AN26031A [PANASONIC]
Single Band LNA-IC for 2.5 GHz Band Applications; 单频段LNA - IC，适用于2.5 GHz频带应用
| 型号： | AN26031A |
| 厂家： | 
PANASONIC |
| 描述： | Single Band LNA-IC for 2.5 GHz Band Applications |
| 文件： | 总16页 (文件大小：393K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
(Tentative)
Part No.
AN26031A
ALGA005-W-0609ANA
Package Code No.
Publication date: May 2012
Ver. EB
1
AN26031A
Contents
Overview …………………………………………………………………………………………………………… 3
Features …………………………………………………….……………………………………………………… 3
Applications ……………………………………………….………………………………….……………………… 3
Package ………………………………………………….………………………………………………………… 3
Type …………………………………………………….…………………………………………………………… 3
Application Circuit Example (Block Diagram) …………………………………………………………………… 4
y 2.5 GHz Band Application ………………………………………………………………………………………… 4
y 3.5 GHz Band Application ………………………………………………………………………………………… 5
Pin Descriptions …………………………………….……………………………………………………………… 6
Absolute Maximum Ratings ……………………………………………………………………………………… 7
Operating Supply Voltage Range ………………………………………………………………………………… 7
Allowable Voltage Range ………………………………………………………………………………………… 8
Electrical Characteristics ………………………………………………………………………………………… 9
Electrical Characteristics (Reference values for design) ………………………………………………………. 11
Control Pin Mode Table …………………………………………………………………………………………… 12
Truth Table ………………………………………………………………………………………………………… 12
Technical Data ……………………………………………………………………………………………………… 13
y I/O block circuit diagrams and pin function descriptions ……………………………………………………… 13
y PD ⎯ Ta diagram ………………………………………………………………………………………………… 14
Usage Note ……………………………….…………………………………………………………………………… 15
Ver. EB
2
AN26031A
AN26031A (Tentative)
Single Band LNA-IC for 2.5 GHz Band Applications
Overview
y AN26031A is a single band LNA (Low Noise Amplifier)-IC for 2.5 GHz Band applications.
y Realizing high performance by using 0.18 μm SiGeC Bi-CMOS process (fT = 90 GHz, fmax = 140 GHz).
y High/Low Gain-mode is changeable, controlled by integrated CMOS logic circuit.
y Achieving miniaturization by using small size Wafer Level Chip Size Package (WLCSP).
Features
y Low voltage operation
y Low current consumption
+3.0 V typ.
7.5 mA typ.
7.5 μA typ.
18.5 dB typ.
0.8 dB typ.
(High-Gain mode)
(Low-Gain mode)
(High-Gain mode)
(High-Gain mode)
y High gain
y Low noise figure
yLow distortion
ySmall package
+2.5 dBm typ. (High-Gain mode)
Applications
y 2.5 GHz Single Band LNA
Package
y5 pin Wafer level chip size package (WLCSP)
Size : 0.86 × 0.56 mm2 (0.3 mm pitch)
Type
y Bi-CMOS IC
Ver. EB
3
AN26031A
Application Circuit Example (Block Diagram)
y 2.5 GHz Band Application
RF output
(Top View)
(2.5 GHz Band)
50 Ω
VCC
A3
A2
A1
B3
C2
B1
CNT
(Gain cnt)
C1
L1
50 Ω
RF input
(2.5 GHz Band)
Notes) y This application circuit is an example. The operation of mass production set is not guaranteed. Perform enough evaluation and verification on
the design of mass production set.
y This block diagram is for explaining functions. The part of the block diagram may be omitted, or it may be simplified.
Ver. EB
4
AN26031A
Application Circuit Example (Block Diagram) (continued)
y 3.5 GHz Band Application
(Top View)
RF output
(3.5 GHz Band)
50 Ω
L2
VCC
A3
A2
A1
B3
C2
B1
CNT
(Gain cnt)
C1
L1
50 Ω
RF input
(3.5GHz Band)
Notes) y This application circuit is an example. The operation of mass production set is not guaranteed. Perform enough evaluation and verification on
the design of mass production set.
y This block diagram is for explaining functions. The part of the block diagram may be omitted, or it may be simplified.
Ver. EB
5
AN26031A
Descriptions
Pin No.
A1
Pin name
Type
Input
Description
IN
RF input
A2
GND
OUT
CNT
VCC
Ground
Output
GND
A3
RF output
B1
Input
High-Gain/Low-Gain switch
VCC
B3
Power Supply
Ver. EB
6
AN26031A
Absolute Maximum Ratings
Note) Absolute maximum ratings are limit values which do not result in damages to this IC, and IC operation is not guaranteed at these limit values.
A No.
Parameter
Symbol
VCC
ICC
Rating
3.7
Unit
V
Notes
*1
1
2
3
4
5
Supply voltage
Supply current
18
mA
mW
°C
—
Power dissipation
PD
29
*2
Operating ambient temperature
Storage temperature
Topr
–40 to +85
–55 to +125
*3
Tstg
°C
*3
Notes) *1 :The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
*2 : The power dissipation shown is the value at Ta = 75°C for the independent (unmounted) IC package with a heat sink.
When using this IC, refer to the PD-Ta diagram of the package standard and design the heat radiation with sufficient margin so that the
allowable value might not be exceeded based on the conditions of power supply voltage, load, and ambient temperature.
*3 : Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25°C.
Operating supply voltage range
Parameter
Supply voltage range
Symbol
Range
Unit
Notes
VCC
2.7 to 3.6
V
*
Note) * : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
Ver. EB
7
AN26031A
Allowable Voltage Range
Notes) y Allowable current and voltage ranges are limit ranges which do not result in damages to this IC, and IC operation is not guaranteed within
these limit ranges.
y Voltage values, unless otherwise specified, are with respect to GND.
y Do not apply external currents or voltages to any pin not specifically mentioned.
y For the circuit currents, "+" denotes current flowing into the IC, and "−" denotes current flowing out of the IC.
Pin No. Pin name
Rating
—
Unit Note
A1
A3
B1
IN
V
V
V
*1
—
—
OUT
CNT
– 0.3 to VCC
– 0.3 to VCC
Note) *1 : RF signal input pin. Do not apply DC current. Do not apply more than 0 dBm to RF input.
Ver. EB
8
AN26031A
Electrical Characteristics at VCC = 3.0 V
Note) Ta = 25°C 2°C unless otherwise specified.
Limits
B No.
Parameter
Symbol
Conditions
Unit Note
Min Typ Max
DC electrical characteristics
V
CC current at High-Gain mode
DC-1 Supply current HG
I
CCH
CCL
—
—
7.5
7.5
10
15
mA
—
—
No input signal
VCC current at Low-Gain mode
No input signal
DC-2 Supply current LG
I
μA
DC-3 Input voltage (High-Gain mode)
DC-4 Input voltage (Low-Gain mode)
VIH
VIL
—
—
1.48
0
—
—
3.6
0.6
V
V
—
—
Current at CNT pin
VIH = VCC
DC-5 SW current (High)
IIH
—
19
30
μA
—
Ver. EB
9
AN26031A
Electrical Characteristics (continued) at VCC = 3.0 V
Note) Ta = 25°C 2°C, fRX = 2.5 GHz, PRX = –30 dBm, CW unless otherwise specified.
Limits
B No.
Parameter
Symbol
Conditions
Unit
Note
Min Typ Max
AC electrical characteristics
A-1 Power Gain HG
GHS
GLS
High-Gain mode
16.6 18.5
20
dB
dB
—
—
A-2 Power Gain LG
Low-Gain mode
–8.8
–7
–5.2
High-Gain mode
IIP3
A-3
f1 = fRX – 10 MHz
f2 = fRX – 20 MHz
Input 2 signals (f1, f2)
IIP3H1S
–2
2.5
—
dBm
—
–10 MHz offset HG
Ver. EB
10
AN26031A
Electrical Characteristics (Reference values for design) at VCC = 3.0 V
Notes) Ta = 25°C 2°C, fRX = 2.3 GHz, 2.5 GHz, 2.7 GHz, PRX = –30 dBm, CW unless otherwise specified.
The characteristics listed below are reference values derived from the design of the IC and are not guaranteed by inspection.
If a problem does occur related to these characteristics, we will respond in good faith to user concerns.
Reference values
B No.
Parameter
Symbol
Conditions
Unit Note
Min
Typ Max
AC electrical characteristics
C-1
C-2
Power Gain HG
Power Gain LG
GHa
GLa
High-Gain mode
16.1
–9
18.5
–7
20.5
–5
dB
dB
—
—
Low-Gain mode
PRX = –20 dBm
C-3
C-4
Noise Figure HG
Noise Figure LG
NFHa
NFLa
High-Gain mode
Low-Gain mode
—
—
0.95
7
1.45
9.5
dB
dB
*1
*1
High-Gain mode
IIP3
f1 = fRXa – 10 MHz
f2 = fRXa – 20 MHz
Input 2 signals (f1, f2)
C-5
IIP3H1a
IIP3H2a
–2.5
2.5
—
dBm
—
–10 MHz offset HG
High-Gain mode
IIP3
f1 = fRXa + 10 MHz
f2 = fRXa + 20 MHz
Input 2 signals (f1, f2)
C-6
C-7
C-8
C-9
–2.5
–12
10
2.0
—
—
—
dBm
dBm
dBm
—
—
—
+10 MHz offset HG
Input P1dB HG
IP1dBHa High-Gain mode
–8.5
24.5
Low-Gain mode
IIP3
f1 = fRXa
IIP3La
+100 kHz offset LG
f2 = fRXa + 100 kHz
Input 2 signals (f1, f2)
Input P1dB LG
IP1dBLa Low-Gain mode
0
8
31
7
—
—
—
—
—
—
—
dBm
dB
dB
dB
dB
dB
dB
—
—
—
—
—
—
—
C-10 Reverse Isolation HG
C-11 Reverse Isolation LG
C-12 Input Return Loss HG
C-13 Input Return Loss LG
C-14 Output Return Loss HG
C-15 Output Return Loss LG
ISOHa
ISOLa
S11Ha
S11La
S22Ha
S22La
High-Gain mode
Low-Gain mode
High-Gain mode
Low-Gain mode
High-Gain mode
Low-Gain mode
26
4.5
10
7
16
8.5
19
14.5
10
9.5
Note) *1 : Connector & substrate loss (0.14 dB) included.
Ver. EB
11
AN26031A
Control Pin Mode Table
Note) See parameters B No. DC-3 / B No. DC-4 in the Electrical Characteristics for control voltage retention ranges.
Pin voltage
Pin No.
Description
Remarks
Low
High
B1
High-Gain/Low-Gain Switching (Gain Control)
Low-Gain
High-Gain
—
Truth Table
Note) See parameters B No. DC-3 / B No. DC-4 in the Electrical Characteristics for control voltage retention ranges.
CNT
High
Low
LNA
Mode
High-Gain
Low-Gain
High-Gain
Low-Gain
Ver. EB
12
AN26031A
Technical Data
yI/O block circuit diagram and pin function descriptions
Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed.
Pin Waveform and
Internal circuit
Impedance
Description
No.
voltage
VCC
A1
0.8 V
—
—
—
LNA input
A1
GND
A2
A3
0.0 V
—
GND
VCC
—
LNA output
A3
GND
B1
High-Gain/Low-Gain SW input
B1
B3
—
160 kΩ
Less than 0.60 V : Low-Gain mode
More than 1.48 V : High-Gain mode
GND
B3
3.3 V
—
Voltage supply
GND
Ver. EB
13
AN26031A
Technical Data (continued)
y PD ⎯ Ta diagram
Ver. EB
14
AN26031A
Usage Notes
y Special attention and precaution in using
1. This IC is intended to be used for general electronic equipment [2.5 GHz Band Applications].
Consult our sales staff in advance for information on the following applications:
x Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may
directly jeopardize life or harm the human body.
x Any applications other than the standard applications intended.
(1) Space appliance (such as artificial satellite, and rocket)
(2) Traffic control equipment (such as for automobile, airplane, train, and ship)
(3) Medical equipment for life support
(4) Submarine transponder
(5) Control equipment for power plant
(6) Disaster prevention and security device
(7) Weapon
(8) Others : Applications of which reliability equivalent to (1) to (7) is required
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the IC described in this book for any special application, unless our company agrees to your using the IC in this book
for any special application.
2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might smoke
or ignite.
3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In
addition, refer to the Pin Description for the pin configuration.
4. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solder-
bridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because
the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during
transportation.
5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin-
VCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short) .
And, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and
smoke emission will depend on the current capability of the power supply.
6. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
7. When using the LSI for new models, verify the safety including the long-term reliability for each product.
8. When the application system is designed by using this LSI, be sure to confirm notes in this book.
Be sure to read the notes to descriptions and the usage notes in the book.
9. Due to unshielded structure of this IC, under exposure of light, function and characteristic of the product cannot be guaranteed.
During normal operation or even under testing condition, please ensure that IC is not exposed to light.
10. Basically, chip surface is ground potential. Please design to ensure no contact between chip surface and metal shielding.
Ver. EB
15
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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