F2971NCGK [RENESAS]
75Ω SP2T RF Switch 5MHz to 3000MHz;
| 型号： | F2971NCGK |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | 75Ω SP2T RF Switch 5MHz to 3000MHz |
| 文件： | 总18页 (文件大小：5269K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
75Ω SP2T RF Switch
F2971
5MHz to 3000MHz
Datasheet
Description
Features
The F2971 is a high reliability, low insertion loss, 75Ω absorptive
SP2T RF switch designed for a multitude of cable systems and RF
applications. This device covers a broad frequency range from
5MHz to 3000MHz. In addition to providing low insertion loss, the
F2971 also delivers excellent linearity and isolation performance
while providing a 75Ω termination for the unselected port.
.
.
.
.
.
Low insertion loss: 0.31dB at 1200MHz
High Isolation: 71dB at 1200MHz (RF1/RF2 to RFC)
High IIP3: 67dBm at 5MHz
Operating Temperature: -40°C to +105°C
4mm x 4mm, 20-pin LQFN package
The F2971 uses a single positive supply voltage and supports 3.3V
logic.
Block Diagram
Figure 1. Block Diagram
RFC
Competitive Advantage
The F2971 provides broadband RF performance to support the
CATV market along with high power handling and high isolation.
75Ω
.
.
.
.
Low insertion loss
High isolation
Excellent linearity
Extended temperature: -40°C to +105°C
RF1
RF2
75Ω
75Ω
Typical Applications
.
CATV/Broadband applications
.
.
.
.
.
.
Headend
Fiber/HFC distribution nodes
Distribution amplifiers
Switch matrix
DTV tuner input select
DVR/PVR/Set-top box
C1
C2
.
CATV test equipment
1
Rev O, April 24, 2018
Pin Assignments
Figure 2. Pin Assignments for 4mm x 4mm x 0.75mm 20-pin LQFN, NCG20P1 – Top View
VDD GND GND C1 C2
20 19 18 17 16
1
2
3
4
5
15
14
13
12
11
GND
GND
RF1
GND
GND
RF2
F2971
GND
GND
GND
GND
EP
6
7
8
9 10
GND GND RFC GND GND
Pin Descriptions
Table 1.
Pin Descriptions
Number
Name
Description
1, 2, 4, 5, 6,
7, 9, 10, 11,
12, 14, 15,
18, 19
Internally grounded. Connect pin directly to paddle ground or as close as possible to the pin with thru-hole
vias.
GND
3
RF1
RFC
RF2
C2
RF1 Port. Matched to 75Ω. If this pin is not 0V DC, then an external coupling capacitor must be used.
RFC Port. Matched to 75Ω. If this pin is not 0V DC, then an external coupling capacitor must be used.
RF2 Port. Matched to 75Ω. If this pin is not 0V DC, then an external coupling capacitor must be used.
Control pin to set switch state. See Table 8.
8
13
16
17
C1
Control pin to set switch state. See Table 8.
Power Supply. Bypass to GND with capacitors shown in the Typical Application Circuit (see Figure 34) as
close as possible to pin.
20
VDD
Exposed Paddle. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple
ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground
vias are also required to achieve the specified RF performance.
EP
2
Rev O, April 24, 2018
Absolute Maximum Ratings
Stresses beyond those listed below may cause permanent damage to the device. Functional operation of the device at these or any other
conditions beyond those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
Table 2.
Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
VDD to GND
VDD
-0.3
4.0
V
Lower of
(VDD+0.3, 3.9)
C1, C2 to GND
VCTRL
VRFIN
-0.3
-0.3
V
V
RF1, RF2, RFC to GND
+0.3
RF1 or RF2 as an input
(connected to RFC).
No RF power applied to unused
RF1 or RF2 port.
30
RFC as an input
(connected to RF1 or RF2).
No RF power applied to
terminated RF1 or RF2 port.
30
26
30
Maximum Input CW Power [a]
PMAX-IN
dBm
RF1 or RF2 port as an input
(terminated states).
Applied to only one port.
RFC as an input
(terminated states).
No RF drive applied to RF1 or
RF2 ports.
Maximum Junction Temperature
Storage Temperature Range
TJMAX
TSTOR
140
150
260
°C
°C
°C
-65
Lead Temperature (soldering, 10s)
Electrostatic Discharge – HBM
(JEDEC/ESDA JS-001-2012)
1500
(Class 2)
V
V
Electrostatic Discharge – CDM
(JEDEC 22-C101F)
1500
(Class C3)
a. Levels based on VDD = 2.7V to 3.6V, 5MHz ≤ fRF ≤ 3000MHz, TEP = 105°C, ZS = ZL = 75Ω.
3
Rev O, April 24, 2018
Recommended Operating Conditions
Table 3.
Recommended Operating Conditions
Parameter
Symbol
Condition
Minimum
Typical Maximum Units
Supply Voltage
VDD
TEP
fRF
2.7
-40
5
3.6
+105
3000
27
V
Operating Temperature Range
RF Frequency Range
Exposed Paddle
°C
MHz
TEP = 85°C
TEP = 105°C
TEP = 85°C
TEP = 105°C
TEP = 85°C
TEP = 105°C
TEP = 85°C
RFC connected to RF1 or
RF2
RF Continuous
Input CW Power
(Non-Switched) [a]
27
PRF
dBm
dBm
24
RF1 / RF2 Input,
Terminated State
21
21
RFC Input switching
between RF1 and RF2
RF Continuous
Input Power
(RF Hot Switching CW) [a]
21
PRFSW
RF1 or RF2 as input,
switched between RFC
and Terminated State
17
TEP = 105°C
17
RF1 Port Impedance
RF2 Port Impedance
RFC Port Impedance
ZRF
Single-ended
Single-ended
Single-ended
75
75
75
Ω
Ω
Ω
1
ZRF2
ZRFC
a. Levels based on VDD = 2.7V to 3.6V, 5MHz ≤ fRF ≤ 3000MHz, ZS = ZL = 75Ω. See Figure 3 for power handling de-rating vs.
RF frequency.
Figure 3. Maximum RF Input Operating Power vs. RF Frequency
4
Rev O, April 24, 2018
Electrical Characteristics
Table 4.
Electrical Characteristics
See the Typical Application Circuit in Figure 34. VDD = 3.0V, TEP = +25°C, fRF = 1200MHz, driven port = RF1 or RF2, PIN = 0dBm, ZS = ZL = 75Ω.
PCB board trace and connector losses are de-embedded, unless otherwise noted.
Parameter
Logic Input HIGH [a]
Symbol
Condition
2.7V ≤ VDD ≤ 3.6V
Minimum
Typical
Maximum Units
[b]
VIH
VIL
VDD
0.3 x VDD
500 [c]
30
V
V
0.7 x VDD
-0.3
Logic Input LOW [a]
Logic Current
VDD DC Current [a]
IIH, IIL
IDD
For each control pin
5
20
nA
µA
Logic inputs at GND or VDD
5MHz ≤ fRF ≤ 250MHz
0.22
0.26
0.29
0.31
0.47
0.64
81
250MHz < fRF ≤ 750MHz
750MHz < fRF ≤ 1000MHz
1000MHz < fRF ≤ 1200MHz [d]
1200MHz < fRF ≤ 2000MHz
2000MHz < fRF ≤ 3000MHz
5MHz ≤ fRF ≤ 250MHz
Insertion Loss
IL
dB
dB
dB
dB
0.51
76
68
67
66
60
250MHz < fRF ≤ 750MHz
750MHz < fRF ≤ 1000MHz
1000MHz < fRF ≤ 1200MHz
1200MHz < fRF ≤ 2000MHz
2000MHz < fRF ≤ 3000MHz
5MHz ≤ fRF ≤ 250MHz
73
72
Isolation
(RF1/RF2 to RFC)
ISORFC
ISOR12
RLIL
71
65
57
77
69
66
64
56
84
250MHz < fRF ≤ 750MHz
750MHz < fRF ≤ 1000MHz
1000MHz < fRF ≤ 1200MHz
1200MHz < fRF ≤ 2000MHz
2000MHz < fRF ≤ 3000MHz
5MHz ≤ fRF ≤ 250MHz
74
71
Isolation
(RF1 to RF2 or RF2 to RF1)
69
61
52
30
250MHz < fRF ≤ 750MHz
750MHz < fRF ≤ 1000MHz
1000MHz < fRF ≤ 1200MHz
1200MHz < fRF ≤ 2000MHz
2000MHz < fRF ≤ 3000MHz
22
20
RF1, RF2, RFC Return Loss
(Insertion Loss State)
18
14
12
a. Increased IDD current will result if logic LOW level is above ground and up to VIL max. Similarly, increased IDD current will
result if the logic HIGH level is below VDD and down to VIH min.
b. Items in min/max columns that are not bold italics are guaranteed by design characterization.
c. Items in min/max columns in bold italics are guaranteed by test.
d. Minimum or maximum specification guaranteed by test at 1200MHz and by design characterization over the full frequency
range.
5
Rev O, April 24, 2018
Electrical Characteristics
Table 5.
Electrical Characteristics
See the Typical Application Circuit in Figure 34. VDD = 3.0V, TEP = +25°C, fRF = 1200MHz, driven port = RF1 or RF2, PIN = 0dBm, ZS = ZL = 75Ω.
PCB board trace and connector losses are de-embedded, unless otherwise noted.
Parameter
Symbol
Condition
5MHz ≤ fRF ≤ 250MHz
Minimum
Typical
Maximum Units
28
24
22
21
17
13
31
32
250MHz < fRF ≤ 750MHz
750MHz < fRF ≤ 1000MHz
1000MHz < fRF ≤ 1200MHz
1200MHz < fRF ≤ 2000MHz
2000MHz < fRF ≤ 3000MHz
5MHz ≤ fRF ≤ 250MHz
RF1, RF2, RFC Return Loss
(Terminated State)
RLTERM
dB
Input 1dB Compression [c]
IP1dB
IIP2
dBm
dBm
250MHz < fRF ≤ 2000MHz
f1 = 5MHz
f2 = 6MHz
95
111
124
67
Input IP2
PIN = +13dBm/tone
(f1 + f2 frequency)
f1 = 185MHz
f2 = 190MHz
(Insertion Loss State)
f1 = 895MHz
f2 = 900MHz
f1 = 5MHz
f2 = 6MHz
Input IP3
(Insertion Loss State)
f1 = 185MHz
f2 = 190MHz
IIP3
PIN = +13dBm/tone
75
dBm
f1 = 1790MHz
f2 = 1795MHz
70
-90
CTB / CSO
77 and 110 channels, POUT = 44dBmV
dBc
Out any RF port when externally
terminated into 75Ω
Non-RF Driven Spurious [d]
SpurMAX
-122
dBm
50% control to 90% RF
50% control to 10% RF
2.6
1.7
Switching Time [e]
TSW
µs
Maximum Switching Rate [f]
SWRATE
25
kHz
Peak transient during switching
measured with 20ns rise time,
0V to 3.3V control pulse
Rise
Fall
1.1
2.0
Maximum Video Feed-through
on RF Ports
VIDFT
mVpp
a. Items in min/max columns in bold italics are guaranteed by test.
b. Items in min/max columns that are not bold italics are guaranteed by design characterization.
c. The input 1dB compression point is a linearity figure of merit. Refer to the “Recommended Operating Conditions” section
and Figure 3 for the maximum operating power levels.
d. Spurious due to on-chip negative voltage generator. Spurious fundamental = approximately 2.2MHz.
e. fRF = 1000MHz.
f. Minimum time required between switching of states = 1/ (Maximum Switching Rate).
6
Rev O, April 24, 2018
Thermal Characteristics
Table 6.
Package Thermal Characteristics
Parameter
Symbol
Value
Units
Junction to Ambient Thermal Resistance
θJA
53
°C/W
Junction to Case Thermal Resistance
(Case is defined as the exposed paddle)
θJC
13.8
°C/W
Moisture Sensitivity Rating (Per J-STD-020)
MSL 1
Typical Operating Conditions (TOCs)
Unless otherwise noted:
.
.
.
.
.
.
.
.
VDD = +3.0V
ZS = ZL = 75Ω
TEP = 25°C
fRF = 1200MHz
Small signal parameters measured with PIN = 0dBm.
Driven port is RF1 or RF2.
All temperatures are referenced to the exposed paddle.
Evaluation Kit traces and connector losses are de-embedded.
7
Rev O, April 24, 2018
Typical Performance Characteristics [1]
Figure 4. Insertion Loss vs. Frequency over
Temperature and VDD [RF1]
Figure 5. Insertion Loss vs. Frequency over
Temperature and VDD [RF2]
0.0
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
0.0
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
-1.0
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.0 V
25 C / 3.0 V
105 C / 3.0 V
-40 C / 3.6 V
25 C / 3.6 V
105 C / 3.6 V
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.0 V
25 C / 3.0 V
105 C / 3.0 V
-40 C / 3.6 V
25 C / 3.6 V
105 C / 3.6 V
-0.8
-0.9
-1.0
0
500
1000
1500
2000
2500
3000
0
500
1000
1500
2000
2500
3000
Frequency (MHz)
Frequency (MHz)
Figure 6. Isolation vs. Frequency over Temp.
and VDD [RF1 to RF2, RF1 Selected]
Figure 7. Isolation vs. Frequency over Temp.
and VDD [RF2 to RF1, RF2 Selected]
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-100
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.0 V
25 C / 3.0 V
105 C / 3.0 V
-40 C / 3.6 V
25 C / 3.6 V
105 C / 3.6 V
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.0 V
25 C / 3.0 V
105 C / 3.0 V
-40 C / 3.6 V
25 C / 3.6 V
105 C / 3.6 V
-110
-120
-110
-120
0
500
1000
1500
2000
2500
3000
0
500
1000
1500
2000
2500
3000
Frequency (MHz)
Frequency (MHz)
Figure 8. Isolation vs. Frequency over Temp.
and VDD [RF2 to RFC, RF1 Selected]
Figure 9. Isolation vs. Frequency over Temp.
and VDD [RF1 to RFC, RF2 Selected]
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-100
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.0 V
25 C / 3.0 V
105 C / 3.0 V
-40 C / 3.6 V
25 C / 3.6 V
105 C / 3.6 V
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.0 V
25 C / 3.0 V
105 C / 3.0 V
-40 C / 3.6 V
25 C / 3.6 V
105 C / 3.6 V
-110
-120
-110
-120
0
500
1000
1500
2000
2500
3000
0
500
1000
1500
2000
2500
3000
Frequency (MHz)
Frequency (MHz)
8
Rev O, April 24, 2018
Typical Performance Characteristics [2]
Figure 10. Isolation vs. Frequency over Temp.
and VDD [RF1 to RFC, All Off]
Figure 11. Isolation vs. Frequency over Temp.
and VDD [RF2 to RFC, All Off]
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-100
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.0 V
25 C / 3.0 V
105 C / 3.0 V
-40 C / 3.6 V
25 C / 3.6 V
105 C / 3.6 V
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.0 V
25 C / 3.0 V
105 C / 3.0 V
-40 C / 3.6 V
25 C / 3.6 V
105 C / 3.6 V
-110
-120
-110
-120
0
500
1000
1500
2000
2500
3000
0
500
1000
1500
2000
2500
3000
Frequency (MHz)
Frequency (MHz)
Figure 12. Isolation vs. Frequency over Temp.
and VDD [RF1 to RF2, All Off]
Figure 13. RFC Return Loss vs. Frequency over
Temperature and VDD [All Off]
-40
0
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.0 V
25 C / 3.0 V
105 C / 3.0 V
-40 C / 3.6 V
25 C / 3.6 V
105 C / 3.6 V
-50
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.0 V
25 C / 3.0 V
105 C / 3.0 V
-40 C / 3.6 V
25 C / 3.6 V
105 C / 3.6 V
-110
-120
0
500
1000
1500
2000
2500
3000
0
500
1000
1500
2000
2500
3000
Frequency (MHz)
Frequency (MHz)
Figure 14. RF1 Return Loss vs. Frequency over
Temperature and VDD [All Off]
Figure 15. RF2 Return Loss vs. Frequency over
Temperature and VDD [All Off]
0
0
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.0 V
25 C / 3.0 V
105 C / 3.0 V
-40 C / 3.6 V
25 C / 3.6 V
105 C / 3.6 V
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.0 V
25 C / 3.0 V
105 C / 3.0 V
-40 C / 3.6 V
25 C / 3.6 V
105 C / 3.6 V
-10
-20
-30
-40
-50
-10
-20
-30
-40
-50
0
500
1000
1500
2000
2500
3000
0
500
1000
1500
2000
2500
3000
Frequency (MHz)
Frequency (MHz)
9
Rev O, April 24, 2018
Typical Performance Characteristics [3]
Figure 16. RF1 Return Loss vs. Frequency over
Temperature and VDD [RF1 Selected]
Figure 17. RF2 Return Loss vs. Frequency over
Temperature and VDD [RF2 Selected]
0
0
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.0 V
25 C / 3.0 V
105 C / 3.0 V
-40 C / 3.6 V
25 C / 3.6 V
105 C / 3.6 V
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.0 V
25 C / 3.0 V
105 C / 3.0 V
-40 C / 3.6 V
25 C / 3.6 V
105 C / 3.6 V
-10
-20
-30
-40
-50
-10
-20
-30
-40
-50
0
500
1000
1500
2000
2500
3000
0
500
1000
1500
2000
2500
3000
Frequency (MHz)
Frequency (MHz)
Figure 18. RF1 Return Loss vs. Frequency over
Temperature and VDD [RF2 Selected]
Figure 19. RF2 Return Loss vs. Frequency over
Temperature and VDD [RF1 Selected]
0
0
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.0 V
25 C / 3.0 V
105 C / 3.0 V
-40 C / 3.6 V
25 C / 3.6 V
105 C / 3.6 V
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.0 V
25 C / 3.0 V
105 C / 3.0 V
-40 C / 3.6 V
25 C / 3.6 V
105 C / 3.6 V
-10
-20
-30
-40
-50
-10
-20
-30
-40
-50
0
500
1000
1500
2000
2500
3000
0
500
1000
1500
2000
2500
3000
Frequency (MHz)
Frequency (MHz)
Figure 20. RFC Return Loss vs. Frequency over
Temperature and VDD [RF1 Selected]
Figure 21. RFC Return Loss vs. Frequency over
Temperature and VDD [RF2 Selected]
0
0
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.0 V
25 C / 3.0 V
105 C / 3.0 V
-40 C / 3.6 V
25 C / 3.6 V
105 C / 3.6 V
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.0 V
25 C / 3.0 V
105 C / 3.0 V
-40 C / 3.6 V
25 C / 3.6 V
105 C / 3.6 V
-10
-20
-30
-40
-50
-10
-20
-30
-40
-50
0
500
1000
1500
2000
2500
3000
0
500
1000
1500
2000
2500
3000
Frequency (MHz)
Frequency (MHz)
10
Rev O, April 24, 2018
Typical Performance Characteristics [4]
Figure 22. Evaluation Board Through-Line Loss
vs. Frequency over Temperature
Figure 23. Evaluation Board Through-Line
Return Loss vs. Freq. over Temp.
0.0
0
-10
-20
-30
-40
-50
-40 C
-40 C
25 C
25 C
105 C
-0.1
105 C
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
0
500
1000
1500
2000
2500
3000
0
500
1000
1500
2000
2500
3000
Frequency (MHz)
Frequency (MHz)
Figure 24. Switching Time Insertion Loss to
Isolation
Figure 25. Switching Time Isolation to
Insertion Loss
Figure 26. IDD vs. Control Voltage; VDD = 2.7V
Figure 27. IDD vs. Control Voltage; VDD = 2.7V
(C1 set to GND and VDD)
(C1 set to 0.6V and 2.1V)
0.14
0.14
C1=GND -40C
C1=GND 25C
C1=GND 105C
C1=VDD -40C
C1=0.6V -40C
C1=0.6V 25C
C1=0.6V 105C
C1=2.1V -40C
C1=2.1V 25C
C1=2.1V 105C
C1=VDD 25C
C1=VDD 105C
0.12
0.10
0.08
0.06
0.04
0.02
0.00
0.12
0.10
0.08
0.06
0.04
0.02
0.00
0
0.5
1
1.5
2
2.5
3
0
0.5
1
1.5
2
2.5
3
C2 Voltage (V)
C2 Voltage (V)
11
Rev O, April 24, 2018
Typical Performance Characteristics [5]
Figure 28. IDD vs. Control Voltage; VDD = 3.0V
(C1 set to GND and VDD)
Figure 29. IDD vs. Control Voltage; VDD = 3.0V
(C1 set to 0.9V and 2.1V)
0.14
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
C1=0.9V -40C
C1=0.9V 25C
C1=0.9V 105C
C1=2.1V -40C
C1=2.1V 25C
C1=2.1V 105C
C1=GND -40C
C1=GND 25C
C1=GND 105C
C1=VDD -40C
C1=VDD 25C
C1=VDD 105C
0.12
0.10
0.08
0.06
0.04
0.02
0.00
0
0.5
1
1.5
2
2.5
3
0
0.5
1
1.5
2
2.5
3
C2 Voltage (V)
C2 Voltage (V)
Figure 30. IDD vs. Control Voltage; VDD = 3.6V
(C1 set to GND and VDD)
Figure 31. IDD vs. Control Voltage; VDD = 3.6V
(C1 set to 0.9V and 2.7V)
0.14
0.14
C1=0.9V -40C
C1=0.9V 25C
C1=0.9V 105C
C1=2.7V -40C
C1=2.7V 25C
C1=2.7V 105C
C1=GND -40C
C1=GND 25C
C1=GND 105C
C1=VDD -40C
C1=VDD 25C
C1=VDD 105C
0.12
0.10
0.08
0.06
0.04
0.02
0.00
0.12
0.10
0.08
0.06
0.04
0.02
0.00
0
0.5
1
1.5
2
2.5
3
3.5
4
0
0.5
1
1.5
2
2.5
3
3.5
4
C2 Voltage (V)
C2 Voltage (V)
12
Rev O, April 24, 2018
Evaluation Kit Picture
Figure 32. Top View
Figure 33. Bottom View
13
Rev O, April 24, 2018
Evaluation Kit / Applications Circuit
Figure 34. Electrical Schematic
Table 7.
Bill of Material (BOM)
Part Reference
C1 – C6
QTY
Description
Manufacturer Part #
Manufacturer
0
1
3
5
1
1
1
Not Installed
C7
R1 – R3
J1 – J5
J8
1000pF ±5%, 50V, C0G Ceramic Capacitor (0603)
100Ω ±1%, 1/10W, Resistor (0402)
Connector Type F
GRM1885C1H102J
ERJ-2RKF1000X
222181
Murata
Panasonic
Amphenol RF
3M
Conn Header Vert 8x2 Pos Gold
SP2T Switch 4mm x 4mm LQFN
Printed Circuit Board
961216-6404-AR
F2971NCGK
U1
IDT
F297X EVKIT REV 01
IDT
14
Rev O, April 24, 2018
Control Mode
Table 8.
Switch Control Truth Table
C1
C2
RFC – RF1
OFF
RFC – RF2
OFF
75Ω Terminated Ports
LOW
LOW
HIGH
HIGH
LOW
HIGH
LOW
HIGH
RFC, RF1, RF2
OFF
ON
N/A
ON
OFF
N/A
RF1
RF2
N/A
Application Information
Default Start-up
Control pins do not include internal pull-down resistors to logic LOW or pull-up resistors to logic HIGH.
Power Supplies
A common Vcc power supply should be used for all pins requiring DC power. All supply pins should be bypassed with external capacitors to
minimize noise and fast transients. Supply noise can degrade the noise figure, and fast transients can trigger ESD clamps and cause them to
fail. Supply voltage change or transients should have a slew rate smaller than 1V / 20µs. In addition, all control pins should remain at 0V (±0.3V)
while the supply voltage ramps or while it returns to zero.
Control Pin Interface
If control signal integrity is a concern and clean signals cannot be guaranteed due to overshoot, undershoot, ringing, etc., the following circuit
at the input of each control pin is recommended. This applies to control pins 16 and 17 as shown below.
Figure 35. Control Pin Interface Schematic
5kΩ
C1
2pF
VDD GND GND
20 19 18 17 16
5kΩ
1
2
3
4
5
15
14
13
12
11
GND
GND
RF1
GND
GND
RF2
C2
2pF
F2971
GND
GND
GND
GND
EP
6
7
8
9 10
GND GND RFC GND GND
15
Rev O, April 24, 2018
Evaluation Kit (EVKit) Operation
External Supply Setup
Set up a VCC power supply in the voltage range of 2.7V to 3.6V with the power supply output disabled.
Logic Control Setup
External logic control is applied to J8 CTL1 (pins 5 and 7) and CTL2 (pins 9 and 11). See Table 8 for the logic truth table.
Turn On Procedure
Setup the supplies and EVKIT as noted in the “External Supply Setup” and “Logic Control Setup” sections above.
Enable the VCC supply.
Set the desired logic setting to achieve the desired configuration (see Table 8). Note that external control logic should not be applied without
VCC being present.
Turn Off Procedure
Set the logic control to 0V.
Disable the VCC supply.
Package Drawings
The package outline drawings are appended at the end of this document and are accessible from the link below. The package information is
the most current data available and is subject to change without notice or revision of this document.
www.idt.com/document/psc/20-qfn-package-outline-drawing-40-x-40-x-075-mm-body-05mm-pitch-epad-206-x-206-mm-ncg20p1
Marking Diagram
Line 1 and 2 are the part number.
Line 3 - “ZE” is for the die version.
Line 3 - “YWW” is the last digit of the year plus the work week.
Line 3 - “PBG” denotes the production process.
IDTF29
71NCGK
ZEYWWPBG
16
Rev O, April 24, 2018
Ordering Information
Orderable Part Number
Package
MSL Rating Shipping Packaging Operating Temperature
F2971NCGK
F2971NCGK8
F2971EVBI
4mm x 4mm x 0.75mm 20-LQFN
(NCG20P1)
MSL1
Tray
-40°C to +105°C
4mm x 4mm x 0.75mm 20-LQFN
(NCG20P1)
MSL1
Reel
-40°C to +105°C
Evaluation Board
Revision History
Revision
Revision Date
Description of Change
O
2018-April-24
Initial release.
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