AN26027A_13 [PANASONIC]
Ultra small, Low NF, Single Band LNA-IC for 600 MHz Band Applications; 超小型，低NF ，单波段LNA - IC，适用于600 MHz频段的应用
| 型号： | AN26027A_13 |
| 厂家： | 
PANASONIC |
| 描述： | Ultra small, Low NF, Single Band LNA-IC for 600 MHz Band Applications |
| 文件： | 总12页 (文件大小：337K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AN26027A
Ultra small, Low NF, Single Band LNA-IC
for 600 MHz Band Applications
FEATURES
DESCRIPTION
AN26027A is single band LNA-IC for 600 MHz Band
applications.
• Low voltage operation
• Low current consumption
+2.85 V typ.
It realizes high performance by using 0.18 µm SiGeC
3 mA typ. (High-Gain mode)
1 µA typ. (Low-Gain mode)
Bi-CMOS process (fT = 90 GHz, fmax = 140 GHz).
High/Low Gain-mode is changeable, controlled by
integrated CMOS logic circuit.
• High gain 15.0 dB typ. fRX = 620 MHz (High-Gain mode)
• Low noise figure
A WLCSP package (Wafer Level Chip Sized Package)
achieves miniaturization.
1.20 dB typ. fRX = 620 MHz (High-Gain mode)
• Low distortion (IIP3 +10 MHz offset)
–4.0 dBm typ. fRX = 620 MHz (High-Gain mode)
• 5 pin Wafer level chip size package (WLCSP)
APPLICATIONS
zDTV（UHF）
SIMPLIFIED APPLICATION
RF output
50 Ω
VCC
Components
Size
0603
0603
0603
Value
Part Number
8.2 nH LQP03TN8N2H04
Vendor
Murata
Murata
Murata
L1
C1
C2
A3
A2
A1
B3
1 000 pF GRM033B11C102KD01
100 000 pF GRM33B30J104KE18
C2
TOP VIEW
Notes) This application circuit is an example. The operation of mass
production set is not guaranteed. You should perform enough
evaluation and verification on the design of mass production
set. You are fully responsible for the incorporation of the
above application circuit and information in the design of your
equipment.
B1
CNT
(Gain cnt)
C1
L1
RF input
50 Ω
Ver. CEB
Publication date: February 2013
1
AN26027A
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply voltage
Symbol
Rating
Unit
V
Note
*1
VCC
3.6
Supply current
ICC
18
–25 to 75
–40 to +125
–40 to +125
—
mA
°C
°C
°C
V
—
*2
Operating ambient temperature
Operating junction temperature
Storage temperature
Topr
Tj
Tstg
*2
*2
IN (Pin No.A1)
*3
Input Voltage Range
ESD
CNT (Pin No.B1)
OUT (Pin No.A3)
-0.3 to VCC
—
V
—
*4
V
HBM (Human Body Model)
MM (Machine Model)
1
kV
V
—
—
100
Notes). This product may sustain permanent damage if subjected to conditions higher than the above stated absolute maximum rating.
This rating is the maximum rating and device operating at this range is not guaranteeable as it is higher than our stated
recommended operating range.
When subjected under the absolute maximum rating for a long time, the reliability of the product may be affected.
*1:The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
*2:Except for the operating ambient temperature, operating junction temperature, and storage temperature,
all ratings are for Ta = 25°C.
*3:RF signal input pin. Do not apply DC.
*4:RF signal output pin. Do not apply DC.
POWER DISSIPATION RATING
PACKAGE
θ JA
PD (Ta=25 °C)
PD (Ta=75 °C)
WLCSP
1391.0℃/W
0.072W
0.036W
Note). For the actual usage, please refer to the PD-Ta characteristics diagram in the package specification, supply
voltage, load and ambient temperature conditions to ensure that there is enough margin follow the power and
the thermal design does not exceed the allowable value.
CAUTION
Although this has limited built-in ESD protection circuit, but permanent damage may occur on it.
Therefore, proper ESD precautions are recommended to avoid electrostatic damage to the MOS gates
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply voltage range
Symbol
Min.
Typ.
Max.
Unit
Note
VCC
2.5
3.0
V
*1
2.85
Note) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
Ver. CEB
2
AN26027A
ELECRTRICAL CHARACTERISTICS
Note) Vcc = 2.85 V, Ta = 25°C 2°C, unless otherwise specified.
Limits
Parameter
DC electrical characteristics
Supply current HG
Symbol
Condition
Unit Note
Min
Typ
Max
Vcc current at High-Gain mode
No input signal
IccH
IccL
VIH
VIL
—
—
3.0
1.0
4.4
10
—
mA
μA
V
—
—
—
—
—
Vcc current at Low-Gain mode
No input signal
Supply current LG
Switching voltage
(High Gain Mode)
VIH = Vcc × 0.90
VIL = Vcc × 0.14
2.57
—
2.85
0.0
Switching voltage
(Low Gain Mode)
0.4
20
V
Current at CNT pin
VIH = Vcc
Switching current(High)
IIH
—
4.6
μA
Ver. CEB
3
AN26027A
ELECRTRICAL CHARACTERISTICS (continued)
Note) Vcc = 2.85 V, Ta= 25°C 2°C, fRXa = 620 MHz, PRX = –30 dBm, CW unless otherwise specified.
Limits
Parameter
Symbol
Condition
Unit Note
Min
Typ
Max
LNA AC electrical characteristics
Power Gain HG
GHS
GLS
High-Gain mode
13.0
–7.5
15.0
–4.0
17.0
–1.0
dB
dB
—
—
Low-Gain mode
PRX = –20 dBm
Power Gain LG
High-Gain mode
IIP3 +10 MHz offset HG
f1 = fRXa + 10 MHz
f2 = fRXa + 20 MHz
Input 2 signals (f1, f2)
IIP3H1
–12
–4.0
—
dBm
—
Ver. CEB
4
AN26027A
APPLICATION INFORMATION
REFERENCE VALUES FOR DESIGN
Notes) Vcc = 2.85 V
Ta = 25°C 2°C, fRXb = 470 MHz, 620 MHz, 770 MHz, PRX = –30 dBm, CW unless otherwise specified.
Reference values
Parameter
Symbol
Conditions
Unit Note
Min Typ Max
LNA AC electrical characteristics
Power Gain HG
GH
GL
High-Gain mode
11.5 15.0 17.5
–8.0 –4.0 –1.0
dB
dB
*1
*1
Low-Gain mode
PRX = –20 dBm
Power GainLG
Noise Figure HG
Noise Figure LG
NFH
NFL
High-Gain mode
Low-Gain mode
—
—
1.3
6.5
2.3
8.5
dB
dB
*1,*3
*1
High-Gain mode
f1 = fRXb + 10 MHz
f2 = fRXb + 20 MHz
Input 2 signals (f1, f2)
IIP3 +10 MHz offset HG
IIP3 +10 MHz offset HG
IIP3H1
IIP3H2
–13 –4.0
–13 –4.0
—
—
dBm
dBm
*1
*1
High-Gain mode
f1 = fRXb – 10 MHz
f2 = fRXb – 20 MHz
Input 2 signals (f1, f2)
Input P1dB HG
IP1dBH
ISOH
High-Gain mode
High-Gain mode
High-Gain mode
–10
—
–6
—
—
—
dBm
dB
*1
*2
*2
Reverse Isolation HG
Reverse Isolation LG
–24
–3.5
ISOL
—
dB
Note)
*1 : Checked by design, not production tested.
*2 : Typical Value checked by design.
*3 : Connector & substrate loss (0.10 dB) included.
Ver. CEB
5
AN26027A
APPLICATION INFORMATION (continued)
REFERENCE VALUES FOR DESIGN (continued)
Notes) Vcc = 2.5 V to 3.0 V
Ta = –25°C to 75°C unless otherwise specified.
Reference values
Unit Note
Min Typ Max
Parameter
Symbol
Conditions
DC electrical characteristics
VCC current at High-Gain mode
No input signal
Supply current HG
IccHT
—
3.0
4.5 mA
*1
VCC current at Low-Gain mode
No input signal
Supply current LG
IccLT
IIHT
—
—
1.0 10.0 μA
*1
*1
Current at CNT pin
VIH = VCC
Switching current (High)
4.6
20
μA
Note)
*1 : Checked by design, not production tested.
Ver. CEB
6
AN26027A
APPLICATION INFORMATION (continued)
REFERENCE VALUES FOR DESIGN (continued)
Notes) Vcc = 2.5 V to 3.0 V
Ta = –25°C to 75°C, fRXb = 470 MHz, 620 MHz, 770 MHz, PRX = –30 dBm, CW unless otherwise specified
Reference values
Parameter
Symbol
Conditions
Unit Note
Min
Typ Max
LNA AC electrical characteristics
Power Gain HG
GHT
GLT
High-Gain mode
11.0 15.0 18.0 dB
–8.5 –4.0 –1.0 dB
*1
*1
Low-Gain mode
PRX = –20 dBm
Power Gain LG
Noise Figure HG
Noise Figure LG
NFHT
NFLT
High-Gain mode
Low-Gain mode
—
—
1.3
6.5
3.0
9.0
dB *1,*3
dB
*1
*1
High-Gain mode
f1 = fRXb + 10 MHz
f2 = fRXb + 20 MHz
Input 2 signals (f1, f2)
IIP3 +10 MHz offset HG
IIP3 +10 MHz offset HG
IIP3H1Ta
IIP3H2Ta
–14.0 –4.0
–14.0 –4.0
—
—
dBm
High-Gain mode
f1 = fRXb – 10 MHz
f2 = fRXb – 20 MHz
Input 2 signals (f1, f2)
dBm
dBm
*1
*1
High-Gain mode
f1 = fRXb – 190 MHz
PRX1 = –27 dBm
f2 = fRXb – 95 MHz
PRX2 = –33 dBm
Input 2 signals (f1, f2)
Input P1dB HG
P1dBHT
–12.0 –6.0
—
Note)
*1 : Checked by design, not production tested.
*3 : Connector & substrate loss (0.10 dB) included.
Ver. CEB
7
AN26027A
PIN CONFIGURATION
Top View
OUT
GND
IN
VCC
A3
A2
A1
B3
B1
CNT
PIN FUNCTIONS
Pin No. Pin name
Type
Input
Description
A1
A2
A3
IN
RF Input
GND
GND
OUT
Ground
Output
RF Output
High-Gain / Low-Gain switch
L: Low-Gain Mode
B1
B3
CNT
VCC
Input
H: High-Gain Mode
Power Supply VCC
FUNCTIONAL BLOCK DIAGRAM
Top View
A3
A2
A1
B3
B1
Notes) This circuit and these circuit constants show an example and do not guarantee the design as a mass-production set.
This block diagram is for explaining functions. The part of the block diagram may be omitted, or it may be simplified.
Ver. CEB
8
AN26027A
PACKAGE INFORMATION ( Reference Data )
Package Code:ALGA005-W-0609ANA
Unit:mm
Body Material : Br/Sb Free Epoxy Resin
Reroute Material : Cu
Bump : SnAgCu
Ver. CEB
9
AN26027A
IMPORTANT NOTICE
1.The products and product specifications described in this book are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore,
ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your
requirements.
2.When using the LSI for new models, verify the safety including the long-term reliability for each product.
3.When the application system is designed by using this LSI, be sure to confirm notes in this book.
Be sure to read the notes to descriptions and the usage notes in the book.
4.The technical information described in this book is intended only to show the main characteristics and application
circuit examples of the products. No license is granted in and to any intellectual property right or other right
owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company
as to the infringement upon any such right owned by any other company which may arise as a result of the use of
technical information de-scribed in this book.
5.This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of
our company.
6.This LSI is intended to be used for general electronic equipment [cellular phones].
Consult our sales staff in advance for information on the following applications: Special applications in which
exceptional quality and reliability are required, or if the failure or malfunction of this LSI may directly jeopardize
life or harm the human body.
Any applications other than the standard applications intended.
(1) Space appliance (such as artificial satellite, and rocket)
(2) Traffic control equipment (such as for automobile, airplane, train, and ship)
(3) Medical equipment for life support
(4) Submarine transponder
(5) Control equipment for power plant
(6) Disaster prevention and security device
(7) Weapon
(8) Others : Applications of which reliability equivalent to (1) to (7) is required
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in
connection with your using the LSI described in this book for any special application, unless our company agrees
to your using the LSI in this book for any special application.
7.This LSI is neither designed nor intended for use in automotive applications or environments unless the specific
product is designated by our company as compliant with the ISO/TS 16949 requirements.
Our company shall not be held responsible for any damage incurred by you or any third party as a result of or in
connection with your using the LSI in automotive application, unless our company agrees to your using the LSI in
this book for such application.
8.If any of the products or technical information described in this book is to be exported or provided to non-residents,
the laws and regulations of the exporting country, especially, those with regard to security export control, must be
observed.
9. Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of
controlled substances, including without limitation, the EU RoHS Directive. Our company shall not be held
responsible for any damage incurred as a result of your using the LSI not complying with the applicable laws and
regulations.
Ver. CEB
10
AN26027A
USAGE NOTES
1. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed
operating conditions (operating power supply voltage and operating environment etc.). Especially, please be
careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off
and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as
redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical
injury, fire, social damages, for example, by using the products.
2. Comply with the instructions for use in order to prevent breakdown and characteristics change due to external
factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's
process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf
life and the elapsed time since first opening the packages.
3. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-
board), it might smoke or ignite.
4. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit
between pins. In addition, refer to the Pin Description for the pin configuration.
5. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to
problems such as a solder-bridge between the pins of the semiconductor device. Also, perform a full technical
verification on the assembly quality, because the same damage possibly can happen due to conductive
substances, such as solder ball, that adhere to the LSI during transportation.
6. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs
such as output pin-VCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin
short (load short) .
And, safety measures such as an installation of fuses are recommended because the extent of the above-
mentioned damage and smoke emission will depend on the current capability of the power supply.
7. Due to unshielded structure of this LSI, under exposure of light, function and characteristic of the product cannot
be guaranteed. During normal operation or even under testing condition, please ensure that LSI is not exposed
to light.
8. Basically, chip surface is ground potential. Please design to ensure no contact between chip surface and metal
shielding.
Ver. CEB
11
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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