BD1206GUL-E2 [ROHM]
LED Driver, 6-Segment, PBGA15, 0.55 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VCSP-15;
| 型号： | BD1206GUL-E2 |
| 厂家： | 
ROHM |
| 描述： | LED Driver, 6-Segment, PBGA15, 0.55 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VCSP-15 驱动 接口集成电路 |
| 文件： | 总15页 (文件大小：462K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
6-Channel Charge Pump
White LED Driver with 16 Dimming
Steps and 1-wire Serial Interface
BD1206GUL
●General Description
●Key Specification
ꢀ Operating power supply voltage range: 2.7V to 5.5V
BD1206GUL is 5ch or 6ch parallel LED driver for the
portable instruments.
ꢀ LED maximum current:
ꢀ Oscillator frequency:
ꢀ Quiescent Current:
20mA (Typ.)
0.85MHz(Typ.)
0.1μA (Typ.)
This IC is equipped with an automatic transition charge
pump and 16-step LED drivers. Hence this IC realizes
high efficiency and high accuracy drive of LEDs.
Additionally, this IC can synchronize LED drive with
external PWM signal. This IC is best suited to turn on
white LEDs that require high-accuracy LED brightness
control.
ꢀ Operating temperature range:
-30℃ to +85℃
●Package
VCSP50L2:
W(Typ.) x D(Typ.) x H(Max.)
2.00mm x 2.00mm x 0.55mm
●Features
ꢀ
ꢀ
ꢀ
ꢀ
5ch or 6ch parallel LED driver is mounted
16-step LED current adjust function
LED current matching is 5% or less
Driving control via a single-line digital control
interface
ꢀ
Automatic transition charge pump type DC/DC
converter (×1, ×1.5, ×2)
ꢀ
ꢀ
High efficiency achieved (Maximum over 93%)
It transits for the most suitable power operating
by the LED terminal process of the 6th light
when only 5 lights driving
ꢀ
ꢀ
ꢀ
Various protection functions such as output
voltage protection and thermal shutdown circuit
are mounted.
The input external PWM is possible and the
back light control interlocked with the motion
picture is possible.
Package: VCSP50L2 (Thick 0.55mm MAX, Pin
pitch 0.5mm) CSP15pin package
●Pin Configuration [Bottom View]
●Typical Application Circuit (6 light with PWM)
BD1206GUL
Figure 1. Pin Configuration
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
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BD1206GUL
●Absolute Maximum Ratings (Ta=25ºC)
Parameter
Symbol
VMAX
Vdin
Pd
Ratings
Unit
V
Power supply voltage
7
GND-0.3 to VBAT+0.3
900
Input voltage ( EN , PWMIN )
Power dissipation
V
mW
ºC
ºC
Operating temperature range
Topr
-30 to +85
Storage temperature range
Tstg
-55 to +150
(Note) Power dissipation deleting is 7.2mW/ ºC, when it’s used in over 25 ºC.(It’s deleting is on the board that is ROHM’s standard)
Dissipation by LSI should not exceed tolerance level of Pd.
●Recommended Operating Rating (Ta = -30 to 85 oC)
Parameter
Symbol
VBAT
Limits
Unit
V
Operating power supply voltage
2.7 to 5.5
●Electrical Characteristics (Unless otherwise noted, Ta = +25oC, VBAT=3.6V)
Limits
Parameter
Symbol
Units
Condition
Min.
Typ.
Max.
Current Consumption
Quiescent Current
Iq
-
-
0.1
62
1
μA
EN=0V
x 1.0 Mode
Include LED current (60mA)
x 2.0 Mode
Current Consumption1
Current Consumption2
Idd1
64
mA
Idd2
-
123
126
mA
Include LED current (60mA)
Charge Pump
Oscillator frequency
Current Source
fOSC
0.56
0.85
1.14
MHz
LED maximum current
ILED-max
ILED-diff
18
-
20
-
22
mA
%
VBAT≥3.2V
LED current setting is 10.0mA,
LED terminal voltage is 1.0V
LED current setting is 10.0mA,
LED terminal voltage is 1.0V
Minimum voltage from LED1 to LED6
pins
LED current accuracy
LED current matching
LED control voltage
10.0
ILED-match
VLED
-
-
0.5
5.0
%
V
0.15
0.25
Logic control terminal
Low threshold voltage
High threshold voltage
High level Input current
Low level Input current
Minimum EN High time
Minimum EN Low time
EN Off Timeout
VIL
VIH
-
1.4
-
-
-
0.4
V
EN, PWMIN
-
V
EN, PWMIN
IIH
0
0
-
1
μA
μA
μs
μs
ms
ms
ms
EN = VBAT, PWMIN = VBAT
EN = 0V, PWMIN = 0V
Described in Figure 4.
Described in Figure 4.
Described in Figure 4.
Described in Figure 4.
Described in Figure 4.
IIL
-1
0.05
0.3
1
-
100
100
-
THI
TLO
TOFF
TLAT
Tacc
-
-
Latch time
1
-
-
Access available time
1
-
5
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BD1206GUL
●Pin Descriptions
Pin No.
Terminal No.
Pin Name
In/Out
Type
Function
1
2
D4
B4
C4
A4
B3
A3
C3
D1
D2
C1
C2
B1
A1
D3
A2
VBAT
C1P
-
A
A
B
A
B
A
C
B
B
B
B
B
A
C
D
Power supply
In/Out
In/Out
In/Out
In/Out
Out
In
Flying capacitor pin positive (+) side
Flying capacitor pin negative (-) side
Flying capacitor pin positive (+) side
Flying capacitor pin negative (-) side
Charge pump output
3
C1N
4
C2P
5
C2N
6
VOUT
EN
7
ON/OFF and dimming control
LED current driver output 1
LED current driver output 2
LED current driver output 3
LED current driver output 4
LED current driver output 5
LED current driver output 6
PWM Control
8
LED1
LED2
LED3
LED4
LED5
LED6
PWMIN
GND
Out
Out
Out
Out
Out
Out
In
9
10
11
12
13
14
15
-
GND
●Pin ESD Type
Type B
Type A
Type C
VBAT
VBAT
PAD
PAD
GND
PAD
GND
GND
Type D
PAD
VBAT
Figure 2. Pin ESD Type
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BD1206GUL
●Block Diagram
×1, ×1.5, ×2
Charge pump
VBAT
VOUT
Over Voltage
Protect
Charge Pump
Mode Control
EN
OSC
TSD
Enable/
Brightness
Control
Vout Control
PWMIN
LED1
LED2
LED3
LED4
LED5
LED6
LED6 DET
4
Current
DAC
GND
Figure 3. Block Diagram
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BD1206GUL
●Separate Function Description
(1) LED driver
a) Register access control protocol
LED current is controlled by only EN terminal. It is possible to access the register inside of this chip by using the
protocol below. Accessing the registers with using this protocol operates LED driver ON/OFF and selecting the mode.
Moreover, MAX current can be outputted without Clock input to EN terminal by holding H zone of fixed time after EN
terminal starting.
< When setting current level >
TLAT
THI
Tacc
TOFF
TLO
Tpulse
EN
(N≦16)
n-1
n
1
2
LED Current Setting
0
n
0
(Notes) TaccMIN
<
Tpulse
<
TaccMAX Please input a pulse on this condition
< When starting by MAX setup >
TaccMAX
TOFF
EN
LED Current Setting
１
0
0
Figure 4. Register access protocol
Tac c
TLAT
TLAT
TLAT
TLAT
EN
16pulse
15pulse
14pulse
13pulse
1mA
0.5mA
0.25mA
0.125mA
LED Current
OFF
Figure 5. Slope control example
(Note)
・In the case of N > 16, BD1206GUL selects the mode of N = 16.
・LED current is changed by the pulse of EN pin.
Be careful to noise of EN signal.
・Reset BD1206GUL when the set is unusual. (Keep EN=L over Toff time.)
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BD1206GUL
b) LED current level
The interface records rising edges of the EN pin and decodes them into 16 different indicated in following table.
Data
Output current [mA]
Data
Output current [mA]
1
2
3
4
5
6
7
8
20.0
17.0
14.0
12.0
10.0
8.5
9
5.0
4.0
10
11
12
13
14
15
16
3.0
2.0
1.0
0.5
7.0
0.25
0.125
6.0
(2) Charge pump
a) Description of operations
Pin voltage comparison takes place at Vout control section, and then Vout generation takes place so that the LED
cathode voltage with the highest Vf is set to 0.15V. A boost rate is changed automatically to a proper one at the
Charge Pump Mode Control section so that operation can take place at possible low boost rate. In addition, when the
VOUT output is short-circuited to GND, the leak current is suppressed via the over current protection function.
b) Soft start function
BD1206GUL have a soft start function that prevents the rush current.
EN/LED*
VOUT
ILED
Soft Start
Ordinal mode
* EN/LED is an internal enable
Figure 6. Soft Start
c) Automatic boost rate change
The boost rate automatically switches to the best mode.
* (×1 mode ꢁ×1.5 mode) or (×1.5 mode ꢁ×2 mode)
If a battery voltage drop occurs BD1206GUL cannot maintain the LED constant current,
and then mode transition begins.
* (×1.5 mode ꢁ×1 mode) or (×2 mode ꢁ×1.5 mode)
If a battery voltage rise occurs, VOUT and VBAT detection are activated, and then mode transition begins.
(3) UVLO (Under Voltage Lock Out)
If the input voltage falls below 2.2V(Typ.), BD1206GUL is shut down to prevent malfunction due to ultra-low voltage.
(4) OVP (Over Voltage Protection)
This circuit protects this IC against damage when the C/P output voltage (VOUT) rises extremely for some external
factors.
(5) Thermal shutdown (TSD)
To protect this IC against thermal damage or heat-driven uncontrolled operations, this circuit turns off the output if the
chip temperature rises over 175ºC. In addition, it turns on the output if the temperature returns to the normal
temperature. Because the built-in thermal protection circuit is intended to protect the IC itself, the thermal shutdown
detection temperature must be set to below 175ºC in thermal design.
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BD1206GUL
(6) Power sequence
EN signal must be released after VBAT voltage enough rise up.
Prohibit the VBAT rise up during EN=”H”.
VBAT
EN
Figure 7. Power sequence
(7) PWM control
PWM control by the external terminal (PWMIN) is possible.
It becomes PWM operation, which used LED current by a register setup as the base and is the best for the brightness
compensation by external control. If the application with is not use PWM, PWMIN pin must be short to VBAT.
E N /L E D *
In te rn al S oft-Sta rt Tim e
V O U T
N on-P W M
P W M IN in pu t
L E D C u rre n t
PWMIN
LED Current
Compulsion OFF
Normal operation
P W M IN in pu t
L E D C u rre nt
L
H
Figure 8. External PWM input solution
It is possible to make it a PWMIN input before EN/LED* is “H”.
A PWM drive becomes effective after the time of LED current standup.
When rising during PWM operation, as for the standup time of VOUT, only the rate of PWM Duty becomes late.
Appearance may be influenced when extremely late frequency and extremely low Duty are inputted.
Please secure over 120 μs “H” sections at the time of PWM pulse Force.
EN/LED* is an internal enable signal
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BD1206GUL
●Application Circuit Example (6 light with PWM)
C2=1μF
C1=1μF
Battery
VOUT
×1, ×1.5, ×2
Charge pump
VBAT
Cin
=1μF
Cout
=1μF
Over Voltage
Protect
Charge Pump
Mode Control
EN
OSC
TSD
From
CPU
Enable/
Brightness
Control
Vout Control
PWMIN
LED1
LED2
LED3
LED4
LED5
LED6
From
LCM
LED6 DET
4
Current
DAC
GND
Figure 9. Application Circuit Example 1
●Application Circuit Example (5 light with PWM)
C2=1μF
C1=1μF
Battery
VOUT
×1, ×1.5, ×2
Charge pump
VBAT
Cin
=1μF
Cout
=1μF
Over Voltage
Protect
Charge Pump
Mode Control
EN
OSC
TSD
From
CPU
Enable/
Brightness
Control
Vout Control
PWMIN
LED1
LED2
LED3
LED4
LED5
LED6
From
LCM
LED6DET
4
Current
DAC
GND
Figure 10. Application Circuit Example 2
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BD1206GUL
●Application Circuit Example (6 light without PWM)
C2=1μF
C1=1μF
Battery
VOUT
×1, ×1.5, ×2
Charge pump
VBAT
Cin
=1μF
Cout
=1μF
Over Voltage
Protect
Charge Pump
Mode Control
EN
OSC
TSD
From
CPU
Enable/
Brightness
Control
Vout Control
Battery
LED1
LED2
PWMIN
LED3
LED4
LED5
LED6
LED6 DET
4
Current
DAC
GND
Figure 11. Application Circuit Example 3
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BD1206GUL
●Operational Notes
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Power Supply and Ground Line
Design PCB pattern to provide low impedance for the wiring between the power supply and the ground lines. Pay
attention to the interference by common impedance of layout pattern when there are plural power supplies and ground
lines. Especially, when there are ground pattern for small signal and ground pattern for large current included the external
circuits, please separate each ground pattern. Furthermore, for all power supply pins to ICs, mount a capacitor between
the power supply and the ground pin. At the same time, in order to use a capacitor, thoroughly check to be sure the
characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low
temperature, thus determining the constant.
(3) Ground Voltage
Make setting of the potential of the ground pin so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no pins are at a potential lower than the ground voltage including an actual electric
transient.
(4) Short Circuit between Pins and Erroneous Mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between pins or between the
pin and the power supply or the ground pin, the ICs can break down.
(5)Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6)Input Pins
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input pin. Therefore, pay thorough attention not to handle the input pins, such as to apply to the input pins a voltage lower
than the ground respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input
pins when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to
the input pins a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics.
(7) External Capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8)Thermal Shutdown Circuit
This LSI builds in a thermal shutdown circuit. When junction temperatures become detection temperature or higher, the
thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the
LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not
continuously use the LSI with this circuit operating or use the LSI assuming its operation.
(9) Thermal Design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd)in
actual states of use.
(10) About the Pin for the Test, the un-use pin
Prevent a problem from being in the pin for the test and the un-use pin under the state of actual use. Please refer to this
Datasheet. And, as for the pin that doesn't specially have an explanation, ask our company person in charge.
(11) About the Rush Current
For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal
powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring, width
of ground wiring, and routing of wiring.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
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Datasheet
BD1206GUL
●Ordering Information
B D
1
2
0
6 G U
L
-
E 2
Part Number
Package
GUL: VCSP50L2
Packaging and forming specification
E2: Embossed tape and reel
●Marking Diagram
VCSP50L2(TOP VIEW)
1PIN MARK
Part Number Marking
LOT Number
1206
●Physical Dimension Tape and Reel Information
VCSP50L2(BD1206GUL)
<Tape and Reel information>
1PIN MARK
Tape
Embossed carrier tape (heat sealing method)
3000pcs
Quantity
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2.00 0.05
(
)
S
φ
15- 0.25 0.05
0.06
S
0.05
A B
A
D
C
B
A
(φ0.15)INDEX POST
B
Direction of feed
1pin
1
2
3
4
0.25 0.05
P=0.5×3
Reel
Order quantity needs to be multiple of the minimum quantity.
∗
(Unit : mm)
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BD1206GUL
●Revision History
Date
Revision
001
Changes
02.Oct.2012
New Release
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
Rev.002
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
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General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
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