BD1321G_16 [ROHM]
General Purpose Operational Amplifiers;
| 型号： | BD1321G_16 |
| 厂家： | 
ROHM |
| 描述： | General Purpose Operational Amplifiers |
| 文件： | 总23页 (文件大小：728K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Operational Amplifier
Ground Sense Low Power
General Purpose Operational Amplifiers
BD1321G
General Description
Key Specifications
BD1321G is a single low voltage operational amplifier
with full swing output. It is the most effective solution for
applications requiring low supply current consumption
and low voltage operation.
Operable supply voltage (single supply):
+2.7V to +5.5V
Supply Current:
Slew Rate:
Temperature Range:
Input Offset Current:
Input Bias Current:
130µA(Typ)
1.0V/µs(Typ)
-40°C to +85°C
5nA (Typ)
Features
15nA (Typ)
Operable with Low Voltage
Input Ground Sense, Output Full Swing
High Open Loop Voltage Gain
Low Supply Current
Packages
W(Typ) x D(Typ) x H(Max)
SSOP5
2.90mm x 2.80mm x 1.25mm
Low Input Offset Voltage
Applications
Portable Equipment
Low Voltage Application
Active Filter
Pin Configuration
BD1321G: SSOP5
Pin No.
Pin Name
IN+
IN+
VSS
IN-
1
2
3
5
4
VDD
OUT
1
2
3
4
5
+
-
VSS
IN-
OUT
VDD
Package
SSOP5
BD1321G
Ordering Information
B
D
1
3
2
1
x
-
T
R
Part Number
BD1321G
Package
: SSOP5
Packaging and forming specification
TR: Embossed tape and reel
G
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.
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Datasheet
BD1321G
Line-up
Topr
-40°C to +85°C
Package
Reel of 3000
Orderable Part Number
SSOP5
BD1321G-TR
Absolute Maximum Ratings (TA=25°C)
Symbol
Rating
Unit
Parameter
Supply Voltage
VDD-VSS
PD
+7
V
Power Dissipation
0.67 (Note 1,2)
W
Differential Input Voltage
VID
VDD - VSS
V
V
(Note 3)
Input Common-mode
Voltage Range
VICM
(VSS - 0.3) to VDD + 0.3
Input Current (Note 4)
II
±10
mA
V
Operating Supply Voltage
Operating Temperature
Storage Temperature
Vopr
Topr
Tstg
+2.7 to +5.5
-40 to +85
-55 to +150
°C
°C
Maximum Junction
Temperature
TJmax
+150
°C
(Note 1) To use at temperature above TA=25C reduce 5.4mW.
(Note 2) Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%).
(Note 3) The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VSS.
(Note 4) An excessive input current will flow when input voltages of more than VDD+0.6V or less than VSS-0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open
circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case
the IC is operated over the absolute maximum ratings.
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Datasheet
BD1321G
Electrical Characteristics
○BD1321G（Unless otherwise specified VDD=+5V, VSS=0V, TA=25°C）
Limit
Temperature
Range
Parameter
Symbol
Unit
Conditions
Min
Typ
0.1
-
Max
4
5
25°C
Full Range
-
-
Input Offset Voltage (Note 5)
Input Offset Voltage drift
Input Offset Current (Note 5)
Input Bias Current (Note 5)
Supply Current (Note 6)
VIO
VIO/T
IIO
mV
µV/℃
nA
nA
μA
V
VDD=2.7V to 5V
25℃
25°C
25°C
-
-
-
3
5
-
-
-
-
50
IB
15
100
25°C
Full Range
-
-
130
-
200
280
RL=∞, AV=0dB
IN+=2.1V
IDD
Maximum Output Voltage(High)
Maximum Output Voltage(Low)
Large Signal Voltage Gain
VOH
VOL
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
VDD-0.1 VDD-0.04
-
RL=2kΩ to 2.5V
-
VSS+0.08 VSS+0.16
V
RL=2kΩ to 2.5V
AV
78
0
110
-
-
4.2
-
dB
V
RL=2kΩ
Input Common-mode
Voltage Range
VICM
CMRR
PSRR
ISOURCE
ISINK
SR
VSS to VDD-0.8V
Common-mode Rejection Ratio
Power Supply Rejection Ratio
Output Source Current (Note 7)
Output Sink Current (Note 7)
Slew Rate
65
65
90
90
dB
dB
mA
mA
-
-
-
6
-
30
-
13
70
60
-
-
-
-
OUT=VDD-0.4V
OUT=0V, short current
OUT=VSS+0.4V
180
OUT=5V, short current
-
1
-
V/µs CL=25pF
CL=25pF, AV=40dB
CL=200pF
MHz f=100kHz
-
-
2
1
-
-
Unity Gain Frequency
Gain Bandwidth
fT
MHz
GBW
θ
-
-
-
3
-
-
-
Phase Margin
45
10
deg
CL=25pF, AV=40dB
Gain Margin
GM
VN
dB
-
-
-
5.5
39
-
-
µVrms Av=40dB
nV/ Hz Av=40dB, f=1kHz
OUT=0.4VP-P
Input Referred Noise Voltage
Total Harmonic Distortion +
Noise
THD+N
25°C
-
0.0015
-
%
f=1kHz, RL=2kΩ
DIN-AUDIO
(Note 5) Absolute value
(Note 6) Full range BD1321G: TA=-40C to +85C
(Note 7) Under the high temperature environment, consider the power dissipation of IC when selecting the output current.
When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.
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Datasheet
BD1321G
Description of Electrical Characteristics
Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also
shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or
general document.
1. Absolute maximum ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
(1) Supply Voltage (VDD/VSS)
Indicates the maximum voltage that can be applied between the VDD terminal and VSS terminal without
deterioration or destruction of characteristics of internal circuit.
(2) Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging
the IC.
(3) Input Common-mode Voltage Range (VICM
)
Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration
or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
(4) Power Dissipation (PD)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C
(normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical characteristics
(1) Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
(2) Input Offset Voltage drift (VIO/T)
Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation.
(3) Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
(4) Input Bias Current (IB)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at
the non-inverting and inverting terminals.
(5) Supply Current (IDD
Indicates the current that flows within the IC under specified no-load conditions.
(6) Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL
)
)
Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output
voltage high and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output
voltage low indicates the lower limit.
(7) Large Signal Voltage Gain (AV)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
AV = (Output voltage) / (Differential Input voltage)
(8) Input Common-mode Voltage Range (VICM
)
Indicates the input voltage range where IC normally operates.
(9) Common-Mode Rejection Ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is
normally the fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
(10) Power Supply Rejection Ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.
It is normally the fluctuation of DC.
PSRR = (Change of power supply voltage)/(Input offset fluctuation)
(11) Output Source Current/ Output Sink Current (ISOURCE / ISINK
)
The maximum current that can be output from the IC under specific output conditions. The output source current
indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC.
(12) Slew Rate (SR)
Indicates the ratio of the change in output voltage with time when a step input signal is applied.
(13) Unity Gain Frequency (fT)
Indicates a frequency where the voltage gain of operational amplifier is 1.
(14) Gain Bandwidth (GBW)
The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave.
(15) Phase Margin (θ)
Indicates the margin of phase from 180 degree phase lag at unity gain frequency.
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Datasheet
BD1321G
(16) Gain Margin (GM)
Indicates the difference between 0dB and the gain where operational amplifier has 180 degree phase delay.
(17) Input Referred Noise Voltage (VN)
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in
series with input terminal.
(18) Total Harmonic Distortion + Noise (THD+N)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
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BD1321G
Typical Performance Curves
○BD1321G
160
140
120
100
80
0.8
85℃
25℃
0.6
BD1321G
-40℃
0.4
0.2
0.0
60
40
20
0
85
0
1
2
3
4
5
6
0
25
50
75
100
125
150
Supply Voltage [V]
Ambient Temperature [°C]
Figure 1.
Figure 2.
Power Dissipation vs Ambient Temperature
(Derating Curve)
Supply Current vs Supply Voltage
6
5
4
3
2
1
0
160
140
120
100
80
5.5V
5.0V
85℃
25℃
2.7V
-40℃
60
40
20
0
-50
-25
0
25
50
75
100
2
3
4
5
6
Ambient Temperature [°C]
SupplyVoltage [V]
Figure 3.
Figure 4.
Supply Current vs Ambient Temperature
Maximum Output Voltage (High) vs Supply Voltage
(RL=2kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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BD1321G
Typical Performance Curves – continued
○BD1321G
6
80
70
60
50
40
30
20
10
0
5.5V
5
4
3
2
1
0
85℃
5.0V
25℃
-40℃
2.7V
-60
-30
0
30
60
90
120
2
3
4
5
6
Ambient Temperature [°C]
Supply Voltage [V]
Figure 5.
Figure 6.
Maximum Output Voltage (High) vs Ambient Temperature
Maximum Output Voltage (Low) vs Supply Voltage
(RL=2kΩ)
(RL=2kΩ)
100
80
60
40
20
0
80
70
60
50
40
30
20
10
0
5.0V
5.5V
25℃
-40℃
85℃
2.7V
-60
-30
0
30
60
90
120
0
1
2
3
4
5
Ambient Temperature [°C]
Output Voltage [V]
Figure 7.
Figure 8.
Maximum Output Voltage (Low) vs Ambient Temperature
Output Source Current vs Output Voltage
(VDD=5V)
(RL=2kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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BD1321G
Typical Performance Curves – continued
○BD1321G
18
200
180
160
140
120
100
80
-40℃
16
5.5V
25℃
14
5.0V
12
85℃
10
2.7V
8
6
4
2
0
60
40
20
0
0
1
2
3
4
5
-50
-25
0
25
50
75
100
Ambient Temperature [°C]
Output Voltage [V]
Figure 9.
Figure 10.
Output Source Current vs Ambient Temperature
(OUT=VDD-0.4V)
Output Sink Current vs Output Voltage
(VDD=5V)
100
80
60
40
20
0
10.0
7.5
5.0
-40℃
5.5V
5.0V
2.5
0.0
85℃
25℃
-2.5
-5.0
-7.5
-10.0
2.7V
-50
-25
0
25
50
75
100
2
3
4
5
6
Supply Voltage [V]
Ambient Temperature [°C]
Figure 11.
Figure 12.
Output Sink Current vs Ambient Temperature
(OUT=VSS+0.4V)
Input Offset Voltage vs Supply Voltage
(VICM= VDD, EK=-0.1V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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BD1321G
Typical Performance Curves – continued
○BD1321G
6
4
10
8
5
-40℃
25℃
5.5V
5.0V
2
3
0
0
2.7V
85℃
-3
-5
-2
-4
-6
-8
-10
-1
0
1
2
3
4
5
-50
-25
0
25
50
75
100
Ambient Temperature [°C]
Input Voltage [V]
Figure 13.
Figure 14.
Input Offset Voltage vs Ambient Temperature
(VICM= VDD, EK=-0.1V)
Input Offset Voltage vs Input Voltage
(VDD=5V)
160
140
120
100
80
160
140
120
100
80
5.5V
85℃
5.0V
2.7V
-40℃
25℃
60
60
-50
-25
0
25
50
75
100
2
3
4
5
6
Ambient Temperature [°C]
Supply Voltage [V]
Figure 15.
Figure 16.
Large Signal Voltage Gain vs Supply Voltage
Large Signal Voltage Gain vs Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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BD1321G
Typical Performance Curves – continued
○BD1321G
120
100
80
60
40
20
0
120
100
5.0V
85℃
80
25℃
5.5V
60
2.7V
-40℃
40
20
0
2
3
4
5
6
-50
-25
0
25
50
75
100
Ambient Temperature [°C]
Supply Voltage [V]
Figure 17.
Figure 18.
Common Mode Rejection Ratio vs Ambient Temperature
Common Mode Rejection Ratio vs Supply Voltage
(VDD=5V)
140
120
100
80
2.0
1.5
1.0
0.5
0.0
5.5V
5.0V
60
2.7V
40
20
0
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature [°C]
Ambient Temperature [°C]
Figure 19.
Figure 20.
Power Supply Rejection Ratio vs Ambient Temperature
Slew Rate L-H vs Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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BD1321G
Typical Performance Curves – continued
○BD1321G
80
70
60
50
40
30
20
10
0
200
2.0
Phase
150
100
50
1.5
5.5V
Gain
1.0
5.0V
2.7V
0.5
0.0
0
10 10 10 10 10 10
567
2
3
4
-50
-25
0
25
50
75
100
Ambient Temperature [°C]
Frequency [Hz]
Figure 22.
Figure 21.
Slew Rate H-L vs Ambient Temperature
Voltage Gain, Phase vs Frequency
1
0.1
800
700
600
500
400
300
200
100
0
20Hz
0.01
20kHz
0.001
1kHz
0.0001
1
10
100
1000
10000
0.01
0.1
1
10
Frequency [Hz]
Output Voltage [Vrms]
Figure 23.
Figure 24.
Total Harmonic Distortion－Output Voltage
(VDD/VSS=+2.5V/-2.5V, Av=0dB,
RL=2kΩ, DIN-AUDIO, TA=25℃)
Input Referred Noise Voltage－Frequency
(VDD/VSS=+2.5V/-2.5V, Av=0dB, TA=25℃)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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BD1321G
Application Information
NULL Method Condition for Test Circuit1
VDD, VSS, EK, VICM Unit:V
Parameter
Input Offset Voltage
VF
SW1 SW2 SW3 VDD VSS
EK
VICM Calculation
VF1
ON
ON
ON
ON
ON OFF
3
3
3
0
0
0
0
-1.5
1.8
0.9
1
2
3
4
VF2
VF3
VF4
VF5
VF6
VF7
-0.5
-2.5
Large Signal Voltage Gain
ON
ON
0
Common-mode Rejection Ratio
(Input Common-mode Voltage Range)
ON OFF
ON OFF
-1.5
-0.9
1.8
1.7
5.5
Power Supply Rejection Ratio
0
- Calculation -
|VF1|
1 + RF/RS
1. Input Offset Voltage (VIO)
VIO
=
[V]
EK × (1+RF/RS)
2. Large Signal Voltage Gain (AV)
Av = 20Log
[dB]
|VF3 - VF2|
VICM × (1+RF/RS)
CMRR = 20Log
3. Common-Mode Rejection Ratio (CMRR)
4. Power Supply Rejection Ratio (PSRR)
[dB]
|VF5 - VF4|
VDD × (1+ RF/RS)
PSRR = 20Log
[dB]
|VF7 - VF6|
0.1μF
RF=50kΩ
500kΩ
SW1
0.01μF
VDD
15V
EK
RS=50Ω
RI=1MΩ
Vo
500kΩ
0.015μF
0.015μF
DUT
SW3
NULL
-15V
1000pF
RI=1MΩ
RS=50Ω
RL
VRL
VICM
V VF
50kΩ
SW2
VSS
Figure 25. Test Circuit 1
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Datasheet
BD1321G
Switch Condition for Test Circuit 2
SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10SW11SW12
SW No.
Supply Current
OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF
OFF ON OFF OFF ON OFF OFF ON OFF OFF ON OFF
OFF ON OFF OFF ON OFF OFF OFF OFF ON OFF OFF
OFF OFF ON OFF OFF OFF ON OFF ON OFF OFF ON
ON OFF OFF ON ON OFF OFF OFF ON OFF OFF ON
Maximum Output Voltage RL=10kΩ
Output Current
Slew Rate
Unity Gain Frequency
SW3
SW4
R2 100kΩ
●
VDD=3V
－
＋
SW1
SW2
SW8 SW9
SW10 SW11 SW12
SW5
SW6
SW7
R1
1kΩ
VSS
RL
CL
IN-
IN+
Vo
Figure 26. Test Circuit 2
Output Voltage
1.8 V
Input Voltage
1.8 V
V
/ ∆ t
SR =
∆
90%
∆V
1.8V P-P
10%
0 V
0 V
t
t
∆ t
Input Wave
Output Wave
Figure 27. Slew Rate Input and Output Wave
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Datasheet
BD1321G
Examples of Circuit
○Voltage Follower
Voltage gain is 0dB.
VDD
Using this circuit, the output voltage (OUT) is configured
to be equal to the input voltage (IN). This circuit also
stabilizes the output voltage (OUT) due to high input
impedance and low output impedance. Computation for
output voltage (OUT) is shown below.
OUT
IN
OUT = IN
VSS
Figure 28. Voltage Follower Circuit
○Inverting Amplifier
R2
For inverting amplifier, input voltage (IN) is amplified by
a voltage gain and depends on the ratio of R1 and R2.
The out-of-phase output voltage is shown in the next
expression
VDD
R1
IN
OUT
OUT = -(R2/R1)・IN
This circuit has input impedance equal to R1.
VSS
Figure 29. Inverting Amplifier Circuit
○Non-inverting Amplifier
R1
R2
For non-inverting amplifier, input voltage (IN) is amplified
by a voltage gain, which depends on the ratio of R1 and
R2. The output voltage (OUT) is in-phase with the input
voltage (IN) and is shown in the next expression.
VDD
OUT = (1 + R2/R1)・IN
OUT
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational
amplifier.
IN
VSS
Figure 30. Non-inverting Amplifier Circuit
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Datasheet
BD1321G
Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 31 (a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation
(PD).
θJA
=
(TJmax－TA) / PD °C/W
The Derating curve in Figure 31 (b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a
reference value measured at a specified condition. Figure 31(c) shows an example of the derating curve for BD1321G.
Power dissipation of LSI [W]
PDmax
θJA=(TJmax-TA)/ PD °C/W
P2
θJA2 < θJA1
Ambient temperature TA [ °C ]
θJA2
P1
TJmax
θJA1
Chip surface temperature TJ [ °C ]
150
0
25
50
75
100
125
Ambient temperature TA [ °C ]
(a) Thermal Resistance
0.8
(b) Derating Curve
BD1321G
0.6
0.4
0.2
0
85
0
25
50
75
100
125
Ambient Temperature [°C]
(c) BD1321G
5.4
mW/°C
When using the unit above TA=25°C, subtract the value above per degree °C. Permissible dissipation is the value
when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area below 3%) is mounted
Figure 31. Thermal Resistance and Derating Curve
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Datasheet
BD1321G
Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the PD rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Datasheet
BD1321G
Operational Notes – continued
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when
no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins
have voltages within the values specified in the electrical characteristics of this IC.
13. Input Voltage
Applying (VSS－0.3) to (VDD+0.3) to the input terminal is possible without causing deterioration of the electrical
characteristics or destruction, regardless of the supply voltage. However, this does not ensure normal circuit
operation. Please note that the circuit operates normally only when the input voltage is within the common mode input
voltage range of the electric characteristics.
14. Power Supply(single/dual)
The op-amp operates when the voltage supplied is between VDD and VSS. Therefore, the single supply op-amp can
be used as dual supply op-amp as well.
15. Output Capacitor
If a large capacitor is connected between the output pin and VSS pin, current from the charged capacitor will flow into
the output pin and may destroy the IC when the VDD pin is shorted to ground or pulled down to 0V. Use a capacitor
smaller than 0.1uF between output pin and VSS pin.
16. Oscillation caused by Output Capacitor
Please pay attention to the oscillation caused by output capacitor when designing an application of negative feedback
loop circuit with these ICs.
17. Latch up
Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up and
protect the IC from abnormaly noise.
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Datasheet
BD1321G
Physical Dimension, Tape and Reel Information
Package Name
SSOP5
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Datasheet
BD1321G
Marking Diagram
SSOP5(TOP VIEW)
Part Number Marking
LOT Number
Product Name
BD1321G
Package Type
SSOP5
Marking
J3
Revision History
Date
Revision
Changes
24.Jan.2014
001
New Release
Correction of erroneous description
P.3 Typ value of Maximum Output Voltage(High) VDD-0.4→VDD-0.04
P.13 Figure 27 Add judgment voltage of Output wave
P.19 Marking L2→J3
04.Oct.2016
002
P.19 Delete Land Pattern Data
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
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serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
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a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
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extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.003
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
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Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
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3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
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weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
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Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
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Datasheet
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BD1321G - Web Page
Distribution Inventory
Part Number
Package
Unit Quantity
BD1321G
SSOP5
3000
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
3000
Taping
inquiry
Yes
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