SFH-309-FA [OSRAM]

Silicon NPN Phototransistor;
SFH-309-FA
型号: SFH-309-FA
厂家: OSRAM GMBH    OSRAM GMBH
描述:

Silicon NPN Phototransistor

文件: 总10页 (文件大小:302K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
2016-01-04  
Silicon NPN Phototransistor  
Version 1.3  
SFH 309 FA  
Features:  
Spectral range of sensitivity: (typ) 730 ... 1120 nm  
Package: 3mm Radial (T 1), Epoxy  
Special: High photosensitivity  
High linearity  
Available in groups  
Applications  
Photointerrupters  
Industrial electronics  
For control and drive circuits  
Ordering Information  
Type:  
Photocurrent  
Ordering Code  
IPCE [µA]  
λ = 950 nm, Ee = 0.5 mW/cm2,  
VCE = 5 V  
SFH 309 FA  
400 ... 5000  
630 ... 2000  
1000 ... 2000  
1000 ... 3200  
1600 ... 3200  
1600 ... 5000  
Q62702P0941  
Q62702P3590  
Q62702P0178  
Q62702P3591  
Q62702P0180  
Q62702P5199  
SFH 309 FA-3/4  
SFH 309 FA-4  
SFH 309 FA-4/5  
SFH 309 FA-5  
SFH 309 FA-5/6  
Note:  
Only one bin within one packing unit (variation less than 2:1)  
2016-01-04  
1
Version 1.3  
SFH 309 FA  
Maximum Ratings (TA = 25 °C)  
Parameter  
Symbol  
Top; Tstg  
VCE  
Values  
Unit  
°C  
Operating and storage temperature range  
Collector-emitter voltage  
Collector current  
-40 ... 100  
35  
15  
75  
V
IC  
mA  
mA  
Collector surge current  
(τ < 10 µs)  
ICS  
Total Power dissipation  
Thermal resistance  
Ptot  
165  
450  
mW  
K / W  
V
RthJA  
VESD  
ESD withstand voltage  
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)  
2000  
Characteristics (TA = 25 °C)  
Parameter  
Symbol  
Values  
Unit  
Wavelength of max. sensitivity  
Spectral range of sensitivity  
(typ)  
(typ)  
λS max  
λ10%  
900  
nm  
(typ) 730 nm  
... 1120  
Radiant sensitive area  
(∅ 220 μm)  
(typ)  
(typ)  
A
0.038  
mm2  
Dimensions of chip area  
Distance chip front to case surface  
Half angle  
L x W  
H
(typ)0.45 x mm x  
0.45  
mm  
mm  
(min ...  
max)  
(min ... max)  
2.4 ... 2.8  
(typ)  
(typ)  
ϕ
± 12  
5
°
Capacitance  
(VCE = 0 V, f = 1 MHz, E = 0)  
CCE  
pF  
Dark current  
(VCE = 20 V, E = 0)  
(typ (max)) ICE0  
1 (≤ 50)  
nA  
2016-01-04  
2
Version 1.3  
SFH 309 FA  
Grouping (TA = 25 °C, λ = 950 nm)  
Group  
Min Photocurrent Max Photocurrent Rise and fall time Collector-emitter  
saturation  
voltage  
Ee = 0.5 mW/cm2, Ee = 0.5 mW/cm2, IC = 1 mA, VCC = 5 IC = IPCEmin x 0.3, Ee  
VCE = 5 V  
IPCE, min [µA]  
400  
VCE = 5 V  
IPCE, max [µA]  
800  
V, RL = 1 kΩ  
= 0.5 mW/cm2  
tr, tf [µs]  
VCEsat [mV]  
200  
-2  
-3  
-4  
-5  
-6  
5
6
7
8
9
630  
1250  
200  
1000  
2000  
200  
1600  
3200  
200  
2500  
5000  
200  
Note.:  
IPCEmin is the min. photocurrent of the specified group.  
Relative Spectral Sensitivity 1) page 9  
Srel = f(λ)  
Photocurrent 1) page 9  
IPCE = f(Ee), VCE = 5 V  
2016-01-04  
3
Version 1.3  
SFH 309 FA  
Photocurrent 1) page 9  
IPCE = f(VCE), Ee = Parameter  
Photocurrent 1) page 9  
IPCE / IPCE(25°C) = f(TA), VCE = 5 V  
OHF01524  
1.6  
Ι PCE  
Ι PCE25  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
-25  
0
25  
50  
75 C 100  
TA  
Dark Current 1) page 9  
ICEO = f(VCE), E = 0  
Dark Current 1) page 9  
ICE0 = f(TA), VCE = 20 V, E = 0  
OHF01527  
OHF01530  
10 1  
10 3  
nA  
nA  
Ι CEO  
Ι CEO  
10 0  
10 -1  
10 -2  
10 -3  
10 2  
10 1  
10 0  
10 -1  
0
5
10  
15  
20  
25  
30 V 35  
-25  
0
25  
50  
75  
100  
˚C  
TA  
VCE  
2016-01-04  
4
Version 1.3  
SFH 309 FA  
Collector-Emitter Capacitance 1) page 9  
CCE = f(VCE), f = 1 MHz, E = 0  
Power Consumption  
Ptot = f(TA)  
OHF01528  
5.0  
pF  
CCE  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
10 -2  
10 -1  
10 0  
10 1  
V
10 2  
VCE  
Directional Characteristics 1) page 9  
Srel = f(ϕ)  
2016-01-04  
5
Version 1.3  
SFH 309 FA  
Package Outline  
Area not flat  
5.2 (0.205)  
4.5 (0.177)  
4.1 (0.161)  
3.9 (0.154)  
0.6 (0.024)  
0.4 (0.016)  
4.0 (0.157)  
3.6 (0.142)  
3.5 (0.138)  
1.8 (0.071)  
1.2 (0.047)  
Chip position  
Collector (Transistor)  
Cathode (Diode)  
6.3 (0.248)  
5.9 (0.232)  
29 (1.142)  
27 (1.063)  
GEOY6653  
Dimensions in mm (inch).  
Package  
3mm Radial (T 1), Epoxy  
Approximate Weight:  
0.2 g  
Note  
Packing information is available on the internet (online product catalog).  
2016-01-04  
6
Version 1.3  
SFH 309 FA  
Recommended Solder Pad  
Dimensions in mm.  
Note:  
pad 1: emitter  
TTW Soldering  
IEC-61760-1 TTW  
OHA04645  
300  
10 s max., max. contact time 5 s per wave  
˚C  
T
Continuous line: typical process  
Dotted line: process limits  
250  
235 ˚C - 260 ˚C  
First wave  
Second wave  
T < 150 K  
200  
150  
100  
50  
Cooling  
Preheating  
ca. 3.5 K/s typical  
ca. 2 K/s  
130 ˚C  
120 ˚C  
100 ˚C  
ca. 5 K/s  
Typical  
0
0
20  
40  
60  
80  
100  
120  
140  
160  
180  
200  
220 s 240  
t
2016-01-04  
7
Version 1.3  
SFH 309 FA  
Disclaimer  
Language english will prevail in case of any discrepancies or deviations between the two language wordings.  
Attention please!  
The information describes the type of component and shall not be considered as assured characteristics.  
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain  
dangerous substances.  
For information on the types in question please contact our Sales Organization.  
If printed or downloaded, please find the latest version in the Internet.  
Packing  
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.  
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing  
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any  
costs incurred.  
Components used in life-support devices or systems must be expressly authorized for such purpose!  
Critical components* may only be used in life-support devices** or systems with the express written approval of  
OSRAM OS.  
*) A critical component is a component used in a life-support device or system whose failure can reasonably be  
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that  
device or system.  
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or  
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be  
endangered.  
2016-01-04  
8
Version 1.3  
SFH 309 FA  
Glossary  
1)  
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or  
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily  
correspond to the actual parameters of each single product, which could differ from the typical data and calculated  
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data  
will be changed without any further notice.  
2016-01-04  
9
Version 1.3  
SFH 309 FA  
Published by OSRAM Opto Semiconductors GmbH  
Leibnizstraße 4, D-93055 Regensburg  
www.osram-os.com © All Rights Reserved.  
2016-01-04  
10  

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