 OUT1N

11 PVCC1

12 PVCC1

Figure 1. Typical Application Circuit

(Note 2) Please make sure you consult our company sales representative before mass production of this IC,

if used other than Door Mirror and HVAC.

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays

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Pin Configuration

Pin Description

Pin No.

Pin Name

IN1P

Function

Output state control

(TOP VIEW)

IN1P

IN2P

IN2N

IN1N

Output state control

Small signal GND

Output state output (open drain)

Output part GND

Motor output

IN1N

SGND1

PO1

SGND1

PO1

SGND2

PO2

PGND1

OUT1P

OUT1N

PVCC1

PVCC2

OUT2N

OUT2P

PGND2

PO2

PGND2

OUT2P

OUT2N

PGND1

OUT1P

OUT1N

PVCC1

THERMAL

PAD

(GND)

Motor output

OUT2N

PVCC2

Motor output

Power supply

Figure 2. Pin Configuration

Power supply

Motor output

Output part GND

Output state output (open drain)

Small signal GND

Output state control

SGND2

IN2N

IN2P

Block Diagram

IN1P

IN1N

IN2P

Internal

Power

Supply

Internal

Power

Supply

IN2N

OCP

OVP

TSD

OCP

OVP

TSD

SGND1

PO1

SGND2

PO2

Output

State

Detection

Output

State

Detection

PGND1

OUT1P

OUT1N

PVCC1

PGND2

OUT2P

OUT2N

PVCC2

Control State

Logic

Control State

Logic

Figure 3. Block Diagram

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Absolute Maximum Ratings (Ta=25°C)

Parameter

Symbol

V_CC

Rating

Unit

Power Supply Voltage (PVCC1,2)

Output Voltage

V_OUT

(OUT1P, OUT2P, OUT1N, OUT2N)

Input Voltage (PO1,2)

V_PO

V_IN

-0.3 to +20

1.0

Input Voltage (IN1P, IN2P, IN1N, IN2N)

Output Current ^{(Note 1)}

Power Dissipation ^{(Note 2)}

3.99

°C

Operating Temperature Range

Storage Temperature Range

Topr

Tstg

Tjmax

-40 to +110

-55 to +150

150

Junction Temperature

(Note 1) Pd should not be exceeded

(Note 2) Derating in done 31.9 mW/°C for operating above Ta≥25°C (Mount on 4-layer 70.0mm x 70.0mm x 1.6mm board, ROHM standard

board)

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an

open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in

case the IC is operated over the absolute maximum ratings.

Recommended Operating Conditions (Ta=25°C)

Parameter

Symbol

V_CC

Min

Typ

Max

Unit

Power Supply Voltage Range ^{(Note 1)}

Input Voltage Range

(IN1P, IN2P, IN1N, IN2N)^{(Note 2)}

V_IN

-0.3

+5.0

5.0

+6.0

6.0

Output Voltage Range (PO1,2)

V_PO

(Note 1) Pd should not be exceeded

(Note 2) In order to start operation while in forward or reverse mode, apply a voltage to all input pins after Vcc exceeds the minimum

operating voltage range (8V).

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Electrical Characteristics (Unless otherwise specified V_CC= 8V to 36V, Ta = -40°C to +110°C)

Limits

Measurement

Circuit ^{(Note 1)}

Parameter

Symbol

Unit

Conditions

Min

Typ

Max

Circuit Current 1

Circuit Current 2

Circuit Current 3

Input H Voltage

Input L Voltage

Input H Current

Input L Current

I_CC1

I_CC2

I_CC3

V_IH

V_IL

I_IH

μA CH1 & CH2 : V_IN≤ 0.4V

mA CH1 or CH2 : 0.4V < V_IN

mA CH1 & CH2 : 0.4V < V_IN

3.0

1.0

100

μA V_IN= 5.0V, Inflow Current

I_IL

μA V_IN= 0.0V, Outflow Current

Io = 0.1A to 0.8A,

Ta = -40°C to +25°C,

Upper and Lower Total

Io = 0.1A to 0.8A,

Ta = 25°C to 110°C,

Upper and Lower Total

Output ON Resistance 1

Output ON Resistance 2

R_ON1

2.25

3.50

4.50

R_ON2

Output Leak Current H

Output Leak Current L

Output Diode Voltage H

Output Diode Voltage L

I_LH

I_LL

μA V_OUT= 0V, Stand-By Mode

μA V_OUT= V_CC, Stand-By Mode

V_FH

V_FL

0.2

0.9

1.4

I_O= 0.6A, V_CC= 0V, Stand-By Mode

Protection Output Pin

Voltage L

I_PO= 3mA, For Activating the

Overcurrent Protection

V_LPO

0.2

0.6

Protection Output Pin

Leakage Current

V_PO= V_CC, For Activating the

Overcurrent Protection

I_LPO

μA

Overcurrent Detect Current

I_OCP

1.050 1.275 1.550

45 50 55

Overvoltage Detect Voltage

V_OVP

(Note 1) See pages 15 and 16.

Truth Table

Input

Output

Operating Mode

Brake

IN1P, IN2P

IN1N, IN2N

OUT1P, OUT2P

OUT1N, OUT2N

Forward Rotation

Reverse Rotation

Stand-By

Open

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Typical Performance Curves (Reference Data)

(Unless otherwise specified V_CC= 8V to 36V, Ta = -40°C to +110°C)

V_CC=36V

Ta=25°C

Ta=110°C

V_CC=12V

Ta=-40°C

V_CC=8V

-50

100

150

Temperature Ta[°C]

SupplyVoltage VCC[V]

Figure 5. Circuit Current vs Temperature

Figure 4. Circuit Current vs Supply Voltage

(Circuit Current 1 I_CC1, V_CC=0V to 60V,

V_IN=0V (Stand-By Mode))

(Circuit Current 1 I_CC1

V_IN=0V (Stand-By Mode))

V_CC=36V

Ta=110°C

V_CC=12V

Ta=25°C

Ta=-40°C

V_CC=8V

-50

100

150

SupplyVoltage VCC[V]

Temperature Ta[°C]

Figure 7. Circuit Current vs Temperature

(Circuit Current 2 I_CC2

Figure 6. Circuit Current vs Supply Voltage

(Circuit Current 2 I_CC2

CH1 : V_IN=5.0V (Brake Mode),

CH2 : V_IN=0V (Stand-By Mode))

CH1 : V_IN=5.0V (Brake Mode),

CH2 : V_IN=0V (Stand-By Mode))

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Typical Performance Curves (Reference Data) - continued

(Unless otherwise specified V_CC= 8V to 36V, Ta = -40°C to +110°C)

V_CC=36V

Ta=110°C

V_CC=12V

Ta=25°C

V_CC=8V

Ta=-40°C

-50

100

150

SupplyVoltage VCC[V]

Temperature Ta[°C]

Figure 9. Circuit Current vs Temperature

(Circuit Current 3 I_CC3

V_IN=5.0V (Brake Mode))

Figure 8. Circuit Current vs Supply Voltage

(Circuit Current 3 I_CC3

V_IN=5.0V (Brake Mode))

Ta=110°C

Ta=25°C

Ta=-40°C

Input Voltage VIN[V]

Figure 10. Circuit Current vs Input Voltage

(Circuit Current 2 I_CC2, V_CC=12V)

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Typical Performance Curves (Reference Data) - continued

(Unless otherwise specified V_CC= 8V to 36V, Ta = -40°C to +110°C)

3.0

2.8

2.6

2.4

2.2

2.0

1.8

1.6

1.4

1.2

1.0

3.0

2.8

2.6

V_CC=36V

V_CC=12V

Ta=25°C

2.4

Ta=-40°C

2.2

2.0

1.8

1.6

1.4

1.2

1.0

Ta=110°C

V_CC=8V

-50

100

150

Temperature Ta[°C]

SupplyVoltage VCC[V]

Figure 12. Input Voltage vs Temperature

Figure 11. Input Voltage vs Supply Voltage

(Input H Voltage V_IH, V_IN=0V→5.0V)

3.0

2.8

2.6

2.4

2.2

2.0

1.8

1.6

1.4

1.2

1.0

3.0

2.8

2.6

2.4

2.2

2.0

1.8

1.6

1.4

1.2

1.0

V_CC=12V

V_CC=36V

Ta=25°C

Ta=-40°C

Ta=110°C

V_CC=8V

-50

100

150

Temperature Ta[°C]

SupplyVoltage VCC[V]

Figure 14. Input Voltage vs Temperature

Figure 13. Input Voltage vs Supply Voltage

(Input L Voltage V_IL, V_IN=5.0V→0V)

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Typical Performance Curves (Reference Data) - continued

(Unless otherwise specified V_CC= 8V to 36V, Ta = -40°C to +110°C)

1.15

1.10

1.05

1.00

0.95

0.90

0.85

0.80

V_CC=12V

1.10

Ta=-40°C

1.05

V_CC=8V

Ta=25°C

1.00

V_CC=36V

0.95

0.90

Ta=110°C

0.85

0.80

-50

100

150

SupplyVoltage VCC[V]

Temperature Ta[°C]

Figure 16. Input Voltage vs Temperature

Figure 15. Input Voltage vs Supply Voltage

(Circuit Current Active Voltage, V_IN=0V→5.0V)

500

450

400

350

300

250

200

150

100

Ta=110°C

Ta=25°C

Ta=110°C

Ta=25°C

Ta=-40°C

Input Voltage VIN[V]

Figure 18. Input Current vs Input Voltage

(Input Current I_IH, I_IL)

Figure 17. Input Current vs Input Voltage

(Input Current I_IH, I_IL)

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Typical Performance Curves (Reference Data) - continued

(Unless otherwise specified V_CC= 8V to 36V, Ta = -40°C to +110°C)

2.5

2.0

1.5

1.0

0.5

0.0

2.5

Ta=110°C

2.0

V_CC=8V

Ta=25°C

1.5

V_CC=12V

V_CC=36V

1.0

Ta=-40°C

0.5

0.0

0.2

0.4

0.6

0.8

1.0

0.0

0.2

0.4

0.6

0.8

1.0

Output Current Io[A]

Figure 20. Output On Resistance vs Output Current

(Output ON Resistance High Side, Ta=25°C)

Figure 19. Output On Resistance vs Output Current

(Output ON Resistance High Side, V_CC=12V)

1.5

Ta=110°C

1.2

V_CC=12V

V_CC=8V

0.9

Ta=25°C

0.6

V_CC=36V

Ta=-40°C

0.3

0.0

0.2

0.4

0.6

0.8

1.0

0.0

0.2

0.4

0.6

0.8

1.0

Output Current Io[A]

Figure 21. Output On Resistance vs Output Current

(Output ON Resistance Low Side, V_CC=12V)

Figure 22. Output On Resistance vs Output Current

(Output ON Resistance Low Side, Ta=25°C)

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Typical Performance Curves (Reference Data) - continued

(Unless otherwise specified V_CC= 8V to 36V, Ta = -40°C to +110°C)

2.5

2.0

1.5

1.0

0.5

0.0

2.5

Ta=110°C

V_CC=8V

2.0

V_CC=36V

V_CC=12V

Ta=25°C

1.5

1.0

Ta=-40°C

0.5

0.0

-50

100

150

Temperature Ta[°C]

SupplyVoltage VCC[V]

Figure 24. Output On Resistance vs Temperature

(Output ON Resistance High Side, I_O=0.8A)

Figure 23. Output On Resistance vs Supply Voltage

(Output ON Resistance High Side, I_O=0.8A)

1.5

Ta=110°C

1.2

0.9

0.6

0.3

0.0

1.2

0.9

0.6

0.3

0.0

V_CC=8V

Ta=25°C

Ta=-40°C

V_CC=36V

V_CC=12V

-50

100

150

SupplyVoltage VCC[V]

Temperature Ta[°C]

Figure 25. Output On Resistance vs Supply Voltage

(Output ON Resistance Low Side, I_O=0.8A)

Figure 26. Output On Resistance vs Output Current

(Output ON Resistance Low Side, I_O=0.8A)

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Typical Performance Curves (Reference Data) - continued

(Unless otherwise specified V_CC= 8V to 36V, Ta = -40°C to +110°C)

SupplyVoltage VCC[V]

Figure 28. Leak Current vs Supply Voltage

(Output Leak Current Low Side I_LL,

V_OUT=V_CC, Ta=110°C)

Figure 27. Leak Current vs Supply Voltage

(Output Leak Current High Side I_LH,

V_OUT=0V, Ta=110°C)

1.4

1.2

1.0

0.8

0.6

0.4

0.2

1.4

1.2

1.0

0.8

0.6

0.4

0.2

Ta=-40°C

Ta=25°C

Ta=-40°C

Ta=25°C

Ta=110°C

0.0

0.2

0.4

0.6

0.8

1.0

0.0

0.2

0.4

0.6

0.8

1.0

Input Current IO[A]

Figure 30. Output Voltage vs Input Current

(Output Diode Voltage Low Side V_FL, V_CC=0V)

Figure 29. Output Voltage vs Input Current

(Output Diode Voltage High Side V_FH, V_CC=0V)

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Typical Performance Curves (Reference Data) - continued

(Unless otherwise specified V_CC= 8V to 36V, Ta = -40°C to +110°C)

600

500

600

500

400

300

200

100

400

Ta=110°C

V_CC=36V

300

Ta=25°C

200

V_CC=12V

V_CC=8V

Ta=-40°C

100

-50

100

150

SupplyVoltage VCC[V]

Temperature Ta[°C]

Figure 32. PO output Voltage vs Temperature

(PO Pin Output Voltage V_LPO, I_PO=3mA,

For Activating the Overcurrent Protection)

Figure 31. PO Output Voltage vs Supply Voltage

(PO Pin Output Voltage V_LPO, I_PO=3mA,

For Activating the Overcurrent Protection)

Input Voltage VPO[V]

Figure 33. Leak Current vs Input Voltage

(PO Pin Leak Current ILPO, V_PO=V_CC, Ta=110°C)

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Typical Performance Curves (Reference Data) - continued

(Unless otherwise specified V_CC= 8V to 36V, Ta = -40°C to +110°C)

1.55

1.50

1.45

1.40

1.35

1.30

1.25

1.20

1.15

1.10

1.05

1.55

1.50

1.45

1.40

1.35

Ta=25°C

Ta=-40°C

1.30

1.25

1.20

1.15

Ta=-40°C

Ta=110°C

1.10

1.05

SupplyVoltage VCC[V]

Figure 35. OCP Detect Current vs Supply Voltage

Figure 34. OCP Detect Current vs Supply Voltage

(OCP Detect Current Low Side I_OCP, I_O=1.05A→1.55A)

(OCP Detect Current High Side I_OCP, I_O=1.05A→1.55A)

1.55

1.50

1.45

1.40

1.55

1.50

1.45

1.40

1.35

V_CC=8V

V_CC=36V

V_CC=8V

1.30

1.25

1.20

1.25

1.20

V_CC=12V

1.15

V_CC=12V

1.15

V_CC=36V

1.10

1.05

1.10

1.05

-50

100

150

-50

100

150

Temperature Ta[°C]

Figure 37. OCP Detect Current vs Temperature

Figure 36. OCP Detect Current vs Temperature

(OCP Detect Current Low Side I_OCP, I_O=1.05A→1.55A)

(OCP Detect Current High Side I_OCP, I_O=1.05A→1.55A)

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Typical Performance Curves (Reference Data) - continued

(Unless otherwise specified V_CC= 8V to 36V, Ta = -40°C to +110°C)

-50

100

150

-50

100

150

Temperature Ta[°C]

Figure 39. Supply Voltage vs Temperature

Figure 38. Supply Voltage vs Temperature

(OVP Release Voltage, V_CC=50V→40V)

(OVP Detect Voltage V_OVP, V_CC=45V→55V)

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Typical Performance Curves Measurement Circuits (Reference Data)

(Unless otherwise specified V_CC= 8V to 36V, Ta = -40°C to +110°C)

I_CC1, I_CC2, I_CC3, V_IH, V_IL, I_IH, I_IL, V_OVP

(1) I_CC1

V_CC=0Vto60V, V_IN=0V

ICC1, ICC2, ICC3

VOVP

(2) I_CC2

CH1 : V_IN=5.0V (Brake Mode),

CH2 : V_IN=0V

PVCC1

PVCC2

PO2

10μF

PVCC1

10kΩ

(3) I_CC3

V_IN=5.0V (CH1 & CH2 : Brake Mode)

PO1

IIH, IIL

IN2P

IN1P

VIH, VIL

IIH, IIL

(4) V_IH

V_IN=0V→5.0V,

V_INfor switching the operation mode

IIH, IIL

ININ

IN2N

VIH, VIL

OUT1P

VIH, VIL

OUT2P

OUT2N

SGND2

PGND2

(5) V_IL

V_IN=5.0V→0V,

V_INfor switching the operation mode

OUT1P

OUT1N

SGND1

PGND1

(6) I_IH, I_IL

V_CC=0V, V_IN=0Vto20V

(8) V_OVP

V_CC=45V→55V→40V

V_CCfor activating the overvoltage protection

PGND1

Figure 40. Measurement Circuit 1

R_ON1, R_ON2, V_FH, V_FL, V_LPO, I_OCP

(1) R_ON1, R_ON2

CH1, CH2 : Forward or Reverse Rotate Mode

I_O=0Ato1.0A,

・High Side

Switch : L

VLPO

・Low Side

Switch : H

PVCC1

PVCC2

PO2

(2) V_FH, V_FL

10μF

CH1, CH2 : Stand-By Mode

V_CC=0V, V_IN=0.0V,

I_O=0Ato1.0A,

・V_FH

Switch : H

・V_FL

RPO

PO1

IN1P

ININ

IN2P

VCC

IN2N

Switch : L

OUT1P

OUT1N

OUT2P

OUT2N

SGND2

PGND2

VCC

IOCP

(3) V_LPO

VFH, VFL

RON1, RON2

VFH, VFL

RON1, RON2

CH1, CH2 : Forward or Reverse Rotate Mode

R_PO=1.6kΩ (I_PO=3mA),

I_O=1.55A,

IOCP

OUT1N

SGND1

PGND1

VFH, VFL

RON1, RON2

VFH, VFL

RON1, RON2

Switch : H or L

(4) I_OCP

CH1, CH2 : Forward or Reverse Rotate Mode

R_PO=10kΩ,

PGND1

I_O=1.05A→1.55A,

・High Side

Figure 41. Measurement Circuit 2

Switch : L

・Low Side

Switch : H

I_Ofor activating the overcurrent protection

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Typical Performance Curves Measurement Circuits (Reference Data) - continued

(Unless otherwise specified V_CC= 8V to 36V, Ta = -40°C to +110°C)

3. I_LH, I_LL, I_LPO

(1) I_LH, I_LL

V_OUT=0V→60V

(2) I_LPO

V_PO=0V→60V

PVCC1

PVCC2

PO2

ILPO

PO1

IN1P

ININ

IN2P

IN2N

OUT1P

OUT1N

OUT2P

OUT2N

SGND2

PGND2

ILH, ILL

OUT1N

SGND1

PGND1

Figure 42. Measurement Circuit 3

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Timing Chart

1. Overcurrent Protection (OCP) Timing Chart (INP=H, INN=L, Forward Rotate Mode, Ta=25°C)

Normal

Abnormal

Normal

I_OCP

I_O

Operating State (H)

OUT1P/2P

OUT1N/2N

Open State

Operating State (L)

PO1,2

T_OFF

T_ON

T_ON= 10μsec(Typ), 4μsec(Min), 22μsec(Max)

T_OFF= 255μsec(Typ), 170μsec(Min), 340μsec(Max)

Figure 43. Overcurrent Protection Timing Chart

(1) The overcurrent protection circuit is designed to conduct protection operation by the channel (i.e.,

OUT1P&OUT1N or OUT2P&OUT2N).

(2) The overcurrent protection circuit uses an output voltage detection system (output current  output

ON resistance).

(3) If 1.275A (Typ) or more current passes through the circuit for a period of 10µsec (Typ), the protection

circuit will put the output pins into an open state for a period of 255µsec (Typ) and subsequently

return to the normal operation. If overcurrent continues to pass through the circuit even after

returning to the normal operation, the said protection operation will be repeated.

2. Overvoltage Protection (OVP) Timing Chart (INP=H, INN=L, Forward Rotate Mode, Ta=25°C)

50V(Typ)

45V(Typ)

PVCC1,2

Operating State (H)

OUT1P/2P

Open State

OUT1N/2N

Operating State (L)

PO1,2

Normal

Protection

Normal

Figure 44. Overvoltage Protection Timing Chart

(1) The overvoltage protection circuit is designed to conduct protection operation by the channel (i.e.,

OUT1P&OUT1N or OUT2P&OUT2N).

(2) If voltage applied to PVCC1or 2 pin exceeds 50V (Typ), the protection circuit will put the output pins into an

open state and if the voltage falls below 45V (Typ), it will return to the normal operation.

(3) The protection circuit is activated only while in forward, reverse, or brake mode and not activated while in

standby mode.

(4) If power supply voltage exceeds the absolute maximum rating even when the overvoltage protection circuit

is activated, the motor driver can break down.

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Timing Chart - continued

3. Thermal Shutdown (TSD) Timing Chart (INP=H, INN=L, Forward Rotate Mode)

175°C(Typ)

150°C(Typ)

Temp

Operating State (H)

OUT1P/2P

OUT1N/2N

PO1,2

Open State

Operating State (L)

Normal

Protection

Normal

Figure 45. Thermal Shutdown Timing Chart

(1) The thermal shutdown circuit is designed to conduct protection operation by the channel (i.e.,

OUT1P&OUT1N or OUT2P&OUT2N).

(2) If IC chip temperature (Tj) exceeds 175C (Typ), the circuit will put the output pins into an open state and if

the temperature falls below 150C (Typ), it will return to the normal operation.

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Recommended Application Example^{(Note 1)(Note 2)}

Input 3

Input 4

Motor 2

10μF

4.7kΩ

100kΩ

BD16922EFV-M

THERMAL PAD

4.7kΩ

100kΩ

10μF

Motor 1

Input 1

Input 2

Figure 46. BD16922EFV-M Recommended Application Example

(Note 1) The external circuit constants shown in the diagram above represent a recommended value, respectively.

(Note 2) The external resistors PO1 and PO2 are a pull-up resistor.

Cautions on Designing of Application Circuits

1. Applicable Motors

Be noted that The BD16922EFV-M motor driver can only drive DC motors and cannot drive stepping motors. Furthermore,

in order to use this motor driver for any motors other than automotive motors (for air conditioners and door mirrors),

contact your ROHM representative.

2. Use of Only Either One of CH1 and CH2

To use only either one of CH1 and CH2, cause a short circuit between PVCC1 and PVCC2 as shown in Figure 46., and

then fix the input not to be used to the L (low) level.

3. PVCC1 and PVCC2

Be sure to mount a power supply decoupling capacitor in the vicinity of the IC pins between the power supply and the

ground. Determine the capacitance of the capacitor after fully ensuring that it presents no problems in characteristics.

Furthermore, cause a short circuit between PVCC1 and PVCC2 (set them to the same potential) before using the IC.

4. Input Pin Voltage

This IC provides guarantee for circuit operation at input H voltage and input L voltage (see page 4). Using the IC at

intermediate potential (with V_INset to 1.0V to 3.0V) may disable the normal operation of any of the protection functions.

To avoid that, apply 50mV/µs or more input voltage.

5. Counter-Electromotive Force

The counter-electromotive force may vary with operating conditions and environment, and individual motor characteristics.

Fully ensure that the counter-electromotive force presents no problems in the operation or the IC.

6. Fluctuations in Output Pin Voltage

If any output pin makes a significant fluctuation in the voltage to fall below GND potential due to heat generation

conditions, power supply, motor to be used, or other conditions, this may result in malfunctions or other failures. In such

cases, take appropriate measures, including the addition of a Schottky diode between the output pin and ground.

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Cautions on Designing of Application Circuits - Continued

7. Large-Current Lines

A large current passes through the power supply pins PVCC1 and 2 of the IC motor block and the PGND1 and 2 pins of

the motor block. This large current causes backflow depending on board pattern layout or external circuit constants such

as the capacitance of the capacitor between the power supply and ground, thus leading to malfunctions, oscillation, or

other unfavorable results. To avoid that, layout a board pattern using thick interconnects wherever possible and

recommended values like those shown in Figure 46. as external circuit constants, and then fully ensure that the layout

presents no problems in characteristics. After that, determine the board pattern layout.

8. Rush Current

This IC has no built-in circuit that limits rush currents caused by applying current to the power supply or switching

operation mode. To avoid the rush currents, take physical measures such as adding a current-limiting resistor between

PVCC1/2 pins and the power supply.

9. Thermal Pad

Since a thermal pad is connected to the sub side of this IC, connect it to the ground potential. Furthermore, do not use

the thermal pad as ground interconnect.

10. Overvoltage Protection

This IC has a built-in overvoltage protection function that protects output pins when overvoltage is applied. If voltage

applied to PVCC1 and 2 pins exceeds 50V (Typ), the output pin will open. However, note that this function is only

enabled while in forward, reverse, or brake mode and disabled while in standby mode. Furthermore, since the built-in

overvoltage protection function may break down if voltage exceeds the absolute maximum rating of power supply voltage,

do not apply voltage exceeding the absolute maximum rating.

11. Overcurrent Protection

This IC has a built-in overcurrent protection function that protects it from breakdown when the output pin is short-circuited.

Overcurrent protection is a function that protects the IC from breakdown due to short-circuited output pin, but is likely to

cause the IC to generate heat or deteriorate if it remains in the overcurrent state and eventually break down. If

overcurrent continues to flow (if PO pin behaves as shown in Figure 43.), take measures to make the IC standby in terms

of application.

12. Thermal Shutdown

This IC has a built-in thermal shutdown circuit as an overheat-protection measure. The thermal shutdown circuit is a

circuit absolutely intended to protect the IC from thermal runaway, not intended to protect or guarantee the IC.

Consequently, do not operate the thermal shutdown circuit based on the subsequent continuous use or operation of the

circuit.

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Power Dissipation

（プラスチックモールド）

Pd［W］

3.99

3.0

2.0

1.0

Ta［℃］

100 110

125

150

Figure 47. BD16922EFV-M Power Dissipation

Derating in done 31.9 mW/°C for operating above Ta≥25°C (Mount on 4-layer 70.0mm x 70.0mm x 1.6mm board, ROHM

standard board)

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I/O Equivalence Circuits^{(Note 1)}

Pin No.

Pin Name

I/O Equivalence Circuit

PVCC1,2

11 12 13 14

100kΩ

IN1P/2P

IN1N/2N

IN1P

IN1N

IN2N

IN2P

SGND1,2

SGND1

SGND2

30Ω

PO1,2

PO1

PO2

SGND1,2

PGND1

PGND2

PVCC1,2

11 12 13 14

OUT1P

OUT1N

OUT2N

OUT2P

OUT1P/2P

OUT1N/2N

15 16 17 18

PGND1,2

19 20

PVCC1

PVCC2

(Note 1) Resistance values shown in the diagrams above represent a typical limit, respectively.

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Operational Notes

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum

rating, increase the board size and copper area to prevent exceeding the Pd rating.

Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush

current may flow instantaneously due to the internal powering sequence and delays, especially if the IC

has more than one power supply. Therefore, give special consideration to power coupling capacitance,

power wiring, width of ground wiring, and routing of connections.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

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Operational Notes - continued

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

Pin A

P⁺

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 48. Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

15. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below

the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

16. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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Ordering Information

E F

B D 1 6 9 2 2

ME2

Package

EFV:HTSSOP-B24

Packaging and forming specification

M : for Automotive

Part Number

E2: Embossed tape and reel

Marking Diagrams

HTSSOP-B24 (TOP VIEW)

Part Number Marking

LOT Number

1 6 9 2 2 E F V

1PIN MARK

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Physical Dimension, Tape and Reel Information

Package Name

HTSSOP-B24

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Revision History

Date

Revision

001

Changes

03.Oct.2013

29.May.2015

11.Sep.2015

New Release

P.1

Note1 add comment

Note2 add comment

002

003

None (adjust revision number between Japanese version and English version)

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.001

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.001

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

Datasheet

BD16922EFV-M - Web Page

Part Number

Package

Unit Quantity

BD16922EFV-M

HTSSOP-B24

2000

Minimum Package Quantity

Packing Type

Constitution Materials List

RoHS

2000

Taping

inquiry

Yes

BD16922EFV-M_15 [ROHM]

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