TDA1308AUK [NXP]
Class-AB stereo headphone driver; AB类立体声耳机驱动器型号: | TDA1308AUK |
厂家: | NXP |
描述: | Class-AB stereo headphone driver |
文件: | 总19页 (文件大小:111K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TDA1308; TDA1308A
Class-AB stereo headphone driver
Rev. 04 — 25 January 2007
Product data sheet
1. General description
The TDA1308; TDA1308A is an integrated class-AB stereo headphone driver contained in
an SO8, DIP8 or a TSSOP8 plastic package. The TDA1308AUK is available in an 8 bump
wafer level chip-size package (WLCSP8). The device is fabricated in a 1 µm
Complementary Metal Oxide Semiconductor (CMOS) process and has been primarily
developed for portable digital audio applications.
The difference between the TDA1308 and the TDA1308A is that the TDA1308A can be
used at low supply voltages.
2. Features
I Wide temperature range
I No switch ON/OFF clicks
I Excellent power supply ripple rejection
I Low power consumption
I Short-circuit resistant
I High performance
N High signal-to-noise ratio
N High slew rate
N Low distortion
I Large output voltage swing
3. Quick reference data
Table 1.
Quick reference data
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max Unit
VDD
supply voltage
TDA1308
single supply
dual supply
3.0
1.5
5.0
2.5
7.0
3.5
V
V
TDA1308A
single supply
dual supply
2.4
1.2
5.0
2.5
7.0
3.5
V
V
VSS
negative supply
voltage
TDA1308; dual supply
TDA1308A; dual supply
no load
−1.5 −2.5 −3.5
−1.2 −2.5 −3.5
V
V
IDD
supply current
-
3
5
mA
TDA1308; TDA1308A
NXP Semiconductors
Class-AB stereo headphone driver
Table 1.
Quick reference data …continued
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max Unit
Ptot
total power
dissipation
no load
-
15
25
mW
[1]
Po
maximum output
power
(THD + N)/S < 0.1 %
-
40
80
mW
[1]
[1]
[2]
[3]
(THD + N)/S total harmonic
distortion plus
-
0.03 0.06
%
-
−70
−92
−52
−101
110
−65
−89
−40
-
dB
dB
dB
dB
dB
noise-to-signal
ratio
RL = 5 kΩ
RL = 5 kΩ
RL = 5 kΩ
-
-
-
S/N
signal-to-noise
ratio
100
-
αcs
channel
separation
-
-
-
70
-
-
-
dB
dB
dB
[1]
RL = 5 kΩ
105
90
PSRR
Tamb
power supply
ripple rejection
fi = 100 Hz;
Vripple(p-p) = 100 mV
ambient
−40
-
+85
°C
temperature
[1] VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB).
[2] VDD = 2.4 V; VO(p-p) = 1.62 V (at −4.8 dBV); for TDA1308A only.
[3] VDD = 2.4 V; VO(p-p) = 1.19 V (at −7.96 dBV); for TDA1308A only.
4. Ordering information
Table 2.
Ordering information
Type number Package
Name
Description
plastic dual in-line package; 8 leads (300 mil)
Version
TDA1308
DIP8
SO8
SOT97-1
SOT96-1
TDA1308T
plastic small outline package; 8 leads; body width
3.9 mm
TDA1308AT
SO8
plastic small outline package; 8 leads; body width
3.9 mm
SOT96-1
TDA1308AUK WLCSP8
TDA1308TT TSSOP8
wafer level chip-size package; 8 bumps;
0.61 × 0.84 × 0.38 mm
TDA1308AUK
SOT505-1
plastic thin shrink small outline package; 8 leads;
body width 3 mm
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
2 of 19
TDA1308; TDA1308A
NXP Semiconductors
Class-AB stereo headphone driver
5. Block diagram
TDA1308(A)
1
8
7
OUTA
V
DD
2
3
INA(neg)
INA(pos)
OUTB
6
5
INB(neg)
INB(pos)
4
V
SS
mka779
Fig 1. Block diagram
6. Pinning information
6.1 Pinning
bump A1
index area
TDA1308AUK
1
2
3
A
B
C
D
E
TDA1308(A)
1
2
3
4
8
7
6
5
OUTA
INA(neg)
INA(pos)
V
DD
OUTB
INB(neg)
INB(pos)
V
SS
001aaf800
Transparent top view
001aaf782
Fig 2. Pin configuration TDA1308(A)
Fig 3. Pin configuration TDA1308AUK
6.2 Pin description
Table 3.
Symbol
OUTA
Pin description TDA1308(A)
Pin
1
Description
output A
INA(neg)
INA(pos)
VSS
2
inverting input A
non-inverting input A
negative supply
non-inverting input B
3
4
INB(pos)
5
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
3 of 19
TDA1308; TDA1308A
NXP Semiconductors
Class-AB stereo headphone driver
Table 3.
Pin description TDA1308(A) …continued
Symbol
INB(neg)
OUTB
VDD
Pin
6
Description
inverting input B
output B
7
8
positive supply
Table 4.
Symbol
OUTA
Pin description TDA1308AUK
Pin
A1
A3
B2
C1
C3
D2
E1
E3
Description
output A
VSS
negative supply
non-inverting input A
output B
INA(pos)
OUTB
INA(neg)
INB(neg)
VDD
inverting input A
inverting input B
positive supply
non-inverting input B
INB(pos)
7. Internal circuitry
V
DD
I
1
INA/B(pos)
INA/B(neg)
M1
M2
A1
M3
OUTA/B
C
m
M5
M4
D1
D2
D3
D4
A2
M6
V
SS
mka781
Fig 4. Equivalent schematic diagram
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
4 of 19
TDA1308; TDA1308A
NXP Semiconductors
Class-AB stereo headphone driver
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
0
Max
8.0
-
Unit
V
VDD
supply voltage
output short-circuit duration Tamb = 25 °C;
tot = 1 W
tSC(O)
20
s
P
Tstg
storage temperature
ambient temperature
−65
−40
−2
+150
+85
+2
°C
°C
kV
V
Tamb
Vesd
[1]
[2]
electrostatic discharge
voltage
HBM
MM
−200
+200
[1] Human body model (HBM): C = 100 pF; R = 1500 Ω; 3 pulses positive plus 3 pulses negative.
[2] Machine model (MM): C = 200 pF; L = 0.5 mH; R = 0 Ω; 3 pulses positive plus 3 pulses negative.
9. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from junction
to ambient
DIP8
109
210
220
1000
K/W
K/W
K/W
K/W
SO8
TSSOP8
WLCSP8
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
5 of 19
TDA1308; TDA1308A
NXP Semiconductors
Class-AB stereo headphone driver
10. Characteristics
Table 7.
Characteristics
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.
Symbol
Supplies
VDD
Parameter
Conditions
Min
Typ
Max
Unit
supply voltage
TDA1308
single supply
dual supply
3.0
1.5
5.0
2.5
7.0
3.5
V
V
TDA1308A
single supply
dual supply
2.4
1.2
−1.5
−1.2
-
5.0
2.5
−2.5
−2.5
3
7.0
3.5
−3.5
−3.5
5
V
V
VSS
negative supply voltage
TDA1308; dual supply
TDA1308A; dual supply
no load
V
V
IDD
supply current
mA
mW
Ptot
total power dissipation
no load
-
15
25
Static characteristics
VI(os)
Ibias
VCM
GV
input offset voltage
-
10
10
-
-
mV
pA
pA
dB
mA
Ω
input bias current
-
-
common mode voltage
open-loop voltage gain
maximum output current
output resistance
0
3.5
RL = 5 kΩ
-
70
60
0.25
-
-
IO
-
-
RO
(THD + N)/S < 0.1 %
-
-
[1]
[1]
[1]
VO
output voltage swing
0.75
4.25
3.5
4.9
-
V
RL = 16 Ω
RL = 5 kΩ
1.5
-
V
0.1
-
V
αcs
channel separation
-
-
-
-
70
105
90
-
dB
dB
dB
pF
[1]
RL = 5 kΩ
-
PSRR
CL
power supply ripple rejection fi = 100 Hz; Vripple(p-p) = 100 mV
load capacitance
-
200
Dynamic characteristics
[2]
[2]
[3]
[3]
[3]
[2]
[2]
(THD + N)/S total harmonic distortion
plus noise-to-signal ratio
-
0.03
−70
0.06
−65
−89
−40
1.0
-
%
-
dB
dB
dB
%
RL = 5 kΩ
RL = 5 kΩ
RL = 5 kΩ
RL = 5 kΩ
RL = 5 kΩ
-
−92
-
−52
-
0.25
−101
0.0009
110
5.5
-
dB
%
-
-
S/N
fG
signal-to-noise ratio
unity gain frequency
maximum output power
100
-
dB
MHz
mW
open-loop; RL = 5 kΩ
-
-
-
Po
(THD + N)/S < 0.1 %
40
80
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
6 of 19
TDA1308; TDA1308A
NXP Semiconductors
Class-AB stereo headphone driver
Table 7.
Characteristics …continued
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.
Symbol
Parameter
input capacitance
slew rate
Conditions
Min
Typ
3
Max
Unit
pF
Ci
-
-
-
-
-
-
SR
B
unity gain inverting
unity gain inverting
5
V/µs
kHz
bandwidth
20
[1] Values are proportional to VDD; (THD + N)/S < 0.1 %.
[2] VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB).
[3] VDD = 2.4 V; VO(p-p) = 1.19 V (at −7.96 dBV); for TDA1308A only.
11. Application information
V
DD
C5
C2
10 µF
C1
100 nF
C7
1 nF
R3
R1
22 kΩ
100 µF
R5
10 kΩ
3.9 kΩ
1
8
5
2
3
8
1
2
3
BCK
WS
V
R2
ref
C6
100 µF
TDA1545A
TDA1308(A)
7
6
33 kΩ
5
6
DATA
7
4
4
C3
1 µF
R4
C8
3.9 kΩ
C4
100 µF
R6
10 kΩ
1 nF
mka783
Fig 5. Example of application with TDA1545A (stereo continuous calibration DAC)
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
7 of 19
TDA1308; TDA1308A
NXP Semiconductors
Class-AB stereo headphone driver
12. Test information
V
DD
100 µF
3.9 kΩ
V
OUTA
R
L
1
8
3.9 kΩ
3.9 kΩ
2
3
V
INA
C6
100 µF
V
ref
TDA1308(A)
(typ. 2.5 V)
5
6
V
INB
7
4
100 µF
3.9 kΩ
V
OUTB
R
L
mka782
Fig 6. Measurement circuit for inverting application
mka784
mka785
−70
G
(dB)
v
80
G
(dB)
v
−90
R
L
= 32 Ω
40
R
L
= 16 Ω
no load
−110
−130
32 Ω
0
5 kΩ
−1
−2
−3
−4
−5
−2
−3
−4
−5
−6
−7
−8
10
10
10
10
10
10
10
10
10
10
10
10
f (Hz)
f (Hz)
i
i
Fig 7. Open-loop gain as a function of input frequency Fig 8. Crosstalk as a function of input frequency
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
8 of 19
TDA1308; TDA1308A
NXP Semiconductors
Class-AB stereo headphone driver
mka786
mka787
100
−50
P
(mW)
o
R
L
= 16 Ω
(THD+N)/S
(dB)
R
R
= 16 Ω; P = 50 mW
o
L
60
32 Ω
8 Ω
−70
−90
= 32 Ω; P = 50 mW
L
o
40
20
10
R
= 5 kΩ; V
= 3.5 V
O(p−p)
L
−110
−1
−2
−3
−4
−5
3
4
5
DD
10
10
10
10
10
f (Hz)
i
V
(V)
Fig 9. Output power as a function of supply voltage
Fig 10. Total harmonic distortion plus noise-to-signal
ratio as a function of input frequency
mka788
−40
(THD+N)/S
(dB)
R
= 8 Ω
16 Ω
L
−60
32 Ω
−80
5 kΩ
f = 1 kHz
i
−100
−2
−1
10
10
1
10
V
(V)
O(p−p)
Fig 11. Total harmonic distortion plus noise-to-signal ratio as a function of output voltage
level
12.1 Quality information
The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
9 of 19
TDA1308; TDA1308A
NXP Semiconductors
Class-AB stereo headphone driver
13. Package outline
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
D
M
E
A
2
A
A
1
L
c
w M
Z
b
1
e
(e )
1
M
H
b
b
2
8
5
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.1
7.62
0.3
0.254
0.01
1.15
0.068 0.021 0.042 0.014
0.045 0.015 0.035 0.009
0.39
0.36
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.02
0.13
0.045
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-13
SOT97-1
050G01
MO-001
SC-504-8
Fig 12. Package outline SOT97-1 (DIP8)
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
10 of 19
TDA1308; TDA1308A
NXP Semiconductors
Class-AB stereo headphone driver
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
v
c
y
H
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT96-1
076E03
MS-012
Fig 13. Package outline SOT96-1 (SO8)
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
11 of 19
TDA1308; TDA1308A
NXP Semiconductors
Class-AB stereo headphone driver
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
A
(A )
2
A
3
A
1
pin 1 index
θ
L
p
L
1
4
detail X
e
w M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
A
A
A
b
c
D
E
e
H
E
L
L
p
UNIT
v
w
y
Z
θ
1
2
3
p
max.
0.15
0.05
0.95
0.80
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
5.1
4.7
0.7
0.4
0.70
0.35
6°
0°
mm
1.1
0.65
0.25
0.94
0.1
0.1
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-04-09
03-02-18
SOT505-1
Fig 14. Package outline SOT505-1 (TSSOP8)
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
12 of 19
TDA1308; TDA1308A
NXP Semiconductors
Class-AB stereo headphone driver
WLCSP8: wafer level chip-size package; 8 bumps; 0.61 x 0.84 x 0.38 mm
TDA1308AUK
D
B
A
bump A1
index area
A
2
E
A
A
1
detail X
e
1
1/2 e
1
C
M
v
C A
C
B
b
y
M
w
E
1/4 e
2
D
C
B
A
1/2 e
2
e
2
1
2
3
0
0.25
0.5 mm
X
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
1
A
2
b
D
E
e
e
2
v
w
y
1
max
0.10 0.39 0.123 0.65 0.88
0.07 0.37 0.57 0.80
mm
0.49
0.396 0.588 0.15 0.05 0.08
0.091
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
06-11-20
06-12-15
TDA1308AUK
Fig 15. Package outline TDA1308AUK (WLCSP8)
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
13 of 19
TDA1308; TDA1308A
NXP Semiconductors
Class-AB stereo headphone driver
14. Soldering
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus PbSn soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
14 of 19
TDA1308; TDA1308A
NXP Semiconductors
Class-AB stereo headphone driver
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 16) than a PbSn process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 8 and 9
Table 8.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
220
< 2.5
235
220
≥ 2.5
220
Table 9.
Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 16.
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
15 of 19
TDA1308; TDA1308A
NXP Semiconductors
Class-AB stereo headphone driver
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 16. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
16 of 19
TDA1308; TDA1308A
NXP Semiconductors
Class-AB stereo headphone driver
15. Revision history
Table 10. Revision history
Document ID
TDA1308_A_4
Modifications:
Release date
20070125
Data sheet status
Change notice
Supersedes
Product data sheet
-
TDA1308_A_3
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors
• Legal texts have been adapted to the new company name where appropriate
• Type number TDA1308AUK has been added
TDA1308_A_3
TDA1308_A_2
TDA1308_1
20020719
20020227
19940905
Product specification
Product specification
Product specification
-
-
-
TDA1308_A_2
TDA1308_1
-
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
17 of 19
TDA1308; TDA1308A
NXP Semiconductors
Class-AB stereo headphone driver
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of a NXP Semiconductors product can reasonably be expected to
16.2 Definitions
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
17. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
18 of 19
TDA1308; TDA1308A
NXP Semiconductors
Class-AB stereo headphone driver
18. Contents
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Thermal characteristics. . . . . . . . . . . . . . . . . . . 5
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Application information. . . . . . . . . . . . . . . . . . . 7
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8
Quality information . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
8
9
10
11
12
12.1
13
14
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Introduction to soldering . . . . . . . . . . . . . . . . . 14
Wave and reflow soldering . . . . . . . . . . . . . . . 14
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 14
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 15
14.1
14.2
14.3
14.4
15
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 25 January 2007
Document identifier: TDA1308_A_4
相关型号:
TDA1308AUK,027
IC 0.04 W, 2 CHANNEL, AUDIO AMPLIFIER, PBGA8, 0.61 X 0.84 MM, 0.38 MM HEIGHT, WLCSP-8, Audio/Video Amplifier
NXP
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