NL17SH34P5T5G [ONSEMI]
Single Buffer;
| 型号： | NL17SH34P5T5G |
| 厂家： | 
ONSEMI |
| 描述： | Single Buffer 栅 光电二极管 逻辑集成电路 触发器 |
| 文件： | 总5页 (文件大小：96K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NL17SH34
Single Buffer
The NL17SH34 MiniGatet is an advanced high−speed CMOS
Buffer in ultra−small footprint.
The NL17SH34 input structure provides protection when voltages
up to 7.0 V are applied, regardless of the supply voltage.
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Features
• High Speed: t = 3.5 ns (Typ) at V = 5.0 V
PD
CC
MARKING
DIAGRAM
• Low Power Dissipation: I = 1.0 mA (Max) at T = 25°C
CC
A
• Power Down Protection Provided on Inputs
• Balanced Propagation Delays
• Overvoltage Tolerant (OVT) Input Pins
SOT−953
CASE 527AE
M
1
• Ultra−Small Package
• These are Pb−Free and Halide−Free Devices
2
= Specific Device Code
(Rotated 90°)
= Month Code
M
PIN ASSIGNMENT
1
2
3
4
5
IN A
GND
NC
V
1
2
5
4
IN A
GND
NC
CC
OUT Y
V
CC
OUT Y
3
FUNCTION TABLE
A Input
Y Output
L
L
Figure 1. Pinout (Top View)
H
H
1
IN A
OUT Y
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Figure 2. Logic Symbol
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
September, 2012 − Rev. 0
NL17SH34/D
NL17SH34
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
V
CC
DC Supply Voltage
DC Input Voltage
DC Output Voltage
−0.5 to +7.0
−0.5 to +7.0
−0.5 to +7.0
V
IN
V
V
OUT
V
= 0
IN
V
High or Low State
−0.5 to V +0.5
CC
I
DC Input Diode Current
V
< GND
−20
mA
mA
mA
mA
°C
IK
IN
I
DC Output Diode Current
V
< GND, V
> V
CC
20
OK
OUT
OUT
I
DC Output Source/Sink Current
DC Supply Current per Supply Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Moisture Sensitivity
25
OUT
I
50
−65 to +150
260
CC
T
STG
T
°C
L
T
+150
°C
J
MSL
Level 1
F
R
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
V
ESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
>2000
>200
N/A
V
I
Latchup Performance
Above V and Below GND at 125°C (Note 5)
100
mA
LATCHUP
CC
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
1.65
0.0
Max
5.5
Unit
V
V
CC
Positive DC Supply Voltage
Digital Input Voltage
V
IN
5.5
V
V
OUT
Output Voltage
0.0
V
CC
V
T
Operating Temperature Range
Input Transition Rise or Fail Rate
−55
+125
°C
ns/V
A
Dt / DV
V
CC
V
CC
= 3.3 V 0.3 V
= 5.0 V 0.5 V
0
0
100
20
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2
NL17SH34
DC ELECTRICAL CHARACTERISTICS
T
A
= 255C
Typ
T
v 855C
*555C to 1255C
A
V
CC
Min
Max
Min
Max
Min
Max
(V)
Symbol
Parameter
Test Conditions
Unit
V
IH
High−Level Input
Voltage
1.65 to 0.75 x
0.75 x
V
CC
V
2.0
V
CC
2.3 to
5.5
0.70 x
CC
0.70 x
CC
V
V
V
Low−Level Input
1.65 to
2.0
0.25 x
CC
0.25 x
CC
0.25 x
CC
V
V
IL
Voltage
V
V
V
2.3 to
5.5
0.30 x
0.30 x
0.30 x
V
CC
V
CC
V
CC
V
OH
High−Level Output
Voltage
V
IN
V
IN
V
IN
V
IN
= V or V
IL
2.0
3.0
4.5
1.9
2.9
4.4
2.0
3.0
4.5
1.9
2.9
4.4
1.9
2.9
4.4
IH
I
= −50 mA
OH
= V or V
IH
IL
I
= −4 mA
= −8 mA
3.0
4.5
2.58
3.94
2.48
3.80
2.34
3.66
OH
OH
I
V
OL
Low−Level Output
Voltage
= V or V
IL
2.0
3.0
4.5
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
IH
I
= 50 mA
OL
= V or V
IH
IL
I
= 4 mA
= 8 mA
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
OL
OL
I
I
Input Leakage Current
V
V
= 5.5 V or GND
0 to 5.5
5.5
$0.1
1.0
$1.0
10
$1.0
40
mA
mA
IN
IN
I
Quiescent Supply
Current
= V or GND
CC
IN
CC
AC ELECTRICAL CHARACTERISTICS (Input t = t = 3.0 ns)
r
f
T
A
= 255C
Typ
T
v 855C
*555C to 1255C
A
V
(V)
Test
Conditions
CC
Min
Max
Min
Max
Min
Max
Symbol
Parameter
Unit
t
,
Propagation Delay,
A to Y
3.0 to 3.6
C = 15 pF
L
4.5
6.4
7.1
10.6
8.5
12.0
10.0
14.5
ns
PLH
L
t
C = 50 pF
PHL
4.5 to 5.5
5.0
C = 15 pF
L
3.5
4.5
5.5
7.5
6.5
8.5
8.0
L
C = 50 pF
10.0
C
Input Capacitance
4.0
8.0
10
10
10
pF
pF
IN
C
Power Dissipation
Capacitance (Note 6)
PD
6. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
PD
Average operating current can be obtained by the equation: I
) = C ꢀ V ꢀ f + I . C is used to determine the no−load dynamic
CC(OPR
PD CC in CC PD
2
power consumption; P = C ꢀ V
ꢀ f + I ꢀ V
.
D
PD
CC
in
CC
CC
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3
NL17SH34
TEST POINT
OUTPUT
V
CC
A or B
50%
GND
DEVICE
UNDER
TEST
t
t
PLH
PHL
C *
L
Y
50% V
CC
*Includes all probe and jig capacitance.
Figure 3. Switching Waveforms
Figure 4. Test Circuit
ORDERING INFORMATION
Device
†
Package
Shipping
NL17SH34P5T5G
SOT−953
(Pb−Free)
8000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NL17SH34
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
NOTES:
X
Y
D
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
A
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
5
4
3
PIN ONE
H
E
INDICATOR
E
1
2
MILLIMETERS
DIM MIN
NOM
0.37
0.15
0.12
1.00
MAX
0.40
0.20
0.17
1.05
0.85
A
b
0.34
0.10
0.07
0.95
0.75
C
TOP VIEW
e
C
D
SIDE VIEW
E
e
0.80
0.35 BSC
HE
L
0.95
1.00
0.175 REF
1.05
5X
L
L2
L3
0.05
−−−
0.10
−−−
0.15
0.15
5X
5X
L3
L2
SOLDERING FOOTPRINT*
5X
0.35
5X
0.20
5X
b
PACKAGE
OUTLINE
0.08 X
Y
BOTTOM VIEW
1.20
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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NL17SH34/D
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