TDA1306T [NXP]
Noise shaping filter DAC; 噪声整形滤波器DAC
| 型号： | TDA1306T |
| 厂家： | 
NXP |
| 描述： | Noise shaping filter DAC |
| 文件： | 总24页 (文件大小：224K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA1306T
Noise shaping filter DAC
1998 Jan 06
Product specification
Supersedes data of September 1994
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
FEATURES
General
GENERAL DESCRIPTION
The TDA1306T is a dual CMOS digital-to-analog
converter with up-sampling filter and noise shaper.
The combination of oversampling up to 4fs, noise shaping
and continuous calibration conversion ensures that only
simple 1st-order analog post-filtering is required.
• Double-speed mode
• Digital volume control
• Soft mute function
The TDA1306T supports the I2S-bus data input mode
(fsys = 256fs) with word lengths of up to 20 bits and the
LSB fixed serial data input format (fsys = 384fs) with word
lengths of 16, 18 or 20 bits. Two cascaded IIR filters
increase the sampling rate 4 times.
• 12 dB attenuation
• Low power dissipation
• Digital de-emphasis
• TDA1305T pin compatible.
The DACs are of the continuous calibration type and
incorporate a special data coding. This ensures a high
signal-to-noise ratio, wide dynamic range and immunity to
process variation and component ageing.
Easy application
• Voltage output
• Only 1st-order analog post-filtering required
• Operational amplifiers and digital filter integrated
• Selectable system clock (fsys) 256fs or 384fs
Two on-board operational amplifiers convert the
digital-to-analog current to an output voltage.
• I2S-bus (fsys = 256fs) or 16, 18 or 20 bits LSB fixed
serial input format (fsys = 384fs)
• Single rail supply.
High performance
• Superior signal-to-noise ratio
• Wide dynamic range
• No zero crossing distortion
• Inherently monotonic
• Continuous calibration digital-to-analog conversion
combined with noise shaping technique.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
plastic small outline package; 24 leads; body width 7.5 mm.
VERSION
TDA1306T
SO24
SOT137−1
1998 Jan 06
2
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
QUICK REFERENCE DATA
All power supply pins VDD and VSS must be connected to the same external supply unit.
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDDD
VDDA
VDDO
digital supply voltage
analog supply voltage
4.5
5.0
5.5
V
V
V
4.5
4.5
5.0
5.0
5.5
5.5
operational amplifier
supply voltage
IDDD
IDDA
IDDO
digital supply current
VDDD = 5 V;
at code 00000H
−
−
−
5
3
2
8
5
4
mA
mA
mA
analog supply current
VDDA = 5 V;
at code 00000H
operational amplifier
supply current
VDDO = 5 V;
at code 00000H
Analog signals
VFS(rms)
full-scale output voltage
(RMS value)
VDDD = VDDA = VDDO = 5 V; 0.935
RL > 5 kΩ
1.1
1.265
V
RL
output load resistance
5
−
−
kΩ
DAC performance
(THD + N)/S
total harmonic distortion
plus noise-to-signal ratio
at 0 dB signal level;
fi = 1 kHz;
−
−
−
−
−
−
−70
0.032
−42
0.8
−
dB
−
%
at −60 dB signal level;
fi = 1 kHz;
−32
2.5
−96
2.822
dB
%
S/N
BR
signal-to-noise ratio
no signal; A-weighted
−108
−
dB
input bit rate at data input fs = 44.1 kHz;
normal speed
Mbits/s
fs = 44.1 kHz;
double speed
−
−
−
−
5.645
18.432
+85
Mbits/s
MHz
°C
fsys
system clock frequency
(pin 12)
6.4
−40
Tamb
operating ambient
temperature
1998 Jan 06
3
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
BLOCK DIAGRAM
Fig.1 Block diagram.
4
1998 Jan 06
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
PINNING
SYMBOL PIN
DESCRIPTION
VDDA
1
2
3
analog supply voltage (+5 V)
analog ground
VSSA
TEST1
test input 1; pin should be connected
to ground
BCK
4
5
6
7
8
9
bit clock input
WS
word select input
DATA
CLKS1
CLKS2
VSSD
data input
clock and format selection 1 input
clock and format selection 2 input
digital ground
VDDD
TEST2
10 digital supply voltage (+5 V)
11 test input 2; pin should be connected
to ground
SYSCLK
APP3
APPL
APP2
APP1
APP0
VOL
12 system clock input 256fs or 384fs
13 application mode 3 input
14 application mode selection input
15 application mode 2 input
16 application mode 1 input
17 application mode 0 input
18 left channel output
FILTCL
19 capacitor for left channel 1st order
filter function; should be connected
between pins 19 and 18
FILTCR
20 capacitor for right channel 1st order
filter function; should be connected
between pins 20 and 21
VOR
Vref
21 right channel output
22 internal reference voltage for output
channels; 0.5VDDO (typ.)
VSSO
VDDO
23 operational amplifier ground
Fig.2 Pin configuration.
24 operational amplifier supply voltage
1998 Jan 06
5
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
The TDA1306T supports the following data input modes:
FUNCTIONAL DESCRIPTION
• I2S-bus with data word length of up to 20 bits
(fsys = 256fs)
The TDA1306T CMOS DAC incorporates an up-sampling
filter, a noise shaper, continuous calibrated current
sources and operational amplifiers.
• LSB fixed serial format with data word length of 16, 18
or 20 bits (fsys = 384fs). As this format idles on the MSB
it is necessary to know how many bits are being
transmitted.
System clock and data input format
The TDA1306T accommodates slave mode only.
Consequently, in all applications, the system devices must
provide the system clock. The system frequency is
selectable at pins CLKS1 and CLKS2 (see Table 1).
The input formats are illustrated in Fig.9. Left and right
data channel words are time multiplexed.
Table 1 Data input format and system clock
SYSTEM CLOCK
CLKS1
CLKS2
DATA INPUT FORMAT
I2S-bus
NORMAL SPEED
DOUBLE SPEED
0
0
1
1
0
1
0
1
256fs
384fs
384fs
384fs
128fs
192fs
192fs
192fs
LSB fixed 16 bits
LSB fixed 18 bits
LSB fixed 20 bits
Device operation
When the APPL pin is held HIGH and APP3 is held LOW,
pins APP0, APP1 and APP2 form a microcontroller
interface. When the APPL pin is held LOW, pins APP0,
APP1, APP2 and APP3 form a pseudo-static application
(TDA1305T pin compatible).
PSEUDO-STATIC APPLICATION MODE (APPL = LOGIC 0)
In this mode, the device operation is controlled by
pseudo-static application pins where:
APP0 = attenuation mode control
APP1 = double-speed mode control
APP2 = mute mode control
APP3 = de-emphasis mode control.
In the pseudo-static application mode the TDA1306T is pin
compatible with the TDA1305T slave mode.
The correspondence between TDA1306T pin number,
TDA1306T pin name, TDA1305T pin mnemonic and a
description of the effects is given in Table 2.
1998 Jan 06
6
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
Table 2 Pseudo-static application mode
PIN
MNEMONIC
TDA1305T
FUNCTION
PIN NUMBER
VALUE
DESCRIPTION
APP0
17
ATSB
0
12 dB attenuation (from full scale) activated
(only if MUSB = logic 1)
1
0
1
0
1
0
1
full scale (only if MUSB = logic 1)
double-speed mode
APP1
APP2
APP3
16
15
13
DSMB
MUSB
DEEM1
normal-speed mode
samples decrease to mute level
level according to ATSB
de-emphasis OFF (44.1 kHz)
de-emphasis ON (44.1 kHz)
MICROCONTROLLER APPLICATION MODE (APPL = LOGIC
1 AND APP3 = LOGIC 0)
MICROCONTROLLER WRITE OPERATION SEQUENCE
The microcontroller write operation follows the following
sequence:
In this mode, the device operation is controlled by a set of
flags in an 8-bit mode control register. The 8-bit mode
control register is written by a microcontroller interface
where:
• APP2 is held LOW by the microcontroller
• Microcontroller data is clocked into the internal shift
register on the LOW-to-HIGH transition on pin APP1
APPL = logic 1
APP0 = Data
APP1 = Clock
APP2 = RAB
APP3 = logic 0.
• Data D7 to D0 is latched into the appropriate control
register on the LOW-to-HIGH transition of pin APP2
(APP1 = HIGH)
• If more data is clocked into the TDA1306T before the
LOW-to-HIGH transition on pin APP2 then only the last
8 bits are used
The correspondence between serial-to-parallel
conversion, mode control flags and a summary of the
effect of the control flags is given in Table 3.
Figures 3 and 4 illustrate the mode set timing.
• If less data is clocked into the TDA1306T unpredictable
operation will result
• If the LOW-to-HIGH transition of pin APP2 occurs when
APP1 = LOW, the command will be disregarded.
Fig.3 Microcontroller timing.
1998 Jan 06
7
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
between APP2 pulses. A minimum pause of 22 µs is
necessary between any two step-up or step-down
commands.
MICROCONTROLLER WRITE OPERATION SEQUENCE (REPEAT
MODE)
The same command can be repeated several times (e.g.
for fade function) by applying APP2 pulses as shown in
Fig.4. It should be noted that APP1 must stay HIGH
Fig.4 Microcontroller timing (repeat mode).
Table 3 Microcontroller mode control register
BIT POSITION
FUNCTION
DESCRIPTION
ACTIVE LEVEL
D7
ATSB
12 dB attenuation
(from full scale)
LOW
D6
D5
D4
D3
D2
D1
D0
DSMB
MUSB
double speed
mute
LOW
LOW
DEEM
de-emphasis
full scale
HIGH
FS
HIGH
INCR
increment
decrement
reserved
HIGH
DECR
HIGH
not applicable
not applicable
1998 Jan 06
8
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
Volume control
VOLUME CONTROL (PSEUDO-STATIC APPLICATION MODE)
A digital level control is incorporated in the TDA1306T
which performs the function of soft mute and attenuation
(pseudo-static application mode) or soft mute, attenuation,
fade, increment and decrement (microcontroller
application mode). The volume control of both channels
can be varied in small step changes determined by the
value of the internal fade counter where:
In the pseudo-static application mode (APPL = logic 0) the
digital audio output level is controlled by APP0
(attenuation) and APP2 (mute) so only the final volume
levels full scale, 12 dB (attenuate) and mute (−infinity dB)
can be selected. The mute function has priority over the
attenuation function. Accordingly, if MUSB is LOW, the
state of ATSB has no effect. An example of volume control
in this application mode is illustrated in Fig.5.
Audio level = counter × maximum level/120.
Where the counter is a 7-bit binary number between 0 and
120. The time taken for mute to vary from 120 to 0 is
1/120fs. For example, when fs = 44.1 kHz, the time taken
is approximately 3 ms.
Fig.5 Volume control (pseudo-static application mode).
1998 Jan 06
9
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
To control the fade counter in a continuous way, the
VOLUME CONTROL (MICROCONTROLLER APPLICATION MODE)
INCREMENT and DECREMENT commands are available
(fade control Registers D1 and D2). They will increment
and decrement the counter by 1 for each register write
operation. When issuing more than 1 step-up or
step-down command in sequence, the write repeat mode
may be used (see microcontroller application mode). An
example of volume control in this application mode is
illustrated in Fig.6.
In the microcontroller application mode (APPL = logic 1,
APP3 = logic 0) the audio output level is controlled by
volume control bits ATSB, MUSB, FS, INCR and DECR.
Mute is activated by sending the MUSB command to the
mode control register via the microcontroller interface. The
audio output level will be reduced to zero in a maximum of
120 steps (depending on the current position of the fade
counter) and taking a maximum of 3 ms. Mute, attenuation
and full scale are synchronized to prevent operation in the
middle of a word.
• The counter is preset to 120 by the full scale command
• The counter is preset to 30 by the attenuate command
when its value is more then 30. If the value of the
counter is less than 30 dB the ATSB command has no
effect.
• The counter is preset to logic 0 by the mute command
MUSB
• Attenuation (−12 dB) is activated by sending the ATSB
command to the fade control register (D7)
• Attenuation and mute are cancelled by sending the
full-scale command to the fade control register
(Register D3).
(1) INCR and DECR in repeat mode.
Fig.6 Volume control (microcontroller application mode).
1998 Jan 06
10
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
There are two recommended application situations within
the microcontroller mode:
Double-speed mode
The double-speed mode is controlled by the DSMB bit at
register D6 (microcontroller application mode) or by
activating the APP1 pin (pseudo-static application mode).
When the control bit is active LOW the device operates in
the double-speed mode.
• The customer wants to use the microcontroller interface
without the volume setting facility. In this event the
operation is as follows:
– Mute ON; by sending the MUSB command
– Mute OFF; by sending the FS command
Oversampling filter and noise shaper
– Attenuation ON; by sending the ATSB command
– Attenuation OFF; by sending the FS command.
The digital filter is a four times oversampling filter.
It consists of two sections which each increase the sample
rate by 2. The noise-shaper operates on 4fs and reduces
the in-band noise density.
It is possible to switch from ‘Attenuation ON’ to ‘Mute
ON’ but not vice-versa.
• Incorporating the volume control feature operates as
follows:
DAC and operational amplifiers
– Mute ON; by sending the MUSB command the
microcontroller has to store the previous volume
setting
In this noise shaping filter DAC a special data code and
bidirectional current sources are used in order to achieve
true low-noise performance. The special data code
guarantees that only small values of current flow to the
output during small signal passages while larger positive
or negative values are generated using the bidirectional
current sources. The noise shaping filter-DAC uses the
continuous calibration conversion technique.
– Mute OFF; by sending succeeding INCR commands
until the previous volume is reached
– Attenuation ON; by sending succeeding DECR
commands until a relative downstep of −12 dB is
reached.
The operational amplifiers and the internal conversion
resistors RCONV1 and RCONV2 convert the DAC current to
an output voltage available at VOL and VOR. Connecting an
external capacitor between FILTCL and VOL, FILTCR and
VOR respectively provides the required 1st-order post
filtering.
The microcontroller has to store the previous volume
– Attenuation OFF; by sending the succeeding INCR
commands until the previous volume is reached
– Volume UP; by sending succeeding INCR
commands
– Volume DOWN; by sending succeeding DECR
commands.
De-emphasis
A digital de-emphasis is implemented in the TDA1306T.
By selecting the DEEM bit at register D4 (microcontroller
application mode) or activating the APP3 pin
(pseudo-static application mode), de-emphasis can be
applied by means of an IIR filter. De-emphasis is
synchronized to prevent operation in the middle of a word.
1998 Jan 06
11
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VDD
PARAMETER
supply voltage
CONDITIONS
MIN.
MAX.
7.0
UNIT
note 1
−
−
V
Txtal
Tstg
Tamb
Ves
maximum crystal temperature
storage temperature
+150
+125
+85
°C
°C
°C
V
−65
operating ambient temperature
electrostatic handling
−40
note 2
note 3
−2000
−200
+2000
+200
V
Notes
1. All VDD and VSS connections must be made to the same power supply.
2. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor.
3. Equivalent to discharging a 200 pF capacitor via a 2.5 mH series inductor.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
in free air
VALUE
69
UNIT
Rth j-a
thermal resistance from junction to ambient
K/W
QUALITY SPECIFICATION
In accordance with “UZW-BO/FQ-0601”.
1998 Jan 06
12
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
DC CHARACTERISTICS
VDDD = VDDA = VDDO = 5 V; Tamb = 25 °C; all voltages referenced to ground (pins 2, 9 and 23); unless otherwise
specified.
SYMBOL
PARAMETER
CONDITIONS
note 1
MIN.
TYP.
MAX.
5.5
UNIT
VDDD
VDDA
VDDO
digital supply voltage (pin 10)
analog supply voltage (pin 1)
4.5
4.5
4.5
5.0
5.0
5.0
V
note 1
note 1
5.5
5.5
V
V
operational amplifier supply
voltage (pin 24)
IDDD
IDDA
IDDO
digital supply current
analog supply current
fsys = 11.28 MHz
at digital silence
−
−
−
5
3
2
8
6
4
mA
mA
mA
operational amplifier supply
current
no operational
amplifier load resistor
Ptot
total power dissipation
fsys = 11.28 MHz;
digital silence; no
operational amplifier
load resistor
−
50
90
mW
VIH
VIL
HIGH level digital input voltage
(pins 3 to 8 and 11 to 17)
0.7VDDD
−0.5
−
−
−
VDDD + 0.5
+0.3VDDD
134
V
LOW level digital input voltage
(pins 3 to 8 and 11 to 17)
V
Rpd
internal pull-down resistor to
VSSD (pins 3 and 11)
17
kΩ
|ILI|
input leakage current
input capacitance
−
−
−
−
10
µA
pF
V
Ci
10
Vref
RCONV
reference voltage (pin 22)
with respect to VSSO
0.45VDDO 0.5VDDO
0.55VDDO
3.6
current-to-voltage conversion
resistor
2.4
0.935
5
3.0
1.1
−
kΩ
VFS(rms)
full-scale output voltage (RMS RL > 5 kΩ; note 2
value)
1.265
V
RL
output load resistance
−
kΩ
Notes
1. All power supply pins (VDD and VSS) must be connected to the same external power supply unit.
2. RL is the AC resistance of the external circuitry connected to the audio outputs of the application circuit.
1998 Jan 06
13
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
AC CHARACTERISTICS (ANALOG)
VDDD = VDDA = VDDO = 5 V; Tamb = 25 °C; all voltages referenced to ground (pins 2, 9 and 23); unless otherwise
specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
DACs
SVRR
supply voltage ripple
rejection VDDA and VDDO
fripple = 1 kHz;
Vripple = 100 mV (p-p);
C22 = 10 µF
−
−
−
40
−
dB
∆Gv
unbalance between the
2 DAC voltage outputs
(pins 18 and 21)
maximum volume
−
0.5
dB
dB
α
crosstalk between the 2 DAC one output digital silence
−110
−85
ct
voltage outputs
(pins 18 and 21)
the other maximum volume
(THD + N)/S total harmonic distortion
plus noise-to-signal ratio
at 0 dB signal level;
fi = 1 kHz
−
−
−
−
−
−70
−
dB
%
0.032
−42
−
at −60 dB signal level;
fi = 1 kHz
−32
2.5
−96
dB
%
0.8
S/N
signal-to-noise ratio
no signal; A-weighted
−108
dB
Operational amplifiers
Gv
open-loop voltage gain
power supply rejection ratio
−
−
85
90
−
−
dB
dB
PSRR
f
V
ripple = 3 kHz;
ripple = 100 mV (p-p);
A-weighted
(THD + N)/S total harmonic distortion
plus noise-to-signal ratio
RL > 5 kΩ; fi = 1 kHz;
Vo = 2.8 V (p-p)
−
−100
−
dB
fUG
unity gain frequency
AC output impedance
open loop
−
−
4.5
1.5
−
MHz
|Zo|
RL > 5 kΩ
150
Ω
1998 Jan 06
14
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
AC CHARACTERISTICS (DIGITAL)
VDDD = VDDA = VDDO 4.5 to 5.5 V; all voltages referenced to ground (pins 2, 9 and 23); Tamb = −40 to +85 °C; unless
otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
54.2
TYP.
59.1
MAX.
104
UNIT
ns
TWX
clock cycle time
fsys = 384fs; normal speed
f
sys = 192fs; double speed
fsys = 256fs; normal speed
sys = 128fs; double speed
54.2
81.3
81.3
22
59.1
88.6
88.6
−
104
156
156
−
ns
ns
ns
ns
ns
f
tCWL
tCWH
fsys LOW level pulse width
fsys HIGH level pulse width
22
−
−
Serial input data timing (see Fig.8)
fs
word select input audio
sample frequency
normal speed
25
50
−
44.1
88.2
−
48
96
64fs
64fs
64fs
48fs
20
20
−
kHz
kHz
kHz
kHz
kHz
kHz
ns
double speed
fBCK
clock input frequency
(data input rate)
fsys = 384fs; normal speed; note 1
f
sys = 192fs; double speed; note 1
fsys = 256fs; normal speed
sys = 128fs; double speed; note 2
−
−
−
−
f
−
−
tr
rise time
−
−
tf
fall time
−
−
ns
tH
bit clock HIGH time
bit clock LOW time
data set-up time
data hold time
55
55
20
10
20
10
−
ns
tL
−
−
ns
tsu
th
−
−
ns
−
−
ns
tsuWS
thWS
word select set-up time
word select hold time
−
−
ns
−
−
ns
Microcontroller interface timing (see Fig.9)
tL
input LOW time
2
2
1
1
1
−
−
−
−
−
−
−
−
−
−
µs
µs
µs
µs
µs
tH
Input HIGH time
tsuDC
thCD
tsuCR
set-up time DATA to CLOCK
hold time CLOCK to DATA
set-up time CLOCK to RAB
Notes
1. A clock frequency of up to 96fs is possible in the event of a rising edge of BCK occurring during SYSCLK = LOW.
2. A clock frequency of up to 64fs is possible in the event of a rising edge of BCK occurring during SYSCLK = LOW.
1998 Jan 06
15
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
1998 Jan 06
16
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
Fig.8 Timing of input signals.
Fig.9 Microcontroller timing.
17
1998 Jan 06
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
TEST AND APPLICATION INFORMATION
Filter characteristics
Table 4 Digital filter specification (fs = 44.1 kHz)
BAND
0 to 19 kHz
ATTENUATION
< 0.001 dB
19 to 20 kHz
24 kHz
< 0.03 dB
> 25 dB
> 40 dB
> 50 dB
> 31 dB
> 35 dB
> 40 dB
25 to 35 kHz
35 to 64 kHz
64 to 68 kHz
68 kHz
69 to 88 kHz
Table 5 Digital filter phase distortion (fs = 44.1 kHz)
BAND PHASE DISTORTION
0 to 16 kHz < ±1°
1998 Jan 06
18
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
PACKAGE OUTLINE
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A
X
c
H
v
M
A
E
y
Z
24
13
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
12
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
0.25
0.01
1.27
0.050
1.4
0.25 0.25
0.01
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.61
0.014 0.009 0.60
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-24
97-05-22
SOT137-1
075E05
MS-013AD
1998 Jan 06
19
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
SOLDERING
Introduction
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
1998 Jan 06
20
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Jan 06
21
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
NOTES
1998 Jan 06
22
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
NOTES
1998 Jan 06
23
Philips Semiconductors – a worldwide company
Argentina: see South America
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,
Fax. +43 160 101 1210
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Belgium: see The Netherlands
Brazil: see South America
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Portugal: see Spain
Romania: see Italy
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Colombia: see South America
Czech Republic: see Austria
Slovakia: see Austria
Slovenia: see Italy
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 488 3263
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Uruguay: see South America
Vietnam: see Singapore
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
For all other countries apply to: Philips Semiconductors,
Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1998
SCA57
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547027/1200/02/pp24
Date of release: 1998 Jan 06
Document order number: 9397 750 03168
相关型号：
TDA1308AUK,027
IC 0.04 W, 2 CHANNEL, AUDIO AMPLIFIER, PBGA8, 0.61 X 0.84 MM, 0.38 MM HEIGHT, WLCSP-8, Audio/Video Amplifier
NXP
©2020 ICPDF网 联系我们和版权申明