BD1206GUL_技术文档

LED Drivers for LCD Backlights

Backlight LED Driver

for Small LCD Panels (Charge Pump Type)

No.10040EAT08

BD1206GUL

●Description

BD1206GUL is 5ch or 6ch parallel LED driver for the portable instruments.

This IC is equipped with an automatic transition charge pump and 16-step LED drivers. Hence this IC realizes high efficiency

and high accuracy drive of LEDs. Additionally, this IC can synchronize LED drive with external PWM signal. This IC is best

suited to turn on white LEDs that require high-accuracy LED brightness control.

●Features

1) 5ch or 6ch parallel LED driver is mounted

2) 16-step LED current adjust function

3) LED current matching is 5% or less

4) Driving control via a single-line digital control interface

5) Automatic transition charge pump type DC/DC converter (×1, ×1.5, ×2)

6) High efficiency achieved (Maximum over 93%)

7) It transits for the most suitable power operating by the LED terminal process of the 6th light when only 5 lights driving

8) Various protection functions such as output voltage protection and thermal shutdown circuit are mounted.

9) The input external PWM is possible and the back light control interlocked with the motion picture is possible.

10) Package: VCSP50L2 (Thick 0.55mm MAX, Pin pitch 0.5mm) CSP15pin package

●Absolute Maximum Ratings (Ta=25ºC)

Parameter

Power supply voltage

Symbol

VMAX

Vdin

Pd

Ratings

Unit

V

7

GND-0.3 ~ VBAT+0.3

900

Input voltage ( EN , PWMIN )

Power dissipation

V

mW

ºC

Operating temperature range

Topr

-30 ~ +85

Storage temperature range

Tstg

-55 ~ +150

(Note) Power dissipation deleting is 7.2mW/ ºC, when it’s used in over 25 ºC.(It’s deleting is on the board that is ROHM’s standard)

Dissipation by LSI should not exceed tolerance level of Pd.

●Operating Conditions (Ta = -30 ~ 85 ^oC)

Parameter

Symbol

VBAT

Limits

Unit

V

Operating power supply voltage

2.7 ~ 5.5

*This chip is not designed to protect itself against radioactive rays.

*This material may be changed on its way to designing.

*This material is not the official specification.

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Technical Note

BD1206GUL

●Electrical Characteristics (Unless otherwise noted, Ta = +25^oC, VBAT=3.6V)

Limits

Parameter

Symbol

Units

Condition

Min.

Typ.

Max.

Current Consumption

Quiescent Current

Iq

-

0.1

62

1

μA

mA

EN=0V

x 1.0 Mode

Include LED current (60mA)

x 2.0 Mode

Include LED current (60mA)

Current Consumption1

Current Consumption2

Charge Pump

Idd1

Idd2

64

123

126

Oscillator frequency

Current Source

fOSC

0.56

0.85

1.14

MHz

LED maximum current

LED current accuracy

LED current matching

LED control voltage

Logic control terminal

Low threshold voltage

High threshold voltage

High level Input current

Low level Input current

Minimum EN High time

Minimum EN Low time

EN Off Timeout

ILED-max

ILED-diff

ILED-match

VLED

18

-

20

-

22

mA

%

VBAT≥3.2V

LED current setting is 10.0mA,

LED terminal voltage is 1.0V

LED current setting is 10.0mA,

LED terminal voltage is 1.0V

Minimum voltage from LED1 to LED6

pins

10.0

5.0

-

0.5

0.15

%

-

0.25

V

VIL

VIH

-

1.4

-

0.4

V

EN, PWMIN

-

V

EN, PWMIN

IIH

0

-

1

μA

μs

ms

EN = VBAT, PWMIN = VBAT

EN = 0V, PWMIN = 0V

Described in Fig.5

IIL

-1

0.05

0.3

1

-

100

-

THI

TLO

TOFF

TLAT

Tacc

-

Latch time

1

-

Access available time

1

-

5

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Technical Note

BD1206GUL

●Block Diagram

×1, ×1.5, ×2

Charge pump

VBAT

VOUT

Over Voltage

Protect

Charge Pump

Mode Control

EN

OSC

TSD

Enable/

Brightness

Control

Vout Control

PWMIN

LED1

LED2

LED3

LED4

LED5

LED6

LED6 DET

4

Current

DAC

GND

Pin number 14pin

Fig. 1 Block Diagram

●Pin Configuration [Bottom View]

D

LED1

LED3

LED5

LED2

PWMIN

EN

VBAT

C1N

C1P

C

B

A

LED4

index

C2N

LED6

1

GND

2

VOUT

3

C2P

4

Fig. 2 Pin Configuration

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2010.02 - Rev.A

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Technical Note

BD1206GUL

●Package Outline

1206

Lot No.

( UNIT : mm )

Fig. 3 Package Dimension

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Technical Note

BD1206GUL

●Pin Descriptions

Pin No.

Terminal No.

Pin Name

In/Out

Type

Function

1

2

D4

B4

C4

A4

B3

A3

C3

D1

D2

C1

C2

B1

A1

D3

A2

VBAT

C1P

-

A

B

A

B

A

C

B

A

C

D

Power supply

In/Out

Out

In

Flying capacitor pin positive (+) side

Flying capacitor pin negative (-) side

Flying capacitor pin positive (+) side

Flying capacitor pin negative (-) side

Charge pump output

3

C1N

4

C2P

5

C2N

6

VOUT

EN

7

ON/OFF and dimming control

LED current driver output 1

LED current driver output 2

LED current driver output 3

LED current driver output 4

LED current driver output 5

LED current driver output 6

PWM Control

8

LED1

LED2

LED3

LED4

LED5

LED6

PWMIN

GND

Out

In

9

10

11

12

13

14

15

-

GND

●Pin ESD Type

Type B

Type A

Type C

VBAT

PAD

GND

PAD

GND

Type D

PAD

VBAT

Fig. 4 Pin ESD Type

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2010.02 - Rev.A

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Technical Note

BD1206GUL

●Separate Function Description

(1) LED driver

a) Register access control protocol

LED current is controlled by only EN terminal. It is possible to access the register inside of this chip by using the

protocol below. Accessing the registers with using this protocol operates LED driver ON/OFF and selecting the mode.

Moreover, MAX current can be outputted without Clock input to EN terminal by holding H zone of fixed time after EN

terminal starting.

< When setting current level >

T_LAT

T_HI

T_acc

T_OFF

T_LO

T_pulse

EN

(N≦16)

n-1

n

1

2

LED Current Setting

0

n

0

(Notes) T_accMIN

<

T_pulse

<

T_accMAXPlease input a pulse on this condition

< When starting by MAX setup >

T_accMAX

T_OFF

EN

LED Current Setting

１

0

Fig.5 Register access protocol

T_{ac c}

T_LAT

EN

16pulse

15pulse

14pulse

13pulse

1mA

0.5mA

0.25mA

0.125mA

LED Current

OFF

Fig.6 Slope control example

(Note)

・In the case of N > 16, BD1206GUL selects the mode of N = 16.

・LED current is changed by the pulse of EN pin.

Be careful to noise of EN signal.

・Reset BD1206GUL when the set is unusual. (Keep EN=L over Toff time.)

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Technical Note

BD1206GUL

b) LED current level

The interface records rising edges of the EN pin and decodes them into 16 different indicated in following table.

Data

Output current [mA]

Data

Output current [mA]

1

2

3

4

5

6

7

8

20.0

17.0

14.0

12.0

10.0

8.5

9

5.0

4.0

10

11

12

13

14

15

16

3.0

2.0

1.0

0.5

7.0

0.25

0.125

6.0

(2) Charge pump

a) Description of operations

Pin voltage comparison takes place at Vout control section, and then Vout generation takes place so that the LED

cathode voltage with the highest Vf is set to 0.15V. A boost rate is changed automatically to a proper one at the

Charge Pump Mode Control section so that operation can take place at possible low boost rate. In addition, when the

VOUT output is short-circuited to GND, the leak current is suppressed via the over current protection function.

b) Soft start function

BD1206GUL have a soft start function that prevents the rush current.

T_OFF

EN/LED*

VOUT

I_LED

Soft Start

Ordinal mode

* EN/LED is an internal enable

Fig.7 Soft Start

c) Automatic boost rate change

The boost rate automatically switches to the best mode.

* (×1 mode  ×1.5 mode) or (×1.5 mode  ×2 mode)

If a battery voltage drop occurs BD1206GUL cannot maintain the LED constant current,

and then mode transition begins.

* (×1.5 mode  ×1 mode) or (×2 mode  ×1.5 mode)

If a battery voltage rise occurs, VOUT and VBAT detection are activated, and then mode transition begins.

(3) UVLO (Under Voltage Lock Out)

If the input voltage falls below 2.2V(Typ.), BD1206GUL is shut down to prevent malfunction due to ultra-low voltage.

(4) OVP (Over Voltage Protection)

This circuit protects this IC against damage when the C/P output voltage (VOUT) rises extremely for some external

factors.

(5) Thermal shutdown (TSD)

To protect this IC against thermal damage or heat-driven uncontrolled operations, this circuit turns off the output if the

chip temperature rises over 175ºC. In addition, it turns on the output if the temperature returns to the normal

temperature. Because the built-in thermal protection circuit is intended to protect the IC itself, the thermal shutdown

detection temperature must be set to below 175ºC in thermal design.

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2010.02 - Rev.A

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Technical Note

BD1206GUL

(6) Power sequence

EN signal must be released after VBAT voltage enough rise up.

Prohibit the VBAT rise up during EN=”H”.

VBAT

EN

Fig.8 Power sequence

(7) PWM control

PWM control by the external terminal (PWMIN) is possible.

It becomes PWM operation, which used LED current by a register setup as the base and is the best for the brightness

compensation by external control.If the application with is not use PWM, PWMIN pin must be short to VBAT.

E N /L E D *

In te rn al S oft-Sta rt Tim e

V O U T

N on-P W M

P W M IN in pu t

L E D C u rre n t

PWMIN

LED Current

Compulsion OFF

Normal operation

P W M IN in pu t

L E D C u rre nt

L

H

Fig.9 External PWM input solution

It is possible to make it a PWMIN input before EN/LED* is “H”.

A PWM drive becomes effective after the time of LED current standup.

When rising during PWM operation, as for the standup time of VOUT, only the rate of PWM Duty becomes late.

Appearance may be influenced when extremely late frequency and extremely low Duty are inputted.

Please secure over 120 μs “H” sections at the time of PWM pulse Force.

EN/LED* is an internal enable signal

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2010.02 - Rev.A

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Technical Note

BD1206GUL

●Application Circuit Example (6 light with PWM)

C2=1μF

C1=1μF

Battery

VOUT

×1, ×1.5, ×2

Charge pump

VBAT

Cin

=1μF

Cout

=1μF

Over Voltage

Protect

Charge Pump

Mode Control

EN

OSC

TSD

From

CPU

Enable/

Brightness

Control

Vout Control

PWMIN

LED1

LED2

LED3

LED4

LED5

LED6

From

LCM

LED6 DET

4

Current

DAC

GND

Fig.10 Application Circuit Example 1

●Application Circuit Example (5 light with PWM)

C2=1μF

C1=1μF

Battery

VOUT

×1, ×1.5, ×2

Charge pump

VBAT

Cin

=1μF

Cout

=1μF

Over Voltage

Protect

Charge Pump

Mode Control

EN

OSC

TSD

From

CPU

Enable/

Brightness

Control

Vout Control

PWMIN

LED1

LED2

LED3

LED4

LED5

LED6

From

LCM

LED6DET

4

Current

DAC

GND

Fig.11 Application Circuit Example 2

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Technical Note

BD1206GUL

●Application Circuit Example (6 light without PWM)

C2=1μF

C1=1μF

Battery

VOUT

×1, ×1.5, ×2

Charge pump

VBAT

Cin

=1μF

Cout

=1μF

Over Voltage

Protect

Charge Pump

Mode Control

EN

OSC

TSD

From

CPU

Enable/

Brightness

Control

Vout Control

Battery

LED1

LED2

PWMIN

LED3

LED4

LED5

LED6

LED6 DET

4

Current

DAC

GND

Fig.12 Application Circuit Example 3

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Technical Note

BD1206GUL

●Notes for use

(1) Absolute Maximum Ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can

break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any

special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety

measures including the use of fuses, etc.

(2) Power supply and ground line

Design PCB pattern to provide low impedance for the wiring between the power supply and the ground lines. Pay attention

to the interference by common impedance of layout pattern when there are plural power supplies and ground lines.

Especially, when there are ground pattern for small signal and ground pattern for large current included the external

circuits, please separate each ground pattern. Furthermore, for all power supply pins to ICs, mount a capacitor between

the power supply and the ground pin. At the same time, in order to use a capacitor, thoroughly check to be sure the

characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low

temperature, thus determining the constant.

(3) Ground voltage

Make setting of the potential of the ground pin so that it will be maintained at the minimum in any operating state.

Furthermore, check to be sure no pins are at a potential lower than the ground voltage including an actual electric

transient.

(4) Short circuit between pins and erroneous mounting

In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can

break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between pins or between the pin

and the power supply or the ground pin, the ICs can break down.

(5)Operation in strong electromagnetic field

Be noted that using ICs in the strong electromagnetic field can malfunction them.

(6)Input pins

In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the

parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the

input pin. Therefore, pay thorough attention not to handle the input pins, such as to apply to the input pins a voltage lower

than the ground respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input

pins when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to

the input pins a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics.

(7) External capacitor

In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a

degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.

(8)Thermal shutdown circuit

This LSI builds in a thermal shutdown circuit. When junction temperatures become detection temperature or higher, the

thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the

LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not

continuously use the LSI with this circuit operating or use the LSI assuming its operation.

(9) Thermal design

Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd)in

actual states of use.

(10) About the pin for the test, the un-use pin

Prevent a problem from being in the pin for the test and the un-use pin under the state of actual use. Please refer to a

function manual and an application notebook. And, as for the pin that doesn't specially have an explanation, ask our

company person in charge.

(11) About the rush current

For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal

powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring, width

of ground wiring, and routing of wiring.

(12) About this document

This document is the design materials to design a set. So, the contents of the materials aren't always guaranteed. Please

design application by having fully examination and evaluation include the external elements.

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2010.02 - Rev.A

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Technical Note

BD1206GUL

●Ordering part number

B

D

1

2

0

6

G

U

L

-

E

2

Part No.

Package

GUL: VCSP50L2

Packaging and forming specification

E2: Embossed tape and reel

VCSP50L2(BD1206GUL)

1PIN MARK

Tape

Embossed carrier tape (heat sealing method)

3000pcs

Quantity

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2.00 0.05

(

)

S

φ

15- 0.25 0.05

0.06

S

0.05

A B

A

D

C

B

A

(φ0.15)INDEX POST

B

Direction of feed

1pin

1

2

3

4

0.25 0.05

P=0.5×3

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

(Unit : mm)

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Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, ﬁre or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, ﬁre control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-

controller or other safety device). ROHM shall bear no responsibility in any way for use of any

of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology speciﬁed herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

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R1010

A


型号：	BD1206GUL
厂家：	ROHM
描述：	Backlight LED Driver for Small LCD Panels (Charge Pump Type) 背光LED驱动器，用于小型液晶面板（电荷泵型）驱动器泵 CD
文件：	总13页 (文件大小：387K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD1206GUL [ROHM]

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