NL17SHT04 [ONSEMI]

Inverting Buffer CMOS Logic Level Shifter;
NL17SHT04
型号: NL17SHT04
厂家: ONSEMI    ONSEMI
描述:

Inverting Buffer CMOS Logic Level Shifter

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NL17SHT04  
Inverting Buffer /  
CMOS Logic Level Shifter  
LSTTLCompatible Inputs  
The NL17SHT04 is a single gate inverting buffer fabricated with  
silicon gate CMOS technology. It achieves high speed operation  
similar to equivalent Bipolar Schottky TTL while maintaining CMOS  
low power dissipation.  
http://onsemi.com  
MARKING  
DIAGRAM  
The internal circuit is composed of three stages, including a buffer  
output which provides high noise immunity and stable output.  
The device input is compatible with TTLtype input thresholds and  
the output has a full 5 V CMOS level output swing. The input protection  
circuitry on this device allows overvoltage tolerance on the input,  
allowing the device to be used as a logiclevel translator from 3 V  
CMOS logic to 5 V CMOS Logic or from 1.8 V CMOS logic to 3 V  
CMOS Logic while operating at the highvoltage power supply.  
The NL17SHT04 input structure provides protection when voltages  
up to 7.0 V are applied, regardless of the supply voltage. This allows  
the NL17SHT04 to be used to interface 5 V circuits to 3 V circuits.  
SOT953  
CASE 527AE  
LM  
1
L
M
= Specific Device Code  
= Month Code  
PIN ASSIGNMENT  
1
2
3
4
5
IN A  
GND  
NC  
The output structures also provide protection when V = 0 V. These  
CC  
input and output structures help prevent device destruction caused by  
supply voltage input/output voltage mismatch, battery backup, hot  
insertion, etc.  
OUT Y  
Features  
V
CC  
High Speed: t = 3.8 ns (Typ) at V = 5 V  
PD  
CC  
Low Power Dissipation: I = 1 mA (Max) at T = 25°C  
CC  
A
FUNCTION TABLE  
TTLCompatible Inputs: V = 0.8 V; V = 2 V  
IL  
IH  
CMOSCompatible Outputs: V > 0.8 V ; V < 0.1 V @ Load  
A Input  
Y Output  
OH  
CC OL  
CC  
Power Down Protection Provided on Inputs and Outputs  
Balanced Propagation Delays  
L
H
L
H
Pin and Function Compatible with Other Standard Logic Families  
These are PbFree Devices  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
1
2
3
5
IN A  
GND  
NC  
V
CC  
4
OUT Y  
Figure 1. Pinout (Top View)  
1
IN A  
OUT Y  
Figure 2. Logic Symbol  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
August, 2011 Rev. 0  
NL17SHT04/D  
NL17SHT04  
MAXIMUM RATINGS  
Symbol  
Characteristics  
Value  
Unit  
V
V
CC  
DC Supply Voltage  
DC Input Voltage  
DC Output Voltage  
0.5 to +7.0  
0.5 to +7.0  
0.5 to 7.0  
V
IN  
V
V
OUT  
V
= 0  
CC  
V
High or Low State  
0.5 to V + 0.5  
CC  
I
Input Diode Current  
Output Diode Current  
DC Output Current  
20  
20  
mA  
mA  
mA  
mA  
mW  
°C  
IK  
I
V
< GND; V  
> V  
OK  
OUT  
OUT CC  
I
25  
OUT  
I
DC Supply Current, V and GND  
50  
CC  
CC  
P
Power dissipation in still air  
50  
D
T
Lead temperature, 1 mm from case for 10 s  
Junction temperature under bias  
Storage temperature  
260  
L
T
+150  
65 to +150  
100  
°C  
J
T
stg  
°C  
I
Latchup Performance  
Above V and Below GND at 125°C (Note 1)  
mA  
Latchup  
CC  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
1. Tested to EIA/JESD78  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Characteristics  
Min  
3.0  
0.0  
Max  
5.5  
5.5  
5.5  
Unit  
V
V
CC  
DC Supply Voltage  
DC Input Voltage  
DC Output Voltage  
V
IN  
V
V
OUT  
V
= 0  
CC  
0.0  
0.0  
V
High or Low State  
V
CC  
T
Operating Temperature Range  
Input Rise and Fall Time  
55  
+125  
°C  
A
t , t  
r
V
CC  
V
CC  
= 3.3 V 0.3 V  
= 5.0 V 0.5 V  
0
0
100  
20  
ns/V  
f
DEVICE JUNCTION TEMPERATURE VERSUS  
TIME TO 0.1% BOND FAILURES  
FAILURE RATE OF PLASTIC = CERAMIC  
UNTIL INTERMETALLICS OCCUR  
Junction  
Temperature °C  
Time, Hours  
1,032,200  
419,300  
178,700  
79,600  
Time, Years  
117.8  
47.9  
80  
90  
100  
110  
120  
130  
140  
20.4  
1
9.4  
37,000  
4.2  
1
10  
100  
1000  
17,800  
2.0  
TIME, YEARS  
8,900  
1.0  
Figure 3. Failure Rate vs. Time Junction Temperature  
http://onsemi.com  
2
 
NL17SHT04  
DC ELECTRICAL CHARACTERISTICS  
T
A
= 25°C  
T
A
85°C  
55 T 125°C  
A
V
CC  
Min  
Typ  
Max  
Min  
Max  
Min  
Max  
(V)  
Symbol  
Parameter  
Test Conditions  
Unit  
V
IH  
Minimum HighLevel  
Input Voltage  
3.0  
4.5  
5.5  
1.4  
2.0  
2.0  
1.4  
2.0  
2.0  
1.4  
2.0  
2.0  
V
V
IL  
Maximum LowLevel  
Input Voltage  
3.0  
4.5  
5.5  
0.53  
0.8  
0.8  
0.53  
0.8  
0.8  
0.53  
0.8  
0.8  
V
V
OH  
= V or V  
3.0  
4.5  
2.9  
4.4  
3.0  
4.5  
2.9  
4.4  
2.9  
4.4  
V
V
V
OH  
Minimum HighLevel  
IN  
IH  
IL  
Output Voltage  
I
= 50 mA  
V
IN  
= V or V  
IH IL  
V
= V or V  
IN  
OH  
OH  
IH  
IL  
I
I
= 4 mA  
= 8 mA  
3.0  
4.5  
2.58  
3.94  
2.48  
3.80  
2.34  
3.66  
V
OL  
= V or V  
3.0  
4.5  
0.0  
0.0  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
V
V
V
OL  
Maximum LowLevel  
IN  
IH  
IL  
Output Voltage  
I
= 50 mA  
V
IN  
= V or V  
IH IL  
V
= V or V  
IN  
OL  
OL  
IH  
IL  
I
I
= 4.0 mA  
= 8.0 mA  
3.0  
4.5  
0.36  
0.36  
0.44  
0.44  
0.52  
0.52  
I
Maximum Input  
Leakage Current  
V
= 5.5 V or GND  
0 to  
5.5  
0.1  
1.0  
1.0  
mA  
mA  
mA  
mA  
IN  
IN  
I
Maximum Quiescent  
Supply Current  
V
IN  
= V or GND  
5.5  
5.5  
0.0  
1.0  
20  
40  
CC  
CC  
I
Quiescent Supply  
Current  
Input: V = 3.4 V  
1.35  
0.5  
1.50  
5.0  
1.65  
10  
CCT  
IN  
I
Output Leakage  
Current  
V
OUT  
= 5.5 V  
OPD  
AC ELECTRICAL CHARACTERISTICS C  
= 50 pF, Input t = t = 3.0 ns  
r f  
load  
T
A
= 25°C  
T
A
85°C  
55 T 125°C  
A
Min  
Typ  
Max  
Min  
Max  
Min  
Max  
Symbol  
Parameter  
Test Conditions  
Unit  
V
V
= 3.3 0.3 V C = 15 pF  
5.0  
6.2  
10.0  
13.5  
11.0  
15.0  
13.0  
17.5  
t
,
Maximum Propagation  
Delay, Input A to Y  
ns  
CC  
L
PLH  
C = 50 pF  
t
L
PHL  
= 5.0 0.5 V C = 15 pF  
3.8  
4.2  
6.7  
7.7  
7.5  
8.5  
8.5  
9.5  
CC  
L
C = 50 pF  
L
C
Maximum Input  
Capacitance  
5.0  
10  
10  
10  
pF  
pF  
IN  
Typical @ 25°C, V = 5.0 V  
CC  
10  
C
Power Dissipation Capacitance (Note 2)  
PD  
2. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.  
PD  
Average operating current can be obtained by the equation: I  
) = C V f + I . C is used to determine the noload dynamic  
CC(OPR  
PD CC in CC PD  
2
power consumption; P = C V  
f + I V  
.
D
PD  
CC  
in  
CC  
CC  
http://onsemi.com  
3
 
NL17SHT04  
3.0 V  
GND  
A
Y
50%  
t
t
PHL  
PLH  
V
V
OH  
50% V  
CC  
OL  
Figure 4. Switching Waveforms  
TEST POINT  
OUTPUT  
DEVICE  
UNDER  
TEST  
C *  
L
*Includes all probe and jig capacitance  
Figure 5. Test Circuit  
ORDERING INFORMATION  
Device  
Package Type  
Package  
4000 / Tape & Reel  
NL17SHT04P5T5G  
SOT953  
(PbFree)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
4
NL17SHT04  
PACKAGE DIMENSIONS  
SOT953  
CASE 527AE  
ISSUE E  
NOTES:  
X
Y
D
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
A
2. CONTROLLING DIMENSION: MILLIMETERS  
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD  
FINISH. MINIMUM LEAD THICKNESS IS THE  
MINIMUM THICKNESS OF THE BASE MATERIAL.  
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH, PROTRUSIONS, OR GATE BURRS.  
5
4
3
PIN ONE  
H
E
INDICATOR  
E
1
2
MILLIMETERS  
DIM MIN  
NOM  
0.37  
0.15  
0.12  
1.00  
MAX  
0.40  
0.20  
0.17  
1.05  
0.85  
A
b
0.34  
0.10  
0.07  
0.95  
0.75  
C
TOP VIEW  
e
C
D
SIDE VIEW  
E
e
0.80  
0.35 BSC  
HE  
L
0.95  
1.00  
0.175 REF  
1.05  
5X  
L
L2  
L3  
0.05  
−−−  
0.10  
−−−  
0.15  
0.15  
5X  
5X  
L3  
L2  
SOLDERING FOOTPRINT*  
5X  
0.35  
5X  
0.20  
5X  
b
PACKAGE  
OUTLINE  
0.08 X  
Y
BOTTOM VIEW  
1.20  
1
0.35  
PITCH  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
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USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
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Phone: 81357733850  
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Order Literature: http://www.onsemi.com/orderlit  
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Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
NL17SHT04/D  

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