EK42552-02 [PSEMI]

SPDT UltraCMOS RF Switch DC - 7500 MHz; 单刀双掷的UltraCMOS RF开关直流 - 7500兆赫
EK42552-02
型号: EK42552-02
厂家: Peregrine Semiconductor    Peregrine Semiconductor
描述:

SPDT UltraCMOS RF Switch DC - 7500 MHz
单刀双掷的UltraCMOS RF开关直流 - 7500兆赫

开关 光电二极管
文件: 总9页 (文件大小:398K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Product Specification  
PE42552  
SPDT UltraCMOS™ RF Switch  
DC - 7500 MHz  
Product Description  
Features  
The PE42552 RF Switch is designed for use in Test/ATE,  
cellular and other wireless applications. This broadband general  
purpose switch maintains excellent RF performance and  
linearity from DC through 7500 MHz. The PE42552 integrates  
on-board CMOS control logic driven by a single-pin, low voltage  
CMOS control input. It also has a logic select pin which enables  
changing the logic definition of the control pin. Additional  
features include a novel user defined logic table, enabled by the  
on-board CMOS circuitry. The PE42552 also exhibits  
HaRP™-Technology-Enhanced  
Eliminates Gate and Phase Lag  
No insertion loss or phase drift  
Fast settling time  
High linearity: 65 dBm IIP3  
Low insertion loss: 0.65 dB at 3.0 GHz,  
0.85 dB at 6.0 GHz, 1.0 at 7.5 GHz  
High isolation of 47 dB at 3.0 GHz,  
44 dB at 7.5 GHz  
outstanding isolation of 44 dB at 7500 MHz, fast settling time,  
and is offered in a tiny 3x3 mm QFN package.  
1 dB compression point: +34.5 dBm typ.  
The PE42552 is manufactured on Peregrine’s UltraCMOS™  
process, a patented variation of silicon-on-insulator (SOI)  
technology on a sapphire substrate, offering the performance of  
GaAs with the economy and integration of conventional CMOS.  
Logic Select pin to invert logic control  
High ESD: 1000 V HBM  
Absorptive switch design  
Standard 3x3 mm QFN package  
Figure 1. Functional Diagram  
RFC  
Figure 2. Package Type  
16-lead 3x3 mm QFN  
RF1  
RF2  
ESD  
ESD  
50  
50Ω  
CMOS  
Control  
Driver  
LS CTRL  
Table 1. Target Electrical Specifications Temp = 25°C, VDD = 3.3V, VSS = 0V / -3.3V  
Parameter  
Conditions  
Min  
Typical  
Max  
Units  
Operation Frequency MHz  
9 kHz  
7.5 GHz  
9 KHz  
0.6  
0.65  
0.85  
1.0  
0.7  
0.8  
1.0  
dB  
dB  
dB  
dB  
3000 MHz  
6000 MHz  
7500 MHz  
Insertion Loss  
1.22  
3000 MHz  
6000 MHz  
7500 MHz  
45  
32  
25  
47  
34  
28  
dB  
dB  
dB  
Isolation – RF1 to RF2  
Isolation – RFC to RFX  
Return Loss  
3000 MHz  
6000 MHz  
7500 MHz  
44  
49  
37  
47  
55  
44  
dB  
dB  
dB  
3000 MHz  
6000 MHz  
7500 MHz  
20  
25  
15  
dB  
dB  
dB  
50% CTRL to 0.05 dB final value (-40 to +85 °C) Rising Edge  
50% CTRL to 0.05 dB final value (-40 to +85 °C) Falling Edge  
9
15  
11  
45  
µs  
µs  
Settling Time  
Switching Time  
50% CTRL to 90% or 10% of final value (-40 to +85 °C)  
5
7
µs  
dBm  
dBm  
800 MHz  
7500 MHz  
32  
34.5  
34  
Input 1 dB Compression  
Input IP3  
Input IP2  
7500 MHz  
7500 MHz  
65  
100  
dBm  
dBm  
Document No. 70-0246-03 www.psemi.com  
©2008 Peregrine Semiconductor Corp. All rights reserved.  
Page 1 of 9  
PE42552  
Product Specification  
Figure 3. Pin Configuration (Top View)  
Table 4. Absolute Maximum Ratings  
Symbol  
Parameter/Conditions  
Power supply voltage  
Voltage on any input except for  
CTRL and LS inputs  
Voltage on CTRL input  
Voltage on LS input  
Min  
-0.3  
Max Units  
VDD  
4.0  
V
VDD  
0.3  
4.0  
4.0  
150  
+
VI  
-0.3  
-65  
V
1
2
3
4
12  
11  
10  
9
GND  
RF1  
GND  
RF2  
VCTRL  
VLS  
TST  
V
V
°C  
Storage temperature range  
Input Power:  
GND  
GND  
GND  
GND  
PIN  
9 kHz 1 MHz  
1 MHz 7.5 GHz  
ESD voltage (HBM)1  
ESD voltage (Machine Model)  
fig. 4,5 dBm  
30  
dBm  
1000  
100  
V
V
VESD  
Note: 1. Human Body Model (HBM, MIL_STD 883 Method 3015.7)  
Exceeding absolute maximum ratings may cause  
permanent damage. Operation should be restricted to  
the limits in the Operating Ranges table. Operation  
between operating range maximum and absolute  
maximum for extended periods may reduce reliability.  
Table 2. Pin Descriptions  
Pin No.  
Pin Name  
Description  
2
RF1  
RF Port 1  
Ground  
1, 3, 4, 5, 6,  
8, 9, 10, 12  
GND  
Electrostatic Discharge (ESD) Precautions  
7
RFC  
RF2  
RF Common  
RF Port 2  
11  
When handling this UltraCMOS™ device, observe the  
same precautions that you would use with other ESD-  
sensitive devices. Although this device contains  
circuitry to protect it from damage due to ESD,  
precautions should be taken to avoid exceeding the  
rating specified.  
Negative supply voltage or GND  
connection (Note 1)  
13  
14  
VSS  
CTRL  
CMOS level:  
Logic Select - Used to determine  
the definition for the CTRL pin (see  
Table 5)  
15  
LS  
16  
VDD  
Nominal 3.3 V supply connection  
Latch-Up Avoidance  
Note: 1. Use VSS (pin 13, VSS = -VDD) to bypass and disable  
internal negative voltage generator. Connect VSS (pin 13) to GND  
(VSS = 0V) to enable internal negative voltage generator.  
Unlike conventional CMOS devices, UltraCMOS™  
devices are immune to latch-up.  
Table 5. Control Logic Truth Table  
Table 3. Operating Ranges  
LS  
0
0
1
1
CTRL  
RFC-RF1  
RFC-RF2  
Parameter  
Min Typ Max Units  
0
1
0
1
off  
on  
on  
off  
on  
off  
off  
on  
VDD Positive Power Supply Voltage  
3.0  
3.3  
3.6  
V
VSS Negative Power Supply Voltage  
(external power supply used)  
-3.6  
-3.3  
-3.0  
V
VSS Negative Power Supply Voltage  
(internal power supply used)  
-0.1  
0.0  
15  
0.0  
120  
-40  
V
Logic Select (LS)  
The Logic Select feature is used to determine the  
definition for the CTRL pin.  
I
DD Power Supply Current  
(VSS = 0V, Temp = +85 °C)  
µA  
µA  
ISS Negative Supply  
-10  
(VSS = -VDD, Temp = 25 °C)  
Spurious Performance  
Control Voltage High  
Control Voltage Low  
0.7xVDD  
-40  
V
V
The typical spurious performance of the PE42552 is  
-116 dBm when VSS=0V (pin 13 = GND). If further  
improvement is desired, the internal negative voltage  
generator can be disabled by setting VSS = -VDD.  
0.3xVDD  
85  
TOP Operating temperature range  
25  
°C  
RF Power In1(PIN):  
9 kHz 1 MHz  
fig. 4,5 dBm  
30 dBm  
1 MHz 7.5 GHz  
Switching Frequency  
Note: 1. Please consult low frequency graphs on page 3 for  
recommended operating power level.  
The PE42552 has a maximum 25 kHz switching rate  
when the internal negative voltage generator is used  
(pin 13=GND). The rate at which the PE42552 can be  
switched is only limited to the switching time (Table 1) if  
an external negative supply is provided at  
(pin13=VSS).  
Moisture Sensitivity Level  
The Moisture Sensitivity Level rating for the PE42552 in  
the 16-lead 3x3mm QFN package is MSL1.  
©2008 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0246-03 UltraCMOS™ RFIC Solutions  
Page 2 of 9  
PE42552  
Product Specification  
Low Frequency Power Handling: ZL = 50  
Figure 4 provides guidelines of how to adjust the Vdd  
and input Power to the 42552 device. The upper limit  
curve represents the maximum Input Power vs Vdd  
recommended for this part.  
Figure 5 shows how the power limit in Figure 4 will  
increase with frequency. As the frequency increases,  
the contours and Maximum Power Limit Curve will  
increase with the increase in power handling shown on  
the curve.  
Figure 4. Maximum Operating Power Limit  
vs. Vdd and Input Power @ 9 KHz  
Figure 5. Operating Power Offset vs.  
Frequency (Normalized to 9kHz)  
Upper Power Limit  
30  
25  
20  
15  
10  
5
8
6
4
2
0
-2  
-4  
-6  
-8  
-10  
-12  
0
1
10  
100  
1000  
Freq (kHz)  
2.9  
3
3.1  
3.2  
3.3  
3.4  
3.5  
3.6  
Power Handling Examples  
Vdd (V)  
Example 1: Maximum power handling at 100kHz, Z=50  
ohms, VSWR 1:1, and Vdd=3V  
To allow for sustained operation under any load VSWR condition,  
max power should be kept 6dB lower than max power in 50 Ohm.  
The power handling offset for 100kHz from Fig. 5 is  
10dB  
The max power handling at Vdd = 3V is 5.5dB from  
Fig. 4  
Derate power under mismatch conditions  
Total maximum power handling for this example is  
10dB + 5.5dB = 15.5dBm  
Document No. 70-0246-03 www.psemi.com  
©2008 Peregrine Semiconductor Corp. All rights reserved.  
Page 3 of 9  
PE42552  
Product Specification  
Performance Plots: Temperature = 25 °C, VDD = 3.3 V unless otherwise indicated  
Figure 6. Nominal Insertion Loss: RF1, RF2  
Figure 7. Insertion Loss: RFX @ 3.3 V  
0
-0.2  
-0.4  
-0.6  
-0.8  
-1  
0
-0.2  
-0.4  
-0.6  
-0.8  
-1  
-1.2  
-1.2  
-1.4  
-1.6  
-1.8  
-2  
RF1 Path  
RF2 Path  
+25deg C  
+85deg C  
-40deg C  
-1.4  
-1.6  
-1.8  
-2  
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
Frequency [GHz]  
Frequency [GHz]  
Figure 8. Insertion Loss: RFX @ 25 °C  
Figure 9. Isolation: Active Port to  
Isolated Port @ 3.3 V  
0
0
-0.2  
-0.4  
-0.6  
-0.8  
-10  
+25deg C  
+85deg C  
-40deg C  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
-90  
-100  
3.0 V  
3.3 V  
3.6 V  
-1  
-1.2  
-1.4  
-1.6  
-1.8  
-2  
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
Frequency [GHz]  
Frequency [GHz]  
Figure 10. Isolation: Active Port to  
Isolated Port @ 25 °C  
Figure 11. Isolation: RFC to Isolated Port @ 3.3 V  
0
0
-10  
-10  
3.0 V  
3.3 V  
3.6 V  
+25deg C  
+85deg C  
-40deg C  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
-90  
-100  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
-90  
-100  
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
Frequency [GHz]  
Frequency [GHz]  
©2008 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0246-03 UltraCMOS™ RFIC Solutions  
Page 4 of 9  
PE42552  
Product Specification  
Performance Plots: Temperature = 25 °C, VDD = 3.3 V unless otherwise indicated  
Figure 12. Isolation: RFC to Isolated Port @ 25 °C  
Figure 13. IIP3: Third Order Distortion from  
10kHz - 7.5GHz  
0
70  
60  
50  
40  
30  
20  
10  
0
-10  
3.0 V  
3.3 V  
3.6 V  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
-90  
-100  
3.0 V  
3.3 V  
3.6 V  
0
1
2
3
4
5
6
7
8
9
Frequency [GHz]  
Frequency [Hz]  
Figure 14. Return Loss at active port @ 25 °C  
Figure 15. Return Loss at active port @ 3.3 V  
0
0
-5  
-5  
3.0 V  
+25deg C  
3.3 V  
3.6 V  
+85deg C  
-40deg C  
-10  
-15  
-20  
-25  
-30  
-35  
-10  
-15  
-20  
-25  
-30  
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
Frequency [GHz]  
Frequency [GHz]  
Document No. 70-0246-03 www.psemi.com  
©2008 Peregrine Semiconductor Corp. All rights reserved.  
Page 5 of 9  
PE42552  
Product Specification  
Figure 16. Evaluation Board Layouts  
Peregrine Specification 101/0334  
Evaluation Kit  
The SPDT switch EK Board was designed to ease  
customer evaluation of Peregrine’s PE42552. The  
RF common port is connected through a 50  
transmission line via the top SMA connector, J1.  
RF1, RF2, RF3 and RF4 are connected through  
50 transmission lines via SMA connectors J3,  
J5, J2 and J4, respectively. A through 50 Ω  
transmission is available via SMA connectors J6  
and J7. This transmission line can be used to  
estimate the loss of the PCB over the  
environmental conditions being evaluated.  
The evaluation kit board is constructed of four  
metal layers. The dual clad top RF layer is  
Rogers RO4003 material with an 8 mil RF core  
and er = 3.55. The other two dielectric layers are  
FR4 for DC control and overall board strength with  
an cumulative board thickness of 60 mils. The RF  
transmission lines were designed using a  
Grounded co-planar waveguide with a linewidth of  
15 mils and gap of 10 mils.  
Figure 17. Evaluation Board Schematic  
Peregrine Specification 102/0404  
J1  
142-0761-881/891  
2
9
10  
11  
12  
4
3
2
1
GND  
GND  
RF2  
GND  
GND  
RF1  
J2  
J3  
142-0761-881/891  
U1  
142-0761-881/891  
QFN50P3X3-16P  
RF2  
1
RF1  
1
GND  
GND  
J4  
R1 DNI  
R2 DNI  
HEADER 14  
CTRL  
2
4
6
1
3
5
7
9
11  
13  
2
4
6
8
10  
12  
14  
1
3
5
7
9
LS  
L1  
VDD  
VSS  
8
10  
12  
14  
0 OHM  
L1 WAS INDUCTOR  
R4 0 OHM  
11  
13  
R3  
DNI  
C4  
C3  
22pF  
C2  
C1  
68pF  
22pF  
22pF  
J5  
J6  
142-0761-881/891  
142-0761-881/891  
Through Line  
1
1
©2008 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0246-03 UltraCMOS™ RFIC Solutions  
Page 6 of 9  
PE42552  
Product Specification  
Figure 18. Package Drawing (mm)  
16-lead 3x3 mm QFN  
QFN 3x3 mm  
MAX  
NOM  
MIN  
0.800  
0.750  
0.700  
A
Document No. 70-0246-03 www.psemi.com  
©2008 Peregrine Semiconductor Corp. All rights reserved.  
Page 7 of 9  
PE42552  
Product Specification  
Figure 19. Tape and Reel Specifications  
16-lead 3x3 mm QFN  
Tape Feed Direction  
Pin 1  
Top of  
Device  
Device Orientation in Tape  
Table 6. Ordering Information  
Order Code Part Marking  
Description  
Package  
Shipping Method  
Bulk or tape cut from reel  
3000 units / T&R  
PE42552MLIB  
PE42552MLIB-Z  
EK42552-02  
42552  
PE42552G-16QFN 3x3mm-75A  
PE42552G-16QFN 3x3mm-3000C  
PE42552-16QFN 3x3mm-EK  
Green 16-lead 3x3mm QFN  
Green 16-lead 3x3mm QFN  
Evaluation Kit  
42552  
PE42552-EK  
1 / Box  
©2008 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0246-03 UltraCMOS™ RFIC Solutions  
Page 8 of 9  
PE42552  
Product Specification  
Sales Offices  
The Americas  
Peregrine Semiconductor Corporation  
Peregrine Semiconductor, Asia Pacific (APAC)  
Shanghai, 200040, P.R. China  
Tel: +86-21-5836-8276  
Fax: +86-21-5836-7652  
9380 Carroll Park Drive  
San Diego, CA 92121  
Tel: 858-731-9400  
Fax: 858-731-9499  
Peregrine Semiconductor, Korea  
#B-2607, Kolon Tripolis, 210  
Geumgok-dong, Bundang-gu, Seongnam-si  
Gyeonggi-do, 463-943 South Korea  
Tel: +82-31-728-3939  
Europe  
Peregrine Semiconductor Europe  
Bâtiment Maine  
Fax: +82-31-728-3940  
13-15 rue des Quatre Vents  
F-92380 Garches, France  
Tel: +33-1-4741-9173  
Fax : +33-1-4741-9173  
Peregrine Semiconductor K.K., Japan  
Teikoku Hotel Tower 10B-6  
1-1-1 Uchisaiwai-cho, Chiyoda-ku  
Tokyo 100-0011 Japan  
Tel: +81-3-3502-5211  
Fax: +81-3-3502-5213  
Hi-Rel and Defense Products  
Americas:  
Tel: 858-731-9453  
Europe, Asia Pacific:  
180 Rue Jean de Guiramand  
13852 Aix-En-Provence Cedex 3, France  
Tel: +33-4-4239-3361  
Fax: +33-4-4239-7227  
For a list of representatives in your area, please refer to our Web site at: www.psemi.com  
Data Sheet Identification  
Advance Information  
The information in this data sheet is believed to be reliable.  
However, Peregrine assumes no liability for the use of this  
information. Use shall be entirely at the user’s own risk.  
The product is in a formative or design stage. The data  
sheet contains design target specifications for product  
development. Specifications and features may change in  
any manner without notice.  
No patent rights or licenses to any circuits described in this  
data sheet are implied or granted to any third party.  
Preliminary Specification  
Peregrine’s products are not designed or intended for use in  
devices or systems intended for surgical implant, or in other  
applications intended to support or sustain life, or in any  
application in which the failure of the Peregrine product could  
create a situation in which personal injury or death might occur.  
Peregrine assumes no liability for damages, including  
consequential or incidental damages, arising out of the use of  
its products in such applications.  
The data sheet contains preliminary data. Additional data  
may be added at a later date. Peregrine reserves the right  
to change specifications at any time without notice in order  
to supply the best possible product.  
Product Specification  
The data sheet contains final data. In the event Peregrine  
decides to change the specifications, Peregrine will notify  
customers of the intended changes by issuing a DCN  
(Document Change Notice).  
The Peregrine name, logo, and UTSi are registered trademarks  
and UltraCMOS, HaRP, MultiSwitch and DuNE are trademarks  
of Peregrine Semiconductor Corp.  
Document No. 70-0246-03 www.psemi.com  
©2008 Peregrine Semiconductor Corp. All rights reserved.  
Page 9 of 9  

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