L-T650HECT [PARALIGHT]

SURFACE MOUNT DEVICE LED;
L-T650HECT
型号: L-T650HECT
厂家: PARA LIGHT ELECTRONICS CO., LTD.    PARA LIGHT ELECTRONICS CO., LTD.
描述:

SURFACE MOUNT DEVICE LED

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中文:  中文翻译
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Release by  
PARALIGHT DCC  
PARA LIGHT ELECTRONICS CO., LTD.  
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan  
Tel: 886-2-2225-3733  
E-mail: para@para.com.tw  
Fax: 886-2-2225-4800  
http://www.para.com.tw  
DATA SHEET  
PART NO.: L-T650HECT  
REV: A / 1  
CUSTOMER’S APPROVAL : _______________  
DCC : ____________  
PAGE 1 of 15  
DRAWING NO. : DS-7B-09-0008  
DATE: 2009-10-31  
PARA-FOR-065  
Release by  
PARALIGHT DCC  
SURFACE MOUNT DEVICE LED  
REV: A / 1  
Part No. : L-T650HECT  
Features  
Top view, Wide view angle, Red color PLCC 2 package SMD LED .  
EIA STD package, packing in 8mm tape on 7" diameter reels (ANSI/EIA-481-B-2001).  
Compatible with automatic Pick & Place equipment.  
Compatible with IR Reflow soldering and TTW soldering.  
Pb free product and acceptable lead-free process.  
Meet RoHS Green Product.  
Application  
Backlighting ( Switches, keys, displays, illuminated advertising)  
Emergency lighting / Signal and symbol luminaries.  
Package Outline Dimensions  
Notes:  
1. All dimensions are in millimeters.  
±
2. Tolerance is  
0.10mm (.004") unless otherwise noted.  
DRAWING NO. : DS-7B-09-0008  
DATE: 2009-10-31  
PAGE  
2 of 15  
PARA-FOR-068  
Release by  
PARALIGHT DCC  
SURFACE MOUNT DEVICE LED  
REV: A / 1  
Part No. : L-T650HECT  
CHIP MATERIALS  
Dice Material : Phoenix N-series AlGaInP  
Light Color : Mid-Super Red  
Lens Color : Water Clear  
Absolute Maximum Ratings(Ta=25)  
Symbol  
PD  
Parameter  
Rating  
75  
Unit  
mW  
Power Dissipation  
Peak Forward Current  
IPF  
100  
mA  
(1/10 Duty Cycle, 0.1ms Pulse Width)  
Continuous Forward Current  
Reverse Voltage  
IF  
20  
5
mA  
V
VR  
ESD  
Topr  
Tstg  
Electrostatic Discharge Threshold(HBM)Note A  
Operating Temperature Range  
Storage Temperature Range  
2000  
V
-40 ~ + 85  
-40 ~ + 85  
Reflow Soldering:260  
(for 10seconds)  
Tsld  
Soldering Temperature (One times MAX.)  
Hand Soldering:350  
(for 3 seconds)  
Note A :  
HBM : Human Body Model. Seller gives no other assurances regarding the ability of to  
withstand ESD.  
Electro-Optical Characteristics (Ta=25)  
Parameter  
Luminous Intensity  
Viewing Angle  
Peak Emission  
Symbol  
IV  
Min.  
250  
Typ.  
450  
120  
Max.  
629  
Unit  
mcd  
Deg  
Test Condition  
IF=20mA  
2θ1/2  
λp  
629  
622  
20  
nm  
nm  
nm  
Measurement @Peak  
IF=20mA  
Wavelength  
Dominant Wavelength  
Spectrum Radiation  
Bandwidth  
λ
619  
D
λ
IF=20mA  
Forward Voltage  
Reverse Current  
VF  
IR  
2.10  
2.40  
5
V
IF = 20mA  
VR = 5V  
μA  
DRAWING NO. : DS-7B-09-0008  
DATE: 2009-10-31  
PAGE  
3 of 15  
PARA-FOR-068  
Release by  
PARALIGHT DCC  
SURFACE MOUNT DEVICE LED  
REV: A / 1  
Part No. : L-T650HECT  
Notes:  
1. Luminous intensity is measured with a light sensor and filter combination that  
proximities the CIE eye-response curve.  
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous  
intensity.  
3. Caution in ESD :  
Static Electricity and surge damages the LED. It is recommended use a wrist band or  
anti-electrostatic glove when handling the LED. All devices, equipment and machinery  
must be properly grounded.  
4. Major standard testing equipment by “Instrument System” Model : CAS140B Compact  
Array Spectrometer and “KEITHLEY” Source Meter Model : 2400.  
Typical Electro-Optical Characteristics Curves  
Fig.1 Relative Intensity vs. Wavelength  
DRAWING NO. : DS-7B-09-0008  
DATE: 2009-10-31  
PAGE  
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Part No. : L-T650HECT  
Typical Electro-Optical Characteristics Curves  
(25Ambient Temperature Unless Otherwise Noted)  
Ta=25  
Ta=25  
Fig.2  
Relative Luminous Intensity vs.Forward Current  
Fig.1 Forward Current vs.Forward Voltage  
50  
40  
30  
20  
IFP=60mA  
IFP=20mA  
IFP=5mA  
10  
0
0
20  
40  
60  
80 100  
Ambient Temperature Ta(  
)  
Ambient Temperature Ta()  
Fig.3 Ambient Temperature vs.Forward Voltage  
Fig.4 Forward Current Derating Curve  
0° 10° 20°  
200  
100  
2
Ta=25℃  
30°  
IFP=20mA  
1
40°  
1.0  
50  
0.5  
0.9  
50°  
30  
20  
0.8  
60°  
0.2  
0.1  
70°  
80°  
90°  
0.7  
10  
1
20  
Ambient Temperature Ta(  
5
10  
50 100  
0.5 0.3 0.1 0.2 0.4 0.6  
-40  
-20  
20 40 60 80 100  
0
)
Ambient Temperature Ta(  
)
Fig.6 Forward Current Derating Curve  
Fig.5 Luminous Intensity vs.Ambient Temperature  
Fig.7 Spatial Distribution  
DRAWING NO. : DS-7B-09-0008  
DATE: 2009-10-31  
PAGE  
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SURFACE MOUNT DEVICE LED  
REV: A / 1  
Part No. : L-T650HECT  
Bin Code List  
Luminous Intensity(IV), Unit:mcd@20mA  
Forward Voltage(VF), Unit:V@20mA  
Bin Code  
P16  
Min  
280  
350  
430  
530  
Max  
350  
430  
530  
650  
Bin Code  
Min  
1.9  
2.0  
2.1  
2.2  
2.3  
Max  
4
5
6
7
8
2.0  
2.1  
2.2  
2.3  
2.4  
P17  
P18  
P19  
Tolerance of each bin are±10%  
Tolerance of each bin are±0.1Volt  
Dominant Wavelength (Hue),Unit: nm@20mA  
Bin Code  
OC1  
Min  
619  
624  
Max  
624  
629  
OC2  
Tolerance of each bin are±1nm  
DRAWING NO. : DS-7B-09-0008  
DATE: 2009-10-31  
PAGE  
6 of 15  
PARA-FOR-068  
Release by  
PARALIGHT DCC  
SURFACE MOUNT DEVICE LED  
REV: A / 1  
Part No. : L-T650HECT  
Label Explanation  
CUS. PART NO: To be denominated.  
CUSTOMER: To be denominated.  
PART NO: Refer to P15  
P19--- Luminous Intensity Code  
4--- Forward Voltage Code  
OC1--- Dominant Wavelength  
LOT NO:  
E L S 8 8 0001  
A
B
C
D
E
F
A---E: For series number  
B---L: Local F: Foreign  
C---S: PLCC SMD  
D---Year  
E---Month  
F---SPEC.  
PACKING QUANTITY OF BAG :  
2000pcs max for T670 series  
2000pcs max for T650 series  
2000pcs max for S020 series  
DATE CODE2008 01 10  
G
H
I
G--- Year  
H--- Month  
I --- Day  
DRAWING NO. : DS-7B-09-0008  
DATE: 2009-10-31  
PAGE  
7 of 15  
PARA-FOR-068  
R
e
a
s
y
Release by  
PARALIGHT DCC  
SURFACE MOUNT DEVICE LED  
REV: A / 1  
Part No. : L-T650HECT  
Reel Dimensions  
Notes:  
1. Taping Quantity : 2000pcs for standard  
2. The tolerances unless noted is±0.1mm, Angle±0.5°, Unit: mm.  
Suggest Soldering Pad Dimensions  
1.12  
1.34  
DRAWING NO. : DS-7B-09-0008  
DATE: 2009-10-31  
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SURFACE MOUNT DEVICE LED  
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Part No. : L-T650HECT  
Package Dimensions Of Tape And Reel  
User Feed Direction  
4.00± 0.10  
(.157± .004)  
2.00± 0.05  
(.079± .002)  
4.00± 0.10  
(.157± .004)  
*0.254± 0.020  
(.0100± .0008)  
*1.73± 0.10  
(.068± .004)  
Notes: All dimensions are in millimeters.  
Packaging Of Electronic Components On Continuous Tapes  
DRAWING NO. : DS-7B-09-0008  
DATE: 2009-10-31  
PAGE  
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SURFACE MOUNT DEVICE LED  
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Part No. : L-T650HECT  
Moisture Resistant Packaging  
Label  
Reel  
Label  
Desiccant  
Aluminum moistue-proof bag  
5
5
2
Label  
Box  
435  
Carton  
Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm.  
Cleaning  
If cleaning is required , use the following solutions for less than 1 minute and less than 40.  
Appropriate chemicals: isopropyl alcohol. (When using other solvents, it should be confirmed  
beforehand whether the solvents will dissolve the package and the resin or not.)  
Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as  
ultrasonic power and the assembled condition. Before cleaning, a pre-test should be  
confirm whether any damage to the LEDS will occur.  
DRAWING NO. : DS-7B-09-0008  
DATE: 2009-10-31  
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SURFACE MOUNT DEVICE LED  
Part No. : L-T650HECT  
REV: A / 1  
Suggest Sn/Pb IR Reflow Soldering Profile Condition:  
Suggest Pb-Free IR Reflow Soldering Profile Condition:  
DRAWING NO. : DS-7B-09-0008  
DATE: 2009-10-31  
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Part No. : L-T650HECT  
CAUTIONS  
1. Static Electricity:  
* Static electricity or surge voltage damages the LEDs.  
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.  
* All devices, equipment and machinery must be properly grounded.  
It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs.  
* When inspecting the final products in which LEDs were assembled, it is recommended to check  
whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged  
LEDs by a light-on test or a VF test at a lower current (blew 1mA is recommended).  
* Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases,  
the forward voltage becomes lower, or the LEDs do not light at the low current.  
Criteria: (VF>2.0V,at IF=0.5m A )  
2. Storage :  
* Before opening the package :  
The LEDs should be kept at 30°C or less and 85%RH or less. When storing the LEDs, moisture  
proof packaging with absorbent material (silica gel) is recommended.  
* After opening the package :  
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within  
168 hours (7 days) after opening the package. If unused LEDs remain, they should be stored in  
moisture proof packages, such as sealed containers with packages of moisture absorbent material  
(silica gel). It is also recommended to return the LEDs to the original moisture poof bag and to  
reseal the moisture proof bag again.  
If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the  
storage time, baking treatment should e performed using the following conditions.  
Baking treatment: more than 24hours at 65±5.  
* Please avoid rapid transitions in ambient temperature in high humidity environments where  
condensation may occur.  
3. Soldering:  
Do not apply any stress to the LED lens during soldering while the LED is at high temperature.  
Recommended soldering condition.  
* Reflow Soldering :  
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.  
* Soldering Iron : (Not recommended)  
Temperature350°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron :  
20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering.  
DRAWING NO. : DS-7B-09-0008  
DATE: 2009-10-31  
PAGE  
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Part No. : L-T650HECT  
4. Lead-Free Soldering  
For Reflow Soldering :  
1 Pre-Heat Temp: 150-180 ,120sec.Max.  
2 Soldering Temp: Temperature Of Soldering Pot Over 240 ,40sec.Max.  
6 ℃,  
3 Peak Temperature: 2 0  
10sec.  
4 Reflow Repetition: 2 Times Max.  
5 Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu  
For Soldering Iron (Not Recommended) :  
1 Iron Tip Temp: 350 Max.  
2 Soldering Iron: 30w Max.  
3 Soldering Time: 3 Sec. Max. One Time.  
5. Drive Method  
Circuit model A  
Circuit model B  
(A)Recommended circuit.  
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.  
6. Reliability  
1Criteria For Judging The Damage  
Criteria for Judgement  
MIN. Max.  
Item  
Symbol  
Test Conditions  
Forward Voltage  
Reverse Current  
VF  
IR  
IF=20mA  
VR=5V  
-
U.S.L.*)×1.1  
U.S.L.*)×2.0  
-
-
Luminous Intensity  
IV  
IF=20mA  
L.S.L**)×0.7  
*)U.S.L.: Upper Standard Level  
**) L.S.L: Lower Standard Level  
DRAWING NO. : DS-7B-09-0008  
DATE: 2009-10-31  
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2Test Items And Results  
Number  
of  
Damage  
d
Reference  
Test Item  
Test Condition  
Standard  
Note  
Tsld=260,10sec.  
(Pre treatment 30  
,70%,168hrs)  
Resistance to Soldering Heat  
(Reflow Soldering)  
JEITA  
ED-4701300 301  
2times  
0/50  
0/50  
JEITA  
ED-4701300 303  
Tsld=215,3sec.  
(Lead Solder)  
1time  
over 95%  
Solder ability (Reflow Soldering)  
Thermal Shock  
JEITA  
ED-4701300 307  
0~ 100℃  
15sec. 15sec.  
20cycles 0/50  
-40~ 25~100~25℃  
30min. 5min. 30min.  
5min.  
JEITA  
ED-4701100 105  
100cycle  
Temperature Cycle  
0/50  
s
JEITA  
ED-4701200 203  
25~ 65~-10℃  
90%RH 24hrs./1cycle  
Moisture Resistance Cyclic  
High Temperature Storage  
10cycles 0/50  
1000hrs. 0/50  
JEITA  
ED-4701200-  
201  
Ta=100℃  
JEITA  
ED-4701100 103  
Temperature Humidity Storage  
Low Temperature Storage  
Ta=60,RH=90%  
Ta=-40℃  
0/50  
1000hrs.  
1000hrs.  
1000hrs.  
JEITA  
ED-4701200 202  
0/50  
0/50  
Steady State Operating Life  
Condition1  
Ta=25,IF=20mA  
Steady State Operating Life  
of High Humidity Heat  
500hrs.  
Ta=60,RH=90%,IF=15mA  
0/50  
7.Others:  
The appearance and specifications of the product may be modified for improvement without notice.  
DRAWING NO. : DS-7B-09-0008  
DATE: 2009-10-31  
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Part No. : L-T650HECT  
XXXX : Special specification for  
PART NO. SYSTEM :  
L – T 65 0 X X T - X X X X  
customer  
T : Taping for 7 inch reel  
TC : Taping for 13 inch reel  
Lens color  
C : Water Clear  
W : White Diffused  
T : Color Transparent  
D : Color Diffused  
KY : 9mil AlInGap 590nm Super Yellow  
KR : 9mil AlInGap 630 nm Super Red  
TE : 14mil AlInGap 624 nm Super Red  
HE: 10mil Phoenix N-Series AlInGap  
624 nm middle Red  
TY: 14mil AlInGap590 nm Super Yellow  
HY: 10mil Phoenix N-Series AlInGap590  
nm middle Yellow  
LB : InGaN ITO rough 470nm Blue  
LG : InGaN ITO rough520nm Green  
W : InGaN + YAG White color  
……  
0 : Single chip  
1/2 : Super thin single chip  
5/6 : Dual chip  
F : Three chip(Full color)  
650 :  
670 :  
020 :  
3020 1.3T TYPE  
3528 1.9T TYPE  
3812 0.6T TYPE  
C : PCB Top View Type  
T :PLCC Top View Type  
S : Side View Type  
DRAWING NO. : DS-7B-09-0008  
DATE: 2009-10-31  
PAGE 15 of 15  
PARA-FOR-068  

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