BD11603MWX [ROHM]
USB Switch ICs SPST Type(Single Pole Single Throw); USB开关IC SPST型(单刀单掷)型号: | BD11603MWX |
厂家: | ROHM |
描述: | USB Switch ICs SPST Type(Single Pole Single Throw) |
文件: | 总10页 (文件大小:392K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
USB Switch ICs
SPST Type
(Single Pole Single Throw)
BH6260MWX
No.11103EAT04
●Description
BH6260MWX is SPST x 2ch and Inverter x 2ch analog switches. Analog SW0 and SW1 pass USB 2.0 high-speed signal.
Analog SW2 and SW3 pass UART signal. Moreover, this is guaranteed from 2.9V to 3.7V as for the range of the
power-supply voltage. Enable signals ENB0, ENB1, EN2, and EN3 can control Analog SW0, SW1, SW2, and SW3.
Furthermore, this is able to pass USB 2.0 high-speed signal without distortion, because of Analog SW0 and SW1 are low
capacitance. The electrostatic discharge protection circuit is built-in in all terminals.
●Features
1) 5Ω switches connect inputs to outputs
2) Low Capacity Analog SW 2ch with clamp Diode
3) 1.8V Output Inverter 2ch
4) 16-Pin SON Package (3.3mm x 1.5mm, Height=0.6mm, 0.4mm pitch)
5) It contributes to the miniaturization because all external is built into.
●Applications
Digital Still Cameras, Digital Video Camcorders, Portable Navigation Devices, TV, Portable DVD Players,
Portable Game Systems, Personal computers, PDA, Mobile phones
●Line up matrix
Parameter
BH6260MWX
BD11600NUX
BD11603MWX
BD11601NUX
Supply Quiescent Current
Input voltage range
0 μA
18 μA
18 μA
18 μA
2.9~3.7 V
2.5~5.5 V
2.5~5.5 V
2.5~5.5 V
Switch ON Resistance
( VIN=0 V )
5 Ω
3 Ω
6 pF
3 Ω
7 pF
2.5 Ω
6 pF
Switch ON Capacitance
Configuration
10 pF
SPST x 2ch
and Inverter x 2ch
DPDT
MUX x 2Lines
USON016X3315
DPST
Package
USON016X3315
VSON010X3020
VSON008X2020
●Absolute maximum ratings (Ta=25℃)
Parameter
Symbol
Vmax1
Ratings
Unit
Conditions
VDD,VDD18,B2,ENB0
ENB1,EN2,EN3
Input supply voltage1
-0.3~5.5
V
Input supply voltage2
Input supply voltage3
Input supply voltage4
Input supply voltage5
Power dissipation
Vmax2
Vmax3
Vmax4
Vmax5
Pd
-0.3~VDD+0.3
-0.3~VDD18+0.3
-0.3~VDD+0.3
-0.3~VDD18+0.3
850
V
V
A0,B0,A1,B1,A3
B3
V
A2 *3
A2 *4
*1
V
mW
℃
℃
Operating temperature range
Storage temperature range
Topr
-40~+85
Tstr
-55~+125
*1 When using more than at Ta=25℃, it is reduced 8.5 mW per 1℃. ROHM specification board 70mm× 70mm mounting.
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.08 - Rev.A
1/9
Technical Note
BH6260MWX
●Operating conditions (Ta=-40~+85℃)
Parameter
Symbol
VDD
Ratings
2.9~3.7
1.7~3.6
Unit
V
Conditions
Input voltage range (VDD)
Input voltage range (VDD18)
VDD18
V
* This product does not especially designed to be protected from radioactivity
●Electrical characteristics (Unless otherwise noted, Ta = 25℃, VDD=3.3V, VDD18=1.8V)
Limits
Parameter
Symbol
Unit
Conditions
Min.
Typ.
Max.
●Total
VDD=3.3V,
ENB0/1:L, EN2/3:H
Supply Quiescent Current 1
Supply Quiescent Current 2
Switch ON Resistance 1
Switch ON Resistance 2
Switch OFF Capacitance (A2, A3)
Switch ON Capacitance (A0, A1)
INV2 Input “L” level
ICC1
ICC2
-
-
-
-
-
-
-
0
10
10
10
13
-
A
A
Ω
Ω
pF
pF
V
VDD=3.3V,
ENB0/1:H, EN2/3:L
0
Ron1
5
VIN=0V
VIN=2.4V
f=1MHz
f=1MHz
Ron2
8
Coff
5.0
Con
10
-
0.25×
VDD18
VILBUF2
VIHBUF2
VOLBUF2
VOHBUF2
VILBUF3
VIHBUF3
VOLBUF3
VOHBUF3
VIHENB
VILENB
RININV3
VIK1
-
0.75×
VDD18
INV2 Input “H” level
-
-
0.3
-
V
INV2 Output “L” level
-
1.50
-
0.15
V
Io=3mA
Io=-3mA
INV2 Output “H” level
INV3 Input “L” level
1.65
V
0.25×
VDD18
-
V
0.75×
VDD18
INV3 Input “H” level
-
-
0.3
-
V
INV3 Output “L” level
-
0.15
V
Io=3mA
Io=-3mA
INV3 Output “H” level
ENBn/ENn input “H” level
ENBn/ENn input “L” level
INV3 Input Resister
1.50
1.65
V
0.75×
VDD
-
-
V
0.25×
VDD
-
-
V
50
100
150
-
kΩ
V
EN3:H
Clamp Diode Voltage1
Clamp Diode Voltage2
Propagation Delay (*1)
BUS Enable Time (*1)
BUS Disable Time (*1)
-1.2
-0.73
VIK2
-
-
-
-
0.73
1.2
0.25
200
200
V
A0,B0,A1,B1,A2,A3
CL=50pF,RL=500Ω
CL=50pF,RL=500Ω
CL=50pF,RL=500Ω
tPLH, tPHL
tPZH, tPZL
tPHZ, tPLZ
-
-
-
ns
ns
ns
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.08 - Rev.A
2/9
Technical Note
BH6260MWX
●Electrical characteristic curves (Reference data)
0.5
0.4
0.3
0.2
0.1
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-0.5
0.0
-0.1
-0.2
-0.3
-0.4
-0.5
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Time (x10* -8) s
Time (x10* -9) s
Fig.1
Fig.2
Eye Pattern Full Speed
Eye Pattern High Speed
5
4.5
4
5
4.5
4
3.5
3
3.5
3
2.5
2
2.5
2
1.5
1
1.5
1
Ta=105°C
Ta=25°C
Ta=-60°C
Ta=105°C
Ta=25°C
Ta=-60°C
0.5
0
0.5
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
6.5
7
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
6.5
7
VDD (V)
VDD (V)
Fig.3
Fig.4
ICC vs Input Voltage (SW OFF)
ICC vs Input Voltage (SW ON)
10
9.5
9
Ta=105°C
Ta=25°C
8.5
8
7.5
7
6.5
6
Ta=-60°C
5.5
5
4.5
4
3.5
3
2.5
2
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
A0 (V)
Fig.5
Ron vs Input Voltage
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.08 - Rev.A
3/9
Technical Note
BH6260MWX
●Block diagram and pin configuration
VDD
NC
ENB0
A0
1
2
3
4
5
6
7
8
16 VDD
15 EN3
14 A3
13 B3
12 EN2
11 A2
Analog
SW0
B0
A0
VDD
VDD
VDD
ENB0
Analog
SW1
A1
B1
VDD
ENB1
VDD18
B0
VDD18
VDD18
VDD18
INV2
VDD
Analog
SW2
B2
ENB1
A1
A2
VDD
VDD
EN2
VDD18
Analog
SW3
VDD18
INV3
A3
B1
10 B2
B3
100k
VDD
VDD
EN3
GND
9
VDD18
GND
Fig.6
Fig.7
Block diagram
Pin configuration
●Package Dimensions
B
2
H
6
6
0
LOT No.
Fig.8
Package Dimensions
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.08 - Rev.A
4/9
Technical Note
BH6260MWX
●Pin Description
Terminal
circuit
Pin NO.
Pin Name
I/O
Function
16
9
-
-
-
VDD
VDD18
GND
-
-
-
Power supply.
Power supply for INV2,3
Ground Pin
8
3,6
4,7
A 0~1
B 0~1
A
I/O
Analog SW0,1 terminal
11
14
B
C
D
E
F
F
A2
A3
O
I
INV2 Output
INV3 Input
INV2 Input
INV3 Output
10
B2
I
13
B3
O
I
2,5
12,15
ENB 0-1
EN 2-3
Analog SW0-1 ON/OFF Pin. (ENBn is Low : Analog SW is ON.)
Analog SW2-3 ON/OFF Pin. (ENn is High : Analog SW is ON.)
I
●Application Circuit
Low Capacitance Switch
USB/UART
CONNECTOR
VDD
VDD18
VDD
VDD18
B0
B3
B1
B2
A0
USB
Block
VDD18
ENB0
A3
100kΩ
EN3
A1
UART
VDD18
ENB1
A2
Block
EN2
ENB0
ENB1
EN2
CNT
Block
UART Signal
GND
EN3
Each Enable Signal
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.08 - Rev.A
5/9
Technical Note
BH6260MWX
●Equivalent Circuit
VDD
VDD
B
A
VDD
VDD
VDD
10k
10k
A0,A1
PAD
B0,B1
PAD
A2
C
VDD
D
VDD
VDD18
10k
10k
B2
A3
10k
100k
E
F
VDD
VDD
10k
ENB0
ENB1
EN2
B3
PAD
EN3
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.08 - Rev.A
6/9
Technical Note
BH6260MWX
●Notes for use
(1) Absolute maximum ratings
If applied voltage (VCC1, VCC2), operating temperature range (Topr), or other absolute maximum ratings are
exceeded, there is a risk of damage. Since it is not possible to identify short, open, or other damage modes, if special
modes in which absolute maximum ratings are exceeded are assumed, consider applying fuses or other physical
safety measures.
(2) Recommended operating range
This is the range within which it is possible to obtain roughly the expected characteristics. For electrical
characteristics, it is those that are guaranteed under the conditions for each parameter. Even when these are within
the recommended operating range, voltage and temperature characteristics are indicated.
(3) Reverse connection of power supply connector
There is a risk of damaging the LSI by reverse connection of the power supply connector. For protection from reverse
connection, take measures such as externally placing a diode between the power supply and the power supply pin of
the LSI.
(4) Power supply lines
In the design of the board pattern, make power supply and GND line wiring low impedance. When doing so, although
the digital power supply and analog power supply are the same potential, separate the digital power supply pattern and
analog power supply pattern to deter digital noise from entering the analog power supply due to the common
impedance of the wiring patterns. Similarly take pattern design into account for GND lines as well. Furthermore, for all
power supply pins of the LSI, in conjunction with inserting capacitors between power supply and GND pins, when using
electrolytic capacitors, determine constants upon adequately confirming that capacitance loss occurring at low
temperatures is not a problem for various characteristics of the capacitors used.
(5) GND voltage
Make the potential of a GND pin such that it will be the lowest potential even if operating below that. In addition,
confirm that there are no pins for which the potential becomes less than a GND by actually including transition
phenomena.
(6) Shorts between pins and misinstallation
When installing in the set board, pay adequate attention to orientation and placement discrepancies of the LSI. If it is
installed erroneously, there is a risk of LSI damage. There also is a risk of damage if it is shorted by a foreign
substance getting between pins or between a pin and a power supply or GND.
(7) Operation in strong magnetic fields
Be careful when using the LSI in a strong magnetic field, since it may malfunction.
(8) Inspection in set board
When inspecting the LSI in the set board, since there is a risk of stress to the LSI when capacitors are connected to
low impedance LSI pins, be sure to discharge for each process. Moreover, when getting it on and off of a jig in the
inspection process, always connect it after turning off the power supply, perform the inspection, and remove it after
turning off the power supply. Furthermore, as countermeasures against static electricity, use grounding in the
assembly process and take appropriate care in transport and storage.
(9) Input pins
Parasitic elements inevitably are formed on an LSI structure due to potential relationships. Because parasitic
elements operate, they give rise to interference with circuit operation and may be the cause of malfunctions as well as
damage. Accordingly, take care not to apply a lower voltage than GND to an input pin or use the LSI in other ways
such that parasitic elements operate. Moreover, do not apply a voltage to an input pin when the power supply voltage
is not being applied to the LSI. Furthermore, when the power supply voltage is being applied, make each input pin a
voltage less than the power supply voltage as well as within the guaranteed values of electrical characteristics.
(10) Ground wiring pattern
When there is a small signal GND and a large current GND, it is recommended that you separate the large current
GND pattern and small signal GND pattern and provide single point grounding at the reference point of the set so that
voltage variation due to resistance components of the pattern wiring and large currents do not cause the small signal
GND voltage to change. Take care that the GND wiring pattern of externally attached components also does not
change.
(11) Externally attached capacitors
When using ceramic capacitors for externally attached capacitors, determine constants upon taking into account a
lowering of the rated capacitance due to DC bias and capacitance change due to factors such as temperature.
(12) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.08 - Rev.A
7/9
Technical Note
BH6260MWX
●Power Dissipation
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Pd=0.85W
-8.5mW/℃
Ta_max=85℃
70 80
0
0
10
20
30
40
50
60
90 100 110 120 130
Ambient temperature :Ta [℃]
Fig.10 Power dissipation
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.08 - Rev.A
8/9
Technical Note
BH6260MWX
●Ordering part number
B
H
6
2
6
0
M W X
-
E
2
Part No.
Part No.
Packaging and forming specification
E2: Embossed tape and reel
パッケージ
MWX:USON016X3315
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.08 - Rev.A
9/9
Notice
N o t e s
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-
controller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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© 2011 ROHM Co., Ltd. All rights reserved.
R1120
A
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