SFH-303-FA [OSRAM]

NPN-Silizium-Fototransistor;
SFH-303-FA
型号: SFH-303-FA
厂家: OSRAM GMBH    OSRAM GMBH
描述:

NPN-Silizium-Fototransistor

文件: 总7页 (文件大小:304K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
NPN-Silizium-Fototransistor  
Silicon NPN Phototransistor  
Lead (Pb) Free Product - RoHS Compliant  
SFH 303 FA  
SFH 303 FA  
Wesentliche Merkmale  
Features  
Spektraler Bereich der Fotoempfindlichkeit:  
730 nm ...1100 nm  
Spectral Range of Sensitivity:  
730 nm ... 1100 nm  
Gehäuse: 5 mm Radial (T13/4), Harz  
Besonderheit des Bauteils:  
- mit Basisanschluss  
Package: 5 mm Radial (T13/4), Epoxy  
Feature of the device:  
- with base connection  
- hohe Fotoempfindlichkeit  
- high photosensitivity  
Anwendungen  
Applications  
• Lichtschranken  
• Photointerrupters  
• Industrieelektronik  
• „Messen/Steuern/Regeln“  
• Industrial electronics  
• For control and drive circuits  
Typ  
Type  
Bestellnummer  
Ordering Code  
Fotostrom, Ee= 0.5mW/cm2, λ = 950nm, VCE = 5 V  
Photocurrent  
Ipce (mA)  
SFH 303 FA  
Q62702P0958  
Q62702P3587  
1.0  
1.6  
SFH 303 FA-3/4  
2008-06-20  
1
SFH 303 FA  
Grenzwerte  
Maximum Ratings  
Bezeichnung  
Parameter  
Symbol  
Symbol  
Wert  
Value  
Einheit  
Unit  
Betriebs- und Lagertemperatur  
Operating and storage temperature range  
Top; Tstg  
VCE  
IC  
– 40 + 100  
° C  
Kollektor-Emitterspannung  
Collector-emitter voltage  
35  
V
Kollektorstrom  
Collector current  
50  
mA  
mA  
V
Kollektorspitzenstrom, τ < 10 µs  
Collector surge current  
ICS  
100  
7
Emitter-Basisspannung  
Emitter-base voltage  
VEB  
Verlustleistung, TA = 25 ° C  
Total power dissipation  
Ptot  
200  
375  
mW  
K/W  
Wärmewiderstand  
Thermal resistance  
RthJA  
2008-06-20  
2
SFH 303 FA  
Kennwerte (TA = 25 °C, λ = 950 nm)  
Characteristics  
Bezeichnung  
Parameter  
Symbol  
Symbol  
Wert  
Value  
Einheit  
Unit  
Wellenlänge der max. Fotoempfindlichkeit  
Wavelength of max. sensitivity  
λS max  
990  
nm  
Spektraler Bereich der Fotoempfindlichkeit  
S = 10% von Smax  
λ
750 1120  
nm  
Spectral range of sensitivity  
S = 10% of Smax  
Bestrahlungsempfindliche Fläche  
Radiant sensitive area  
0.11  
mm2  
A
Abmessung der Chipfläche  
Dimensions of chip area  
L × B  
L × W  
0.5 × 0.5  
20  
mm × mm  
Halbwinkel  
Half angle  
ϕ
Grad  
deg.  
Fotostrom der Kollektor-Basis-Fotodiode  
Photocurrent of collector-base photodiode  
Ee = 0.5 mW/cm2, VCB = 5 V  
IPCB  
4.0  
µA  
V
CB = 5 V  
Kapazität  
Capacitance  
V
V
V
CE = 0 V, f = 1 MHz, E = 0  
CB = 0 V, f = 1 MHz, E = 0  
EB = 0 V, f = 1 MHz, E = 0  
CCE  
CCB  
CEB  
7.5  
14  
19  
pF  
pF  
pF  
Dunkelstrom  
Dark current  
ICEO  
1 (50)  
nA  
V
CEO = 20 V, E = 0  
Kollektor-Emitter-Sättigungsspannung  
Collector-emitter saturation voltage  
(threefold saturated)  
VCEsat  
150  
mV  
2008-06-20  
3
SFH 303 FA  
Die Fototransistoren werden nach ihrer Fotoempfindlichkeit gruppiert und mit arabischen Ziffern  
gekennzeichnet.  
The phototransistors are grouped according to their spectral sensitivity and distinguished by  
arabian figures.  
Bezeichnung  
Parameter  
Symbol  
Symbol  
Wert  
Value  
Einheit  
Unit  
-2  
-3  
-4  
Fotostrom  
IPCE  
1.0 2.0 1.6 3.2 2.5  
mA  
Photocurrent  
Ee= 0.5mW/cm2, λ = 950nm, VCE = 5 V  
Anstiegszeit/Abfallzeit  
Rise and fall time  
tr, tf  
11  
13  
15  
µs  
IC = 1 mA, VCC = 5 V, RL = 1 kΩ  
2008-06-20  
4
SFH 303 FA  
Relative Spectral Sensitivity,  
Photocurrent  
PCE = f (Ee), VCE = 5 V  
Output Characteristics  
IC = f (VCE), IB = Parameter  
S
rel = f (λ)  
I
100  
%
90  
Srel  
80  
70  
60  
50  
40  
30  
20  
10  
0
400 500 600 700 800 900 nm1100  
lambda  
Dark Current  
Dark Current  
Capacitance  
C = f (VR), f = 1 MHz, E = 0  
ICEO = f (TA), VCE = 20 V, E = 0  
ICEO = f (VCE), E = 0  
20  
10000  
nA  
10  
pF  
18  
nA  
C
1000  
16  
I CEO  
I CEO  
14  
12  
10  
100  
1
10  
1
Ceb  
8
6
4
2
0.1  
Ccb  
0.1  
0.01  
Cce  
0
0.01  
1E-03  
1E-02  
1E-01  
1E+00 1E+01 1E+02  
-25  
0
25  
50  
75  
100  
0
5
10  
15  
20  
25  
30  
35  
V
°C  
V
V
VCE  
TA  
Directional Characteristics  
rel = f (ϕ)  
S
2008-06-20  
5
SFH 303 FA  
Maßzeichnung  
Package Outlines  
Area not flat  
25.2 (0.992)  
24.2 (0.953)  
9.0 (0.354)  
5.9 (0.232)  
5.5 (0.217)  
5.1 (0.201)  
4.8 (0.189)  
8.2 (0.323)  
7.8 (0.307)  
1.8 (0.071)  
1.2 (0.047)  
7.5 (0.295)  
0.6 (0.024)  
0.4 (0.016)  
6.9 (0.272)  
B C E  
11.5 (0.453)  
10.9 (0.429)  
GEOY6351  
Chip position  
Maße in mm (inch) / Dimensions in mm (inch).  
Lötbedingungen  
Soldering Conditions  
Wellenlöten (TTW)  
TTW Soldering  
(nach CECC 00802)  
(acc. to CECC 00802)  
OHLY0598  
300  
10 s  
C
Normalkurve  
standard curve  
250  
200  
150  
100  
50  
T
235 C ... 260 C  
Grenzkurven  
limit curves  
2. Welle  
2. wave  
1. Welle  
1. wave  
ca 200 K/s  
2 K/s  
5 K/s  
100 C ... 130 C  
Zwangskühlung  
forced cooling  
2 K/s  
0
0
50  
100  
150  
200  
s
250  
t
2008-06-20  
6
SFH 303 FA  
Published by  
OSRAM Opto Semiconductors GmbH  
Wernerwerkstrasse 2, D-93049 Regensburg  
www.osram-os.com  
© All Rights Reserved.  
Attention please!  
The information describes the type of component and shall not be considered as assured characteristics.  
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain  
dangerous substances. For information on the types in question please contact our Sales Organization.  
Packing  
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.  
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing  
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs  
incurred.  
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical  
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.  
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected  
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.  
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain  
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.  
2008-06-20  
7

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