AN48836B-NL [PANASONIC]
Sensor/Transducer, Open-drain, BICMOS, 5 Pin, Plastic/epoxy;
| 型号： | AN48836B-NL |
| 厂家： | 
PANASONIC |
| 描述： | Sensor/Transducer, Open-drain, BICMOS, 5 Pin, Plastic/epoxy 信息通信管理 |
| 文件： | 总29页 (文件大小：770K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TO PIDSA HQ
DELIVERY SPECIFICATIONS
Orderer (Customer) Part Number
Panasonic Global Part Number
AN48836B-NL
1203003
Vendor Issue Number
Confirmation of Security Control
We confirm and certify that the products of these specifications shall not be supplied so as to be used for Military Purpose (defined herein
below). "Military Purpose" in this statement means the design, development, manufacture, storage or use of any weapons, including
without limitation nuclear weapons, biological weapons, chemical weapons and missiles.
Receipt Date:
/
/
"Changes in the description of Delivery Specifications" and "changes that affect performance, quality or environment" are implemented
according to advance consultation.
3.12
2012.
SMART Puniness distraction
S423141-03#01
Issuance Date:
/
/
Industrial Devices Company, Panasonic Corporation
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or
provided to non-residents, the laws and regulations of the exporting country, especially, those with
regard to security export control, must be observed.
(2)The technical information described in this book is intended only to show the main characteristics
and application circuit examples of the products. No license is granted in and to any intellectual
property right or other right owned by Panasonic Corporation or any other company. Therefore, no
responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information de-scribed in this book.
(3)The products described in this book are intended to be used for general applications (such as
office equipment, communications equipment, measuring instruments and household appliances), or for
specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
・Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling
equipment, combustion equipment, life support systems and safety devices) in which exceptional quality
and reliability are required, or if the failure or malfunction of the products may directly jeopardize
life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a
result of or in connection with your using the products described in this book for any special
application, unless our company agrees to your using the products in this book for any special
application.
(4)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed
operating conditions (operating power supply voltage and operating environment etc.). Especially,
please be careful not to exceed the range of absolute maximum rating on the transient state, such as
power-on, power-off and mode-switching. Other-wise, we will not be liable for any defect which may
arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence
of break down and failure mode, possible to occur to semiconductor products. Measures on the systems
such as redundant design, arresting the spread of fire or preventing glitch are recommended in order
to prevent physical injury, fire, social damages, for example, by using the products.
(5)Comply with the instructions for use in order to prevent breakdown and characteristics change due
to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting
or at customer's process. When using products for which damp-proof packing is required, satisfy the
conditions, such as shelf life and the elapsed time since first opening the packages.
(6)This book may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of our company.
Reprint from WARNING LABEL STANDARDS SC3-11-00007
This delivery specifications may include old company names such as “Matsushita Electronics Corporation” or
.“”Semiconductor Company, Panasonic
“Semiconductor Company, Matsushita Electric Industrial Co., Ltd
Corporation ” Please interpret these old company names as Industrial Devices Company, Panasonic
Corporation”
as of January 1, 2012.
Total Pages
14
Page
1
Regulations
No.
IC3F5610
Product Standards
Part No.
AN48836B
Package Code No.
SMINI-5DE
Semiconductor Company
Panasonic Corporation
Established by
Applied by
Checked by
Prepared by
M.Hiramatsu
N.Fujita
T.Yamasaki
2011-03-11
Established
Revised
Semiconductor Company, Panasonic Corporation
AN48836B
Product Standards
Total Pages
Page
14
2
Contents
Overview …………………………………………………………………………………………………………….
Features ……………………………………………………………………………………………………………..
Applications …………………………………………………………………………………………………………
Package …………………………………………………………………………………………………………….
Type …………………………………...…………………………………………………………………………….
Block Diagram ………………...…………………………………………………………………………………….
Pin Descriptions …………………………………………………………………………………………………….
Absolute Maximum Ratings ……………………………………………………………………………………….
Operating Supply Voltage Range ……………..………………………………………………………………….
Allowable Voltage Range………………………..………………………………………………………………….
Electrical Characteristics ………………………………………………………………………………………….
Electrical Characteristics (Reference values for design) ………...…………………………………………...
Test Circuit Diagram ……………………………………………………………………………………………….
3
3
3
3
3
4
5
6
6
6
7
8
9
Technical Data ………………………………………….…………………………………………………………… 11
Usage Notes ……………………………………….………………………………………………………………. 12
Caution on Use of Hall ICs ……………………….………………………………………………………………. 13
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AN48836B
Product Standards
Total Pages
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3
AN48836B
1.8 V Supply voltage, Low current consumption, high sensitivity CMOS Hall IC
Operates in both magnetic field directions
Overview
AN48836B is a Hall IC (a magnetic sensor) for 1.8 V supply voltage by using Bi-CMOS technology.
In this Hall IC, a Hall element, a offset cancel circuit, an amplifier circuit, a sample and hold circuit, a Schmidt circuit, and output
stage FET are integrated on a single chip housed in a small package by IC technique.
Features
y High sensitivity (6 mT max) due to offset cancel circuit and a new sample and hold circuit.
y Small current by using intermittent action. (average supply current : 3 μA typ. sampling cycle : 42 ms typ at VCC = 1.8 V)
y Small package (SMD)
y CMOS inverter output (no pull-up resistance)
Applications
y Magneto-electric Conversion Switch.
Package
y 5 pin Plastic Small Surface Mount Package (SMINI Type).
Type
y Bi-CMOS IC.
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AN48836B
Product Standards
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4
Block Diagram
N.C.
3
N.C.
1
VCC
4
CLK
ON / OFF control
Sample
and
hold
5
OUT
Hall
element
Switch
Amplifier
GND
2
Note) This block diagram is for explaining functions. Part of the block diagram may be omitted, or it may be simplified.
2011-03-11
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Revised
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AN48836B
Product Standards
Total Pages
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5
Pin Descriptions
Pin No.
Pin name
N.C.
Type
—
Description
1
2
3
4
5
N.C.
GND
N.C
Ground
—
Ground pin
N.C.
VCC
OUT
Power supply Supply pin
Output Output pin
2011-03-11
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Revised
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AN48836B
Product Standards
Total Pages
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6
Absolute Maximum Ratings
Note) Absolute maximum ratings are limit values which do not result in damages to this IC, and IC operation is not guaranteed at these limit values.
A No.
Parameter
Symbol
VCC
ICC
Rating
Unit
V
Notes
*1
1
2
3
4
5
Supply voltage
Supply current
4.0
5
mA
mW
°C
⎯
Power dissipation
PD
48
*2
Operating ambient temperature
Storage temperature
Topr
−40 to +85
−55 to +125
*3
Tstg
°C
*3
Notes)*1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
*2 : The power dissipation shown is the value at Ta = 85°C for the independent (unmounted) IC package without a heat sink.
When using this IC, refer to the PD-Ta diagram of the package standard and design the heat radiation with sufficient margin so that the
allowable value might not be exceeded based on the conditions of power supply voltage, load, and ambient temperature.
*3 : Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25°C.
Operating Supply Voltage Range
Parameter
Supply voltage range
Symbol
Range
Unit
Notes
VCC
1.65 to 3.6
V
*1
Note) *1: The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
Allowable Voltage Range
Notes) y Allowable current and voltage ranges are limit ranges which do not result in damages to this IC, and IC operation is not guaranteed within
these limit ranges.
y Voltage values, unless otherwise specified, are with respect to GND.
y Do not apply external currents or voltages to any pin not specifically mentioned.
Pin No. Pin name
Range
Unit Note
2
5
GND
OUT
0
V
V
—
*1
–0.3 to (VCC + 0.3)
Note) *1 : (VCC + 0.3) V ≤ 4.0 V.
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Revised
Semiconductor Company, Panasonic Corporation
AN48836B
Product Standards
Total Pages
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7
Electrical Characteristics at VCC = 1.8 V
Note) Ta = 25°C±2°C unless otherwise specified.
Limits
Min Typ Max
B
Test
Circuit
notes
Parameter
No.
Symbol
Conditions
Unit
Operating magnetic flux density
H → L S
—
—
—
—
1
BHLS
BHLN
BLHS
BLHN
1
1
1
1
—
4.0
6.0
—
—
mT
mT
mT
*1
*1
*1
*1
Operating magnetic flux density
H → L N
2
–6.0 –4.0
Operating magnetic flux density
L → H S
3
0.5
—
3.0
Operating magnetic flux density
L → H N
4
–3.0 –0.5 mT
—
—
5
6
Output voltage Low
Output voltage High
VOL
VOH
2
3
IO = 2 mA, B = –6.0 mT /6.0 mT
IO = –2 mA, B = –0.5 mT /0.5 mT
—
0.1
1.7
0.3
—
V
V
1.5
ICC
(AVE)
—
7
Average supply current
4
—
3
5
μA
*2
2011-03-11
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Revised
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AN48836B
Product Standards
Total Pages
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8
Electrical Characteristics (Reference values for design) at VCC = 1.8 V
Note) Ta = 25°C±2°C unless otherwise specified.
The characteristics listed below are reference values derived from the design of the IC and are not guaranteed by inspection.
If a problem does occur related to these characteristics, we will respond in good faith to user concerns.
Reference Values
B
No.
Test
Circuit
Notes
Parameter
Symbol
Conditions
Unit
Min Typ Max
8
9
Hysteresis width (S)
Hysteresis width (N)
BWS
BWN
1
1
4
—
—
—
—
—
—
1.0
1.0
—
—
—
mT
mT
—
—
*3
10 Active supply current
I
CC(ON)
4.5 mA
11 Standby supply current
12 Active time
ICC(OFF)
t(ON)
4
5
5
5
—
—
—
—
—
5
—
21
21
42
4
μA
μs
*3
*3
*3
*3
35
35
—
13 Standby time
t(OFF)
t(DEC)
5
ms
ms
14 Interval of decision
—
Notes)*1: Symbol BHLS shows the operating magnetic flux density at which output level is changed from high to low at the South pole magnetic field
environment, and Symbol BLHS shows the operating magnetic flux density at which output level is changed from low to high at the South
pole magnetic field environment. Symbol BHLN shows the operating magnetic flux density at which output level is changed from high to
low at the North pole magnetic field environment, and Symbol BLHN shows the operating magnetic flux density at which output level is
changed from low to high at the North pole magnetic field environment.
*2: ICC(AVE) = {ICC(ON) × t(ON) + ICC(OFF) × t(OFF)} / {t(ON) + t(OFF)}.
*3: Power Supply Timing Chart
Normal operation starts approx. 42 ms after power supply is turned on.
It is unsure about the first detection is the South pole or the North pole.
ICC
t(ON) = 21 μs
ICC(ON)
N pole
S pole
N pole
detection
detection
detection
t(OFF) = 21 ms
ICC(OFF)
t
t(DEC) = 42 ms
2011-03-11
Established
Revised
Semiconductor Company, Panasonic Corporation
AN48836B
Product Standards
Total Pages
Page
14
9
Test Circuit Diagram
1. Test Circuit 1 BHLS, BLHS, BHLN, BLHN
Change the applied magnetic flux density and measure the magnetic flux density when the output level changes to Low from High,
or to High from Low.
Note) Operating flux density "BHLS", "BLHS", "BHLN", "BLHN" and Hysteresis width, "BWS","BWN" are defined as shown in Figure 2
VCC = 1.8 V
B = –6.0 mT to 6.0 mT
VCC
OUT
4
2
GND
5
V
Output voltage
S
BLHN BLHS
BWN
BWS
BHLN
BHLS
N
Figure1. Direction of applied magnetic field
Applied magnetic flux density B
Figure2. Operating magnetic flux density
2011-03-11
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Revised
Semiconductor Company, Panasonic Corporation
AN48836B
Product Standards
Total Pages
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14
10
Test Circuit Diagram (continued)
2. Test Circuit 2 VOL
3. Test Circuit 3 VOH
VCC = 1.8 V
VCC = 1.8 V
B = 6.0 mT, –6.0 mT
B = –0.5 mT, 0.5 mT
4
VCC
OUT
4
VCC
OUT
2
GND
2
GND
IO = 2 mA
IO = –2 mA
5
5
V
V
VOH
VOL
5. Test Circuit 5 t(ON), t(OFF), t(DEC)
4. Test Circuit 4 ICC(ON), ICC(OFF), ICC(AVE)
VCC = 1.8 V
VCC = 1.8 V
A
ICC
VCC
OUT
4
5
VCC
OUT
4
5
Measure "t".
f
2
GND
2
GND
Open
Open
2011-03-11
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Revised
Semiconductor Company, Panasonic Corporation
AN48836B
Product Standards
Total Pages
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14
11
Technical Data
y I/O block circuit diagrams and pin function descriptions
Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed.
Pin
No.
Waveform
and voltage
Internal circuit
Impedance
Description
DC Voltage
(0 V)
Ground pin
[GND]
2
—
0 Ω
4
DC Voltage
(0 V to 3.6 V)
Supply pin
[VCC]
4
Hi-Z
4
5
Pulse Output
(0 V to 3.6 V)
Positive output pin
[OUT]
5
Hi-Z
2011-03-11
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Revised
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AN48836B
Product Standards
Total Pages
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14
12
Usage Notes
y Special attention and precaution in using
1. This IC is intended to be used for general electronic equipment.
Consult our sales staff in advance for information on the following applications:
x Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may
directly jeopardize life or harm the human body.
x Any applications other than the standard applications intended.
(1) Space appliance (such as artificial satellite, and rocket)
(2) Traffic control equipment (such as for automobile, airplane, train, and ship)
(3) Medical equipment for life support
(4) Submarine transponder
(5) Control equipment for power plant
(6) Disaster prevention and security device
(7) Weapon
(8) Others : Applications of which reliability equivalent to (1) to (7) is required
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the IC described in this book for any special application, unless our company agrees to your using the IC in this book
for any special application.
2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might
smoke or ignite.
3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In
addition, refer to the Pin Description for the pin configuration.
4. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solder-
bridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because
the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during
transportation.
5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin-
VCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short) .
And, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and
smoke emission will depend on the current capability of the power supply.
6. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
7. When using the LSI for new models, verify the safety including the long-term reliability for each product.
8. When the application system is designed by using this LSI, be sure to confirm notes in this book.
Be sure to read the notes to descriptions and the usage notes in the book.
9. This IC is not applicable to automotive electronic parts.
2011-03-11
Established
Revised
Semiconductor Company, Panasonic Corporation
AN48836B
Product Standards
Total Pages
Page
14
13
Caution on Use of Hall ICs
As the Hall-IC often detects movement, the position of the Hall-IC may be changed, and there is the risk of a change in detection
level, if exposed to shock or vibration over a long period. Secure the IC by applying adhesive to the package or placing in a
dedicated case.
1.When using an adhesive
Some kinds of adhesive generate gas (such as chrole gas) during curing. This corrosive gas corrodes the aluminum on the surface
of the Hall-IC, and may cause a functional defect of disconnection.
If Hall-IC is to be sealed after installation, attention should be given to the adhesive used for Hall-IC installation, as well as for
the adhesive or resin used for peripherals and substrate cleaner.
Please confirm the above matter to those manufacturers before using.
We could not select the specified adhesive, for we find it difficult to guarantee the ingredient of each adhesive.
2.When bending lead wire
Bend the lead wire without stressing the package.
(a)
3 mm
Fixed
Fixed
Fixed
Ｗ
Ｗ
Ｗ
(b)
3 mm
Bending method of lead wire
Bending position of lead wire
3.Power supply line/ Power transmission line
If a power supply line/power transmission line becomes longer, noise and/or oscillation may be found on the line. In this case,
set the capacitor of 0.1 μF to 10 μF near the Hall IC to prevent it.
If a voltage of 5.4 V or more is thought to be applied to the power supply line (reverse electromotive force from coil or the ignition
pulse, etc.), protect it with external components (capacitor, resistor, zener diode, diode, surge absorbing elements, etc.).
4.Mounting the surface mount type (SMINI-5DE package)
When mounted on printed circuit board, the Hall-IC may be highly stressed by the warpage that may occur from the soldering.
This may also cause a change in the operating magnetic flux density and a deterioration of its resistance to moisture.
Observe the recommended conditions since electrical characteristics can easily change due to stress when mounting. Avoid
solding by using soldoring iron or solder flow (dip) method.
2011-03-11
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Revised
Semiconductor Company, Panasonic Corporation
AN48836B
Product Standards
Total Pages
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14
Caution on Use of Hall ICs (continued)
5.Mounting the insertion type (SE-3S package)
If the insertion type Hall-IC is inserted to the bottom of its lead into the printed circuit board, it will be stressed so that reliability
can not be maintained. Set a space of at least 2.0 mm between the package and printed circuit board.
6.VCC and GND
Do not connect VCC and GND pins reversely. Otherwise, the IC will be damaged. If the voltage of GND pin is set higher than
that of the other pins, which is the same configuration as diode forward connection, it is set to ON at current may flow (About
0.7V), resulting in damage to the IC. (This is common to monolithic IC.)
7.Cautions of Hall IC at Power-On
When a Hall IC is turned on, the position of the magnet or looseness may cause the output of a Hall IC to be changed, and a pulse
may be generated.
Therefore, care should be exercised whenever the output state of a Hall IC is critical when the supply power is ON.
8.When Hall-IC is fixed with holder
When a Hall-IC is mounted on the printed circuit board with a holder and the coefficient of expansion of the holder is large, the
lead wire of the Hall-IC will be stretched and it may give a stress to the Hall IC.
If the lead wire is stressed intensely due to the distortion of holder or substrate, the adhesiveness between the package and the lead
wire may be weakened and cause a minute gap resulting in the deterioration of its resistance to moisture.
9. On using flux in soldering
Choose a flux which does not include ingredients from the chloric group. The ingredients of chloric group may enter through the
joint of the lead frame and package resin, causing corrosion and disconnection of the aluminum wiring on the surface of IC chip.
2011-03-11
Established
Revised
Semiconductor Company, Panasonic Corporation
Total pages
6
Page
1
Regulations
No.
SC3S2017
Package Standards
Package Code
SMINI-5DE
Semiconductor Company
Panasonic Corporation
Established by
Applied by
Checked by
Prepared by
H.Shidooka
H.Yoshida
M.Okajima
M.Itoh
-
-
Established
Revised
Semiconductor Company, Panasonic Corporation
Established: 2009-07-30
Revised : 2009-10-16
Package Standards
Total pages
6
Page
2
1. Outline Drawing
Unit:mm
Package Code : SMINI-5DE
2.00±0.10
+0.05
-0.02
5-0.20
+0.05
-0.02
0.13
5
4
2
3
1
(0.65) (0.65)
1.30±0.10
7°
Br / Sb Free
Epoxy Resin
Body Material
Lead Material
:
: Cu Alloy
Lead Finish Method : SnBi Plating
-
-
Established
Revised
Semiconductor Company, Panasonic Corporation
Established: 2009-07-30
Revised : 2009-10-16
Package Standards
Total pages
6
Page
3
2. Package Structure (Technical Report : Reference Value)
Package Code : SMINI-5DE
Chip Material
Si
1
2
3
4
Leadframe material
Inner lead surface
Outer lead surface
Cu alloy
Ag plating
SnBi plating
Resin adhesive method
Adhesive material
Thermo-compression bonding
Au
Method
Material
Method
Material
Method
Material
Chip mount
Wirebond
5
6
7
Transfer molding
Br/Sb Free Epoxy resin
6 mg
Molding
Mass
3
1
6
4
2
5
7
-
-
Established
Revised
Semiconductor Company, Panasonic Corporation
Established: 2009-07-30
Revised : 2009-10-16
Package Standards
Total pages
6
Page
4
3. Mark Layout
Package Code : SMINI-5DE
Product Name
Date Code
-
-
Established
Revised
Semiconductor Company, Panasonic Corporation
Established: 2009-07-30
Revised : 2009-10-16
Package Standards
Total pages
6
Page
5
4. Power Dissipation (Technical Report)
Package Code : SMINI-5DE
0.200
0.150
Without PWB
Rth(j-a) = 833.3 ℃/W
0.120
0.100
0.050
0.000
0
25
50
75
100
125
Ambient Temperature(oC )
-
-
Established
Revised
Semiconductor Company, Panasonic Corporation
Established: 2009-07-30
Revised : 2009-10-16
Package Standards
Total pages
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Page
6
5. Power Dissipation (Supplementary Explanation)
Experiment environment
[
]
Power Dissipation（Technical Report）is a result in the experiment environment of SEMI standard
conformity. （Ambient air temperature (Ta) is 25 degrees C）
Supplementary information of PWB to be used for measurement
[
]
are shown
The supplement of PWB information for Power Dissipation data (Technical Report）
below.
Total Layer
1-layer
Resin Material
FR-4
Indication
Glass-Epoxy
4-layer
4-layer
FR-4
[Notes about Power Dissipation（Thermal Resistance）]
Power Dissipation values（Thermal Resistance）depend on the conditions of the surroundings, such as
specification of PWB and a mounting condition , and a ambient temperature. (Power Dissipation (Thermal
Resistance) is not a fixed value.)
The Power Dissipation value（Technical Report）is the experiment result in specific conditions (evaluation
environment of SEMI standard conformity) ,and keep in mind that Power Dissipation values (Thermal
resistance) depend on circumference conditions and also change.
Definition of each temperature and thermal resistance
[
]
Ta ：Ambient air temperature
※The temperature of the air is defined at the position where the convection,
radiation, etc. don’t affect the temperature value, and it’s separated from the heating
elements.
Tc ：It’s the temperature near the center of a package surface. The package surface is
defined at the opposite side if the PWB.
Tj ：Semiconductor element surface temperature (Junction temperature.)
Rth(j-c)：The thermal resistance (difference of temperature of per 1 Watts) between a
semiconductor element junction part and the package surface
Rth(c-a)：The thermal resistance (difference of temperature of per 1 Watts) between the
package surface and the ambient air
Rth(j-a)：The thermal resistance (difference of temperature of per 1 Watts) between a
semiconductor element junction part and the ambient air
Ta
[Definition formula]
Tj={Rth(j-c)+Rth(c-a)}×P+Ta
Rth(c-a)
Rth(j-c)
=Rth(j-a)×P+Ta
Rth(j-a)
Tj-Tc
P
Tc
Tj
(℃/W)
(℃/W)
(℃/W)
Rth(j-c) =
Tc-Ta
P
Rth(c-a) =
Rth(j-a) =
Tj-Ta
P
PWB
= Rth(j-c)＋Rth(c-a)
Package
Semiconductor element
Fig1. Definition image
P:power(W)
-
-
Established
Revised
Semiconductor Company, Panasonic Corporation
Established: 2009-07-30
Revised : 2009-10-16
Recommended
Total pages
page
Soldering Conditions
2
1
Product name : AN48836B-NL
Package : SMINI-5DE
１．Recommended Soldering Conditions
In case that the semiconductor packages are mounted on the PCB, the soldering should be
performed under the following conditions.
Reflow soldering
Reflow peak temp. :
max.260 ℃
No． mark
contents
value
150 ℃～180 ℃
60 s～120 s
tp
℃
Tp
260 ℃
255 ℃
Pre-heating temp.
Pre-heating temp. hold time
Rising rate
1
2
3
4
5
6
7
8
T1
ｔ１
a
260
240
220
200
180
160
140
2 ℃/s～5 ℃/s
255 ℃+5 ℃､-0 ℃
10 s±3 s
220 ℃
a
b
Peak temp.
Tp
tp
tw
b
T1
Peak temp. hold time
High temp. region hold time
Down rate
within 60 s (≧220 ℃)
2 ℃/s～5 ℃/s
within 2 times
tw
t1
Number of reflow
-
Time
＊Peak temperature : less than 260 ℃
＊Temperature is measured at package surface point
11-157
No.
2012/3/6
Prepared
Revised
Industrial Devices Company, Panasonic Corporation
Recommended
Total pages
page
Soldering Conditions
2
2
2．Storage environment after dry pack opening
Open dry pack
Soldering
Storage environment kept up to soldering
(at 30 ℃/70 %RH max. , within 365days)
Bake at 125 ℃
with 15 h to 25 h
*Please refer to the following when
doing at the low temperature bake.
When the storage time exceeds
※ Because the taping and the magazine materials are not the heat-resistant materials,
the bake at 125℃ cannot be done.
Therefore, please solder everything or control everything in the rule time.
Please keep them in an equal environment with the moisture-proof packaging or dry box.
(Temperature: room temperature, relative humidity: 30% or less. )
To control storage time, when bake in the taping and the magazine is necessary, it is
necessary for each type to set a bake condition. Please inquire of our company.
☆ AN48836B-NL limitation, low temperature bake condition ： 40 ℃ / 25 %RH or less / 192 h
3．Note
Storage environment conditions: keep the following conditions Ta=5 ℃～30 ℃､RH=30 %～70 %.
Storage period before opening dry pack shall be 1year from a shipping day under Ta=5 ℃～30 ℃､
RH=30 %～70 %. When the storage exceeds, Bake at 125 ℃ with 15 h to 25 h.
Baking cycle should be only one time.
①
②
③
Please be cautious of solderability at baking.
④
⑤
In case that use reflow two times, 2nd reflow must be finished within 365 days.
Remove flux sufficiently from product in the washing process.
( Flux : Chlorineless rosin flux is recommended.)
⑥
In case that use ultrasonic for product washing,
There is the possibility that the resonance may occur due to the frequency and shape of PCB.
It may be affected to the strength of lead. Please be cautious of this matter.
11-157
No.
2012/3/6
Prepared
Revised
Industrial Devices Company, Panasonic Corporation
推奨ランド図
Recommended
Land Pattern
SMINI-5DE
page
Total pages
1
1
(参考ランド寸法/ PWB pad dimensions)
単位 / Unit：mm
１．３０
０．４
０．６５
０．６５
０．４
2009.10.14
Prepared
Revised
Semiconductor Company, Panasonic Corporation
包装仕様
Packing Specifications
Total pages
page
3
1
SMINI-5DE
ｴﾝﾎﾞｽｷｬﾘｱﾃｰﾋﾟﾝｸﾞꢀEmboss carrier taping
1
包装流れ図 Packing flow figure
エンボスキャリアテープ
Emboss carrier tape
トップカバーテープ
Top cover tape
Ｃ３ラベル
C3 label
AN12345A-NB
3000pcs.
(3N)AN12345A-NB 1000
(3N)2 10N112200-NB 108010
AN12345A-NB
AN12345A-NB
USP4B42516 AN12345A-NB
1.23-45
410N112300 2058
12345678 3000 23456789 3000 34567890 3000 45678901 3000
MADE IN JAPAN
307 150000
Panasonic M
工程管理ラベル
Process control label
内装箱
Inner case
外装箱
Outer case
Ｃ３ラベル
C3 label
2009.12.15
Prepared
Revised
Semiconductor Company, Panasonic Corporation
包装仕様
Packing Specifications
Total pages
page
3
2
2 梱包図ꢀꢀPacking ｆｉgure
Ｕｎｉｔ：mm
1)ꢀエンボスキャリアテープ概要と収納方向 ꢀ
Emboss carrier tape and IC package direction of storage
引き出し方向
Direction of unreeling
2)ꢀリール概要ꢀＲｅｅｌ
3) 内装箱寸法 Inner case size
φ13.0
185 typ.
185 typ.
ｴﾝﾎﾞｽｷｬﾘｱﾃｰﾌﾟ
Embossꢀcarrierꢀtape
φ180+0/-3.0
ꢀ(reference)
9.0
欠落部品なし
The lack of the product is not permitted.
4)ꢀ外装箱寸法ꢀOuter case size
C3ラベル貼り付け位置
C3 Label sticks this position
195 typ.
405typ.
梱包数量ꢀPackingꢀquantity
3
IC package quantity
contents
1ꢀ Reel
Reel
3,000ꢀPcs.
15,000ꢀPcs.
90,000ꢀPcs.
Inner case
Outer case
5ꢀ Reelｓ
30 ꢀReelｓ
2009.12.15
Prepared
Revised
Semiconductor Company, Panasonic Corporation
包装仕様
Packing Specifications
Total pages
page
3
3
Ｕｎｉｔ：mm
4
テーピング図ꢀꢀEmbossꢀcarrierꢀtapeꢀdrawing
P0
A0
D0
t1
K
K1
t2
P2
P1
1.
1. キャリアテープ／Carrier tape
2. カバーテープ／Cover tape
項ꢀꢀꢀꢀ目
Item
照合文字
Symbol
寸法
Dimensions
備ꢀꢀꢀꢀꢀ考
Remarks
2.20+0.10
-0.08
縦／Length
A0
製品挿入凹み角穴
Dented square
hole for product
insertion
横／Width
B0
K
2.40±0.10
0.95±0.10
深さ／Depth
累積誤差±0.2max/10ピッチ
Accumulated error ±0.2max/10 pitches
ピッチ／Pitch
直径／Diameter
ピッチ／Pitch
位置／Position
直径／Diameter
P1
D0
P0
E
4.0±0.1
1.5+0.1/-0.0
4.0±0.1
送り穴
Sprocket hole
累積誤差±0.2max/10ピッチ
Accumulated error ±0.2max/10 pitches
1.75±0.10
1.0+0.3/-0.0
エンボス穴
Emboss hole
D1
縦方向／
Longitudinal
中心線間距離
Center-to-center
distance
P2
2.00±0.05
横方向／Traverse
幅／Width
F
3.50±0.05
5.4±0.1
W1
カバーテープ
Cover tape
ﾎﾟﾘｴﾁﾚﾝﾃﾚﾌﾀﾚｰﾄ (PET)
Polyethylene terephthalate
帯電防止処理有り／Antistatic
帯電防止処理有り／Antistatic
材質／Material
幅／Width
W
8.0±0.3
0.2±0.1
キャリアテープ
Carrier tape
厚さ／Thickness
材質／Material
t1
ﾎﾟﾘｽﾁﾚﾝ (PS)
穴部外形深さ／Hole outer depth
全体の厚さ／Total thickness
K1
t2
1.10±0.15
1.20±0.15
注：1) 各コーナー部のRは、0.25R以下／The radius at each corner shall be 0.25R or less.
※リール材質 ： ポリスチレン（耐電防止処理有り）／Reel material : Polystyrene (Antistatic)
2009.12.15
Prepared
Revised
Semiconductor Company, Panasonic Corporation
Industrial Devices Company, Panasonic Corporation
1 Kotari-yakemachi, Nagaokakyo City, Kyoto 617-8520, Japan
Tel:075-951-8151
相关型号：
AN48841B
Low current consumption, high sensitivity CMOS Hall IC Operates on Alternating Magnetic Field
PANASONIC
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