L-T670HYCT [PARALIGHT]
SURFACE MOUNT DEVICE LED;
| 型号： | L-T670HYCT |
| 厂家： | 
PARA LIGHT ELECTRONICS CO., LTD. |
| 描述： | SURFACE MOUNT DEVICE LED |
| 文件： | 总15页 (文件大小：722K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PARA LIGHT ELECTRONICS CO., LTD.
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan
Tel: 886-2-2225-3733
E-mail: para@para.com.tw
Fax: 886-2-2225-4800
http://www.para.com.tw
DATA SHEET
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PART NO.: L-T670HYCT
REV: A / 0
CUSTOMER’S APPROVAL : _______________
DCC : ____________
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PARA-FOR-065
SURFACE MOUNT DEVICE LED
Part No. : L-T670HYCT
REV: A / 0
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Features
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Top view, Wide view angle, Yellow color PLCC 2 package SMD LED .
EIA STD package, packing in 8mm tape on 7" diameter reels (ANSI/EIA-481-B-2001).
Compatible with automatic Pick & Place equipment.
Compatible with IR Reflow soldering and TTW soldering.
Pb free product and acceptable lead-free process!
Meet RoHS Green Product.
ò
Application
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Backlighting ( Switches, keys, displays, illuminated advertising)
Emergency lighting / Signal and symbol luminaries.
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Package Outline Dimensions
TOP VIEW
SIDE VIEW
3.50
0.15
c 0.80
2.40
3.20
-
+ POLARITY
BACK VIEW
FRONT VIEW
0.75
0.75
Notes:
1. All dimensions are in millimeters.
$
2. Tolerance is
0.10mm (.004") unless otherwise noted.
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ò CHIP MATERIALS
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Dice Material : AlInGaP
Light Color : Yellow
Lens Color : Water Clear
ò Absolute Maximum Ratings(Ta=25R)
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Symbol
PD
Parameter
Power Dissipation
Rating
75
Unit
mW
Peak Forward Current
IPF
100
mA
(1/10 Duty Cycle, 0.1ms Pulse Width)
Continuous Forward Current
Reverse Voltage
IF
20
5
mA
V
VR
ESD
Topr
Tstg
Electrostatic Discharge Threshold (HBM)Note A
2000
V
R
R
Operating Temperature Range
-40 ~ + 85
-40 ~ + 85
Reflow Soldering:260
Storage Temperature Range
R
(for 10seconds)
Tsld
Soldering Temperature (One times MAX.)
R
Hand Soldering:350
(for 3 seconds)
Note A :
HBM : Human Body Model. Seller gives no other assurances regarding the ability of to
withstand ESD.
ò Electro-Optical Characteristics (Ta=25R)
Parameter
Luminous Intensity
Viewing Angle
Symbol
IV
E
Min.
300
Typ.
500
120
590
Max.
Unit
mcd
Deg
nm
Test Condition
IF=20mA
2
1/2
Dominant Wavelength
Spectrum Radiation
Bandwidth
a
IF=20mA
IF=20mA
D
a
15
nm
V
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Forward Voltage
Reverse Current
VF
IR
2.0
2.4
10
IF = 20mA
VR = 5V
I
A
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Notes:
1. Luminous intensity is measured with a light sensor and filter combination that
proximities the CIE eye-response curve.
E
2.
1/2 is the off-axis angle at which the luminous intensity is half the axial luminous
intensity.
3. Caution in ESD :
Static Electricity and surge damages the LED. It is recommended use a wrist band or
anti-electrostatic glove when handling the LED. All devices, equipment and machinery
must be properly grounded.
4. Major standard testing equipment by “Instrument System” Model : CAS140B Compact
Array Spectrometer and “KEITHLEY” Source Meter Model : 2400.
ò Typical Electro-Optical Characteristics Curves
Fig.1 Relative Intensity vs. Wavelength
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ò Typical Electro-Optical Characteristics Curves
(25R Ambient Temperature Unless Otherwise Noted)
Ta=25
Ta=25
Fig.2
Relative Luminous Intensityvs.ForwardCurrent
Fig.1ForwardCurrent vs.Forward Voltage
50
40
30
20
IFP=60mA
IFP=20mA
IFP=5mA
10
0
0
20 40 60 80 100
Ambient Temperature Ta(
)
Ambient Temperature Ta(
)
Fig.3Ambient Temperature vs.ForwardVoltage
Fig.4 Forward Current Derating Curve
0
10 20
200
100
2
Ta=25
30
40
IFP=20mA
1
1.0
0.9
50
0.5
50
60
30
20
0.8
0.2
0.1
70
80
90
0.7
10
1
20
5
10
50 100
0.5 0.3 0.1 0.2 0.4 0.6
-40
-20
0
20 40 60 80 100
Ambient Temperature Ta(
)
Ambient TemperatureTa(
)
Fig.6Forward Current Derating Curve
Fig.5 Luminous Intensityvs.Ambient Temperature
Fig.7Spatial Distribution
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SURFACE MOUNT DEVICE LED
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ò
Bin Code List
Luminous Intensity(IV), Unit:mcd@20mA
Forward Voltage(VF), Unit:V@20mA
Bin Code
P16
Min
280
350
430
530
Max
350
430
530
650
Bin Code
Min
1.9
2.0
2.1
2.2
Max
2.0
2.1
2.2
2.3
4
5
6
7
P17
P18
P19
Tolerance of each bin areꢁꢂꢃ
%
Tolerance of each bin areꢁ0.1Volt
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀDominant Wavelength (Hue),Unit: nm@20mA
Bin Code
YA
Min
Max
590
593
595
587
YB
590
593
YC0
Tolerance of each bin are
ꢁ1nm
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ò Label Explanation
CUS. PART NO: To be denominated.
CUSTOMER: To be denominated.
PART NO: Refer to P15
IV--- Luminous Intensity Code
VF--- Forward Voltage Code
WD--- Dominant Wavelength
LOT NO:
E L P 7 8 0001
A
B
C
D
E
F
A---E: For series number
B---L: Local F: Foreign
C---P:PLCC SMD
D---Year
E---Month
F---SPEC.
PACKING QUANTITY OF BAG :
2000pcs max for T670 series
2000pcs max for T650 series
2000pcs max for S020 series
DATE CODEꢄ2007 08 23
G
H
I
G--- Year
H--- Month
I --- Day
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ò Reel Dimensions
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Notes:
1. Taping Quantity : 2000pcs max
2. The tolerances unless noted is
ꢁ
0.1mm, Angleꢁ0.5ꢅ, Unit: mm.
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ò Suggest Soldering Pad Dimensions
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1. 6
1. 8
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ò Package Dimensions Of Tape And Reel
4.00± 0. 10
(. 157± .004)
2.00± 0. 05
(. 079± .002)
*0.23± 0.03
(.009± .001)
4.00± 0.10
(.157±. 004)
*2. 03+0. 10
(.080+.004)
Notes: All dimensions are in millimeters.
ò Packaging Of Electronic Components On Continuous Tapes
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Moisture Resistant Packaging
Label
Reel
Label
Desiccant
Aluminum moistue-proof bag
5
5
2
Label
Box
435
Carton
Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm.
ò Cleaning
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If cleaning is required , use the following solutions for less than 1 minute and less than 40?.
Appropriate chemicals: isopropyl alcohol. (When using other solvents, it should be confirmed
beforehand whether the solvents will dissolve the package and the resin or not.)
Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as
ultrasonic power and the assembled condition. Before cleaning, a pre-test should be
confirm whether any damage to the LEDS will occur.
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Suggest Sn/Pb IR Reflow Soldering Profile Condition:
ꢀꢀꢀꢀ Suggest Pb-Free IR Reflow Soldering Profile Condition:
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ò CAUTIONS
1. Static Electricity:
* Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
* All devices, equipment and machinery must be properly grounded.
It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs.
* When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged
LEDs by a light-on test or a VF test at a lower current (blew 1mA is recommended).
* Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases,
the forward voltage becomes lower, or the LEDs do not light at the low current.
Criteria: (VF>2.0V,at IF=0.5m A )
2. Storage :
* Before opening the package :
The LEDs should be kept at 30°C or less and 85%RH or less. When storing the LEDs, moisture
proof packaging with absorbent material (silica gel) is recommended.
* After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within
168 hours (7 days) after opening the package. If unused LEDs remain, they should be stored in
moisture proof packages, such as sealed containers with packages of moisture absorbent material
(silica gel). It is also recommended to return the LEDs to the original moisture poof bag and to
reseal the moisture proof bag again.
If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should e performed using the following conditions.
Baking treatment: more than 24hours at 65±5R.
* Please avoid rapid transitions in ambient temperature in high humidity environments where
condensation may occur.
3. Soldering:
Do not apply any stress to the LED lens during soldering while the LED is at high temperature.
Recommended soldering condition.
* Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
* Soldering Iron : (Not recommended)
Temperature350°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron :
20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering.
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4. Lead-Free Soldering
For Reflow Soldering :
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1 Pre-Heat Temp: 150-180R,120sec.Max.
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2 Soldering Temp: Temperature Of Soldering Pot Over 240R,40sec.Max.
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3 Peak Temperature: 260R 10sec.
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4 Reflow Repetition: 2 Times Max.
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5 Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu
For Soldering Iron (Not Recommended) :
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1 Iron Tip Temp: 350R Max.
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2 Soldering Iron: 30w Max.
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3 Soldering Time: 3 Sec. Max. One Time.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
6. Reliability
Criteria For Judging The Damage
1
3
Criteria for Judgement
MIN. Max.
U.S.L.*)
Item
Symbol
Test Conditions
Forward Voltage
Reverse Current
VF
IR
IF=20mA
VR=5V
-
ꢆ
1.1
2.0
-
ꢆ
L.S.L**) 0.7
U.S.L.*)
ꢆ
Luminous Intensity
IV
IF=20mA
-
ꢇꢈU.S.L.: Upper Standard Level
**) L.S.L: Lower Standard Level
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Test Items And Results
Test Item
Number
of
Damaged
Reference
Standard
Test Condition
Note
Tsld=260
(Pre treatment 30
,70%,168hrs)
Tsld=215 ,3sec.
(Lead Solder)
-40 ~ 100
30min. 30min.
~ 25 ~100
?
,10sec.
Resistance to Soldering Heat
(Reflow Soldering)
JEITA
ED-4701300 301
2times
0/50
?
Solder
ability
(Reflow
JEITA
ED-4701300 303
?
1time
over 95%
0/50
0/50
0/50
Soldering)
JEITA
ED-4701300 307
?
?
Thermal Shock
100cycles
100cycles
JEITA
-40
?
?
?
~25
?
Temperature Cycle
ED-4701100 105 30min. 5min. 30min. 5min
JEITA
ED-4701200-
201
High Temperature Storage
Ta=100
Ta=60 ,RH=90%
Ta=-40
Ta=25 ,IF=20mA
Ta=60 ,RH=90%,IF=15mA
?
1000hrs.
0/50
0/50
JEITA
ED-4701100 103
Temperature Humidity Storage
Low Temperature Storage
?
1000hrs.
1000hrs.
1000hrs.
JEITA
ED-4701200 202
?
0/50
0/50
Steady State Operating Life
Condition
?
Steady State Operating Life
of High Humidity Heat
7.Others:
500hrs.
?
0/50
The appearance and specifications of the product may be modified for improvement without notice.
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XXXX : Special specification for
ò PART NO. SYSTEM :
customer
L – T 67 0 X X CT - X X X X
T : Taping for 7 inch reel
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TC : Taping for 13 inch reel
Lens color
C : Water Clear
W : White Diffused
T : Color Transparent
D : Color Diffused
KY : 9mil AlInGap 590nm Super Yellow
KR : 9mil AlInGap 630 nm Super Red
TE : 14mil AlInGap 624 nm Super Red
HEꢄ10mil AlInGap 624 nm Super Red
TY: 14mil AlInGap590 nm Super Yellow
HY: 14mil AlInGap590 nm Super Yellow
LB : InGaN ITO rough 470nm Blue
LG : InGaN ITO rough520nm Green
W : InGaN + YAG White color
0 : Single chip
1/2 : Super thin single chip
5/6 : Dual chip
F : Three chip(Full color)
650 :
670 :
020 :
3020 1.3T TYPE
3528 1.9T TYPE
3812 0.6T TYPE
C : PCB Top View Type
T :PLCC Top View Type
S : Side View Type
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