NLU1GT04_16 [ONSEMI]
Single Inverter, TTL Level;
| 型号： | NLU1GT04_16 |
| 厂家： | 
ONSEMI |
| 描述： | Single Inverter, TTL Level |
| 文件： | 总6页 (文件大小：70K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NLU1GT04
Single Inverter, TTL Level
LSTTL−Compatible Inputs
The NLU1GT04 MiniGatet is an advanced CMOS high−speed
inverting buffer in ultra−small footprint.
The device input is compatible with TTL−type input thresholds and
the output has a full 5.0 V CMOS level output swing.
The NLU1GT04 input and output structures provide protection
when voltages up to 7 V are applied, regardless of the supply voltage.
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MARKING
DIAGRAMS
Features
UDFN6
MU SUFFIX
CASE 517AA
• High Speed: t = 3.8 ns (Typ) @ V = 5.0 V
PD
CC
M
• Low Power Dissipation: I = 1 mA (Max) at T = 25°C
CC
A
1
• TTL−Compatible Input: V = 0.8 V; V = 2.0 V
IL
IH
• CMOS−Compatible Output:
V
OH
> 0.8 V ; V < 0.1 V @ Load
UDFN6
MU SUFFIX
CASE 517AQ
CC
OL
CC
PM
• Power Down Protection Provided on inputs
• Balanced Propagation Delays
1
• Ultra−Small Packages
N or P = Device Marking
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
M
= Date Code
Compliant
PIN ASSIGNMENT
1
NC
IN A
GND
NC
IN A
GND
1
2
3
6
5
V
CC
2
3
4
5
6
OUT Y
NC
NC
V
CC
4
OUT Y
FUNCTION TABLE
A
Y
L
H
H
L
Figure 1. Pinout (Top View)
1
IN A
OUT Y
ORDERING INFORMATION
See detailed ordering and shipping information in the package
Figure 2. Logic Symbol
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
June, 2016 − Rev. 3
NLU1GT04/D
NLU1GT04
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
V
CC
DC Supply Voltage
−0.5 to +7.0
V
IN
DC Input Voltage
−0.5 to +7.0
V
V
OUT
DC Output Voltage
−0.5 to +7.0
V
I
DC Input Diode Current
V
< GND
< GND
OUT
−20
mA
mA
mA
mA
mA
°C
IK
IN
I
DC Output Diode Current
V
20
OK
I
DC Output Source/Sink Current
DC Supply Current Per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Moisture Sensitivity
12.5
O
I
25
CC
I
25
−65 to +150
260
GND
T
STG
T
°C
L
T
150
°C
J
MSL
Level 1
F
R
Flammability Rating Oxygen
Index: 28 to 34
UL 94 V−0 @ 0.125 in
V
ESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
N/A
V
I
Latchup Performance Above V and Below GND at 125 °C (Note 5)
500
mA
LATCHUP
CC
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA / JESD22−A114−A.
3. Tested to EIA / JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
1.65
0
Max
5.5
Unit
V
V
CC
Positive DC Supply Voltage
Digital Input Voltage
V
IN
5.5
V
V
OUT
Output Voltage
0
5.5
V
T
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
−55
+125
°C
ns/V
A
Dt/DV
V
CC
V
CC
= 3.3 V 0.3 V
= 5.0 V 0.5 V
0
0
100
20
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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2
NLU1GT04
DC ELECTRICAL CHARACTERISTICS
T
= −555C
A
to +1255C
T
A
= 25 5C
Typ
T
= +855C
A
V
CC
(V)
1.8
3.0
Min
1.2
1.4
2.0
Max
Min
1.2
1.4
2.0
Max
Min
1.2
1.4
2.0
Max
Symbol
Parameter
Conditions
Unit
V
IH
Low−Level Input Voltage
V
4.5 to
5.5
V
Low−Level Input Voltage
1.8
3.0
0.3
0.53
0.8
0.3
0.53
0.8
0.3
0.53
0.8
V
V
IL
4.5 to
5.5
V
OH
High−Level
V
= V or V
= −50 mA
3.0
4.5
2.9
4.4
3.0
4.5
2.9
4.4
2.9
4.4
IN
IH
IL
I
OH
Output Voltage
V
= V or V
IN
OH
OH
OH
IH
IL
I
I
I
= −2 mA
= −4 mA
= −8 mA
1.8
3.0
4.5
1.40
2.58
3.94
1.38
2.48
3.80
1.37
2.34
3.66
V
OL
Low−Level Output
Voltage
V
= V or V
= 50 mA
3.0
4.5
0
0
0.1
0.1
0.1
0.1
0.1
0.1
V
IN
IH
IL
I
OL
V
= V or V
IN
OL
OL
OL
IH
IL
I
I
I
= 2 mA
= 4 mA
= 8 mA
1.8
3.0
4.5
0.36
0.36
0.36
0.44
0.44
0.44
0.52
0.52
0.52
I
Input Leakage Current
0 v V v 5.5 V
0 to
5.5
0.1
1.0
1.0
mA
mA
mA
mA
IN
IN
I
Quiescent Supply
Current
0 v V v V
5.5
5.5
0.0
1.0
20
40
CC
IN
CC
I
Quiescent Supply
Current
V = 3.4 V
IN
1.35
0.5
1.50
5.0
1.65
10
CCT
I
Output Leakage Current
V = 5.5 V
OUT
OPD
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
AC ELECTRICAL CHARACTERISTICS (Input t = t = 3.0 ns)
r
f
T
A
= −555C to
+1255C
T
A
= 25 5C
Typ
5.0
T
= +855C
A
V
(V)
Test
Condition
CC
Min
Max
10.0
13.5
6.7
Min
Max
Min
Max
13.0
17.5
8.5
Symbol
Parameter
Unit
t
,
Propagation De-
lay, Input A to
Output Y
3.0 to
3.6
C = 15 pF
L
11.0
15.0
7.5
ns
PLH
t
PHL
C = 50 pF
L
6.2
4.5 to
5.5
C = 15 pF
L
3.8
C = 50 pF
L
4.2
7.7
8.5
9.5
C
Input Capacitance
5
10
10
10.0
pF
pF
IN
C
Power Dissipation
Capacitance
(Note 6)
5.0
10
PD
6. C is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
PD
load. Average operating current can be obtained by the equation I
dynamic power consumption: P = C • V
= C • V • f + I . C is used to determine the no−load
CC(OPR)
PD CC in CC PD
2
• f + I • V
D
PD
CC
in CC CC.
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3
NLU1GT04
V
CC
A or B
50%
GND
t
PLH
t
PHL
Y
50% V
CC
Figure 3. Switching Waveforms
OUTPUT
INPUT
C
L*
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended for propagation delay tests.
Figure 4. Test Circuit
ORDERING INFORMATION
Device
†
Package
Shipping
NLU1GT04MUTCG
UDFN6
(Pb−Free)
3000 / Tape & Reel
3000 / Tape & Reel
NLU1GT04AMUTCG
UDFN6
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NLU1GT04
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA
ISSUE D
EDGE OF PACKAGE
NOTES:
A
B
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
L1
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN ONE
REFERENCE
E
DETAIL A
Bottom View
MILLIMETERS
2X
DIM MIN
0.45
A1 0.00
MAX
0.55
0.05
(Optional)
A
0.10
C
MOLD CMPD
EXPOSED Cu
TOP VIEW
A3
b
0.127 REF
0.15
2X
0.25
0.10
C
C
D
E
e
1.20 BSC
1.00 BSC
0.40 BSC
A3
L
0.30
0.40
0.15
0.50
(A3)
L1 0.00
L2 0.40
0.10
0.08
A1
DETAIL B
Side View
(Optional)
A
MOUNTING FOOTPRINT*
SEATING
PLANE
10X
C
6X
0.42
SIDE VIEW
6X
0.22
C
A1
5X L
3
1
L2
6X b
0.40
PITCH
6
4
1.07
0.10
0.05
C
A B
e
C
DIMENSIONS: MILLIMETERS
NOTE 3
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
5
NLU1GT04
PACKAGE DIMENSIONS
UDFN6, 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
L
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
L1
DETAIL A
PIN ONE
REFERENCE
OPTIONAL
E
MILLIMETERS
CONSTRUCTIONS
DIM MIN
0.45
A1 0.00
MAX
0.55
0.05
A
0.10
C
EXPOSED Cu
MOLD CMPD
A2
b
0.07 REF
0.20
TOP VIEW
0.30
0.10
C
D
1.45 BSC
E
e
1.00 BSC
0.50 BSC
DETAIL B
L
L1
0.30
−−−
0.40
0.15
DETAIL B
OPTIONAL
0.05
0.05
C
C
CONSTRUCTIONS
A
MOUNTING FOOTPRINT
6X
A1
6X
0.30
SEATING
PLANE
A2
C
SIDE VIEW
e
PACKAGE
OUTLINE
6X L
1.24
3
1
DETAIL A
6X
0.53
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
6
4
6X b
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.10
C A B
NOTE 3
0.05
C
BOTTOM VIEW
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NLU1GT04/D
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