SFH-4080 [OSRAM]
IR-Lumineszenzdiode;
| 型号： | SFH-4080 |
| 厂家： | 
OSRAM GMBH |
| 描述： | IR-Lumineszenzdiode |
| 文件： | 总9页 (文件大小：266K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IR-Lumineszenzdiode
Infrared Emitter
Lead (Pb) Free Product - RoHS Compliant
SFH 4080
Nicht für Neuentwicklungen im Automobilbereich /
not for new designs in automotive applications
Wesentliche Merkmale
Features
• Sehr kleines Gehäuse:
• Very small package:
(LxBxH) 1,7 mm x 0,8 mm x 0,65 mm
• Typische Peakwellenlänge 880 nm
• Gegurtet lieferbar
(LxWxH) 1.7 mm x 0.8 mm x 0.65 mm
• Typical Peakwavelength 880 nm
• Available on tape and reel
Anwendungen
Applications
• Miniaturlichtschranken für Gleich- und
Wechsellichtbetrieb
• Miniature photointerrupters
• Industrial electronics
• Industrieelektronik
• „Messen/Steuern/Regeln“
• Sensorik
• Alarm- und Sicherungssysteme
• IR-Freiraumübertragung
• For drive and control circuits
• Sensor technology
• Alarm and safety equipment
• IR free air transmission
Typ
Type
Bestellnummer
Ordering Code
Strahlstärkegruppierung1) (IF = 100 mA, tp = 20 ms)
Radiant Intensity Grouping1)
Ie (mW/sr)
SFH 4080
Q65110A6461
> 1.0 (typ. 2.5)
1) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr
2008-10-20
1
SFH 4080
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Top; Tstg
– 40 … + 100
°C
Operating and storage temperature range
Sperrspannung
Reverse voltage
VR
5
V
Durchlassstrom
Forward current
IF
100
2.5
180
450
mA
A
Stoßstrom, τ = 10 μs, D = 0
Surge current
IFSM
Ptot
Verlustleistung
Power dissipation
mW
K/W
Wärmewiderstand Sperrschicht - Umgebung bei RthJA
Montage auf FR4 Platine, Padgröße je 5 mm2
Thermal resistance junction - ambient mounted
on PC-board (FR4), padsize 5 mm2 each
Wärmewiderstand Sperrschicht - Lötstelle bei
Montage auf Metall-Block
RthJS
250
K/W
Thermal resistance junction - soldering point,
mounted on metal block
2008-10-20
2
SFH 4080
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 100 mA, tp = 20 ms
λpeak
880
nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 100 m A
Δλ
80
nm
Abstrahlwinkel
Half angle
ϕ
± 80
Grad
deg.
Aktive Chipfläche
Active chip area
0.09
mm2
mm²
μs
A
Abmessungen der aktiven Chipfläche
Dimensions of the active chip area
L × B
L × W
0.3 × 0.3
0.5
Schaltzeiten, Ie von 10% auf 90% und von 90% tr, tf
auf 10%, bei IF = 100 mA, RL = 50 Ω
Switching times, Ιe from 10% to 90% and from
90% to 10%, IF = 100 mA, RL = 50 Ω
Kapazität
Co
15
pF
Capacitance
VR = 0 V, f = 1 MHz
Durchlassspannung
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 μs
VF
VF
1.5 (≤ 1.8)
3.0 (≤ 3.8)
V
V
Sperrstrom
Reverse current
VR = 5 V
IR
0.01 (≤ 1)
μA
Gesamtstrahlungsfluss
Total radiant flux
IF = 100 mA, tp = 20 ms
Φe
TCI
23
mW
%/K
Temperaturkoeffizient von Ie bzw. Φe,
IF = 100 mA
– 0.5
Temperature coefficient of Ie or Φe, IF = 100 mA
Temperaturkoeffizient von VF, IF = 100 mA
Temperature coefficient of VF, IF = 100 mA
TCV
TCλ
– 2
mV/K
nm/K
Temperaturkoeffizient von λ, IF = 100 mA
Temperature coefficient of λ, IF = 100 mA
+ 0.25
2008-10-20
3
SFH 4080
Strahlstärke Ie in Achsrichtung
gemessen bei einem Raumwinkel Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter
Symbol
Werte
Values
Einheit
Unit
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
Ie min
Ie typ
1.0
2.5
mW/sr
mW/sr
Strahlstärke
Ie typ
22
mW/sr
Radiant intensity
IF = 1 A, tp = 100 μs
2008-10-20
4
SFH 4080
Ιe
= f (IF)
Relative Spectral Emission
Irel = f (λ)
Radiant Intensity
Max. Permissible Forward Current
IF = f (TA), RthJA = 450 K/W
Ιe 100 mA
Single pulse, tp = 20 μs
OHR00878
OHR00877
10 2
OHR00883
100
%
120
Ι e
mA
Ι F
Ι e (100mA)
Ι rel
10 1
10 0
100
80
80
60
40
20
0
RthjA = 450 K/W
60
40
20
0
10 -1
10 -2
10 -3
0
20
40
60
80
100 ˚C 120
10 0
10 1
10 2
10 3 mA 10 4
750
800
850
900
950 nm 1000
TA
Ι F
λ
Forward Current
IF = f (VF) single pulse, tp = 20 μs
Permissible Pulse Handling
Capability IF = f (tp), TA = 25 °C
duty cycle D = parameter
OHR00886
104
OHR00881
10 1
mA
A
Ι F
Ι F
D
= 0.005
0.01
0.02
0.05
10 0
10 -1
10 -2
10 -3
103
102
101
0.1
0.2
0.5
DC
t p
t p
D =
Ι F
T
T
0
1
2
3
4
5
6
V
8
10-5 10-4 10-3 10-2 10-1 100 101 s 102
t p
VF
Radiation Characteristics Irel = f (ϕ)
40˚
30˚
20˚
10˚
0˚
OHF00614
1.0
ϕ
50˚
0.8
0.6
0.4
60˚
70˚
0.2
0
80˚
90˚
100˚
1.0
0.8
0.6
0.4
0˚
20˚
40˚
60˚
80˚
100˚
120˚
2008-10-20
5
SFH 4080
Maßzeichnung
Package Outlines
+0.05 (0.002)
-0.03 (0.001)
0.125 (0.005)
±0.1 (0.004)
0.8 (0.031)
Package
marking
Package
marking
+0.02 (0.001)
-0.05 (0.002)
±0.05 (0.002)
0.7 (0.028)
0.65 (0.026)
GPLY7036
Maße in mm (inch) / Dimensions in mm (inch).
Gehäuse / Package
Farbe / Colour
Epoxydharz, diffus / Epoxy, diffuse
Farblos / colourless
Anode
Gehäusemarkierung/
Package marking
2008-10-20
6
SFH 4080
Empfohlenes Lötpaddesign
Recommended Solder Pad
Reflow Löten
Reflow Soldering
0.8 (0.031)
Copper solder pad
0.8 (0.031)
0.8 (0.031)
OHAPY606
Alternatives Lötpaddesign
Alternative Solder Pad
Reflow Löten
Reflow Soldering
0.7 (0.028)
0.8 (0.031)
0.6 (0.024)
0.05 (0.002)
Solder stencil aperture
Copper solder pad
Maße in mm (inch) / Dimensions in mm (inch).
OHPY3832
2008-10-20
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SFH 4080
Lötbedingungen
Vorbehandlung nach JEDEC Level 2
Soldering Conditions
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
Preconditioning acc. to JEDEC Level 2
(nach J-STD-020C)
(acc. to J-STD-020C)
OHLA0687
300
Maximum Solder Profile
Recommended Solder Profile
Minimum Solder Profile
˚C
+0 ˚C
-5 ˚C
260 ˚C
245 ˚C
235 ˚C
255 ˚C
240 ˚C
250
T
±5 ˚C
+5 ˚C
-0 ˚C
217 ˚C
10 s min
200
150
100
50
30 s max
Ramp Down
6 K/s (max)
100 s max
120 s max
Ramp Up
3 K/s (max)
25 ˚C
0
0
50
100
150
200
250
s
300
t
Wellenlöten (TTW)
TTW Soldering
(nach CECC 00802)
(acc. to CECC 00802)
OHLY0598
300
C
10 s
Normalkurve
standard curve
250
200
150
100
50
T
235 C ... 260 C
Grenzkurven
limit curves
2. Welle
2. wave
1. Welle
1. wave
ca 200 K/s
2 K/s
5 K/s
100 C ... 130 C
Zwangskühlung
forced cooling
2 K/s
0
0
50
100
150
200
s
250
t
2008-10-20
8
SFH 4080
Published by
OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2008-10-20
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