ATC100A150JT [RFMD]

380W GaN WIDEBAND PULSED; 380W氮化镓WIDEBAND脉冲
ATC100A150JT
型号: ATC100A150JT
厂家: RF MICRO DEVICES    RF MICRO DEVICES
描述:

380W GaN WIDEBAND PULSED
380W氮化镓WIDEBAND脉冲

脉冲
文件: 总11页 (文件大小:773K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
RF3928B  
380W GaN  
WIDEBAND  
PULSED  
POWER AMPLI-  
FIER  
RF3928B  
380W GaN WIDEBAND PULSED  
POWER AMPLIFIER  
Package: Hermetic 2-Pin, Flanged Ceramic  
Features  
Wideband Operation 2.8GHz to  
3.4GHz  
RF IN  
VG  
Pin 1 (CUT)  
RF OUT  
VD  
Pin 2  
Advanced GaN HEMT Technology  
Advanced Heat-Sink Technology  
Supports Multiple Pulse  
Conditions  
GND  
BASE  
10% to 20% Duty Cycle  
100s to 300s Pulse Width  
Integrated Matching  
Components for High Terminal  
Impedances  
Functional Block Diagram  
65V Operation Typical  
Performance  
Product Description  
Pulsed Output Power 380W  
Small Signal Gain 13dB  
Drain Efficiency 50%  
-40°C to 85°C Operating  
Temperature  
The RF3928B is a 65V 380W high power discrete amplifier designed for S-Band  
pulsed radar, Air Traffic Control and Surveillance, and general purpose broadband  
amplifier applications. Using an advanced high power density Gallium Nitride (GaN)  
semiconductor process, these high-performance amplifiers achieve high output  
power, high efficiency and flat gain over a broad frequency range in a single pack-  
age. The RF3928B is a matched GaN transistor packaged in a hermetic, flanged  
ceramic package. This package provides excellent thermal stability through the use  
of advanced heat sink and power dissipation technologies. Ease of integration is  
accomplished through the incorporation of simple, optimized matching networks  
external to the package that provide wideband gain and power performance in a  
single amplifier.  
Applications  
Radar  
Air Traffic Control and  
Surveillance  
General Purpose Broadband  
Amplifiers  
Ordering Information  
RF3928BS2  
RF3928BSB  
RF3928BSQ  
RF3928BSR  
RF3928BTR13  
2-Piece sample bag  
5-Piece bag  
25-Piece reel  
50 Pieces on 7” short reel  
250 Pieces on 13” reel  
RF3928B99PCBA-410 Fully assembled evaluation board 2.8GHz to 3.4GHz;  
65V operation  
Optimum Technology Matching® Applied  
GaAs HBT  
GaAs MESFET  
InGaP HBT  
SiGe BiCMOS  
Si BiCMOS  
SiGe HBT  
GaAs pHEMT  
Si CMOS  
Si BJT  
GaN HEMT  
BiFET HBT  
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-  
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2012, RF Micro Devices, Inc.  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical  
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.  
DS120503  
1 of 11  
RF3928B  
Absolute Maximum Ratings  
Parameter  
Caution! ESD sensitive device.  
Rating  
Unit  
V
Exceeding any one or a combination of the Absolute Maximum Rating conditions may  
cause permanent damage to the device. Extended application of Absolute Maximum  
Rating conditions to the device may reduce device reliability. Specified typical perfor-  
mance or functional operation of the device under Absolute Maximum Rating condi-  
tions is not implied.  
Drain Source Voltage  
150  
-8 to +2  
155  
V
mA  
V
Gate Source Voltage  
The information in this publication is believed to be accurate and reliable. However, no  
responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any  
infringement of patents, or other rights of third parties, resulting from its use. No  
license is granted by implication or otherwise under any patent or patent rights of  
RFMD. RFMD reserves the right to change component circuitry, recommended appli-  
cation circuitry and specifications at any time without prior notice.  
Gate Current (I )  
G
Operational Voltage  
65  
Ruggedness (VSWR)  
3:1  
RoHS (Restriction of Hazardous Substances): Compliant per EU Directive  
2002/95/EC.  
°C  
°C  
°C  
Storage Temperature Range  
-55 to +125  
-40 to +85  
250  
Operating Temperature Range (T )  
L
Operating Junction Temperature (T )  
J
Human Body Model  
Class 1A  
Hours  
°C/W  
MTTF (T < 200°C)  
3.0E + 06  
1.4E + 05  
J
MTTF (T < 250°C)  
J
Thermal Resistance, Rth (junction to case)  
T =85°C, DC bias only  
0.90  
0.18  
0.25  
C
T =85°C, 100s pulse, 10% duty cycle  
C
T =85°C, 300s pulse, 10% duty cycle  
C
* MTTF – median time to failure for wear-out failure mode (30% Idss degradation) which is determined by the technology process reliability.  
Refer to product qualification report for FIT (random) failure rate.  
Operation of this device beyond any one of these limits may cause permanent damage. For reliable continuous operation, the device  
voltage and current must not exceed the maximum operating values specified in the table on page two.  
Bias Conditions should also satisfy the following expression: P  
<(T –T )/R J-C and T =T  
DISS  
J C TH C CASE  
Specification  
Typ.  
Parameter  
Unit  
Condition  
Min.  
Max.  
Recommended Operating  
Condition  
Drain Voltage (V  
)
65  
-3  
V
V
DSQ  
Gate Voltage (V  
)
-8  
-2  
GSQ  
Drain Bias Current  
440  
mA  
Frequency of Operation  
2800  
3400  
MHz  
DC Functional Test  
I
– Gate Leakage  
2
2
mA  
mA  
V
V =-8V, V =0V  
G D  
G (OFF)  
D (OFF)  
I
– Drain Leakage  
V =-8V, V =65V  
G D  
V
V
(th) – Threshold Voltage  
(on) – Drain Voltage at high  
-3.5  
V =65V, I =40mA  
D D  
GS  
0.22  
V
V =0V, I =1.5A  
DS  
G
D
current  
[1, 2]  
RF Functional Test  
Small Signal Gain  
Power Gain  
13  
dB  
dB  
dB  
F=2900MHz, P =30dBm  
IN  
11.2  
11.8  
F=2900MHz, P =44dBm  
IN  
Input Return Loss  
-6  
F=2900MHz, P =30dBm  
IN  
Output Power  
55.3  
45  
56  
50  
13  
dBm  
%
F=2900MHz, P =44dBm  
IN  
Drain Efficiency  
Small Signal Gain  
dB  
F=3150MHz, P =30dBm  
IN  
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support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.  
2 of 11  
DS120503  
RF3928B  
Specification  
Typ.  
Parameter  
Unit  
Condition  
Min.  
Max.  
RF Functional Test  
(continued)  
Power Gain  
11.2  
11.8  
dB  
dB  
F=3150MHz, P =44dBm  
IN  
Input Return Loss  
-6  
F=3150MHz, P =30dBm  
IN  
Output Power  
55.5  
45  
56  
50  
13  
dBm  
%
F=3150MHz, P =44dBm  
IN  
Drain Efficiency  
Small Signal Gain  
dB  
F=3400MHz, P =30dBm  
IN  
Power Gain  
11.3  
11.8  
dB  
dB  
F=3400MHz, P =44dBm  
IN  
Input Return Loss  
-6  
F=3400MHz, P =30dBm  
IN  
Output Power  
55.5  
45  
56  
50  
dBm  
%
F=3400MHz, P =44dBm  
IN  
Drain Efficiency  
[1, 2]  
RF Typical Performance  
Frequency Range  
Small Signal Gain  
2800  
3400  
MHz  
dB  
13  
F=3100MHz, P =30dBm  
IN  
Power Gain  
11.8  
dB  
P
=55.8dBm  
OUT  
Gain Variation with Temperature  
-0.015  
dB/°C  
dBm  
W
At peak output power  
Peak output power  
Peak output power  
At peak output power  
Output Power (P  
)
55.8  
380  
50  
SAT  
Drain Efficiency  
%
[1] Test Conditions: Pulsed Operation, PW=100s, DC=10%, V =65V, I =440mA, T=25ºC  
DS  
DQ  
[2] Performance in a standard tuned test fixture  
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support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.  
DS120503  
3 of 11  
RF3928B  
Typical Performance in Standard Fixed Tuned Test Fixture over Temperature  
(Pulsed at Center Band Frequency)  
GainꢀversusꢀOutputꢀPowerꢀ(fꢀ=ꢀ3200MHz)  
EfficiencyꢀversusꢀOutputꢀPowerꢀ(fꢀ=ꢀ3200MHz)  
(Pulsedꢀ10%ꢀdutyꢀcycle,ꢀ100μS,ꢀVD =ꢀ65V,ꢀIDQ =ꢀ440mA)  
(Pulsedꢀ10%ꢀdutyꢀcycle,ꢀ100μS,ꢀVD =ꢀ65V,ꢀIDQ=ꢀ440mA)  
17  
16  
15  
14  
13  
12  
11  
10  
70  
60  
50  
40  
30  
20  
10  
Effꢀ85°C  
Effꢀ25°C  
Effꢀꢁ40°C  
Gainꢀ85°C  
Gainꢀ25°C  
Gainꢀꢁ40°C  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
OutputꢀPowerꢀ(dBm)  
OutputꢀPowerꢀ(dBm)  
InputꢀReturnꢀLossꢀversusꢀOutputꢀPowerꢀ(fꢀ=ꢀ3200MHz)  
(Pulsedꢀ10%ꢀdutyꢀcycle,ꢀ100μS,ꢀVD =ꢀ65V,ꢀIDQ =ꢀ440mA)  
ꢁ6  
ꢁ7  
IRLꢀ85°C  
IRLꢀ25°C  
IRLꢀꢁ40°C  
ꢁ8  
ꢁ9  
ꢁ10  
ꢁ11  
ꢁ12  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
OutputꢀPowerꢀ(dBm)  
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support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.  
4 of 11  
DS120503  
RF3928B  
Typical Performance in Standard Fixed-tuned Test Fixture (T=25°C, Unless  
Noted)  
SmallꢀSignalꢀPerformanceꢀversusꢀFrequency,ꢀPIN =ꢀ30dBm  
Gain/IRLꢀversusꢀFrequency,ꢀPIN =ꢀ44dBm  
(Pulsedꢀ10%ꢀdutyꢀcycle,100μS,VD =ꢀ65V,ꢀIDQ =ꢀ440mA)  
(Pulsedꢀ10%ꢀdutyꢀcylce,ꢀ100μS,ꢀVD =ꢀ65V,ꢀIDQ =ꢀ440mA)  
15  
14  
13  
12  
11  
10  
9
0
13  
12  
11  
10  
0
Fixedꢀtuned testꢀcircuit  
Fixedꢀtuned testꢀcircuit  
ꢁ2  
ꢁ4  
ꢁ4  
ꢁ8  
ꢁ12  
ꢁ6  
ꢁ8  
ꢁ10  
ꢁ12  
ꢁ14  
Gain  
IRL  
Gain  
IRL  
8
2800  
2900  
3000  
3100  
3200  
3300  
3400  
3500  
3600  
2800  
2900  
3000  
3100  
3200  
3300  
3400  
3500  
Frequencyꢀ(MHz)  
Frequencyꢀ(MHz)  
Gain/ꢀEfficiencyꢀversusꢀPOUT ,ꢀfꢀ=ꢀ3200MHz  
DrainꢀEfficiencyꢀversusꢀFrequency,ꢀPIN =ꢀ44dBm  
(Pulsedꢀ10%ꢀdutyꢀcycle,ꢀ100μS,ꢀVD =ꢀ65V,ꢀIDQ =ꢀ440mA)  
(Pulsedꢀ10%ꢀdutyꢀcycle,ꢀ100μS,ꢀVDꢀ=ꢀ65V,ꢀIDQ =ꢀ440mA)  
15  
70  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
Fixedꢀtuned testꢀcircuit  
14  
13  
12  
11  
10  
9
60  
50  
40  
30  
20  
10  
Gain  
DrainꢀEff  
Eff  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
2800  
2900  
3000  
3100  
3200  
Frequencyꢀ(MHz)  
3300  
3400  
3500  
3600  
OutputꢀPowerꢀ(dBm)  
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support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.  
DS120503  
5 of 11  
RF3928B  
Typical Performance in Standard Fixed-tuned Test Fixture (T=25°C, Unless  
Noted)  
Pout/DEꢀversusꢀPulseꢀWidth,ꢀfꢀ=ꢀ3200MHz  
Pout/DEꢀversusꢀDutyꢀCycle,ꢀfꢀ=ꢀ3200MHz  
(Pulsedꢀ10%ꢀdutyꢀcycle,ꢀVD =ꢀ65V,ꢀIDQ =ꢀ440mA)  
(Pulsedꢀ,100μsꢀpulse,ꢀVD =ꢀ65V,ꢀIDQ =ꢀ440mA)  
60  
55  
50  
45  
40  
35  
30  
25  
20  
400  
380  
360  
340  
320  
300  
280  
260  
240  
65  
60  
55  
50  
45  
40  
35  
400  
375  
350  
325  
300  
275  
250  
OutputꢀPower  
DrainꢀEfficiency  
Pout  
5
Eff  
10  
100  
PulseꢀWidthꢀ(μsec)  
1000  
0
10  
15  
20  
DutyꢀCycleꢀ(%)  
PulseꢀPowerꢀDissipationꢀDeꢁratingꢀCurve  
(BasedꢀonꢀMaximumꢀpackageꢀtemperatureꢀandꢀRth)  
1200  
1000  
800  
600  
400  
200  
0
300ꢂSꢀPulseꢀWidth,ꢀ10%ꢀDutyꢀCycle  
100ꢂSꢀPulseꢀWidth,ꢀ10%ꢀDutyꢀCycle  
0
20  
40  
60  
80  
100  
120  
140  
MaximumꢀCaseꢀTemperatureꢀ(°C)  
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support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.  
6 of 11  
DS120503  
RF3928B  
Package Drawing  
(All Dimensions in mm)  
Pin  
1
Function  
Gate  
Description  
V
RF Input  
G
V
RF Output  
2
Drain  
D
Ground Base  
3
Source  
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support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.  
DS120503  
7 of 11  
RF3928B  
Bias Instruction for RF3928B Evaluation Board  
ESD Sensitive Material. Please use proper ESD precautions when handling devices of evaluation board. Evaluation board  
requires additional external fan cooling. Connect all supplies before powering evaluation board.  
1. Connect RF cables at RFIN and RFOUT.  
2. Connect ground to the ground supply terminal, and ensure that both the VG and VD grounds are also connected to this  
ground terminal.  
3. Apply -6V to VG.  
4. Apply 65V to VD.  
5. Increase VG until drain current reaches 440mA or desired bias point.  
6. Turn on the RF input.  
IMPORTANT NOTE: Depletion mode device, when biasing the device VG must be applied BEFORE VD. When removing bias VD  
must be removed BEFORE VG is removed. Failure to follow sequencing will cause the device to fail.  
NOTE: For optimal RF performance, consistent and optimal heat removal from the base of the package is required. A thin layer  
of thermal grease should be applied to the interface between the base of the package and the equipment chassis. It is recom-  
mended a small amount of thermal grease is applied to the underside of the device package. Even application and removal of  
excess thermal grease can be achieved by spreading the thermal grease using a razor blade. The package should then be  
bolted to the chassis and input and output leads soldered to the circuit board.  
Vd  
Vg  
RFIN  
RFOUT  
RF3928B  
2.8GHz to 3.4GHz  
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support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.  
8 of 11  
DS120503  
RF3928B  
Evaluation Board Schematic  
VDRAIN  
+
C19  
C18  
VGATE  
L21  
L20  
C7  
C8  
+
L22  
C14  
L23  
R3  
R2  
R1  
C5  
C17  
C15  
C16  
C6  
C4  
C3  
C2  
C12  
C13  
L1  
J2  
RF OUT  
50  strip  
50  strip  
C11  
J1  
RF IN  
C10  
RF3928B  
C1  
C9  
Evaluation Board Bill of Materials  
Component  
Value  
10  
0  
51  
22pF  
Manufacturer  
Panasonic  
Panasonic  
Panasonic  
ATC  
Part Number  
ERJ-8GEYJ100V  
ERJ-3GEY0R00  
ERJ-8GEYJ510  
ATC100A220JT  
ATC100A150JT  
R1  
R2  
R3  
C1,C11  
C2, C14  
C5, C16  
C6, C15  
C7  
15pF  
ATC  
1000pF  
10000pF  
120  
10F  
Novacap  
TDK  
0805G102M101NT  
C2012X7R2A103M  
ERJ-6GEYJ120V  
EEU-FC2A100  
Panasonic  
Panasonic  
ATC  
C8, C18  
C9  
0.7pF  
ATC100A0R7BT  
ATC100A0R2BT  
ATC100B620JT  
0807SQ-22N_LC  
28F0181-1SR-10  
35F0121-1SR-10  
9337CKE100M  
C10  
0.2pF  
ATC  
C17  
62pF  
ATC  
L1  
22nH  
Coilcraft  
Steward  
Steward  
Illinois Capacitor  
L20, L21  
L22, L23  
C19  
115, 10A  
75, 10A  
330F  
C3, C4, C7, C12, C13  
NOT POPULATED  
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support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.  
DS120503  
9 of 11  
RF3928B  
Evaluation Board Layout  
Device Impedances  
Frequency (MHz)  
Z Source ()  
Z Load ()  
42.1 – j30.5  
2800  
60.4 – j0.5  
3000  
3200  
3400  
51.9 – j13.5  
44.1 – j16.5  
38.3 – j16.7  
33.8 – j25.7  
29.5 – j8.9  
17.0 – j9.0  
NOTE: Device impedances reported are the measured evaluation board impedances chosen for a trade off of peak power, peak efficiency and  
gain performance across the entire frequency bandwidth.  
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support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.  
10 of 11  
DS120503  
RF3928B  
Device Handling/Environmental Conditions  
GaN HEMT devices are ESD sensitive materials. Please use proper ESD precautions when handling devices or  
evaluation boards.  
GaN HEMT Capacitances  
The physical structure of the GaN HEMT results in three terminal capacitors similar to other FET technologies.  
These capacitances exist across all three terminals of the device. The physical manufactured characteristics of  
the device determine the value of the CDS (drain to source), CGS (gate to source) and CGD (gate to drain). These  
capacitances change value as the terminal voltages are varied. RFMD presents the three terminal capacitances  
measured with the gate pinched off (VGS = -8V) and zero volts applied to the drain. During the measurement pro-  
cess, the parasitic capacitances of the package that holds the amplifier is removed through a calibration step.  
Any internal matching is included in the terminal capacitance measurements. The capacitance values presented  
in the typical characteristics table of the device represent the measured input (CISS), output (COSS), and reverse  
(CRSS) capacitance at the stated bias voltages. The relationship to three terminal capacitances is as follows:  
CISS = CGD + CGS  
COSS = CGD + CDS  
CRSS = CGD  
DC Bias  
The GaN HEMT device is a depletion mode high electron mobility transistor (HEMT). At zero volts VGS the drain of  
the device is saturated and uncontrolled drain current will destroy the transistor. The gate voltage must be taken  
to a potential lower than the source voltage to pinch off the device prior to applying the drain voltage, taking care  
not to exceed the gate voltage maximum limits. RFMD recommends applying VGS = -5V before applying any VDS  
.
RF Power transistor performance capabilities are determined by the applied quiescent drain current. This drain  
current can be adjusted to trade off power, linearity, and efficiency characteristics of the device. The recom-  
mended quiescent drain current (IDQ) shown in the RF typical performance table is chosen to best represent the  
operational characteristics for this device, considering manufacturing variations and expected performance.  
The user may choose alternate conditions for biasing this device based on performance trade off.  
Mounting and Thermal Considerations  
The thermal resistance provided as RTH (junction to case) represents only the packaged device thermal charac-  
teristics. This is measured using IR microscopy capturing the device under test temperature at the hottest spot of  
the die. At the same time, the package temperature is measured using a thermocouple touching the backside of  
the die embedded in the device heatsink but sized to prevent the measurement system from impacting the  
results. Knowing the dissipated power at the time of the measurement, the thermal resistance is calculated.  
In order to achieve the advertised MTTF, proper heat removal must be considered to maintain the junction at or  
below the maximum of 200°C. Proper thermal design includes consideration of ambient temperature and the  
thermal resistance from ambient to the back of the package including heatsinking systems and air flow mecha-  
nisms. Incorporating the dissipated DC power, it is possible to calculate the junction temperature of the device.  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical  
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.  
DS120503  
11 of 11  

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Porcelain Superchip Multilayer Capacitors
ETC

ATC100B0R1BT500XT

RF Power Field Effect Transistors
FREESCALE

ATC100B0R1BT500XT

RF LDMOS Wideband Integrated Power Amplifiers
NXP

ATC100B0R1JT500XT

RF LDMOS Wideband Integrated Power Amplifiers
NXP

ATC100B0R2BT500XT

RF Power Field Effect Transistors
FREESCALE

ATC100B0R2BT500XT

RF LDMOS Wideband Integrated Power Amplifiers
NXP

ATC100B0R3BT500XT

RF Power Field Effect Transistors
FREESCALE