AN26102A [PANASONIC]
SiGe Linear Power Amplifier for 2.4 GHz Band Applications; SiGe半导体线性功率放大器的2.4 GHz频段应用
| 型号： | AN26102A |
| 厂家： | 
PANASONIC |
| 描述： | SiGe Linear Power Amplifier for 2.4 GHz Band Applications |
| 文件： | 总16页 (文件大小：379K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
Part No.
AN26102A
Package Code No.
ALGA011-W-0912ANB
Publication date: May 2012
Ver. AEB
1
AN26102A
Contents
Overview ………………………………………………….………………………………………………………….
Features ………………………………………………….………………………………………………………….
Applications……………………………………………….………………………………………………………….
Package ………………………………………………….………………………………………………………….
Type ……………………………………………………….………………………………………………………….
Application Circuit Example (Block Diagram) ………….…………….………………………………………….
Pin Descriptions ………………………………………….………………………………………………………….
Absolute Maximum Ratings …………………………………………….……………………………………….
3
3
3
3
3
4
5
6
Operating Supply Voltage Range …………………………………….…………………………………………. 6
Allowable Current and Voltage Range ………………………………….……………………………………….
Electrical Characteristics ………………………………………………………………………………………….
7
8
Control Pin Mode Table …………………………….……………………………………………………………. 10
Truth Table ………………………………………………….……………………………………………………… 10
Technical Data ……………………………………………….……………………………………………………. 11
y I/O block circuit diagram and pin function descriptions …….…………………………………………………. 11
y PD ⎯ Ta diagram ………………………………………………………………………………………………… 13
Usage Notes ……….………………………………………………………………………………………………. 14
Ver. AEB
2
AN26102A
AN26102A
SiGe Linear Power Amplifier for 2.4 GHz Band Applications
Overview
y AN26102A is Power amplifier IC for 2.4 GHz band (2 400 MHz to 2 500 MHz) applications.
y Realizing high performance by using 0.25 μm Bi-CMOS process (fT = 50 GHz, fmax = 60 GHz).
y Achieving miniaturization by using chip size package.
Features
y Operating voltage
VCC = PAVCC = +3.30 V typ.
y Low current consumption 145 mA typ. @Pout = +18 dBm
y High gain
30 dB typ. @fTX = 2450 MHz, Pout = +18 dBm
y Chip size package (11-pin WLCSP)
Applications
y 2.4 GHz band (2 400 MHz to 2 500 MHz) applications
Package
y 11 pin Wafer Level Chip Size Package (WLCSP)
Size : 1.16 mm × 0.86 mm (0.3mm pitch)
Type
y Bi-CMOS IC
Ver. AEB
3
AN26102A
Application Circuit Example (Block Diagram)
VCC
PAVCC
VEN
Cp2
*L1
*L2
Cp3
R1
IN
50 Ω
OUT
C4
C3
C2
C1
Cp4
PAIN
VCC
VEN
PAOUT
50 Ω
VDET
B4
B3
B1
VDET
GND
GND
Cp1
A4
A3
A2
A1
GND
PAVCC1
PAVCC2
GND
Cp6
Cp5
PAVCC
PAVCC
Notes) y This application circuit is an example. The operation of mass production set is not guaranteed. You should perform enough evaluation and
verification on the design of mass production set. You are fully responsible for the incorporation of the above application circuit and
information in the design of your equipment.
y This block diagram is for explaining functions. The part of the block diagram may be omitted, or it may be simplified.
y *L1, *L2 is a substrate pattern L.
Ver. AEB
4
AN26102A
Pin Descriptions
Pin No.
A1
Pin name
GND
Type
Ground
Description
GND
A2
PAVCC2
GND
Power Supply
Ground
2nd stage amplifier collector supply
GND
A3
A4
PAVCC1
GND
Power Supply
Ground
1st stage amplifier collector supply
GND
B1
B3
GND
Ground
GND
B4
VDET
PAOUT
VEN
Output
Power detector output
RF output , 3rd stage amplifier collector supply
Bias circuit control
C1
Output
C2
Input
C3
VCC
Power Supply
Input
Bias circuit supply
C4
PAIN
RF input, DC block required
Ver. AEB
5
AN26102A
Absolute Maximum Ratings
Note) Absolute maximum ratings are limit values which do not result in damages to this IC, and IC operation is not guaranteed at these limit values.
A No.
Parameter
Symbol
Rating
Unit
Notes
VCC
PAVCC
ICC
4.5
4.5
V
V
*1
*1
*1
*2
*3
*3
1
Supply voltage
2
3
4
5
Supply current
300
mA
mW
°C
Power dissipation
PD
50
Operating ambient temperature
Storage temperature
Topr
–30 to +85
–40 to +150
Tstg
°C
Notes) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
*2 : The power dissipation shown is the value at Ta = 85°C for the independent (unmounted) IC package without a heat sink.
When using this IC, refer to the y PD – Ta diagram in the Technical Data and design the heat radiation with sufficient margin so that the
allowable value might not be exceeded based on the conditions of power supply voltage, load, and ambient temperature.
*3 : Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25°C.
Operating Supply Voltage Range
Parameter
Supply voltage range
Symbol
VCC
Range
Unit
V
Notes
*1
2.95 to 4.20
2.95 to 4.20
PAVCC
V
*1
Note) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
Ver. AEB
6
AN26102A
Allowable Current and Voltage Range
Notes) y Allowable current and voltage ranges are limit ranges which do not result in damages to this IC, and IC operation is not guaranteed within
these limit ranges.
y Voltage values, unless otherwise specified, are with respect to GND.
y PAVCC is voltage for PAVCC1, PAVCC2, PAOUT
y Do not apply external currents or voltages to any pin not specifically mentioned.
Pin No. Pin name
Range
– 0.3 to 4.0
– 0.3 to PAVCC
– 0.3 to PAVCC
– 0.3 to PAVCC
—
Unit
V
Notes
—
C2
C1
A4
A2
C4
VEN
PAOUT
PAVCC2
PAVCC1
PAIN
V
*1
V
—
V
—
V
*2
Notes) *1 : RF signal output pin. (Maximum output power is 23.5 dBm.)
*2 : RF signal input pin. (Maximum input power is –2 dBm.) Do not apply DC current.
Ver. AEB
7
AN26102A
Electrical Characteristics at VEN = 2.85 V, VCC = PAVCC = 3.3 V
Note) Unless otherwise specified, Ta = 25°C 2°C, ZS = ZL = 50 Ω.
Limits
Notes
B No.
Parameter
Symbol
Conditions
Unit
Min Typ Max
DC electrical characteristics
Current at Active mode
(No RF signal input)
DC-1 Supply current (Active mode)
ICC
H
—
—
85
20
135
30
mA
µA
V
—
—
—
—
—
Current at Sleep mode
(No RF signal input)
DC-2 Supply current (Sleep mode)
ICC
L
SW voltage
DC-3
VIH
VIL
IIH
VEN for Active mode
2.70 2.85 3.40
(Active mode)
SW voltage
DC-4
VEN for Sleep mode
—
—
0.0
1.5
0.30
3.5
V
(Sleep mode)
Current at VEN pin
VIH = VEN
DC-5 SW current (Active mode)
mA
Ver. AEB
8
AN26102A
Electrical Characteristics (continued) at VEN = 2.85 V, VCC = PAVCC = 3.3 V
Note) Unless otherwise specified, Ta = 25°C 2°C, fTX = 2450 MHz, CW, ZS = ZL = 50 Ω.
Limits
Notes
B No.
Parameter
Symbol
Conditions
Unit
Min
Typ Max
Power amplifier AC electrical characteristics
Active mode,
f = fTX, CW
Pout = +18 dBm
Operation current
A-1
IDS
—
26
—
0.3
150
30
200
33.5
–40
mA
dB
dBc
V
—
—
—
—
—
—
(Signal : CW)
Active mode,
f = fTX, CW
Pout = +18 dBm
Power gain
A-2
GDS
(Signal : CW)
Active mode,
f = fTX
Pout = +18 dBm
A-3 2nd harmonics
HF2S
DET1S
DET2S
DDET
–50
DET output voltage
A-4
Active mode,
Pout = +18 dBm
0.43 0.495
(Pout = +18 dBm)
DET output voltage
A-5
Active mode,
Pout = +22 dBm
0.485 0.58 0.72
0.02 0.15 0.22
V
(Pout = +22 dBm)
A-6 Delta DET voltage
Active mode
V
Ver. AEB
9
AN26102A
Control Pin Mode Table
Note) See parameters B No. DC-3 / B No. DC-4 in the Electrical Characteristics for control voltage relation ranges.
Voltage
Pin No.
Descriptions
Note
Low
High
C3
Active/Sleep switching
Sleep
Active
—
Truth Table
Note) See parameters B No. DC-3 / B No. DC-4 in the Electrical Characteristics for control voltage relation ranges.
CNT
High
Low
PA
Mode
Active
Sleep
PA Active
PA Sleep
Ver. AEB
10
AN26102A
Technical Data
y I/O block circuit diagrams and pin function descriptions
Note) The characteristics listed below are reference values based on the IC design and are not guaranteed.
Pin
No.
Voltage
Internal circuit
Descriptions
A1
0.00 V
—
GND
VCC
2nd stage amplifier collector supply (PAVCC
)
A2
A3
3.30 V
0.00 V
A2
GND
VCC
—
GND
A4
A4
3.30 V
1st stage amplifier collector supply (PAVCC)
GND
B1
B3
0.00 V
0.00 V
—
—
GND
GND
VCC
B4
—
Power detector output
B4
GND
Ver. AEB
11
AN26102A
Technical Data (continued)
y I/O block circuit diagrams and pin function descriptions (continued)
Note) The characteristics listed below are reference values based on the IC design and are not guaranteed.
Pin
No.
Voltage
Internal Circuit
VCC
Descriptions
RF Output
C1
3.30 V
C1
3rd stage amplifier collector supply (PAVCC
)
GND
VCC
Active/Sleep SW Input
Less than 0.30 V : Sleep mode
More than 2.70 V : Active mode
C2
C2
—
GND
C3
C3
3.30 V
Voltage supply (VCC)
GND
VCC
C4
C4
—
PA input
GND
Ver. AEB
12
AN26102A
Technical Data (continued)
y PD ⎯ Ta diagram
Ver. AEB
13
AN26102A
Usage Notes
y Special attention and precaution in using
1. This IC is intended to be used for general electronic equipment [2.4 GHz Band Applications].
Consult our sales staff in advance for information on the following applications:
x Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may
directly jeopardize life or harm the human body.
x Any applications other than the standard applications intended.
(1) Space appliance (such as artificial satellite, and rocket)
(2) Traffic control equipment (such as for automobile, airplane, train, and ship)
(3) Medical equipment for life support
(4) Submarine transponder
(5) Control equipment for power plant
(6) Disaster prevention and security device
(7) Weapon
(8) Others : Applications of which reliability equivalent to (1) to (7) is required
2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might
smoke or ignite.
3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In
addition, refer to the Pin Description for the pin configuration.
4. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solder-
bridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because
the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during
transportation.
5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin-
VCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short) .
And, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and
smoke emission will depend on the current capability of the power supply.
6. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
7. When using the LSI for new models, verify the safety including the long-term reliability for each product.
8. When the application system is designed by using this LSI, be sure to confirm notes in this book.
Be sure to read the notes to descriptions and the usage notes in the book.
9. Due to unshielded structure of this IC, under exposure of light, function and characteristic of the product cannot be guaranteed.
During normal operation or even under testing condition, please ensure that IC is not exposed to light.
10. Basically, chip surface is ground potential. Please design to ensure no contact between chip surface and metal shielding.
Ver. AEB
14
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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